TWI300253B - - Google Patents

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Publication number
TWI300253B
TWI300253B TW091109596A TW91109596A TWI300253B TW I300253 B TWI300253 B TW I300253B TW 091109596 A TW091109596 A TW 091109596A TW 91109596 A TW91109596 A TW 91109596A TW I300253 B TWI300253 B TW I300253B
Authority
TW
Taiwan
Prior art keywords
bonding pad
wafer
platform
total reflection
infrared spectrometer
Prior art date
Application number
TW091109596A
Other languages
English (en)
Chinese (zh)
Inventor
Lainjong Li
Syun Ming Jang
Chung Chi Ko
Original Assignee
Taiwan Semiconductor Mfg
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Taiwan Semiconductor Mfg filed Critical Taiwan Semiconductor Mfg
Priority to TW091109596A priority Critical patent/TWI300253B/zh
Application granted granted Critical
Publication of TWI300253B publication Critical patent/TWI300253B/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond

Landscapes

  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
TW091109596A 2002-05-08 2002-05-08 TWI300253B (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW091109596A TWI300253B (ja) 2002-05-08 2002-05-08

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW091109596A TWI300253B (ja) 2002-05-08 2002-05-08

Publications (1)

Publication Number Publication Date
TWI300253B true TWI300253B (ja) 2008-08-21

Family

ID=45069919

Family Applications (1)

Application Number Title Priority Date Filing Date
TW091109596A TWI300253B (ja) 2002-05-08 2002-05-08

Country Status (1)

Country Link
TW (1) TWI300253B (ja)

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees