TWI305295B - Lithographic apparatus and device manufacturing method - Google Patents
Lithographic apparatus and device manufacturing method Download PDFInfo
- Publication number
- TWI305295B TWI305295B TW094115266A TW94115266A TWI305295B TW I305295 B TWI305295 B TW I305295B TW 094115266 A TW094115266 A TW 094115266A TW 94115266 A TW94115266 A TW 94115266A TW I305295 B TWI305295 B TW I305295B
- Authority
- TW
- Taiwan
- Prior art keywords
- projection system
- airflow
- lithography apparatus
- guiding element
- substrate
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title description 3
- 239000000758 substrate Substances 0.000 claims description 52
- 238000001459 lithography Methods 0.000 claims description 35
- 230000005855 radiation Effects 0.000 claims description 18
- 230000000694 effects Effects 0.000 claims description 14
- 238000000059 patterning Methods 0.000 claims description 11
- 230000001143 conditioned effect Effects 0.000 claims description 4
- 238000005259 measurement Methods 0.000 claims description 3
- 230000004807 localization Effects 0.000 claims 1
- 230000003287 optical effect Effects 0.000 description 7
- 238000009826 distribution Methods 0.000 description 4
- 239000010410 layer Substances 0.000 description 4
- 239000007921 spray Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 230000006870 function Effects 0.000 description 3
- 238000003384 imaging method Methods 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 230000033001 locomotion Effects 0.000 description 3
- 239000012530 fluid Substances 0.000 description 2
- 238000007654 immersion Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000004088 simulation Methods 0.000 description 2
- 239000003708 ampul Substances 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 230000002238 attenuated effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000005670 electromagnetic radiation Effects 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 238000010884 ion-beam technique Methods 0.000 description 1
- 239000002346 layers by function Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 230000007595 memory recall Effects 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 210000001747 pupil Anatomy 0.000 description 1
- 230000011514 reflex Effects 0.000 description 1
- 230000001235 sensitizing effect Effects 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 238000010408 sweeping Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70908—Hygiene, e.g. preventing apparatus pollution, mitigating effect of pollution or removing pollutants from apparatus
- G03F7/70933—Purge, e.g. exchanging fluid or gas to remove pollutants
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70908—Hygiene, e.g. preventing apparatus pollution, mitigating effect of pollution or removing pollutants from apparatus
Landscapes
- Health & Medical Sciences (AREA)
- Epidemiology (AREA)
- Public Health (AREA)
- Life Sciences & Earth Sciences (AREA)
- Atmospheric Sciences (AREA)
- Engineering & Computer Science (AREA)
- Environmental & Geological Engineering (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US57153404P | 2004-05-17 | 2004-05-17 | |
| US10/876,760 US7072021B2 (en) | 2004-05-17 | 2004-06-28 | Lithographic apparatus and device manufacturing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200600979A TW200600979A (en) | 2006-01-01 |
| TWI305295B true TWI305295B (en) | 2009-01-11 |
Family
ID=34938280
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW094115266A TWI305295B (en) | 2004-05-17 | 2005-05-11 | Lithographic apparatus and device manufacturing method |
Country Status (6)
| Country | Link |
|---|---|
| US (2) | US7072021B2 (enExample) |
