TWI303477B - - Google Patents
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- Publication number
- TWI303477B TWI303477B TW95126341A TW95126341A TWI303477B TW I303477 B TWI303477 B TW I303477B TW 95126341 A TW95126341 A TW 95126341A TW 95126341 A TW95126341 A TW 95126341A TW I303477 B TWI303477 B TW I303477B
- Authority
- TW
- Taiwan
- Prior art keywords
- layer
- electrode
- type air
- air discharge
- discharge protection
- Prior art date
Links
- 239000010410 layer Substances 0.000 claims description 40
- 239000010949 copper Substances 0.000 claims description 18
- 238000000034 method Methods 0.000 claims description 17
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 15
- 229910052802 copper Inorganic materials 0.000 claims description 15
- 239000011241 protective layer Substances 0.000 claims description 14
- 238000002360 preparation method Methods 0.000 claims description 13
- 239000000758 substrate Substances 0.000 claims description 12
- 229920002120 photoresistant polymer Polymers 0.000 claims description 11
- 239000000463 material Substances 0.000 claims description 9
- 229920000642 polymer Polymers 0.000 claims description 8
- 239000011248 coating agent Substances 0.000 claims description 4
- 238000000576 coating method Methods 0.000 claims description 4
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 4
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 239000007772 electrode material Substances 0.000 claims description 3
- 229910001316 Ag alloy Inorganic materials 0.000 claims description 2
- 229910000838 Al alloy Inorganic materials 0.000 claims description 2
- 229910001020 Au alloy Inorganic materials 0.000 claims description 2
- 239000004593 Epoxy Substances 0.000 claims description 2
- 229910001260 Pt alloy Inorganic materials 0.000 claims description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 2
- 229910001069 Ti alloy Inorganic materials 0.000 claims description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 2
- 239000003822 epoxy resin Substances 0.000 claims description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 2
- 229910052737 gold Inorganic materials 0.000 claims description 2
- 239000010931 gold Substances 0.000 claims description 2
- 239000003353 gold alloy Substances 0.000 claims description 2
- 229910052697 platinum Inorganic materials 0.000 claims description 2
- 229920000647 polyepoxide Polymers 0.000 claims description 2
- 229910052709 silver Inorganic materials 0.000 claims description 2
- 239000004332 silver Substances 0.000 claims description 2
- 239000010936 titanium Substances 0.000 claims description 2
- 229910052719 titanium Inorganic materials 0.000 claims description 2
- 239000002861 polymer material Substances 0.000 claims 2
- 229910000831 Steel Inorganic materials 0.000 claims 1
- 230000008878 coupling Effects 0.000 claims 1
- 238000010168 coupling process Methods 0.000 claims 1
- 238000005859 coupling reaction Methods 0.000 claims 1
- 239000013078 crystal Substances 0.000 claims 1
- QUCZBHXJAUTYHE-UHFFFAOYSA-N gold Chemical compound [Au].[Au] QUCZBHXJAUTYHE-UHFFFAOYSA-N 0.000 claims 1
- 229910052710 silicon Inorganic materials 0.000 claims 1
- 239000010703 silicon Substances 0.000 claims 1
- 239000010959 steel Substances 0.000 claims 1
- 229910052751 metal Inorganic materials 0.000 description 18
- 239000002184 metal Substances 0.000 description 18
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 7
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 6
- 238000005323 electroforming Methods 0.000 description 4
- 229910052759 nickel Inorganic materials 0.000 description 3
- 229910000881 Cu alloy Inorganic materials 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 230000006378 damage Effects 0.000 description 2
- 238000001459 lithography Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000003068 static effect Effects 0.000 description 2
- MAKDTFFYCIMFQP-UHFFFAOYSA-N titanium tungsten Chemical compound [Ti].[W] MAKDTFFYCIMFQP-UHFFFAOYSA-N 0.000 description 2
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- 229910018487 Ni—Cr Inorganic materials 0.000 description 1
- 230000005856 abnormality Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- VNNRSPGTAMTISX-UHFFFAOYSA-N chromium nickel Chemical compound [Cr].[Ni] VNNRSPGTAMTISX-UHFFFAOYSA-N 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000003698 laser cutting Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 230000001960 triggered effect Effects 0.000 description 1
Landscapes
- Thermistors And Varistors (AREA)
- Elimination Of Static Electricity (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW95126341A TW200807673A (en) | 2006-07-19 | 2006-07-19 | Chip typed air-discharge protecting element and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW95126341A TW200807673A (en) | 2006-07-19 | 2006-07-19 | Chip typed air-discharge protecting element and preparation method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200807673A TW200807673A (en) | 2008-02-01 |
| TWI303477B true TWI303477B (enExample) | 2008-11-21 |
Family
ID=44766710
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW95126341A TW200807673A (en) | 2006-07-19 | 2006-07-19 | Chip typed air-discharge protecting element and preparation method thereof |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TW200807673A (enExample) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8089741B2 (en) | 2008-11-28 | 2012-01-03 | Cyntec Co., Ltd. | Over-voltage protection device and method for manufacturing thereof |
| TWI748921B (zh) * | 2021-05-07 | 2021-12-01 | 旭積科技股份有限公司 | 電子裝置及其電容器組件封裝結構 |
-
2006
- 2006-07-19 TW TW95126341A patent/TW200807673A/zh unknown
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8089741B2 (en) | 2008-11-28 | 2012-01-03 | Cyntec Co., Ltd. | Over-voltage protection device and method for manufacturing thereof |
| TWI748921B (zh) * | 2021-05-07 | 2021-12-01 | 旭積科技股份有限公司 | 電子裝置及其電容器組件封裝結構 |
Also Published As
| Publication number | Publication date |
|---|---|
| TW200807673A (en) | 2008-02-01 |
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