TWI308598B - - Google Patents

Download PDF

Info

Publication number
TWI308598B
TWI308598B TW95138394A TW95138394A TWI308598B TW I308598 B TWI308598 B TW I308598B TW 95138394 A TW95138394 A TW 95138394A TW 95138394 A TW95138394 A TW 95138394A TW I308598 B TWI308598 B TW I308598B
Authority
TW
Taiwan
Prior art keywords
metal
ingot
annealing
precious metal
precious
Prior art date
Application number
TW95138394A
Other languages
English (en)
Chinese (zh)
Other versions
TW200819550A (en
Inventor
Rong-Zhi Chen
zhi-long Li
yin-ting Hong
rui-dong Zhang
ba-cui Shi
Original Assignee
China Steel Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by China Steel Corp filed Critical China Steel Corp
Priority to TW95138394A priority Critical patent/TW200819550A/zh
Publication of TW200819550A publication Critical patent/TW200819550A/zh
Application granted granted Critical
Publication of TWI308598B publication Critical patent/TWI308598B/zh

Links

Landscapes

  • Physical Vapour Deposition (AREA)
TW95138394A 2006-10-18 2006-10-18 Method of producing sputtering targets having noble metal TW200819550A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW95138394A TW200819550A (en) 2006-10-18 2006-10-18 Method of producing sputtering targets having noble metal

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW95138394A TW200819550A (en) 2006-10-18 2006-10-18 Method of producing sputtering targets having noble metal

Publications (2)

Publication Number Publication Date
TW200819550A TW200819550A (en) 2008-05-01
TWI308598B true TWI308598B (cg-RX-API-DMAC7.html) 2009-04-11

Family

ID=44769812

Family Applications (1)

Application Number Title Priority Date Filing Date
TW95138394A TW200819550A (en) 2006-10-18 2006-10-18 Method of producing sputtering targets having noble metal

Country Status (1)

Country Link
TW (1) TW200819550A (cg-RX-API-DMAC7.html)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI465596B (zh) * 2012-11-22 2014-12-21 Solar Applied Mat Tech Corp 鋁鈦合金濺鍍靶材及其製作方法

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009167530A (ja) * 2009-02-10 2009-07-30 Nippon Mining & Metals Co Ltd ニッケル合金スパッタリングターゲット及びニッケルシリサイド膜
CN115039957A (zh) * 2022-05-30 2022-09-13 周六福珠宝股份有限公司 一种中空式金银珠宝的制作方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI465596B (zh) * 2012-11-22 2014-12-21 Solar Applied Mat Tech Corp 鋁鈦合金濺鍍靶材及其製作方法

Also Published As

Publication number Publication date
TW200819550A (en) 2008-05-01

Similar Documents

Publication Publication Date Title
CN101691657B (zh) Al-基合金溅射靶及其制造方法
JP4494610B2 (ja) 薄膜形成用スパッタリングターゲット材
TW201118190A (en) Sintered CU-GA sputtering target and method for producing the target
CN102732845B (zh) 一种高纯度、高成分均匀性的镍铬合金靶材及其制备方法
TW200530429A (en) Ni-Pt alloy and target comprising the alloy
CN111286703B (zh) 一种镍铂合金溅射靶材及其制备方法
WO2021046927A1 (zh) 一种含微量稀土元素的镍铼合金旋转管状靶材及制备方法
CN104388862A (zh) 一种含τ3相γ-TiAl金属间化合物铸锭的全片层热处理方法
CN107586977B (zh) 一种高强高导铜合金棒材的制备方法
TWI654323B (zh) 銅合金濺鍍靶材及銅合金濺鍍靶材之製造方法
US7754027B2 (en) Method for manufacturing a sputtering target
CN101386974A (zh) Tft lcd电极薄膜制备所用的靶材及靶材和电极薄膜制备方法
WO2024124617A1 (zh) 一种CoFeB靶材及其制备方法
CN1370853A (zh) 金属溅镀靶材的制造方法
TW201040297A (en) Lanthanum target for sputtering
CN108796297B (zh) 一种直接用于3d打印的高强度高韧性铜镍锡合金原料及其制备方法和应用
CN106244842B (zh) 一种硬铂合金及制备方法
CN104004976A (zh) 锆基、铜基非晶合金及其制备方法、及由其制得的电子产品结构件及加工方法
CN101319303A (zh) 含贵金属溅镀靶材的制作方法
CN118932202B (zh) 一种高通量高熵合金成分设计的方法
CN107723517A (zh) 一种具有良好增材制造成形性能的Ti‑Al基合金及其应用
CN100567560C (zh) 嵌套式溅射靶及其制造方法
CN101428390B (zh) 一种金合金箔材制备方法
TWI272316B (en) Method for producing a high-entropy alloy film
CN107739888A (zh) 一种具有良好增材制造成形性能的Ti‑V基合金及其应用

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees