TWI292927B - Adjustable implantation angle workpiece support structure for an ion beam implanter - Google Patents
Adjustable implantation angle workpiece support structure for an ion beam implanter Download PDFInfo
- Publication number
- TWI292927B TWI292927B TW092118690A TW92118690A TWI292927B TW I292927 B TWI292927 B TW I292927B TW 092118690 A TW092118690 A TW 092118690A TW 92118690 A TW92118690 A TW 92118690A TW I292927 B TWI292927 B TW I292927B
- Authority
- TW
- Taiwan
- Prior art keywords
- workpiece
- ion beam
- chamber
- rotating member
- implant
- Prior art date
Links
- 238000010884 ion-beam technique Methods 0.000 title claims description 97
- 238000002513 implantation Methods 0.000 title claims description 24
- 239000007943 implant Substances 0.000 claims description 53
- 150000002500 ions Chemical class 0.000 claims description 20
- 238000000034 method Methods 0.000 claims description 8
- 239000000463 material Substances 0.000 claims description 4
- 230000003116 impacting effect Effects 0.000 claims description 3
- 238000005468 ion implantation Methods 0.000 claims 5
- 230000003068 static effect Effects 0.000 claims 2
- 238000004891 communication Methods 0.000 claims 1
- 230000005611 electricity Effects 0.000 claims 1
- 239000012530 fluid Substances 0.000 claims 1
- 239000010977 jade Substances 0.000 claims 1
- 238000010408 sweeping Methods 0.000 claims 1
- 235000012431 wafers Nutrition 0.000 description 8
- 239000004065 semiconductor Substances 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 235000017166 Bambusa arundinacea Nutrition 0.000 description 1
- 235000017491 Bambusa tulda Nutrition 0.000 description 1
- 241001330002 Bambuseae Species 0.000 description 1
- 235000015334 Phyllostachys viridis Nutrition 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 230000003466 anti-cipated effect Effects 0.000 description 1
- 239000011425 bamboo Substances 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 210000003127 knee Anatomy 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
- H01J37/317—Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation
- H01J37/3171—Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation for ion implantation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/20—Positioning, supporting, modifying or maintaining the physical state of objects being observed or treated
- H01J2237/202—Movement
- H01J2237/20207—Tilt
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/20—Positioning, supporting, modifying or maintaining the physical state of objects being observed or treated
- H01J2237/202—Movement
- H01J2237/20221—Translation
- H01J2237/20235—Z movement or adjustment
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Physical Vapour Deposition (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US10/192,344 US6710360B2 (en) | 2002-07-10 | 2002-07-10 | Adjustable implantation angle workpiece support structure for an ion beam implanter |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200405442A TW200405442A (en) | 2004-04-01 |
| TWI292927B true TWI292927B (en) | 2008-01-21 |
Family
ID=30114329
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW092118690A TWI292927B (en) | 2002-07-10 | 2003-07-09 | Adjustable implantation angle workpiece support structure for an ion beam implanter |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US6710360B2 (enExample) |
| EP (1) | EP1520287A1 (enExample) |
| JP (1) | JP4320471B2 (enExample) |
| CN (1) | CN100468605C (enExample) |
| AU (1) | AU2003248915A1 (enExample) |
| TW (1) | TWI292927B (enExample) |
| WO (1) | WO2004006283A1 (enExample) |
Families Citing this family (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4061044B2 (ja) * | 2001-10-05 | 2008-03-12 | 住友重機械工業株式会社 | 基板移動装置 |
| US6774373B2 (en) * | 2002-07-29 | 2004-08-10 | Axcelis Technologies, Inc. | Adjustable implantation angle workpiece support structure for an ion beam implanter |
| US6900444B2 (en) * | 2002-07-29 | 2005-05-31 | Axcelis Technologies, Inc. | Adjustable implantation angle workpiece support structure for an ion beam implanter |
| US6740894B1 (en) * | 2003-02-21 | 2004-05-25 | Axcelis Technologies, Inc. | Adjustable implantation angle workpiece support structure for an ion beam implanter utilizing a linear scan motor |
| US20070063147A1 (en) * | 2004-06-14 | 2007-03-22 | Semiconductor Energy Laboratory Co., Ltd. | Doping device |
| US7745293B2 (en) * | 2004-06-14 | 2010-06-29 | Semiconductor Energy Laboratory Co., Ltd | Method for manufacturing a thin film transistor including forming impurity regions by diagonal doping |
| US6992309B1 (en) | 2004-08-13 | 2006-01-31 | Axcelis Technologies, Inc. | Ion beam measurement systems and methods for ion implant dose and uniformity control |
| US6992310B1 (en) | 2004-08-13 | 2006-01-31 | Axcelis Technologies, Inc. | Scanning systems and methods for providing ions from an ion beam to a workpiece |
| US7276712B2 (en) * | 2005-07-01 | 2007-10-02 | Axcelis Technologies, Inc. | Method and apparatus for scanning a workpiece in a vacuum chamber of an ion beam implanter |
| DE102006027820B4 (de) * | 2006-06-16 | 2008-04-03 | All Welding Technologies Ag | Kammeranordnung zur Verwendung bei der Elektronenstrahlbearbeitung |
| US9611540B2 (en) * | 2008-12-22 | 2017-04-04 | Axcelis Technologies, Inc. | Electrostatic chuck shielding mechanism |
| CN103928282B (zh) * | 2014-05-06 | 2016-03-16 | 武汉大学 | 一种离子注入样品台 |
| JP6292310B2 (ja) * | 2014-09-25 | 2018-03-14 | 三菱電機株式会社 | イオン注入装置 |
| US20160111254A1 (en) * | 2014-10-16 | 2016-04-21 | Varian Semiconductor Equipment Associates, Inc. | Workpiece Processing Method And Apparatus |
| US10325752B1 (en) * | 2018-03-27 | 2019-06-18 | Varian Semiconductor Equipment Associates, Inc. | Performance extraction set |
| CN111398404B (zh) * | 2020-05-15 | 2025-06-03 | 浙江师范大学 | 碰撞角度及探测角度均可独立调谐的交叉分子束实验装置 |
| CN118919385B (zh) * | 2024-07-16 | 2025-10-03 | 颀中科技（苏州）有限公司 | 载具 |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4761559A (en) | 1986-09-24 | 1988-08-02 | Eaton Corporation | Ion beam implantation display method and apparatus |
| US4975586A (en) * | 1989-02-28 | 1990-12-04 | Eaton Corporation | Ion implanter end station |
| US5229615A (en) | 1992-03-05 | 1993-07-20 | Eaton Corporation | End station for a parallel beam ion implanter |
| US5444597A (en) | 1993-01-15 | 1995-08-22 | Blake; Julian G. | Wafer release method and apparatus |
| US5436790A (en) | 1993-01-15 | 1995-07-25 | Eaton Corporation | Wafer sensing and clamping monitor |
| US5898179A (en) * | 1997-09-10 | 1999-04-27 | Orion Equipment, Inc. | Method and apparatus for controlling a workpiece in a vacuum chamber |
| US6222196B1 (en) * | 1998-11-19 | 2001-04-24 | Axcelis Technologies, Inc. | Rotatable workpiece support including cyclindrical workpiece support surfaces for an ion beam implanter |
| US6065499A (en) * | 1998-12-21 | 2000-05-23 | Eaton Corporation | Lateral stress relief mechanism for vacuum bellows |
| GB2349269A (en) * | 1999-04-19 | 2000-10-25 | Applied Materials Inc | Ion implanter |
| US6207959B1 (en) | 1999-04-19 | 2001-03-27 | Applied Materials, Inc. | Ion implanter |
| KR100298587B1 (ko) * | 1999-11-22 | 2001-11-05 | 윤종용 | 이온 주입 장치 |
| US6677599B2 (en) * | 2000-03-27 | 2004-01-13 | Applied Materials, Inc. | System and method for uniformly implanting a wafer with an ion beam |
| GB2386469B (en) * | 2001-11-14 | 2006-05-17 | Varian Semiconductor Equipment | Scan methods and apparatus for ion implantation |
-
2002
- 2002-07-10 US US10/192,344 patent/US6710360B2/en not_active Expired - Lifetime
-
2003
- 2003-07-09 TW TW092118690A patent/TWI292927B/zh active
- 2003-07-10 CN CNB038163098A patent/CN100468605C/zh not_active Expired - Fee Related
- 2003-07-10 AU AU2003248915A patent/AU2003248915A1/en not_active Abandoned
- 2003-07-10 WO PCT/US2003/021527 patent/WO2004006283A1/en not_active Ceased
- 2003-07-10 EP EP03763426A patent/EP1520287A1/en not_active Withdrawn
- 2003-07-10 JP JP2004520092A patent/JP4320471B2/ja not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| CN1669107A (zh) | 2005-09-14 |
| US20040007678A1 (en) | 2004-01-15 |
| WO2004006283A1 (en) | 2004-01-15 |
| AU2003248915A1 (en) | 2004-01-23 |
| EP1520287A1 (en) | 2005-04-06 |
| US6710360B2 (en) | 2004-03-23 |
| JP2005533340A (ja) | 2005-11-04 |
| TW200405442A (en) | 2004-04-01 |
| CN100468605C (zh) | 2009-03-11 |
| JP4320471B2 (ja) | 2009-08-26 |
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