JP2007537052A - 導電部を備えた保持リング - Google Patents

導電部を備えた保持リング Download PDF

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Publication number
JP2007537052A
JP2007537052A JP2007513299A JP2007513299A JP2007537052A JP 2007537052 A JP2007537052 A JP 2007537052A JP 2007513299 A JP2007513299 A JP 2007513299A JP 2007513299 A JP2007513299 A JP 2007513299A JP 2007537052 A JP2007537052 A JP 2007537052A
Authority
JP
Japan
Prior art keywords
conductive
retaining ring
polishing
conductive portion
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2007513299A
Other languages
English (en)
Japanese (ja)
Other versions
JP2007537052A5 (ko
Inventor
アントイン ピー マネンス
スレシュ シュラウチ
アライン ドゥボウスト
ヤン ワング
リアング ユー チェン
フェング キュー ルイ
ポウル ディー バターフィールド
ラシッド マブリエブ
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Applied Materials Inc
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US11/003,083 external-priority patent/US7608173B2/en
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of JP2007537052A publication Critical patent/JP2007537052A/ja
Publication of JP2007537052A5 publication Critical patent/JP2007537052A5/ja
Pending legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B24B37/32—Retaining rings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
JP2007513299A 2004-05-13 2005-05-11 導電部を備えた保持リング Pending JP2007537052A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US57104904P 2004-05-13 2004-05-13
US11/003,083 US7608173B2 (en) 2004-12-02 2004-12-02 Biased retaining ring
PCT/US2005/016431 WO2005113193A1 (en) 2004-05-13 2005-05-11 Retaining ring with conductive portion

Publications (2)

Publication Number Publication Date
JP2007537052A true JP2007537052A (ja) 2007-12-20
JP2007537052A5 JP2007537052A5 (ko) 2008-07-03

Family

ID=34969425

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007513299A Pending JP2007537052A (ja) 2004-05-13 2005-05-11 導電部を備えた保持リング

Country Status (4)

Country Link
JP (1) JP2007537052A (ko)
KR (2) KR100861588B1 (ko)
TW (1) TWI290754B (ko)
WO (1) WO2005113193A1 (ko)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015128161A (ja) * 2014-12-25 2015-07-09 国立大学法人大阪大学 研磨方法
KR101675560B1 (ko) * 2015-11-02 2016-11-14 주식회사 윌비에스엔티 화학적 기계 연마 장치의 리테이너 링

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7789736B2 (en) 2006-10-13 2010-09-07 Applied Materials, Inc. Stepped retaining ring
US8496511B2 (en) 2010-07-15 2013-07-30 3M Innovative Properties Company Cathodically-protected pad conditioner and method of use
KR101882708B1 (ko) 2010-08-06 2018-07-27 어플라이드 머티어리얼스, 인코포레이티드 유지 링에 의한 기판 엣지 튜닝

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10270412A (ja) * 1997-03-26 1998-10-09 Internatl Business Mach Corp <Ibm> ワークピースを平坦化する方法および装置
JP2003347243A (ja) * 2002-05-27 2003-12-05 Sony Corp 研磨方法、研磨装置及び半導体装置の製造方法
JP2005317625A (ja) * 2004-04-27 2005-11-10 Tokyo Seimitsu Co Ltd 化学的機械研磨装置及びウェーハ

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6375549B1 (en) * 2000-03-17 2002-04-23 Motorola, Inc. Polishing head for wafer, and method for polishing
US6776693B2 (en) * 2001-12-19 2004-08-17 Applied Materials Inc. Method and apparatus for face-up substrate polishing
DE10261306B4 (de) * 2002-12-27 2010-02-25 Advanced Micro Devices, Inc., Sunnyvale Haltering mit reduzierter Abnutzungs- und Kontaminationsrate für einen Polierkopf einer CMP-Anlage und Polierkopf und CMP-Vorrichtung mit Haltering

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10270412A (ja) * 1997-03-26 1998-10-09 Internatl Business Mach Corp <Ibm> ワークピースを平坦化する方法および装置
JP2003347243A (ja) * 2002-05-27 2003-12-05 Sony Corp 研磨方法、研磨装置及び半導体装置の製造方法
JP2005317625A (ja) * 2004-04-27 2005-11-10 Tokyo Seimitsu Co Ltd 化学的機械研磨装置及びウェーハ

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015128161A (ja) * 2014-12-25 2015-07-09 国立大学法人大阪大学 研磨方法
KR101675560B1 (ko) * 2015-11-02 2016-11-14 주식회사 윌비에스엔티 화학적 기계 연마 장치의 리테이너 링

Also Published As

Publication number Publication date
KR20080058514A (ko) 2008-06-25
TWI290754B (en) 2007-12-01
KR20070011599A (ko) 2007-01-24
WO2005113193A1 (en) 2005-12-01
TW200603348A (en) 2006-01-16
KR100861588B1 (ko) 2008-10-07

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