TWI297955B - Optical sensor chip package - Google Patents

Description

1297955 jade, invention description (5) 2 0 8 is electrically connected to the connection end 210 ° via a conductive line C, for example, distributed on the exchangeable substrate 2 〇 2 ) 0 4 is disposed in the wafer setting area 2 0 2 a on the flexible substrate 220 and is electrically connected to the pad 2 0 8 via the bonding pad 2 0 8 and the The connection terminal 2 1 电 is electrically connected to the working piece. The light transmissive encapsulant 206 is overlaid on the photo-sensing wafer 220 and the pad 206 of the flexible substrate 220, and covers the photo-sensing wafer 220 with the flexible The substrate 2 0 2 is a mechanically and electrically connected wire. Preferably, as shown in Fig. 2a, the light transmissive encapsulant 206 covers the opposite upper and lower surfaces of the flexible substrate 202. It is worth noting that since the amount of the lower half of the sealable plastic of the permeable sealant is equivalent to the amount of the upper half of the sealant plastic, when it is cooled and solidified, the lower half and the upper half are The shrinkage plastics have the same shrinkage, which can greatly improve the problem of package bending, and reduce the stress on the semiconductor wafer, and can greatly increase the manufacturing yield. It should be noted that the present invention is characterized in that the connection end point 2 1 of the flexible substrate 220 for external connection is only disposed on one side of the flexible substrate 202, and the The photo-sensing wafer 404 and the permeable sealant 2 〇6 are disposed on the other side of the flexible substrate 220. Preferably, the side of the flexible substrate 220 provided with the connection terminals 2 1 可 may extend only from one side 206a of the light transmissive encapsulant 206. Since the connection end point 210 and the optical sensing chip 204 are respectively disposed at the two ends of the optical sensing chip package structure 1 , the wafer setting area 202a and the end part 202b can be designed Has an angle. As shown in Figure 28’

00699-TW.ptd Page 9 1297955 V. Description of the Invention (6) The angle between the wafer setting area 2 0 2 a and the end portion 2 0 2 b is 1 800 0; in addition, as shown in Figures 2b and 2c It is shown that the angle between the wafer setting region 2 0 2a and the end portion 2 0 2b is 90 分别 and the approach 〇〇 (ie, the wafer setting region 2 0 2a and the end portion 2 〇 2 b are parallel to each other). In this way, the angle between the wafer setting area 202a and the end portion 2 0 2 b can be freely designed according to the direction of incidence of the optical signal (indicated by the arrow), so that the optical sensing wafer 204 and the working piece can be freely designed. There is a proper relative orientation between them. According to an embodiment of the present invention, as shown in Fig. 2a, the connection end point 2 1 of the flexible substrate 2 〇 2 may be a connection pad formed of a conductive film such as a metal thin film. More specifically, the connection pad 2 10 can be a copper connection interface, and the surface thereof is plated with a layer of nickel on the surface of the connection pad 21 and a layer of gold on the nickel layer, thereby protecting the connection. The surface of the pad 2 1〇 is not corrosed, oxidized or contaminated, ensuring the joint 213 and the work piece reliability (joint rel iabi 1 ity ). According to another embodiment of the present invention, the connection end of the flexible substrate 2 〇 2 may also be a hard conductive pin 306 and from the end of the flexible substrate 2 〇 2 2 2 2b The side extends outside the flexible substrate 220, thereby being connected to a workpiece by means of plugging. The invention further provides an optical sensing chip package structure 4, as shown in Fig. 4. The inductive chip package structure 4 includes a lead frame 402 as a wafer carrier, an optical sensing chip 204, and a light transmissive encapsulant 206. y The lead frame 420 has a plurality of pins 4〇4 and a wafer holder ,6, wherein the pins 404 each have an inner lead portion 4〇4a and an outer lead portion

1297955 V. Description of the Invention (7) _ ^ " The optical sensing chip 1024 is disposed on the wafer carrier of the lead frame 420 and electrically connected to the inner lead portion of the pins 404 4〇4a. The light transmissive encapsulant 2 〇 6 is overlaid on the photo-sensing wafer 2 〇 4, the wafer holder 4〇6 of the lead frame, and the inner lead portions 4〇4a. All of the outer lead portions 4 〇 4 b of the lead frame _ extend from the side 2 0 6 a of the light transmissive sealant 2 〇 6 . That is, the photo-sensing wafer 2 〇 4 is disposed on one side of the lead frame 420 from the light-transmissive encapsulant 206, and all of the external leads on the guide frame 40 2 The leg portions 4〇4b are all disposed on opposite sides of the optically inductive chip package structure 400. The lead portion 404b of the lead frame 420 may have an angle with the wafer holder 406. The angle of the angle is between the twist and the 18 〇. In this way, the optical sensing wafer 2 〇 4 and the workpiece have an appropriate relative orientation. When the optical sensing chip package structure is heated, the wafer carrier (for example, a flexible substrate or a lead frame) has the photo-sensitive wafer and the side of the light-transmitting sealing body is subjected to stress caused by a mismatch in thermal expansion coefficient. It may cause bending or deformation. However, since all the external connection end points are only disposed on the flexible substrate or the other side of the lead frame, the flexible substrate or the lead frame is bent or deformed on one side thereof on the opposite side thereof. It is difficult to influence, so it can effectively reduce the influence of the bending or deformation of the substrate (or lead frame) on the external connection end point. Therefore, the connection terminal, the conductive pin or the outer lead portion can smoothly connect the connection portion of the working member such as a slot, and ensure the connection reliability of the optical sensing chip package structure and the workpiece. Although the invention has been disclosed in the foregoing preferred embodiments, it is not intended to be limiting

〇〇 699-TW.ptd Page 11 1297955 V. INSTRUCTIONS (8) In the present invention, various changes and modifications can be made without departing from the spirit and scope of the invention. Therefore, the scope of protection of the present invention is defined by the scope of the appended claims. ❶ ❿

00699-TW.ptd Page 12 1279955 IV. Abstract of the Invention (Invention Name: Optically Sensitive Wafer Package Construction) An optical sensing chip package structure comprising a flexible substrate, an optical sensing wafer and a light transmissive encapsulant . The flexible substrate has a plurality of pads and a plurality of connection terminals for external connection, wherein the pads are electrically connected to the connection terminals. The optical sensing chip is disposed on the flexible substrate and electrically connected to a plurality of pads of the flexible substrate. The permeable sealant covers the photo-sensing wafer and the pad of the flexible substrate. The plurality of connection ends of the flexible substrate are disposed only on one side of the slidable substrate. V. (1) The representative figure of this case is: ____2a____ diagram (2), the representative symbol of the representative figure of this case is a simple description: 2 0 0 optical sensing chip package structure 2 0 2 flexible substrate 202a wafer setting area 202b Side six, English invention summary (invention name: OPTICAL SENSOR CHIP PACKAGE)

An optical sensor chip package includes a flexible substrate, an optical sensor chip and a transparent encapsulation body. The flexible substrate has a plurality of contact pads and a plurality of terminals for making external connections, wherein the contact pads are electrically connected to the terminals. The optical sensor chip is disposed on the flexible

00699-TW.ptd Page 2 1297955 IV. Abstract of Chinese Invention (Invention Name: Optical Sensing Wafer 2 0 4 Optical Sensing Wafer 206a Side 2 10 Connection End Point 2 0 6 Translucent Sealant 2 0 8 Pad 〇6 The transparent encapsulation body covers the optica sensor chip and the contact pads of the flexible substrate, the terminals of the flexible, the transparent encapsulation body covers the optica sensor chip and the contact pads of the flexible substrate, the terminals of the flexible Substrate are all formed on only one side of the flexible substrate.

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Claims (1)

1297955 IV. Abstract of the Invention (Invention Name: Optically Sensitive Wafer Package Construction) An optically sensitive wafer package structure comprising a flexible substrate, an optical sensing wafer, and a light transmissive encapsulant. The flexible substrate has a plurality of pads and a plurality of connection terminals for external connection, wherein the pads are electrically connected to the connection terminals. The optical sensing chip is disposed on the flexible substrate and electrically connected to a plurality of pads of the flexible substrate. The permeable sealant covers the photo-sensing wafer and the pad of the flexible substrate. The plurality of connection ends of the flexible substrate are disposed only on one side of the slidable substrate. V. (1) The representative figure of this case is: ____2a____ diagram (2), the representative symbol of the representative figure of this case is a simple description: 2 0 0 optical sensing chip package structure 2 0 2 flexible substrate 202a wafer setting area 202b The optical substrate chip package includes a flexible substrate, an optical sensor chip and a transparent encapsulation body. The flexible substrate has a plurality of contact pads and a plurality of terminals For making external connections, the contact pads are electrically connected to the terminals. The optical sensor chip is disposed on the flexible 00699-TW.ptd Page 2 1297955 IV. Abstract of Chinese Invention (Invention Name: Optical Sensing Wafer 2 0 4 Optical Sensing Wafer 206a Side 2 10 Connection End Point 2 0 6 Translucent Sealant 2 0 8 Pad 〇6 The transparent encapsulation body covers the optica sensor chip and the contact pads of the flexible substrate, the terminals of the flexible, the transparent encapsulation body covers the optica sensor chip and the contact pads of the flexible substrate, the terminals of the flexible Substrate are all formed on only one side of the flexible substrate. 00699-TW.ptd Page 3, 1297955 曰 ____ Case No. 921167! ^ Brief Description of the Drawings [Simple Description of the Drawings] In order to make the above and other objects, features, and advantages of the present invention more apparent, DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The preferred embodiments of the present invention will be described in detail below with reference to the accompanying drawings. 1 a is a view of a conventional optical sensing chip package structure, showing a plurality of connection terminals disposed on a lower surface of the substrate for electrically connecting to corresponding pads on a printed circuit board; 1b is a different view of a conventional optical sensing chip package structure showing mechanically and electrically connecting the optical sensing chip package structure to the printed circuit board using a plurality of solder balls; 曰 2a-2c: A cross-sectional view of an optical sensing chip package structure according to an embodiment of the present invention, wherein a side of a wafer mounting region of the flexible substrate and a connecting end of the flexible substrate has a temperature of 180, 90, and Angle of formation 3 is a top view of an optically-sensitive wafer package structure according to another embodiment of the present invention; and FIG. 4 is a top view of an optical sensor chip package structure according to still another embodiment of the present invention. Description of the drawings: 100 Optical sensor chip Package structure 102 Substrate 104 Optical sensor wafer 106 Wire 108 Transparent encapsulant 110 Connection end point 112 Printed circuit board 114 Pad 116 2〇〇 Tin ball Optical sensor chip Package structure 202 Flexible substrate 0〇699-την-Amendment ptc Page 13 ^ 1297955 _ Case No. 92116795_ Year of the month correction diagram Simple description 2 0 2a Wafer setting area 2 0 2b End 204 Optical sensing wafer 2 06 Translucent sealing body 2 0 6a side 2 08 pad 210 connection end 300 optical sensing chip package construction 302 conductive pin 400 optical sensing chip package construction 402 lead frame 404 pin 404a inner pin portion 404b outer pin portion 406 wafer holder 00699 - TW - Amendment. ptc Page 14 1279955 ... _m 92116795 _ Year R R Chromium _ VI. Patent Scope 1. An optical sensing chip package construction comprising: a flexible substrate having a plurality of pads And a plurality of connection terminals for externally connecting 'where the pads are electrically connected to the connection terminals; an optical sensing chip' is disposed on the flexible substrate and is connected to the flexible substrate a conductive connection; and a light transmissive encapsulant covering the photo-sensing wafer and the pads of the flexible substrate and covering the flexible substrate above and below, wherein the flexible substrate The connection end points are all disposed only on one side of the flexible substrate. 2. The optically inductive chip package structure of claim 1, wherein the permeable sealant covers the upper and lower portions of the flexible substrate. 3. The optically inductive chip package structure of claim 1, wherein the connecting ends of the flexible substrate comprise a gold film formed on a surface thereof. 4. The optically inductive chip package structure of claim 1, wherein the connection end points comprise a copper layer formed on the surface of the flexible substrate, a nickel layer formed on the copper layer, and a gold layer. A layer is formed on the nickel layer. 5. The optical sensing chip package structure of claim 1, wherein the connecting end points of the flexible substrate are rigid pins and are opposite to each other. 00699-TW-Amendment _ptc第15页