JP2006501676A - 相互接続レベルにおけるプロセス制御 - Google Patents

相互接続レベルにおけるプロセス制御 Download PDF

Info

Publication number
JP2006501676A
JP2006501676A JP2004541567A JP2004541567A JP2006501676A JP 2006501676 A JP2006501676 A JP 2006501676A JP 2004541567 A JP2004541567 A JP 2004541567A JP 2004541567 A JP2004541567 A JP 2004541567A JP 2006501676 A JP2006501676 A JP 2006501676A
Authority
JP
Japan
Prior art keywords
interconnect
workpiece
semiconductor wafer
control
site
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2004541567A
Other languages
English (en)
Japanese (ja)
Other versions
JP2006501676A5 (enExample
Inventor
ジェイ． チョン ロバート
オー． グリーン エリック
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Advanced Micro Devices Inc
Original Assignee
Advanced Micro Devices Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Micro Devices Inc filed Critical Advanced Micro Devices Inc
Publication of JP2006501676A publication Critical patent/JP2006501676A/ja
Publication of JP2006501676A5 publication Critical patent/JP2006501676A5/ja
Pending legal-status Critical Current

Links

Images

Classifications

    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Programme-control systems
    • G05B19/02—Programme-control systems electric
    • G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
    • G05B19/4183—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by data acquisition, e.g. workpiece identification
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/32—Operator till task planning
    • G05B2219/32183—Test cell
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/36—Nc in input of data, input key till input tape
    • G05B2219/36284—Use of database for machining parameters, material, cutting method, tools
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/45—Nc applications
    • G05B2219/45026—Circuit board, pcb
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/45—Nc applications
    • G05B2219/45031—Manufacturing semiconductor wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/54453—Marks applied to semiconductor devices or parts for use prior to dicing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
    • Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Automation & Control Theory (AREA)
  • Quality & Reliability (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Control By Computers (AREA)
JP2004541567A 2002-09-30 2003-09-19 相互接続レベルにおけるプロセス制御 Pending JP2006501676A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/260,894 US6842661B2 (en) 2002-09-30 2002-09-30 Process control at an interconnect level
PCT/US2003/029340 WO2004032225A1 (en) 2002-09-30 2003-09-19 Process control at an interconnect level

Publications (2)

Publication Number Publication Date
JP2006501676A true JP2006501676A (ja) 2006-01-12
JP2006501676A5 JP2006501676A5 (enExample) 2009-01-29

Family

ID=32029815

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004541567A Pending JP2006501676A (ja) 2002-09-30 2003-09-19 相互接続レベルにおけるプロセス制御

Country Status (9)

Country Link
US (1) US6842661B2 (enExample)
JP (1) JP2006501676A (enExample)
KR (1) KR101001347B1 (enExample)
CN (1) CN1685494A (enExample)
AU (1) AU2003270745A1 (enExample)
DE (1) DE10393397B4 (enExample)
GB (1) GB2409339B (enExample)
TW (1) TWI289243B (enExample)
WO (1) WO2004032225A1 (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8301288B2 (en) * 2004-06-16 2012-10-30 International Business Machines Corporation Optimized scheduling based on sensitivity data
US7235414B1 (en) * 2005-03-01 2007-06-26 Advanced Micro Devices, Inc. Using scatterometry to verify contact hole opening during tapered bilayer etch
US7964422B1 (en) 2005-11-01 2011-06-21 Nvidia Corporation Method and system for controlling a semiconductor fabrication process
KR100759684B1 (ko) * 2006-04-17 2007-09-17 삼성에스디아이 주식회사 건식식각장치 및 이를 이용한 유기전계발광 표시장치의식각방법

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11209873A (ja) * 1998-01-22 1999-08-03 Applied Materials Inc スパッタリング装置
JP2000068521A (ja) * 1991-08-23 2000-03-03 Semiconductor Energy Lab Co Ltd 半導体装置
JP2000182917A (ja) * 1998-12-15 2000-06-30 Toshiba Corp 半導体装置の製造方法、半導体装置の製造システム、半導体装置製造システム用制御プログラムを記録したコンピュ−タ読取り可能な記録媒体及び半導体装置製造システム用制御に用いるデ−タを記録したコンピュ−タ読取り可能な記録媒体
US6157078A (en) * 1999-09-23 2000-12-05 Advanced Micro Devices, Inc. Reduced variation in interconnect resistance using run-to-run control of chemical-mechanical polishing during semiconductor fabrication
JP2001196283A (ja) * 1999-10-26 2001-07-19 Nec Corp 半導体製造装置及びその製造方法
JP2002151465A (ja) * 2000-11-16 2002-05-24 Mitsubishi Electric Corp 半導体装置の製造方法および製造システム、並びに半導体装置

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5844416A (en) * 1995-11-02 1998-12-01 Sandia Corporation Ion-beam apparatus and method for analyzing and controlling integrated circuits
US6041270A (en) * 1997-12-05 2000-03-21 Advanced Micro Devices, Inc. Automatic recipe adjust and download based on process control window
US6054868A (en) * 1998-06-10 2000-04-25 Boxer Cross Incorporated Apparatus and method for measuring a property of a layer in a multilayered structure
JP3556549B2 (ja) * 1999-12-10 2004-08-18 シャープ株式会社 シート抵抗測定器および電子部品製造方法
US6413867B1 (en) * 1999-12-23 2002-07-02 Applied Materials, Inc. Film thickness control using spectral interferometry
US6470230B1 (en) 2000-01-04 2002-10-22 Advanced Micro Devices, Inc. Supervisory method for determining optimal process targets based on product performance in microelectronic fabrication
US6747734B1 (en) 2000-07-08 2004-06-08 Semitool, Inc. Apparatus and method for processing a microelectronic workpiece using metrology
US6958814B2 (en) * 2002-03-01 2005-10-25 Applied Materials, Inc. Apparatus and method for measuring a property of a layer in a multilayered structure
US6828542B2 (en) * 2002-06-07 2004-12-07 Brion Technologies, Inc. System and method for lithography process monitoring and control

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000068521A (ja) * 1991-08-23 2000-03-03 Semiconductor Energy Lab Co Ltd 半導体装置
JPH11209873A (ja) * 1998-01-22 1999-08-03 Applied Materials Inc スパッタリング装置
JP2000182917A (ja) * 1998-12-15 2000-06-30 Toshiba Corp 半導体装置の製造方法、半導体装置の製造システム、半導体装置製造システム用制御プログラムを記録したコンピュ−タ読取り可能な記録媒体及び半導体装置製造システム用制御に用いるデ−タを記録したコンピュ−タ読取り可能な記録媒体
US6157078A (en) * 1999-09-23 2000-12-05 Advanced Micro Devices, Inc. Reduced variation in interconnect resistance using run-to-run control of chemical-mechanical polishing during semiconductor fabrication
JP2001196283A (ja) * 1999-10-26 2001-07-19 Nec Corp 半導体製造装置及びその製造方法
JP2002151465A (ja) * 2000-11-16 2002-05-24 Mitsubishi Electric Corp 半導体装置の製造方法および製造システム、並びに半導体装置

Also Published As

Publication number Publication date
US20040064214A1 (en) 2004-04-01
AU2003270745A1 (en) 2004-04-23
KR101001347B1 (ko) 2010-12-14
GB0505536D0 (en) 2005-04-27
GB2409339B (en) 2006-05-10
DE10393397T5 (de) 2005-08-11
US6842661B2 (en) 2005-01-11
TWI289243B (en) 2007-11-01
GB2409339A (en) 2005-06-22
WO2004032225A1 (en) 2004-04-15
DE10393397B4 (de) 2010-09-02
KR20050054969A (ko) 2005-06-10
CN1685494A (zh) 2005-10-19
TW200408920A (en) 2004-06-01

Similar Documents

Publication Publication Date Title
US6708075B2 (en) Method and apparatus for utilizing integrated metrology data as feed-forward data
US6810296B2 (en) Correlating an inline parameter to a device operation parameter
US6610550B1 (en) Method and apparatus for correlating error model with defect data
US6751518B1 (en) Dynamic process state adjustment of a processing tool to reduce non-uniformity
US6773931B2 (en) Dynamic targeting for a process control system
KR100708009B1 (ko) 통계적 공정 제어를 이용하여 제어기의 성능을 모니터하는 방법 및 장치
US6708129B1 (en) Method and apparatus for wafer-to-wafer control with partial measurement data
US20040121495A1 (en) Dynamic adaptive sampling rate for model prediction
US7502709B2 (en) Dynamic metrology sampling for a dual damascene process
US6756243B2 (en) Method and apparatus for cascade control using integrated metrology
US6645780B1 (en) Method and apparatus for combining integrated and offline metrology for process control
US6728591B1 (en) Method and apparatus for run-to-run control of trench profiles
US6947803B1 (en) Dispatch and/or disposition of material based upon an expected parameter result
US6740534B1 (en) Determination of a process flow based upon fault detection analysis
US6834213B1 (en) Process control based upon a metrology delay
US6698009B1 (en) Method and apparatus for modeling of batch dynamics based upon integrated metrology
US6788988B1 (en) Method and apparatus using integrated metrology data for pre-process and post-process control
US6842661B2 (en) Process control at an interconnect level
US6957120B1 (en) Multi-level process data representation
US7720559B1 (en) Dynamic tool scheduling based upon defects
US6823231B1 (en) Tuning of a process control based upon layer dependencies
US6834211B1 (en) Adjusting a trace data rate based upon a tool state
US6912436B1 (en) Prioritizing an application of correction in a multi-input control system
US6978189B1 (en) Matching data related to multiple metrology tools
US7117062B1 (en) Determining transmission of error effects for improving parametric performance

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20060911

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20081117

RD03 Notification of appointment of power of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7423

Effective date: 20100421

RD05 Notification of revocation of power of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7425

Effective date: 20100902

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20101208

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20101209

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20110629