1304647 九、發明說明： 1 【發明所屬之技術領域】 【 I發明係有關於球格陣列封裝構造（BGA Paekage)，特 別係有關於-種可防止導線架之重配置引腳與球塾在模 封時位移之導線架基底球袼陣列封裝構造。 【先前技術】 在以往的球料㈣裝構造巾，複數㈣列的球狀外接 端子係設置在一電路基板之下矣而 ^ , 下表面，然以印刷電路板作為晶 片載體之成本比導線架更高且抗濕性更差。 美國專利第5,847,455號揭示—種導線架基底球格陣列 封裝構造，即是以導線架作為BGA封裝之晶片載體。如第 1圖所示，習知導線架基底球格陣列封裝構造100主要包 含一導線架1 1 0、一晶片i 2 〇、複數個銲線J 3 〇、一模 封膠體140以及複數個銲球15〇。如第2圖所示，該 導線架1 1 0係具有複數個引腳丨i 2，每一引腳丨i 2之内 Φ 端形成為一内接指1 1 1，以供該些銲線1 3 0之打線連 接，每一引腳1 1 2之外端定義有一球墊i丨3，以供該此 銲球1 5 0之接合。其中，該導線架丨丨〇係另具有一曰 曰白 片承座1 1 4，可供該晶片1 2 0之貼附固定。該些銲緯 130係電性連接該晶片12〇之銲墊12ι至該些内接指 111。該模封膠體1 40係密封該些内接指i丨丨、該此弓丨 腳112、該晶片120以及該些銲線121。由於在封裳製 程中，每一引腳丨i 2係為獨立設置以連接並支持對應 之内接指1 1 1與球墊i〗3，故該些引腳i i 2未作有卜声 5 .1304647 的彎折與細化，無法達到該些球墊i 13重配置的目 的。由於該些球墊113受制於導線架本身設計是集中 於某一區域内（如第2圖所示），無法擴散成有較大間 隔的陣列排歹，j，這導致了該些鲜$ i5〇的配置相當擁 擠且容易橋接短路《此外，在半導體之模封過程該 模封膠體140之形成，易使該些球墊113產生位移，導 致引腳短路。 【發明内容】 •為了解決上述之問題，本發明之主要目的係在於提 供一種導線架基底球格陣列封裝構造及其使用之晶片 載體，可以防止導線架基底球格陣列封裝構造之重配置 引腳與球塾在模封時位移’並增進植球支撑強度。此外， 相對於以基板接球之球格陣列封裝構造更具有低成本 與高抗濕性之功效。 本發明之次一目的係在於提供一種導線架基底球 • 格陣列封裝構造，可以提供一加勁片在封裝製程中的連結 本發明之再一 格陣列封裝構造， 止模封位移。 目的係在於提供一種導線架基底球 可以增進該晶片承座之固定性，且能防 本發明的目的及解決其技術問題是採用以下技術 索來實現的。本發明揭示一種導線架基底球格陣列 、 4及其使用之晶片載體。該導線架基底球格阵 子裝構造係包含一導線架、一加勁片、一晶片、複數個 6 1304647 銲線、一模封膠體以及複數個導電球。該導線架係具有複數 個内接指、複數個重配置引腳以及複數個球墊，該些重配置 引腳係以一體連接對應之該些内接指與該些球墊。該加勁片 係貼附於該導線架之上表面，以固定該些重配置引腳血該些 f墊加勁片係具有至少一開槽或開孔，以顯露該些内接 才日 '日日片係"又置於該導線架上。該些銲線係電性連接該晶 片至a些内接指。該模封膠體係密封該些内接指、該些重配 置引腳、該晶片以及該些銲線。該些導電球餘置於該些球 本發明的目的及解決其技術問題還可採用以下技 術措施進一步實現。 在刖述的導線架基底球格陣列封裝構造中，該加勁 片之邊緣係不對齊於該模封膠體之邊緣，而被該模封膠體密1304647 IX. Description of the invention: 1 [Technical field to which the invention pertains] [I invention relates to a ball grid array package structure (BGA Paekage), in particular, to a reconfigurable pin and ball 塾 in a mold A lead frame base ball grid array package structure with a time-displacement displacement. [Prior Art] In the conventional ball (four)-mounted structural towel, the plurality of (four) rows of spherical external terminals are disposed under a circuit board, and the lower surface, the cost of the printed circuit board as a wafer carrier is higher than that of the lead frame. Higher and less moisture resistant. U.S. Patent No. 5,847,455 discloses a leadframe base ball grid array package structure in which a lead frame is used as a wafer carrier for a BGA package. As shown in FIG. 1 , the conventional lead frame base ball grid array structure 100 mainly includes a lead frame 110, a wafer i 2 〇, a plurality of bonding wires J 3 〇, a molding compound 140, and a plurality of weldings. The ball is 15 inches long. As shown in FIG. 2, the lead frame 110 has a plurality of pins 丨i 2, and the Φ end of each pin 丨i 2 is formed as an internal finger 1 1 1 for the bonding wires. 1 3 0 wire connection, each pin 1 1 2 outer end defines a ball pad i 丨 3 for the bonding of the solder ball 150. Wherein, the lead frame further has a 曰 white sheet holder 1 14 for attaching and fixing the wafer 120. The solder joints 130 are electrically connected to the pads 12 of the wafer 12 to the internal fingers 111. The molding compound 140 seals the inscribed fingers, the arch 112, the wafer 120, and the bonding wires 121. Since each pin 丨i 2 is independently set to connect and support the corresponding inner finger 1 1 1 and the ball pad i 3 in the process of sealing, the pins ii 2 are not made to have a sound 5 The bending and refinement of .1304647 cannot achieve the purpose of reconfiguring the ball mats i 13 . Since the ball pads 113 are subject to the design of the lead frame itself, which is concentrated in a certain area (as shown in FIG. 2), it cannot be diffused into a larger row of arrays, j, which leads to the fresh $i5. The configuration of the crucible is quite crowded and easy to bridge the short circuit. In addition, the formation of the mold encapsulant 140 during the semiconductor molding process tends to cause displacement of the ball pads 113, resulting in short-circuiting of the pins. SUMMARY OF THE INVENTION In order to solve the above problems, the main object of the present invention is to provide a lead frame base ball grid array package structure and a wafer carrier therefor, which can prevent reconfiguration pins of a lead frame base ball grid array package structure. Displaces with the ball 塾 during molding and improves the strength of the ball support. In addition, it has a lower cost and higher moisture resistance than the ball grid array package structure in which the substrate is attached to the ball. A second object of the present invention is to provide a lead frame base ball grid package structure that can provide a stiffener in a package process. The present invention further includes an array package structure and a die seal displacement. The object is to provide a lead frame base ball which can improve the fixing of the wafer holder, and can prevent the object of the present invention and solve the technical problem by the following technique. The present invention discloses a lead frame base ball grid array, 4 and a wafer carrier therefor. The lead frame base ball array structure comprises a lead frame, a stiffener, a wafer, a plurality of 6 1304647 bond wires, a mold sealant and a plurality of conductive balls. The lead frame has a plurality of internal fingers, a plurality of reconfiguration pins, and a plurality of ball pads, and the reconfiguration pins are integrally connected to the corresponding inner fingers and the ball pads. The stiffening sheet is attached to the upper surface of the lead frame to fix the reconfigured pins. The f-pad stiffeners have at least one slot or opening to reveal the inscribed days. The film system is placed on the lead frame again. The bonding wires are electrically connected to the wafer to a plurality of internal fingers. The mold encapsulation system seals the inner fingers, the reconfigurable pins, the wafer, and the bond wires. The conductive balls are left in the balls. The object of the present invention and solving the technical problems thereof can be further achieved by the following technical measures. In the above-described lead frame base ball grid array package structure, the edge of the stiffener is not aligned with the edge of the mold seal, and is densely sealed by the mold seal.
在前述的導線架基底球格陣列封裝構造中，該加勁 片另具有複數個繫條’其係延伸至該模封膠體之角隅。 在前述料線架基底球格陣列μ料t，該加勁 片係為電絕緣性的聚亞醯胺膠片。 乂在刚述的導線架基底球格陣列封敦構造巾，該加勁 片係為具有電絕緣性黏著層之金屬片。 在前述的導線架基底球格陣列封裂構造中，該加勁 片係具有複數個模流通孔，其係位在該些球㈣該4b重配置 引腳之間空隙處。 該導線 在前述的導線架基底球格陣列封裴構造中 7 1304647 動面係形成有複數個銲墊2 3 1。該些銲線2 * 〇 ^ 、 υ之一端係連接 該晶片230之該些銲塾231，另一端係通過該加勁片22〇之 開槽22 1或開孔連接至對應之該此内接扣 —η摆払211，以電性連接 該晶片23〇與該導線架21〇。該晶片230可為記憶體晶片、 微處理器晶片、邏輯晶片或特殊應用積體電路（asic)晶片。 如第3圖所示，該模封膠體250係密封該些内接指2ιι、 該些重配置引腳212、該晶片230以及該些銲線Μ;。較佳 地’該模封膠體250係覆蓋至該導線架21〇之下表面，以增 攀進該封裝構造200底面防濕性之功效，增加產品可靠性。: 第6圖所示，該模封膠體25〇係具有複數個接球孔25ι，其 係顯露該些球墊213，並且該些接球孔251之尺寸係稍小於 該些球墊2丨3，以達到防止例如錫鉛材質之導電球26〇在迴 銲時污染至該些重配置引腳212之功效。 、咸些導電球260係可透過該些接球孔25丨並設置於該些 球墊213，以組成球格陣列封裝型態。在本實施例中，該些 • 導電球260係可包含銲球。 因此，利用該加勁片220貼附於該導線架21〇之上表面， 具有防止該些重配置引腳212與該些球墊213在模封時位移 以及增進植球支撐強度之功效。 此外’如第3及4圖所示，較佳地，該加勁片220之邊 、、彖222係不對齊於該模封膠體25〇之邊緣，而被該模封膠體 丄封以&進δ亥封震構造200側面抗濕性之功效。該加 勁片220另具有複數個繫條223，可延伸至該模封膠體 之角隅’以提供該加勁片22〇與該導線架2 i 〇在封裝 1304647 230、複數個銲線240、一模封膠體250以及複數個導電球 260，而組成球格陣列（BGA)封裝型態。如第4圖所示，該 導線架210係具有複數個内接指211、複數個重配置引腳212 以及複數個球墊213，該些重配置引腳212係以一體連接對 應之遠些内接指2 11與該些球塾2 1 3，可為任意彎曲形狀與 區段斜向配置，以使該些球墊213可格狀陣列配置，不會受 到習知導線架之限制集中在某一處或縮小球墊尺寸。此外， 在本實施例中，該導線架210係另具有一晶片承座214，以 供a玄晶片2 3 〇之黏貼設置。較佳地，該導線架21 〇係另且有 複數個電鍍引腳215，其係連接對應之該些球墊213並延伸 至該模封膠體250之邊緣，可在導線架單離之前在該些球墊 213之表面形成電鍍層。 如第3及4圖所示，該加勁片220係貼附於該導線架2 i 〇 之上表面，以固定該些重配置引腳212與該些球墊213，以 避免在模封時該些重配置引腳212產生位移而短路，亦能避 免在模封時該些球墊2 13產生位移而導致bgA外接腳位的 位置改變。如第4及5圖所示，該加勁片220係具有至少_ 開槽221或開孔，以顯露該些内接指211，並且該加勁片 係具有一中央開口 224，以顯露該晶片承座214(如第5圖所 不）。在本實施例中，該加勁片220係可選用電絕緣性的聚 亞醯胺（PI)膠片。 該晶片230係設置於該導線架210上，例如可利用已知 黏晶材質將該晶片230之背面透過該加勁片220之中央開口 224黏貼到該導線架210之晶片承座214。該晶片23〇之主 *1304647 動面係形成有複數個銲墊231。該些銲線240之一端係連接 該晶片230之該些銲墊231，另一端係通過該加勁片22〇之 開槽22 1或開孔連接至對應之該些内接指2丨丨，以電性連接 該晶片230與該導線架210。該晶片23〇可為記憶體晶片、 微處理器晶片、邏輯晶片或特殊應用積體電路（Asic)晶片。 如第3圖所示，該模封膠體25〇係密封該些内接指211、 該些重配置引腳212、該晶片230以及該些銲線24〇。較佳 地，該模封膠體250係覆蓋至該導線架21〇之下表面，以增 進該封裝構造200底面防濕性之功效，增加產品可靠性。如 第6圖所示，該模封膠體25〇係具有複數個接球孔251，其 係顯露該些球墊213，並且該些接球孔251之尺寸係稍小於 ”亥二球墊2 1 3以達到防止例如錫热材質之導電球260在迴 銲時污染至該些重配置引腳212之功效。 該些導電球260係可透過該些接球孔25丨並設置於該些 球墊213，以組成球袼陣列封裝型態。在本實施例中，該些 φ 導電球26〇係可包含銲球。 因此，利用該加勁片22〇貼附於該導線架210之上表面， 具有防止該些重配置引腳212與該些球墊213在模封時位移 以及增進植球支撐強度之功效。 此外，如第3及4圖所示，較佳地，該加勁片之邊 緣222係不對齊於該模封膠體25〇之邊緣，而被該模封膠體 250密封，以增進該封裝構造側面抗濕性之功效。該加 勁片220另具有複數個繫條223，可延伸至該模封膠體 之角隅或邊緣，以提供該加勁片22〇與該導線架在封裝 1304647 製程中的連結固定。較佳地，該加勁片22〇之中央開口 224 之尺寸係大於該晶片230且小於該晶片承座214，而具有增 進該晶片承座214之固定性以及防止模封位移之功效。 在本發明之第二具體實施例中，揭示另一種導線架 基底球格陣列封裝構造。如第7及8圖所示，一種導 線架基底球格陣列封裝構造3〇〇主要包含一導線架31〇、一 加动片320、一晶片330、複數個輝線340、一模封膠體350 以及複數個導電球360。該導線架31〇係具有複數個内接指 3Π、複數個重配置引腳312以及複數個球墊313，該些重配 置引腳3 12係以一體連接對應之該些内接指3丨丨與該些球墊 313八中，該導線架3 10係另具有複數個電鑛引腳 3 14其係連接该些球墊3 1 3並延伸至該模封膠體3 5 〇 之邊緣，以能在該些球墊313表面進行電鍍。 該加勁片320係貼附於該導線架3 1〇之上表面，以固定 。亥些重配置引腳312與該些球墊313，該加勁片32〇係具有 至少一開槽321或開孔，以顯露該些内接指3丨丨。在本實施 例中該加勁片3 2 〇係為一具有電絕緣性黏著層3 2 2 之金屬片323。 "玄曰曰片330係具有複數個銲墊331，且該晶片330之背面 係設置於該加勁片320之金屬片323上。並以打線技術， 使該些銲線340係電性連接該晶片33〇之銲墊以丨至該些内 接指3 11。 該模封膠體350係密封該些内接指3n、該些重配置引腳 312 曰片33〇以及該些銲線34〇。該些導電球係設置 1304647 於該些球墊3 13，該些導電球3 6 0係可包含銲球。因此， 該封裝構造2 0 0係具有防止該些重配置引腳3 12與該些球 墊3 1 3在模封時位移以及增進植球支撐強度之功效。In the aforementioned leadframe base ball grid array package construction, the stiffener has a plurality of tie strips that extend to the corners of the mold sealant. In the aforementioned stocker base ball grid array t, the stiffening film is an electrically insulating polyimide film. The lead frame base ball grid array structure towel just described is a metal piece having an electrically insulating adhesive layer. In the aforementioned lead frame base ball grid array fracture configuration, the stiffener has a plurality of die flow holes that are positioned in the gap between the balls (4) of the 4b reconfiguration pins. The wire is formed with a plurality of pads 2 31 1 in the aforementioned lead frame base ball grid array structure. One of the bonding wires 2*〇, υ is connected to the solder pads 231 of the wafer 230, and the other end is connected to the corresponding inner buckle through the slot 22 1 or the opening of the stiffener 22 - η pendulum 211 to electrically connect the wafer 23 and the lead frame 21 〇. The wafer 230 can be a memory die, a microprocessor die, a logic die, or a special application integrated circuit (asic) die. As shown in FIG. 3, the molding compound 250 seals the internal fingers 2, the reconfiguration pins 212, the wafer 230, and the bonding wires. Preferably, the molding compound 250 covers the lower surface of the lead frame 21 to increase the moisture resistance of the bottom surface of the package structure 200, thereby increasing product reliability. As shown in FIG. 6, the molding compound 25 has a plurality of ball holes 25ι, which expose the ball pads 213, and the ball holes 251 are slightly smaller than the ball pads 2丨3. In order to prevent the conductive ball 26, such as tin-lead material, from being contaminated to the reconfigured pins 212 during reflow. And a plurality of conductive balls 260 are permeable to the ball holes 25 and disposed on the ball pads 213 to form a ball grid array package. In this embodiment, the conductive balls 260 may comprise solder balls. Therefore, the use of the stiffener 220 to be attached to the upper surface of the lead frame 21 has the effect of preventing the displacement of the reconfigurable pins 212 and the ball pads 213 during molding and enhancing the strength of the ball support. In addition, as shown in Figures 3 and 4, preferably, the side of the stiffener 220, the 彖222 is not aligned with the edge of the molding compound 25, and is sealed by the molding compound. The effect of the δ Hai seal structure 200 side moisture resistance. The stiffener 220 further has a plurality of tie bars 223 extending to the corners of the mold seal to provide the stiffener 22 and the lead frame 2 i in the package 1304647 230, a plurality of bonding wires 240, a die The encapsulant 250 and the plurality of conductive balls 260 form a ball grid array (BGA) package type. As shown in FIG. 4, the lead frame 210 has a plurality of internal fingers 211, a plurality of reconfiguration pins 212, and a plurality of ball pads 213. The reconfiguration pins 212 are integrally connected to each other. The connecting finger 2 11 and the ball 塾 2 1 3 can be arranged obliquely in any curved shape and section, so that the ball pads 213 can be arranged in a lattice array, and are not concentrated by a conventional lead frame. One or reduce the size of the ball pad. In addition, in the embodiment, the lead frame 210 further has a wafer holder 214 for a paste placement of a black wafer. Preferably, the lead frame 21 is further provided with a plurality of plating pins 215 which are connected to the corresponding ball pads 213 and extend to the edge of the molding compound 250, before the lead frame is separated. The surface of the ball pads 213 forms a plating layer. As shown in FIGS. 3 and 4, the stiffener 220 is attached to the upper surface of the lead frame 2 i to fix the reconfigurable pins 212 and the ball pads 213 to avoid the molding. The reconfiguration pins 212 are displaced and shorted, and the ball pads 2 13 are prevented from being displaced during the molding process, resulting in a change in the position of the bgA external pins. As shown in FIGS. 4 and 5, the stiffener 220 has at least a slot 221 or an opening to expose the inner fingers 211, and the stiffener has a central opening 224 to reveal the wafer holder. 214 (as shown in Figure 5). In the present embodiment, the stiffener 220 is optionally made of electrically insulating polyimide (PI) film. The wafer 230 is disposed on the lead frame 210. For example, the back surface of the wafer 230 can be adhered to the wafer holder 214 of the lead frame 210 through a central opening 224 of the stiffener 220 by using a known adhesive material. The main surface of the wafer 23 is formed with a plurality of pads 231. One end of the bonding wires 240 is connected to the pads 231 of the wafer 230, and the other end is connected to the corresponding inscribed fingers 2 through the slots 22 1 or openings of the stiffener 22 The wafer 230 and the lead frame 210 are electrically connected. The wafer 23 can be a memory chip, a microprocessor chip, a logic chip, or a special application integrated circuit (Asic) wafer. As shown in FIG. 3, the molding compound 25 seals the internal fingers 211, the reconfiguration pins 212, the wafer 230, and the bonding wires 24A. Preferably, the molding compound 250 covers the lower surface of the lead frame 21 to enhance the moisture resistance of the bottom surface of the package structure 200, thereby increasing product reliability. As shown in FIG. 6, the molding compound 25 has a plurality of ball holes 251, which expose the ball pads 213, and the size of the ball holes 251 is slightly smaller than the "two ball pads 2 1". 3, in order to prevent the conductive ball 260, such as a tin-hot material, from contaminating the reconfigurable pins 212 during reflow. The conductive balls 260 are permeable to the ball holes 25 and disposed on the ball pads. 213, in the form of a ballast array package. In this embodiment, the φ conductive balls 26 can include solder balls. Therefore, the stiffener 22 〇 is attached to the upper surface of the lead frame 210, Preventing the reconfiguration pins 212 and the ball pads 213 from being displaced during molding and improving the strength of the ball support. Further, as shown in FIGS. 3 and 4, preferably, the edge 222 of the stiffener is Not aligned with the edge of the molding compound 25, but sealed by the molding compound 250 to enhance the side moisture resistance of the package structure. The stiffener 220 further has a plurality of tie bars 223 extending to the mold a corner or edge of the encapsulant to provide the stiffener 22〇 with the leadframe in the package 1304 The connection in the process is fixed in 647. Preferably, the central opening 224 of the stiffener 22 is larger than the wafer 230 and smaller than the wafer holder 214, and has the advantage of improving the fixing of the wafer holder 214 and preventing the molding. In the second embodiment of the present invention, another lead frame base ball grid array package structure is disclosed. As shown in FIGS. 7 and 8, a lead frame base ball grid array package structure mainly includes a lead frame 31A, a moving piece 320, a wafer 330, a plurality of glow wires 340, a mold sealing body 350 and a plurality of conductive balls 360. The lead frame 31 has a plurality of internal fingers 3Π, a plurality of weights The pin 312 and the plurality of ball pads 313 are integrally connected to the corresponding inner fingers 3 and the ball pads 313, and the lead frame 3 10 has another A plurality of electric ore pins 3 14 are connected to the ball pads 3 1 3 and extend to the edges of the molding gels 35 to enable electroplating on the surface of the ball pads 313. The stiffeners 320 are attached. On the upper surface of the lead frame 3 1〇, to fix it. The pin 312 is disposed with the ball pads 313, and the stiffener 32 has at least one slot 321 or opening to expose the inner fingers 3 丨丨. In the embodiment, the stiffeners 3 2 The metal sheet 323 having an electrically insulating adhesive layer 3 2 2 has a plurality of pads 331 and the back surface of the wafer 330 is disposed on the metal piece 323 of the stiffener 320. And the bonding wires 340 are electrically connected to the pads of the wafer 33 丨 to the inner fingers 3 11 . The molding compound 350 seals the inner fingers 3 n , the weights The pins 312 are arranged 33 〇 and the bonding wires 34 〇. The conductive balls are arranged 1304647 on the ball pads 3 13, and the conductive balls 360 can include solder balls. Therefore, the package structure 200 has the effect of preventing the displacement of the reconfiguration pins 3 12 and the ball pads 3 1 3 during molding and improving the strength of the ball support.
較佳地，如第8圖所示，該加勁片3 2 0係具有複數 個模流通孔3 2 4，其係位在該些球墊3丨3或該些重配 置引腳3 1 2之間空隙處，而具有幫助該模封膠體3 5 0 :^l動覆蓋到該導線架3 1 0之下表面，以包覆該些内接 指3 1 1與該些重配置引腳3丨2之功效。 以上所述，僅是本發明的較佳實施例而已，並非對 本發明作任何形式上的限制，雖然本發明已以較佳實 施例揭露如上，然而並非用以限定本發明，任何熟悉 本項技術者，在不脫離本發明之技術範圍内，所作的 任何簡單修改、等效性變化與㈣，均仍屬於本發明 的技術範圍内。 【圖式簡單說明】 第1 B · -種習知導線架基底球格陣列封裝構造之截 面不意圖。 =2圖：第1圖中習知封裝構造之導線架示意圖。 第3圖：依據本發明之第—具體實施例，—種導線 基底球格陣列封裝構造之截面示意圖。 第4圖：依據本發明之第-具體實施例，該封裂構 — 之導線架與加勁片之示意圖。 第5圖：依據本發明之第-具體實施例，該封裝構 之加勁片之示意圖。 12Preferably, as shown in FIG. 8, the stiffener 320 has a plurality of die flow holes 326, which are tied to the ball pads 3丨3 or the reconfiguration pins 3 1 2 Between the gaps, the mold encapsulant 3 5 0 : ^ 1 is moved to cover the lower surface of the lead frame 3 1 0 to cover the inner fingers 3 1 1 and the reconfigurable pins 3 丨2 effect. The above is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention. Although the present invention has been disclosed in the above preferred embodiments, it is not intended to limit the present invention. Any simple modifications, equivalent changes, and (4) made without departing from the technical scope of the present invention are still within the technical scope of the present invention. [Simplified Schematic Description] The first B · - the conventional cross-section of the lead frame ball grid array package structure is not intended. = 2 Figure: Schematic diagram of the lead frame of the conventional package structure in Figure 1. Figure 3 is a cross-sectional view showing a wire base array package structure in accordance with a first embodiment of the present invention. Fig. 4 is a schematic view showing the lead frame and the stiffener of the sealing structure according to the first embodiment of the present invention. Figure 5 is a schematic illustration of a stiffener of the package in accordance with a first embodiment of the present invention. 12
13046471304647
第6 圖 :依據 .本發明 之第一具體實施例， 該 封 裝 構 造 在一 球墊處之局部底面示意 圖。 第7 圖 :依據 .本發明 之第二具體實施例， 另 一 種 導 線 架基 底球格陣列封裝構造之 .截面 示 意1 圖 0 第8 圖 :依擄 .本發明 之第二具體實施例， 該 封 裝 構 造 之導 線架與加勁片之示意圖 0 【主 要元件符號說明】 100 導 線架基 底球格 陣列封裝構造 110 導 線架 111 内接指 112 引 腳 1 13 球 墊 114 晶片承座 120 晶 片 121 銲墊 130 銲 線 140 模封膠體 150 銲 球 200 導 線架基 底球格 陣列封裝構造 210 導 線架 211 内接指 212 重 配 置 引 腳 213 球 墊 214 晶片承座 215 電 鍍 引 腳 220 加 勁片 221 開槽 222 邊 緣 223 繫 條 224 中央開口 230 晶 片 23 1 銲墊 240 銲 線 250 模 封膠體 25 1 接球孔 260 導 電球 300 導 線架基 底球格 陣列封裝構造 3 10 導 線架 3 11 内接指 3 12 重 配 置 引 腳 3 13 球 墊 3 14 電鍍引腳 13 、1304647 320 加勁 片 321 323 金屬 片 324 330 晶片 33 1 340 銲線 350 開孔 3 22黏著層 模流通孔 銲墊 模封膠體 360導電球Fig. 6 is a schematic view showing a partial bottom surface of a package at a ball pad in accordance with a first embodiment of the present invention. Figure 7: According to a second embodiment of the present invention, another lead frame base ball grid array package structure. Cross-sectional schematic 1 Figure 0 Figure 8: According to a second embodiment of the present invention, the package Schematic diagram of constructed lead frame and stiffener 0 [Main component symbol description] 100 lead frame base ball grid package structure 110 lead frame 111 internal finger 112 pin 1 13 ball pad 114 wafer holder 120 wafer 121 pad 130 solder Line 140 Molding Glue 150 Solder Ball 200 Lead Frame Base Grid Array Package Construction 210 Lead Frame 211 Internal Finger 212 Reconfiguration Pin 213 Ball Pad 214 Wafer Mount 215 Plating Pin 220 Stiffener 221 Slot 222 Edge 223 Series Strip 224 Central opening 230 Wafer 23 1 Solder pad 240 Bond wire 250 Molding paste 25 1 Ball hole 260 Conductive ball 300 Lead frame Base grid array package construction 3 10 Lead frame 3 11 Internal finger 3 12 Reconfiguration pin 3 13 ball pad 3 14 Plating Pins 13 , 1304647 320 Stiffening Sheets 321 323 Metal Sheets 324 330 Wafers 33 1 340 Bonding Wires 350 Openings 3 22 Adhesive Layers Molded Holes Pads Molded Seals 360 Conductive Balls
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