TWI289243B - Method, apparatus and system for process control at an interconnect level and computer readable program storage device - Google Patents
Method, apparatus and system for process control at an interconnect level and computer readable program storage device Download PDFInfo
- Publication number
- TWI289243B TWI289243B TW092125872A TW92125872A TWI289243B TW I289243 B TWI289243 B TW I289243B TW 092125872 A TW092125872 A TW 092125872A TW 92125872 A TW92125872 A TW 92125872A TW I289243 B TWI289243 B TW I289243B
- Authority
- TW
- Taiwan
- Prior art keywords
- control
- interconnection
- interconnect
- workpiece
- controller
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B19/00—Programme-control systems
- G05B19/02—Programme-control systems electric
- G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
- G05B19/4183—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by data acquisition, e.g. workpiece identification
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B2219/00—Program-control systems
- G05B2219/30—Nc systems
- G05B2219/32—Operator till task planning
- G05B2219/32183—Test cell
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B2219/00—Program-control systems
- G05B2219/30—Nc systems
- G05B2219/36—Nc in input of data, input key till input tape
- G05B2219/36284—Use of database for machining parameters, material, cutting method, tools
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B2219/00—Program-control systems
- G05B2219/30—Nc systems
- G05B2219/45—Nc applications
- G05B2219/45026—Circuit board, pcb
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B2219/00—Program-control systems
- G05B2219/30—Nc systems
- G05B2219/45—Nc applications
- G05B2219/45031—Manufacturing semiconductor wafers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/544—Marks applied to semiconductor devices or parts
- H01L2223/54453—Marks applied to semiconductor devices or parts for use prior to dicing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
- Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Automation & Control Theory (AREA)
- Quality & Reliability (AREA)
- General Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Control By Computers (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US10/260,894 US6842661B2 (en) | 2002-09-30 | 2002-09-30 | Process control at an interconnect level |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200408920A TW200408920A (en) | 2004-06-01 |
| TWI289243B true TWI289243B (en) | 2007-11-01 |
Family
ID=32029815
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW092125872A TWI289243B (en) | 2002-09-30 | 2003-09-19 | Method, apparatus and system for process control at an interconnect level and computer readable program storage device |
Country Status (9)
| Country | Link |
|---|---|
| US (1) | US6842661B2 (enExample) |
| JP (1) | JP2006501676A (enExample) |
| KR (1) | KR101001347B1 (enExample) |
| CN (1) | CN1685494A (enExample) |
| AU (1) | AU2003270745A1 (enExample) |
| DE (1) | DE10393397B4 (enExample) |
| GB (1) | GB2409339B (enExample) |
| TW (1) | TWI289243B (enExample) |
| WO (1) | WO2004032225A1 (enExample) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8301288B2 (en) * | 2004-06-16 | 2012-10-30 | International Business Machines Corporation | Optimized scheduling based on sensitivity data |
| US7235414B1 (en) * | 2005-03-01 | 2007-06-26 | Advanced Micro Devices, Inc. | Using scatterometry to verify contact hole opening during tapered bilayer etch |
| US7964422B1 (en) | 2005-11-01 | 2011-06-21 | Nvidia Corporation | Method and system for controlling a semiconductor fabrication process |
| KR100759684B1 (ko) * | 2006-04-17 | 2007-09-17 | 삼성에스디아이 주식회사 | 건식식각장치 및 이를 이용한 유기전계발광 표시장치의식각방법 |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3320035B2 (ja) * | 1991-08-23 | 2002-09-03 | 株式会社半導体エネルギー研究所 | 半導体装置 |
| US5844416A (en) * | 1995-11-02 | 1998-12-01 | Sandia Corporation | Ion-beam apparatus and method for analyzing and controlling integrated circuits |
| US6041270A (en) * | 1997-12-05 | 2000-03-21 | Advanced Micro Devices, Inc. | Automatic recipe adjust and download based on process control window |
| JP3310608B2 (ja) * | 1998-01-22 | 2002-08-05 | アプライド マテリアルズ インコーポレイテッド | スパッタリング装置 |
| US6054868A (en) * | 1998-06-10 | 2000-04-25 | Boxer Cross Incorporated | Apparatus and method for measuring a property of a layer in a multilayered structure |
| JP3897922B2 (ja) * | 1998-12-15 | 2007-03-28 | 株式会社東芝 | 半導体装置の製造方法、及びコンピュ−タ読取り可能な記録媒体 |
| US6157078A (en) * | 1999-09-23 | 2000-12-05 | Advanced Micro Devices, Inc. | Reduced variation in interconnect resistance using run-to-run control of chemical-mechanical polishing during semiconductor fabrication |
| JP3910324B2 (ja) * | 1999-10-26 | 2007-04-25 | ファブソリューション株式会社 | 半導体製造装置 |
| JP3556549B2 (ja) * | 1999-12-10 | 2004-08-18 | シャープ株式会社 | シート抵抗測定器および電子部品製造方法 |
| US6413867B1 (en) * | 1999-12-23 | 2002-07-02 | Applied Materials, Inc. | Film thickness control using spectral interferometry |
| US6470230B1 (en) | 2000-01-04 | 2002-10-22 | Advanced Micro Devices, Inc. | Supervisory method for determining optimal process targets based on product performance in microelectronic fabrication |
| US6747734B1 (en) | 2000-07-08 | 2004-06-08 | Semitool, Inc. | Apparatus and method for processing a microelectronic workpiece using metrology |
| JP4437611B2 (ja) * | 2000-11-16 | 2010-03-24 | 株式会社ルネサステクノロジ | 半導体装置の製造方法 |
| US6958814B2 (en) * | 2002-03-01 | 2005-10-25 | Applied Materials, Inc. | Apparatus and method for measuring a property of a layer in a multilayered structure |
| US6828542B2 (en) * | 2002-06-07 | 2004-12-07 | Brion Technologies, Inc. | System and method for lithography process monitoring and control |
-
2002
- 2002-09-30 US US10/260,894 patent/US6842661B2/en not_active Expired - Fee Related
-
2003
- 2003-09-19 WO PCT/US2003/029340 patent/WO2004032225A1/en not_active Ceased
- 2003-09-19 AU AU2003270745A patent/AU2003270745A1/en not_active Abandoned
- 2003-09-19 GB GB0505536A patent/GB2409339B/en not_active Expired - Fee Related
- 2003-09-19 TW TW092125872A patent/TWI289243B/zh not_active IP Right Cessation
- 2003-09-19 JP JP2004541567A patent/JP2006501676A/ja active Pending
- 2003-09-19 DE DE10393397T patent/DE10393397B4/de not_active Expired - Fee Related
- 2003-09-19 CN CNA038232510A patent/CN1685494A/zh active Pending
- 2003-09-19 KR KR1020057005289A patent/KR101001347B1/ko not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| US20040064214A1 (en) | 2004-04-01 |
| AU2003270745A1 (en) | 2004-04-23 |
| KR101001347B1 (ko) | 2010-12-14 |
| GB0505536D0 (en) | 2005-04-27 |
| GB2409339B (en) | 2006-05-10 |
| DE10393397T5 (de) | 2005-08-11 |
| US6842661B2 (en) | 2005-01-11 |
| JP2006501676A (ja) | 2006-01-12 |
| GB2409339A (en) | 2005-06-22 |
| WO2004032225A1 (en) | 2004-04-15 |
| DE10393397B4 (de) | 2010-09-02 |
| KR20050054969A (ko) | 2005-06-10 |
| CN1685494A (zh) | 2005-10-19 |
| TW200408920A (en) | 2004-06-01 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |