TWI290754B - Retaining ring with conductive portion - Google Patents

Retaining ring with conductive portion Download PDF

Info

Publication number
TWI290754B
TWI290754B TW094115427A TW94115427A TWI290754B TW I290754 B TWI290754 B TW I290754B TW 094115427 A TW094115427 A TW 094115427A TW 94115427 A TW94115427 A TW 94115427A TW I290754 B TWI290754 B TW I290754B
Authority
TW
Taiwan
Prior art keywords
conductive
substrate
ring
conductive portion
retaining ring
Prior art date
Application number
TW094115427A
Other languages
English (en)
Chinese (zh)
Other versions
TW200603348A (en
Inventor
Antoine P Manens
Suresh Shrauti
Alain Duboust
Yan Wang
Liang-Yuh Chen
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US11/003,083 external-priority patent/US7608173B2/en
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of TW200603348A publication Critical patent/TW200603348A/zh
Application granted granted Critical
Publication of TWI290754B publication Critical patent/TWI290754B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B24B37/32—Retaining rings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
TW094115427A 2004-05-13 2005-05-12 Retaining ring with conductive portion TWI290754B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US57104904P 2004-05-13 2004-05-13
US11/003,083 US7608173B2 (en) 2004-12-02 2004-12-02 Biased retaining ring

Publications (2)

Publication Number Publication Date
TW200603348A TW200603348A (en) 2006-01-16
TWI290754B true TWI290754B (en) 2007-12-01

Family

ID=34969425

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094115427A TWI290754B (en) 2004-05-13 2005-05-12 Retaining ring with conductive portion

Country Status (4)

Country Link
JP (1) JP2007537052A (ko)
KR (2) KR20080058514A (ko)
TW (1) TWI290754B (ko)
WO (1) WO2005113193A1 (ko)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7789736B2 (en) 2006-10-13 2010-09-07 Applied Materials, Inc. Stepped retaining ring
US8496511B2 (en) 2010-07-15 2013-07-30 3M Innovative Properties Company Cathodically-protected pad conditioner and method of use
KR101701870B1 (ko) * 2010-08-06 2017-02-02 어플라이드 머티어리얼스, 인코포레이티드 유지 링에 의한 기판 엣지 튜닝
JP2015128161A (ja) * 2014-12-25 2015-07-09 国立大学法人大阪大学 研磨方法
KR101675560B1 (ko) * 2015-11-02 2016-11-14 주식회사 윌비에스엔티 화학적 기계 연마 장치의 리테이너 링

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5911619A (en) * 1997-03-26 1999-06-15 International Business Machines Corporation Apparatus for electrochemical mechanical planarization
US6375549B1 (en) * 2000-03-17 2002-04-23 Motorola, Inc. Polishing head for wafer, and method for polishing
US6776693B2 (en) * 2001-12-19 2004-08-17 Applied Materials Inc. Method and apparatus for face-up substrate polishing
JP2003347243A (ja) * 2002-05-27 2003-12-05 Sony Corp 研磨方法、研磨装置及び半導体装置の製造方法
DE10261306B4 (de) * 2002-12-27 2010-02-25 Advanced Micro Devices, Inc., Sunnyvale Haltering mit reduzierter Abnutzungs- und Kontaminationsrate für einen Polierkopf einer CMP-Anlage und Polierkopf und CMP-Vorrichtung mit Haltering
JP2005317625A (ja) * 2004-04-27 2005-11-10 Tokyo Seimitsu Co Ltd 化学的機械研磨装置及びウェーハ

Also Published As

Publication number Publication date
TW200603348A (en) 2006-01-16
KR20070011599A (ko) 2007-01-24
WO2005113193A1 (en) 2005-12-01
JP2007537052A (ja) 2007-12-20
KR20080058514A (ko) 2008-06-25
KR100861588B1 (ko) 2008-10-07

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Legal Events

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MM4A Annulment or lapse of patent due to non-payment of fees