TWI306269B - - Google Patents

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Publication number
TWI306269B
TWI306269B TW091113908A TW91113908A TWI306269B TW I306269 B TWI306269 B TW I306269B TW 091113908 A TW091113908 A TW 091113908A TW 91113908 A TW91113908 A TW 91113908A TW I306269 B TWI306269 B TW I306269B
Authority
TW
Taiwan
Prior art keywords
data
processing
processed
processing result
operation data
Prior art date
Application number
TW091113908A
Other languages
English (en)
Chinese (zh)
Inventor
Hideki Tanaka
Satoshi Harada
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Application granted granted Critical
Publication of TWI306269B publication Critical patent/TWI306269B/zh

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/23—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by multiple measurements, corrections, marking or sorting processes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32917—Plasma diagnostics
    • H01J37/32935—Monitoring and controlling tubes by information coming from the object and/or discharge

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Drying Of Semiconductors (AREA)
TW091113908A 2001-06-27 2002-06-25 TWI306269B (https=)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001194762 2001-06-27

Publications (1)

Publication Number Publication Date
TWI306269B true TWI306269B (https=) 2009-02-11

Family

ID=19032842

Family Applications (1)

Application Number Title Priority Date Filing Date
TW091113908A TWI306269B (https=) 2001-06-27 2002-06-25

Country Status (3)

Country Link
JP (1) JP4220378B2 (https=)
TW (1) TWI306269B (https=)
WO (1) WO2003003437A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI917451B (zh) 2020-10-16 2026-03-11 日商東京威力科創股份有限公司 基板處理系統、控制方法及控制程式

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6616759B2 (en) 2001-09-06 2003-09-09 Hitachi, Ltd. Method of monitoring and/or controlling a semiconductor manufacturing apparatus and a system therefor
CN1653598B (zh) 2002-05-16 2010-05-05 东京毅力科创株式会社 处理装置状态或处理结果的预测方法
JP4363861B2 (ja) * 2003-02-04 2009-11-11 株式会社日立ハイテクノロジーズ 半導体製造装置
JP4707421B2 (ja) * 2005-03-14 2011-06-22 東京エレクトロン株式会社 処理装置，処理装置の消耗部品管理方法，処理システム，処理システムの消耗部品管理方法
US7291285B2 (en) * 2005-05-10 2007-11-06 International Business Machines Corporation Method and system for line-dimension control of an etch process
KR101286240B1 (ko) 2007-10-23 2013-07-15 삼성전자주식회사 반도체 구조물의 형상을 예정하는 공정 파라 메타의 예측시스템, 상기 공정 파라 메타의 예측 시스템을 가지는반도체 제조 장비 및 그 장비의 사용방법
JP4836994B2 (ja) * 2008-06-11 2011-12-14 株式会社日立製作所 半導体処理装置
JP5643528B2 (ja) 2009-03-30 2014-12-17 東京エレクトロン株式会社 基板処理装置
JP5782226B2 (ja) 2010-03-24 2015-09-24 東京エレクトロン株式会社 基板処理装置
KR102112130B1 (ko) * 2013-10-23 2020-05-19 주식회사 디엠에스 샤워헤드 장치
US20240327988A1 (en) * 2023-03-28 2024-10-03 Applied Materials, Inc. Thermal processing chamber state based on thermal sensor readings

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04212414A (ja) * 1990-08-16 1992-08-04 Fuji Electric Co Ltd プラズマ処理装置
JP3300816B2 (ja) * 1992-02-27 2002-07-08 株式会社日立国際電気 半導体製造装置管理方法及びその装置
US5442562A (en) * 1993-12-10 1995-08-15 Eastman Kodak Company Method of controlling a manufacturing process using multivariate analysis
US6197116B1 (en) * 1996-08-29 2001-03-06 Fujitsu Limited Plasma processing system
JPH10223499A (ja) * 1997-02-06 1998-08-21 Hitachi Ltd 物品の製造方法、物品の製造システムおよび複数の加工処理装置の運用方法
US6368975B1 (en) * 1999-07-07 2002-04-09 Applied Materials, Inc. Method and apparatus for monitoring a process by employing principal component analysis

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI917451B (zh) 2020-10-16 2026-03-11 日商東京威力科創股份有限公司 基板處理系統、控制方法及控制程式

Also Published As

Publication number Publication date
WO2003003437A1 (fr) 2003-01-09
JP4220378B2 (ja) 2009-02-04
JPWO2003003437A1 (ja) 2004-10-21

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MM4A Annulment or lapse of patent due to non-payment of fees