| EP (1) | EP1600818A1 (enExample) |
| JP (1) | JP4332137B2 (enExample) |
| KR (1) | KR100719153B1 (enExample) |
| SG (1) | SG117570A1 (enExample) |
| TW (1) | TWI305295B (enExample) |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7072021B2 (en) * | 2004-05-17 | 2006-07-04 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
| US7148951B2 (en) | 2004-10-25 | 2006-12-12 | Asml Netherlands B.V. | Lithographic apparatus |
| JP3977377B2 (ja) * | 2005-03-04 | 2007-09-19 | キヤノン株式会社 | 露光装置およびデバイス製造方法 |
| JP2006245400A (ja) * | 2005-03-04 | 2006-09-14 | Canon Inc | 光学装置およびデバイス製造方法。 |
| US7728951B2 (en) | 2005-09-29 | 2010-06-01 | Asml Netherlands B.V. | Lithographic apparatus and method for conditioning an interior space of a device manufacturing apparatus |
| US7420299B2 (en) * | 2006-08-25 | 2008-09-02 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
| JP2008147577A (ja) * | 2006-12-13 | 2008-06-26 | Canon Inc | 露光装置及びデバイス製造方法 |
| JP6660179B2 (ja) * | 2015-12-28 | 2020-03-11 | キヤノン株式会社 | 露光装置、および物品の製造方法 |
| JP6742870B2 (ja) * | 2016-09-16 | 2020-08-19 | キヤノン株式会社 | 露光装置、及び物品製造方法 |
| JP7033168B2 (ja) * | 2020-06-30 | 2022-03-09 | キヤノン株式会社 | 露光装置、および物品の製造方法 |
| JP7512131B2 (ja) * | 2020-08-27 | 2024-07-08 | キヤノン株式会社 | 露光装置、及び物品の製造方法 |
| JP7766542B2 (ja) | 2022-03-30 | 2025-11-10 | キヤノン株式会社 | 露光装置、露光装置の調整方法、および物品製造方法 |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3308292A1 (de) * | 1983-03-09 | 1984-09-13 | Metalegno Stabilimento, Vaduz | Lattenrost mit drehbar gelagerten federleisten |
| WO2001006548A1 (en) * | 1999-07-16 | 2001-01-25 | Nikon Corporation | Exposure method and system |
| JP2001358056A (ja) | 2000-06-15 | 2001-12-26 | Canon Inc | 露光装置 |
| WO2002054460A1 (fr) | 2000-12-27 | 2002-07-11 | Nikon Corporation | Dispositif d'exposition |
| JP2002373852A (ja) | 2001-06-15 | 2002-12-26 | Canon Inc | 露光装置 |
| JP2003115451A (ja) * | 2001-07-30 | 2003-04-18 | Canon Inc | 露光装置及びそれを用いたデバイスの製造方法 |
| CN1650401B (zh) * | 2002-04-09 | 2010-04-21 | 株式会社尼康 | 曝光方法与曝光装置、以及器件的制造方法 |
| DE10239344A1 (de) * | 2002-08-28 | 2004-03-11 | Carl Zeiss Smt Ag | Vorrichtung zum Abdichten einer Projektionsbelichtungsanlage |
| SG115613A1 (en) * | 2003-02-12 | 2005-10-28 | Asml Netherlands Bv | Lithographic apparatus comprising a gas flushing system |
| US6867844B2 (en) * | 2003-06-19 | 2005-03-15 | Asml Holding N.V. | Immersion photolithography system and method using microchannel nozzles |
| DE102004018659A1 (de) * | 2004-04-13 | 2005-11-03 | Carl Zeiss Smt Ag | Abschlussmodul für eine optische Anordnung |
| US7072021B2 (en) * | 2004-05-17 | 2006-07-04 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
-
2004
- 2004-06-28 US US10/876,760 patent/US7072021B2/en not_active Expired - Lifetime
-
2005
- 2005-05-09 SG SG200502906A patent/SG117570A1/en unknown
- 2005-05-11 TW TW094115266A patent/TWI305295B/zh not_active IP Right Cessation
- 2005-05-16 KR KR1020050040434A patent/KR100719153B1/ko not_active Expired - Fee Related
- 2005-05-17 JP JP2005172914A patent/JP4332137B2/ja not_active Expired - Fee Related
- 2005-05-17 EP EP05076148A patent/EP1600818A1/en not_active Withdrawn
-
2006
- 2006-05-22 US US11/437,745 patent/US7271873B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JP2005333152A (ja) | 2005-12-02 |
| US7072021B2 (en) | 2006-07-04 |
| US7271873B2 (en) | 2007-09-18 |
| KR20060047923A (ko) | 2006-05-18 |
| SG117570A1 (en) | 2005-12-29 |
| KR100719153B1 (ko) | 2007-05-17 |
| JP4332137B2 (ja) | 2009-09-16 |
| US20050254025A1 (en) | 2005-11-17 |
| TW200600979A (en) | 2006-01-01 |
| US20060232754A1 (en) | 2006-10-19 |
| EP1600818A1 (en) | 2005-11-30 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |