TWI307257B - - Google Patents
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- Publication number
- TWI307257B TWI307257B TW94117443A TW94117443A TWI307257B TW I307257 B TWI307257 B TW I307257B TW 94117443 A TW94117443 A TW 94117443A TW 94117443 A TW94117443 A TW 94117443A TW I307257 B TWI307257 B TW I307257B
- Authority
- TW
- Taiwan
- Prior art keywords
- layer
- soft film
- soft
- circuit
- film structure
- Prior art date
Links
- 239000010410 layer Substances 0.000 claims description 82
- 239000000758 substrate Substances 0.000 claims description 21
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 20
- VNNRSPGTAMTISX-UHFFFAOYSA-N chromium nickel Chemical compound [Cr].[Ni] VNNRSPGTAMTISX-UHFFFAOYSA-N 0.000 claims description 18
- 229910018487 Ni—Cr Inorganic materials 0.000 claims description 16
- 239000013078 crystal Substances 0.000 claims description 16
- 229920002120 photoresistant polymer Polymers 0.000 claims description 13
- 229910052802 copper Inorganic materials 0.000 claims description 12
- 239000010949 copper Substances 0.000 claims description 12
- 239000011651 chromium Substances 0.000 claims description 8
- 239000011889 copper foil Substances 0.000 claims description 6
- 238000004519 manufacturing process Methods 0.000 claims description 3
- 238000000151 deposition Methods 0.000 claims description 2
- 238000005406 washing Methods 0.000 claims description 2
- 206010036790 Productive cough Diseases 0.000 claims 1
- 238000001459 lithography Methods 0.000 claims 1
- 239000007921 spray Substances 0.000 claims 1
- 210000003802 sputum Anatomy 0.000 claims 1
- 208000024794 sputum Diseases 0.000 claims 1
- 239000002344 surface layer Substances 0.000 claims 1
- 238000000034 method Methods 0.000 description 59
- 238000005516 engineering process Methods 0.000 description 10
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 7
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 5
- 239000002131 composite material Substances 0.000 description 5
- 238000010586 diagram Methods 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 239000000126 substance Substances 0.000 description 5
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 230000005611 electricity Effects 0.000 description 4
- 229910052707 ruthenium Inorganic materials 0.000 description 4
- 229910052759 nickel Inorganic materials 0.000 description 3
- 229920000768 polyamine Polymers 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 239000004642 Polyimide Substances 0.000 description 2
- 229910052804 chromium Inorganic materials 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 239000008187 granular material Substances 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000012528 membrane Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 239000002689 soil Substances 0.000 description 2
- GSJBKPNSLRKRNR-UHFFFAOYSA-N $l^{2}-stannanylidenetin Chemical compound [Sn].[Sn] GSJBKPNSLRKRNR-UHFFFAOYSA-N 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 208000001613 Gambling Diseases 0.000 description 1
- 101100001708 Mus musculus Angptl4 gene Proteins 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 229910001570 bauxite Inorganic materials 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000013043 chemical agent Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 230000007123 defense Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 239000004922 lacquer Substances 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 210000000496 pancreas Anatomy 0.000 description 1
- 229920006254 polymer film Polymers 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- -1 shown Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
Landscapes
- Manufacturing Of Printed Wiring (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW094117443A TW200642553A (en) | 2005-05-27 | 2005-05-27 | Embedded chip on film (COF) |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW094117443A TW200642553A (en) | 2005-05-27 | 2005-05-27 | Embedded chip on film (COF) |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200642553A TW200642553A (en) | 2006-12-01 |
| TWI307257B true TWI307257B (enExample) | 2009-03-01 |
Family
ID=45071565
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW094117443A TW200642553A (en) | 2005-05-27 | 2005-05-27 | Embedded chip on film (COF) |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TW200642553A (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI414215B (zh) * | 2009-06-30 | 2013-11-01 | Ｊｘ日鑛日石金屬股份有限公司 | A copper foil for printed wiring board and a method for manufacturing the same, a copper clad sheet having the copper foil, and a printed wiring board |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9445502B2 (en) | 2013-05-30 | 2016-09-13 | Nanchang O-Film Tech Co., Ltd. | Flexible circuit connecting device |
-
2005
- 2005-05-27 TW TW094117443A patent/TW200642553A/zh not_active IP Right Cessation
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI414215B (zh) * | 2009-06-30 | 2013-11-01 | Ｊｘ日鑛日石金屬股份有限公司 | A copper foil for printed wiring board and a method for manufacturing the same, a copper clad sheet having the copper foil, and a printed wiring board |
Also Published As
| Publication number | Publication date |
|---|---|
| TW200642553A (en) | 2006-12-01 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |