TWI298962B - - Google Patents
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- Publication number
- TWI298962B TWI298962B TW95134723A TW95134723A TWI298962B TW I298962 B TWI298962 B TW I298962B TW 95134723 A TW95134723 A TW 95134723A TW 95134723 A TW95134723 A TW 95134723A TW I298962 B TWI298962 B TW I298962B
- Authority
- TW
- Taiwan
- Prior art keywords
- manufacturing
- insulating body
- metal layer
- connector according
- layer
- Prior art date
Links
- 239000002184 metal Substances 0.000 claims description 44
- 229910052751 metal Inorganic materials 0.000 claims description 44
- 238000004519 manufacturing process Methods 0.000 claims description 27
- 238000000034 method Methods 0.000 claims description 11
- 239000000126 substance Substances 0.000 claims description 10
- 230000001681 protective effect Effects 0.000 claims description 8
- 238000000576 coating method Methods 0.000 claims description 7
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical group [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 6
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 6
- 239000010931 gold Substances 0.000 claims description 6
- 229910052737 gold Inorganic materials 0.000 claims description 6
- 239000002923 metal particle Substances 0.000 claims description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 238000009413 insulation Methods 0.000 claims description 3
- 229910052759 nickel Inorganic materials 0.000 claims description 3
- 230000035515 penetration Effects 0.000 claims description 3
- 238000004544 sputter deposition Methods 0.000 claims description 3
- 239000012212 insulator Substances 0.000 claims description 2
- 238000007747 plating Methods 0.000 claims description 2
- 239000006188 syrup Substances 0.000 claims description 2
- 235000020357 syrup Nutrition 0.000 claims description 2
- 238000003825 pressing Methods 0.000 description 20
- 230000002093 peripheral effect Effects 0.000 description 12
- 230000006835 compression Effects 0.000 description 6
- 238000007906 compression Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 229920006351 engineering plastic Polymers 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Manufacturing Of Electrical Connectors (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW95134723A TW200816582A (en) | 2006-09-20 | 2006-09-20 | Manufacturing method of connector |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW95134723A TW200816582A (en) | 2006-09-20 | 2006-09-20 | Manufacturing method of connector |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200816582A TW200816582A (en) | 2008-04-01 |
| TWI298962B true TWI298962B (OSRAM) | 2008-07-11 |
Family
ID=44769136
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW95134723A TW200816582A (en) | 2006-09-20 | 2006-09-20 | Manufacturing method of connector |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TW200816582A (OSRAM) |
-
2006
- 2006-09-20 TW TW95134723A patent/TW200816582A/zh not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| TW200816582A (en) | 2008-04-01 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |