DE10393397B4 - Verfahren zur Prozesssteuerung auf Ebene der Verbindungsstrukturen, die eine Durchführung umfassen - Google Patents

Verfahren zur Prozesssteuerung auf Ebene der Verbindungsstrukturen, die eine Durchführung umfassen Download PDF

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Publication number
DE10393397B4
DE10393397B4 DE10393397T DE10393397T DE10393397B4 DE 10393397 B4 DE10393397 B4 DE 10393397B4 DE 10393397 T DE10393397 T DE 10393397T DE 10393397 T DE10393397 T DE 10393397T DE 10393397 B4 DE10393397 B4 DE 10393397B4
Authority
DE
Germany
Prior art keywords
control
property
controlling
semiconductor wafer
connection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE10393397T
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German (de)
English (en)
Other versions
DE10393397T5 (de
Inventor
Robert J. Austin Chong
Eric O. Austin Green
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
GlobalFoundries Inc
Original Assignee
Advanced Micro Devices Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Micro Devices Inc filed Critical Advanced Micro Devices Inc
Publication of DE10393397T5 publication Critical patent/DE10393397T5/de
Application granted granted Critical
Publication of DE10393397B4 publication Critical patent/DE10393397B4/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • GPHYSICS
    • G05CONTROLLING; REGULATING
    • G05BCONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00Programme-control systems
    • G05B19/02Programme-control systems electric
    • G05B19/418Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
    • G05B19/4183Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by data acquisition, e.g. workpiece identification
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
    • GPHYSICS
    • G05CONTROLLING; REGULATING
    • G05BCONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00Program-control systems
    • G05B2219/30Nc systems
    • G05B2219/32Operator till task planning
    • G05B2219/32183Test cell
    • GPHYSICS
    • G05CONTROLLING; REGULATING
    • G05BCONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00Program-control systems
    • G05B2219/30Nc systems
    • G05B2219/36Nc in input of data, input key till input tape
    • G05B2219/36284Use of database for machining parameters, material, cutting method, tools
    • GPHYSICS
    • G05CONTROLLING; REGULATING
    • G05BCONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00Program-control systems
    • G05B2219/30Nc systems
    • G05B2219/45Nc applications
    • G05B2219/45026Circuit board, pcb
    • GPHYSICS
    • G05CONTROLLING; REGULATING
    • G05BCONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00Program-control systems
    • G05B2219/30Nc systems
    • G05B2219/45Nc applications
    • G05B2219/45031Manufacturing semiconductor wafers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544Marks applied to semiconductor devices or parts
    • H01L2223/54453Marks applied to semiconductor devices or parts for use prior to dicing
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P90/00Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
    • Y02P90/02Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Automation & Control Theory (AREA)
  • Quality & Reliability (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Control By Computers (AREA)
DE10393397T 2002-09-30 2003-09-19 Verfahren zur Prozesssteuerung auf Ebene der Verbindungsstrukturen, die eine Durchführung umfassen Expired - Fee Related DE10393397B4 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US10/260,894 2002-09-30
US10/260,894 US6842661B2 (en) 2002-09-30 2002-09-30 Process control at an interconnect level
PCT/US2003/029340 WO2004032225A1 (en) 2002-09-30 2003-09-19 Process control at an interconnect level

Publications (2)

Publication Number Publication Date
DE10393397T5 DE10393397T5 (de) 2005-08-11
DE10393397B4 true DE10393397B4 (de) 2010-09-02

Family

ID=32029815

Family Applications (1)

Application Number Title Priority Date Filing Date
DE10393397T Expired - Fee Related DE10393397B4 (de) 2002-09-30 2003-09-19 Verfahren zur Prozesssteuerung auf Ebene der Verbindungsstrukturen, die eine Durchführung umfassen

Country Status (9)

Country Link
US (1) US6842661B2 (enExample)
JP (1) JP2006501676A (enExample)
KR (1) KR101001347B1 (enExample)
CN (1) CN1685494A (enExample)
AU (1) AU2003270745A1 (enExample)
DE (1) DE10393397B4 (enExample)
GB (1) GB2409339B (enExample)
TW (1) TWI289243B (enExample)
WO (1) WO2004032225A1 (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8301288B2 (en) * 2004-06-16 2012-10-30 International Business Machines Corporation Optimized scheduling based on sensitivity data
US7235414B1 (en) * 2005-03-01 2007-06-26 Advanced Micro Devices, Inc. Using scatterometry to verify contact hole opening during tapered bilayer etch
US7964422B1 (en) 2005-11-01 2011-06-21 Nvidia Corporation Method and system for controlling a semiconductor fabrication process
KR100759684B1 (ko) * 2006-04-17 2007-09-17 삼성에스디아이 주식회사 건식식각장치 및 이를 이용한 유기전계발광 표시장치의식각방법

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6041270A (en) * 1997-12-05 2000-03-21 Advanced Micro Devices, Inc. Automatic recipe adjust and download based on process control window
US6157078A (en) * 1999-09-23 2000-12-05 Advanced Micro Devices, Inc. Reduced variation in interconnect resistance using run-to-run control of chemical-mechanical polishing during semiconductor fabrication
WO2001050522A1 (en) * 2000-01-04 2001-07-12 Advanced Micro Devices, Inc. Method for determining optimal process targets in microelectronic fabrication
WO2002004886A1 (en) * 2000-07-08 2002-01-17 Semitool, Inc. Apparatus and method for processing a microelectronic workpiece using metrology

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3320035B2 (ja) * 1991-08-23 2002-09-03 株式会社半導体エネルギー研究所 半導体装置
US5844416A (en) * 1995-11-02 1998-12-01 Sandia Corporation Ion-beam apparatus and method for analyzing and controlling integrated circuits
JP3310608B2 (ja) * 1998-01-22 2002-08-05 アプライド マテリアルズ インコーポレイテッド スパッタリング装置
US6054868A (en) * 1998-06-10 2000-04-25 Boxer Cross Incorporated Apparatus and method for measuring a property of a layer in a multilayered structure
JP3897922B2 (ja) * 1998-12-15 2007-03-28 株式会社東芝 半導体装置の製造方法、及びコンピュ−タ読取り可能な記録媒体
JP3910324B2 (ja) * 1999-10-26 2007-04-25 ファブソリューション株式会社 半導体製造装置
JP3556549B2 (ja) * 1999-12-10 2004-08-18 シャープ株式会社 シート抵抗測定器および電子部品製造方法
US6413867B1 (en) * 1999-12-23 2002-07-02 Applied Materials, Inc. Film thickness control using spectral interferometry
JP4437611B2 (ja) * 2000-11-16 2010-03-24 株式会社ルネサステクノロジ 半導体装置の製造方法
US6958814B2 (en) * 2002-03-01 2005-10-25 Applied Materials, Inc. Apparatus and method for measuring a property of a layer in a multilayered structure
US6828542B2 (en) * 2002-06-07 2004-12-07 Brion Technologies, Inc. System and method for lithography process monitoring and control

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6041270A (en) * 1997-12-05 2000-03-21 Advanced Micro Devices, Inc. Automatic recipe adjust and download based on process control window
US6157078A (en) * 1999-09-23 2000-12-05 Advanced Micro Devices, Inc. Reduced variation in interconnect resistance using run-to-run control of chemical-mechanical polishing during semiconductor fabrication
WO2001050522A1 (en) * 2000-01-04 2001-07-12 Advanced Micro Devices, Inc. Method for determining optimal process targets in microelectronic fabrication
WO2002004886A1 (en) * 2000-07-08 2002-01-17 Semitool, Inc. Apparatus and method for processing a microelectronic workpiece using metrology

Also Published As

Publication number Publication date
US20040064214A1 (en) 2004-04-01
AU2003270745A1 (en) 2004-04-23
KR101001347B1 (ko) 2010-12-14
GB0505536D0 (en) 2005-04-27
GB2409339B (en) 2006-05-10
DE10393397T5 (de) 2005-08-11
US6842661B2 (en) 2005-01-11
JP2006501676A (ja) 2006-01-12
TWI289243B (en) 2007-11-01
GB2409339A (en) 2005-06-22
WO2004032225A1 (en) 2004-04-15
KR20050054969A (ko) 2005-06-10
CN1685494A (zh) 2005-10-19
TW200408920A (en) 2004-06-01

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