TWI295113B - - Google Patents
Download PDFInfo
- Publication number
- TWI295113B TWI295113B TW94122829A TW94122829A TWI295113B TW I295113 B TWI295113 B TW I295113B TW 94122829 A TW94122829 A TW 94122829A TW 94122829 A TW94122829 A TW 94122829A TW I295113 B TWI295113 B TW I295113B
- Authority
- TW
- Taiwan
- Prior art keywords
- wafer
- component
- substrate
- passive
- passive component
- Prior art date
Links
- 235000012431 wafers Nutrition 0.000 claims description 64
- 239000000758 substrate Substances 0.000 claims description 38
- 238000000034 method Methods 0.000 claims description 28
- 229910000679 solder Inorganic materials 0.000 claims description 11
- 239000000565 sealant Substances 0.000 claims description 6
- 238000000576 coating method Methods 0.000 claims description 5
- 239000003990 capacitor Substances 0.000 claims description 4
- 239000011248 coating agent Substances 0.000 claims description 4
- 238000009434 installation Methods 0.000 claims description 4
- 238000010276 construction Methods 0.000 claims description 3
- 238000007789 sealing Methods 0.000 claims description 3
- 230000008020 evaporation Effects 0.000 claims description 2
- 238000001704 evaporation Methods 0.000 claims description 2
- 229910052751 metal Inorganic materials 0.000 claims description 2
- 239000002184 metal Substances 0.000 claims description 2
- 238000007747 plating Methods 0.000 claims description 2
- 239000008280 blood Substances 0.000 claims 2
- 210000004369 blood Anatomy 0.000 claims 2
- 239000000126 substance Substances 0.000 claims 2
- 238000011900 installation process Methods 0.000 claims 1
- 238000005516 engineering process Methods 0.000 description 14
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 9
- 238000005476 soldering Methods 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 5
- 239000013078 crystal Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 229910052742 iron Inorganic materials 0.000 description 3
- 238000004806 packaging method and process Methods 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 229920002120 photoresistant polymer Polymers 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000013500 data storage Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 238000010899 nucleation Methods 0.000 description 1
- 238000012858 packaging process Methods 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000010025 steaming Methods 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Landscapes
- Credit Cards Or The Like (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW094122829A TW200703684A (en) | 2005-07-06 | 2005-07-06 | Packaging method of memory card device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW094122829A TW200703684A (en) | 2005-07-06 | 2005-07-06 | Packaging method of memory card device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200703684A TW200703684A (en) | 2007-01-16 |
| TWI295113B true TWI295113B (enrdf_load_stackoverflow) | 2008-03-21 |
Family
ID=45068342
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW094122829A TW200703684A (en) | 2005-07-06 | 2005-07-06 | Packaging method of memory card device |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TW200703684A (enrdf_load_stackoverflow) |
-
2005
- 2005-07-06 TW TW094122829A patent/TW200703684A/zh not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| TW200703684A (en) | 2007-01-16 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US8030135B2 (en) | Methods for a multiple die integrated circuit package | |
| US7352058B2 (en) | Methods for a multiple die integrated circuit package | |
| TW483074B (en) | Semiconductor apparatus, its manufacturing method, circuit board and electronic machine | |
| CN100547778C (zh) | 柔性电路衬底及形成方法以及包括柔性电路衬底的组件 | |
| US20110019370A1 (en) | Flexible circuit module | |
| JP4766050B2 (ja) | 電子回路装置の製造方法 | |
| CN102771200A (zh) | 多层印刷电路板及其制造方法 | |
| CN102316664A (zh) | 柔性电路板及其制作方法 | |
| JP2001085592A (ja) | 半導体装置及びその製造方法、回路基板並びに電子機器 | |
| US20110100549A1 (en) | Method for manufacturing component-embedded module | |
| JP4945682B2 (ja) | 半導体記憶装置およびその製造方法 | |
| CN204067348U (zh) | 晶片的正、背面间电性连接结构 | |
| JP2011187912A (ja) | 電子素子内蔵型印刷回路基板及びその製造方法 | |
| KR101167453B1 (ko) | 전자부품 내장형 인쇄회로기판 및 그 제조방법 | |
| JP2001036246A (ja) | 配線基板およびこれを用いた多層配線基板 | |
| TW200830498A (en) | Manufacturing method for integrating passive component within substrate | |
| TWI295113B (enrdf_load_stackoverflow) | ||
| CN101752338A (zh) | 球栅阵列封装结构及其封装工艺 | |
| CN101958292B (zh) | 印刷电路板、封装件及其制造方法 | |
| CN111293094A (zh) | 微型感测器 | |
| CN106611752B (zh) | 芯片正背面之间的电性连接结构及其制造方法 | |
| CN105810659A (zh) | 封装装置及其制作方法 | |
| CN1897018B (zh) | 记忆卡元件构装方法 | |
| JPH08167676A (ja) | 半導体装置 | |
| JP2004200665A6 (ja) | 半導体装置およびその製造方法 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |