1288453 五•、發明說明α) ’ 【發明領域】 本發明係有關於一種捲帶式承載件（^ a p e c a r r i e r )， 以及特別有關於一種與半導體元件連接之捲帶式承載件。 【先前技術】 近年來，隨著電腦等電子產品漸漸小型化、輕量化以及 半導體晶片配線的微細化，逐漸發展出用於這些電子產品 中之捲帶式承載件，例如捲帶式自動接合（tape automated bonding，TAB)捲帶、捲帶式球格陣列（“以 baU grid array，T-BGA)捲帶、及針對特殊應用的 電路（application specific integrated ci 、 ASIC )捲帶等。 [’ 這些捲帶式承載件的習知製造方法將配合第i 下。首先，將銅落104壓著（laminate)在聚亞柄胺 (polyimide)薄膜102表面上，再利用微影: 1 04圖案化，以形成預先設定之導電線路。接—UT，、銅 防銲層106 (solder resist )於導電線路、者’塗覆一 暴露出被設定與半導體元件連接的導電=^面上，但 燥固化該防鲜層106。最後在暴露出的導路末端部分。 1 08表面鍍上一錫層11 〇。 电、，泉路末端部分 一般而言，在乾燥固化該防銲層丨〇6之 出的端點表面保持清潔以利後續錫層的芰’為了使暴露 的步驟清潔暴露出的銅表面。然而^後二附，會利用酸〉 中，其發現在與防銲層交界處的線路之鍍錫的步驟 U 2。該凹陷1 1 2處不但在機械結^ 生溝狀的凹陷 構上車乂為脆弱’也易因t 1288453 五、發明說明' (2) ‘ ________ 陷112過深傷及該線路而造成 · 度（r e 1 i a b i 1 i t y)的問題。 ’ &險’衍生可靠 【發明概要】 本發明之主要目的係提供—種捲 捲帶式承載件之方法，以克服或 ^ f件以及製造該 問題。 飞〆改善耵述先前技術之 根據本發明一實施例，該捲帶式承載件 ^ 以及複數個導電線路位在該絕緣薄膜上，其二=絕緣薄朕 路具有一末端部分用以連接於一半導趙元件。3二 載件另包含一防鋒層形成於該導電線路上，僅二二二1 線路的末端部分。本發明之特徵在於該捲帶式$出該導2 -mF^l^Cbarrier .etal 外的該線路末端部分之上，以及一錫屄开彡忐 、千曰 層上。 场層形成在該阻障金一色 適合用以形成該阻障金屬層的金屬包括錄、錄人八— 鉻、鈦/鎢、鈀、金以及其合金，其中以使用鎳 '合金八 為佳。該阻障金屬層之厚度係介於約〇 ·丨A m到約1 “ σ至 中以〇 · 2 5 # m為佳。該導電線路則是由銅製成。、V m，其 根據本發明另一實施例之捲帶式承載件，其 ^ 阻障金屬層係形成於該導電線路的表面上，;^ =在於該 盖於該阻障金屬層上而僅暴露出對應於該導帝 了層仏復 分的區域，並且該錫層係形成在暴露於二:末端部 金屬層上。 干層之外的阻障 本發明亦提供兩種用以製造一捲帶式承载件的方、去 第 00542.ptd 第5頁 277 1288453 五、發明說明（3) -種方法包令 '" 電層；接著m ^驟··首先，在該絕緣薄暝上^ ^ 中每-導電線路具有一成複數個導電線路，： ί路：ί，形成該防銲層於該導電線路】僅ΐ導體元 防銲層之外m表面，再將該阻障金屬層鍍於a層 鍍在该阻障金屬層上。 上，取仗，將該錫層 與件製造方法包含下列步驟：… 後以酸洗成在絕緣薄膜ί:; 整個導電線路表面铲，f :專？上的整個導電線路表面’再於 的區域之外的阻障層；然後於對應末端部分 清潔暴露於該防銲層：二成防銲層；利用-酸洗步驟 層錢在暴露於防層表面；最後督η 為了讓本發明之m卜：阻陬金屬層上。 顯特徵，下文特舉太π ^他目的、特徵、和優點能更明 作詳細說明二本發明較佳實施例，並配合所附圖示， 【發明說明】 關於前述習用捲帶式承 經研究後發現其反應機制=戶斤發生之問題，本案發明人 先前技術所提供之捲帶式。如第1圖以及第2圖所示’ 銅線路1 08之上。應注竟的3載件，其錫層1 1 0直接形成在 要使錫層11 0與銅線路^虫=，在形成該錫層11 0之前，為 ^部分（要被覆蓋鍍錫層的末端 00542.ptd 1288453 五、發明說明（4) 銅箔）1 0 8有良好的接合，因此會利八 洗μ潔該末端部分i08，該酸 3 ^ 析出銅離子（Cu2+)。儘管在上述清ς =鋼⑹）使其 會被沖洗乾淨，然而仍可能有部分酸：劑二仗，酸，劑 1 0 6與末端部分i 〇 8的交界處。 θ欠遠在防鲜層 參照第2圖，殘留的酸洗劑（Ha% 部分108交界處的銅（Cu)析出銅離子干曰，=末端 112。此時，該交界處的防銲層丨〇6因失 =、凹陷 其本身的内聚力而翹起，使得更多 又因 106之外。 』、、杲路暴絡於防銲層 然後在接T來的制步，驟，該捲帶式承載件欲 部分將浸在包含錫離子（Sn”的電鍍液中，並利又‘的 學的氧化還原反應，將錫離子還原成锡沈積於暴露於電化 Γ°6Λ外Λ銅;線路表面108。但是在還原錫離子的過_ 中，易經由電子的傳遞使導電線路表面的銅隨之 ， 的氧化反應而析出更多的銅離子，造成 ^相對 這樣的局部電池反應容易集中在防銲層106與銅電路：二而 界處，使得原先因酸洗劑殘留而形成的凹陷112 ， 大’甚至可能將厚度僅有約9_18㈣的線路貫穿，而^ 斷路或是訊號傳輸不穩定。 為了克服或改善上述的問題，本發明提供一種新穎 帶式承載件結構，如第3圖所示之捲帶式承載件2〇〇，其主 要包含複數個導電線路2 〇 4在一絕緣薄膜2 〇 2上，各^ 線路m具有一末端部分2。6用以連接：一2〇二體：以 1288453 五、發明說明（5) )、灰ΐΓί護捲帶式承載件2〇°上的導電線路2°4 不文潮濕灰塵或其他物理力的影響，該線路 有一層防銲層m。為了使導電線路2〇4經由其 γ 206與-半導體元件冑良好的電性連接，胃防銲層:未 覆蓋於導電線路204的末端部分2〇6。該捲帶式承載件2qq 之特徵在於具有一阻障今屬爲9 道 ^ I I羊五屬層210在该導電線路2 04的末端 部分之上’及一錫層212在該阻障金屬層21〇上。 該絕緣薄膜20 2較佳地係為一可撓性的聚亞醯胺（ρί ) 薄膜，該導電線路2 04則較佳由圖案化一銅落而形成。為 了配合今日電子產品功能複雜化，尺寸微小化的趨勢，驅 動電子產品的半導體元件益形複雜化，因此用於連接半導 體兀件的捲帶式承載件也必須在有限面積上具有大量且^緻 密排列的線路配置。為了達成上述細微間距（fine 1 的要求，需要極薄的銅箔用以形成細微間距的導電 2 04，該銅箱的厚度較佳約在9 —15"的範圍。一般宇 該防銲層2 0 8係由一加熱硬化樹脂（亦可使用紫外光硬化 樹脂）形成，其具有良好的絕緣性、可撓性以及對於絕緣 薄膜2 0 2或是金屬導電線路2 〇 4都有極佳的附著性。 該阻障金屬層2 1 〇的作用係在於阻隔銅線路2 〇 6以及錫層 2 1 2使其無法直接接觸，藉此避免銅與錫之間的局部電池 反應。該阻障金屬層2 1 〇的厚度在約〇. 1 # m到約1 // m之 間，較佳地係為約〇 · 2 5 // m。適合用以形成該阻障金屬層 2 1 0的金屬包括鎳、鎳合金、鉻、鈦/鎢、鈀、金以及其合 金’其中以使用鎳或鎳合金為佳。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a tape carrier (a a p e c a r r i e r ), and more particularly to a tape carrier that is coupled to a semiconductor component. [Prior Art] In recent years, as electronic products such as computers have become smaller and lighter, and semiconductor wafer wiring has been miniaturized, tape and reel carriers for use in these electronic products have been developed, such as tape and tape type automatic bonding ( Tape automated bonding, TAB) tape and tape cassettes ("baU grid array, T-BGA" tapes, and application specific integrated ci, ASIC tapes, etc. [' A conventional manufacturing method of the tape carrier will be combined with the first. First, the copper drop 104 is laminated on the surface of the polyimide film 102, and then patterned using lithography: 104. To form a predetermined conductive line. UT, a solder resist layer 106 (solder resist) on the conductive line, 'applying a conductive surface that is set to be connected to the semiconductor element, but dry curing The anti-fresh layer 106. Finally, at the end portion of the exposed guide. The surface of the 1 08 is plated with a tin layer 11 〇. The end portion of the spring road is generally dried and solidified by the solder resist layer 6 End surface The cleaning is carried out to facilitate the subsequent tin layer 'in order to make the exposed step clean the exposed copper surface. However, the second attachment will utilize the acid, which finds the tin plating step at the junction with the solder resist layer. U 2. The depression 1 1 2 is not only fragile in the mechanically formed groove-like depression structure, but also easy to cause t 1288453 V. Invention description (2) ' ________ trap 112 deep injury and the line The problem of re 1 iabi 1 ity. ' & insurance' derivative reliability [in summary of the invention] The main object of the present invention is to provide a method of winding a tape carrier to overcome or manufacture and manufacture According to an embodiment of the present invention, the tape carrier device and a plurality of conductive lines are disposed on the insulating film, and the second insulating thin circuit has an end portion for Connected to a half-guide element. The third carrier further comprises an anti-front layer formed on the conductive line, only the end portion of the circuit of the 221-2 line. The invention is characterized in that the tape type is out of the guide 2 - mF End of the line outside ^l^Cbarrier .etal Above, and a tin-bismuth layer, a layer on the millenium layer. The field layer is formed in the barrier gold color suitable for forming the barrier metal layer including recording, recording eight-chromium, titanium/tungsten, palladium , gold and alloys thereof, wherein nickel 'alloy 8 is preferred. The thickness of the barrier metal layer is from about 〇·丨A m to about 1 σ σ to medium 〇 · 2 5 # m is preferred. The conductive line is made of copper. And V m according to another embodiment of the present invention, the tape-type carrier is formed on the surface of the conductive line, wherein the cover is on the barrier metal layer and only A region corresponding to the integrated layer of the conductive layer is exposed, and the tin layer is formed on the metal layer exposed to the second: end portion. Barriers Beyond the Dry Layers The present invention also provides two methods for manufacturing a tape carrier, go to 00542.ptd, page 5, 277, 1288,453. 5, invention description (3) - method package '" First, on the insulating thin layer, each conductive line has a plurality of conductive lines, and: ί: ί, the solder resist is formed on the conductive line. The surface of the conductor element is outside the solder mask layer, and the barrier metal layer is plated on the layer of the barrier metal layer. On the enamel, the tin layer and the part manufacturing method include the following steps: ... after pickling into an insulating film ί:; the entire conductive line surface shovel, f: special? a barrier layer on the entire conductive circuit surface's area beyond the re-existing region; then exposed to the solder resist layer at the corresponding end portion: two solder resist layers; using a pickling step to expose the surface to the protective layer Finally, in order to make the invention, it is blocked on the metal layer. The following is a detailed description of the preferred embodiments of the present invention, and with reference to the accompanying drawings, [Description of the Invention] Later, it was found that the reaction mechanism = the problem of the occurrence of the household, the tape-reel type provided by the inventor of the present invention. As shown in Figures 1 and 2, above the copper line 108. It should be noted that the three carriers, the tin layer 110 is formed directly in the tin layer 110 and the copper line ^ worm =, before the formation of the tin layer 110, the portion (to be covered with tin plating End 00542.ptd 1288453 V. Description of the Invention (4) Copper foil 1 108 has a good bond, so the end portion i08 is cleaned and the acid ions 3 Cu are precipitated. Although it will be rinsed out in the above clearing = steel (6), there may still be some acid: the junction of the diterpenoid, the acid, the agent 106 and the end portion i 〇 8. θ is too far in the anti-fresh layer. Referring to Figure 2, the residual pickling agent (copper (Cu) at the junction of Ha% part 108 precipitates copper ion dry, = end 112. At this point, the solder mask at the junction 丨〇6 is lost due to the loss of its own cohesive force, so that it is more than 106. 』,, 杲, 杲 于 于 防 防 防 防 防 防 防 防 防 防 防 该 该 该 该The part of the carrier is to be immersed in a plating solution containing tin ions (Sn), and the redox reaction is reduced, and the tin ions are reduced to tin and deposited on the exposed copper bismuth; the line surface 108 However, in the reduction of tin ions, it is easy to cause more copper ions to be deposited by the oxidation reaction of the copper on the surface of the conductive line via electron transfer, so that the local battery reaction is easily concentrated in the solder resist layer. 106 and copper circuit: the boundary between the two, so that the depression 112 originally formed by the pickling residue, the large 'may even penetrate the line with a thickness of only about 9-18 (four), and the ^ circuit or signal transmission is unstable. To overcome or To improve the above problems, the present invention provides a novel The belt carrier structure, such as the tape carrier 2〇〇 shown in FIG. 3, mainly comprises a plurality of conductive lines 2 〇 4 on an insulating film 2 〇 2, each of the lines m having an end portion 2 6 for connection: one 2 〇 two body: with 1288453 five, invention description (5)), ash ΐΓ 卷 卷 承载 承载 承载 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 In effect, the line has a solder mask layer m. In order to make the conductive line 2〇4 electrically connected to the semiconductor element via its γ 206, the stomach solder mask: the end portion 2〇6 not covering the conductive line 204 The tape carrier 2qq is characterized in that it has a barrier of 9 wires II on the end portion of the conductive wire 204 and a tin layer 212 in the barrier metal layer. The insulating film 20 2 is preferably a flexible polyamidene (ρί ) film, and the conductive line 204 is preferably formed by patterning a copper drop. The function is complicated, the size is small, and the semiconductor components that drive electronic products are complicated. Therefore, the tape carrier for connecting the semiconductor components must also have a large number of densely arranged circuit configurations on a limited area. In order to achieve the above fine pitch (fine 1 requirements, extremely thin copper foil is required to form The fine pitch of the conductive layer 04, the thickness of the copper box is preferably in the range of 9-15" generally, the solder resist layer 208 is formed of a heat-hardening resin (which may also use an ultraviolet curing resin), It has good insulation, flexibility and excellent adhesion to the insulating film 220 or the metal conductive line 2 〇 4. The barrier metal layer 2 1 〇 acts as a barrier copper line 2 〇 6 And the tin layer 2 1 2 makes it impossible to directly contact, thereby avoiding local battery reaction between copper and tin. The barrier metal layer 2 1 〇 has a thickness of between about # 1 1 m and about 1 // m, preferably about 〇 · 2 5 // m. Metals suitable for forming the barrier metal layer 210 include nickel, nickel alloy, chromium, titanium/tungsten, palladium, gold, and alloys thereof, wherein nickel or a nickel alloy is preferably used.
1288453· 五、發明說明（6) 第4圖所不為根據本發明之第二實施例的捲帶式承載件 3 0 0，其特破在於該阻障金屬層2丨〇係直接形成於該導電線 路204的整個表面丨’該防銲層2 0 8係覆蓋於具有該阻障金 屬層21〇上，，僅暴露出對應於該導電線路2 04末端部分20 Θ 的區域，並且錫層2 1 2係形成在暴露於防銲層2 〇 8之外的阻 障金屬層2 1 0上。 本^明亦提供一種製造第3圖所示之捲帶式承載件2 〇 〇的 方法。首先，在絕緣薄膜2 0 2上形成一導電層。詳細言 之可利用絶緣性的黏著劑將一銅箔固接到絕緣薄膜2 〇 2 々作為°亥‘電層’此處使用的黏著劑除了良好的黏著性之 外較佳地具有耐熱、耐化學藥品、可撓等性質。 然後在該導電層的表面塗覆一層光阻劑，經由曝光、-顯 步驟使該光阻劑形成預先設定之圖案，再依光阻劑圖讀; 案蝕，、圖案化該導電層以形成導電線路2〇4。 f著，在導電線路2 〇 4上塗佈上防銲劑，然後經由例如· 二二t顯衫的方式除去在導電線路2 0 4的末端部分2 0 6上的 =然後以加熱或是紫外光照射等方式固化乾燥防銲 d以形成防銲層2 0 8。 9nsT步，利用含有例如4S〇4的酸洗劑對暴露於防銲層 =的導電線路204表面進行清潔，然後以電鑛或是無 ί的HeCtr〇leSS PUting)的方式在暴露於防銲層之 或二^電線路末端部分206形成阻障金屬層21 0。再以電鍍 ，鍍（eleCtroless plating)的方式在阻障金 上形成錫層2 1 2。 00542.ptd 第9頁 1288453 ----—---- 五、發明說明（7) 本發明亦提供一種製造第4圖所示之* 方法。首先，以與前述大致相同之方帶式承載件3 0 0的 成在絕緣薄膜20 2上。然後，先以酸洗將導電線路2 04形 202上的整個導電線路204表面，再利用·1^%洗在絕緣薄膜 (electroless plat ing)的方式在整個、#兒鍍或是無電鍍 成阻障金屬層2 1 0。接著，在對應於幸=電線路2 0 4表面形 的阻障金屬層210上形成防銲層58ϊ最^部分2 0 6區，,外 步驟清潔暴露於該防銲層之外的該阻障今用一酸洗 τ孟屬層表面接，拉 錫層212錢在在暴露於防銲層208之外的卩且障金屬層2丨〇 ’ 本發明之特徵即是在銅線路以及錫層之間，提供一且立 金屬層，避免銅電路與錫層直接接觸而造成局部電池 應，因此能改善先前技術所面對的問題。 爭 雖然本發明已以前述較佳實施例揭示，然其並非用: 定本發明’任何熟習此技藝者，在不脫離本發明之精神和 範圍内’當可作各種之更動與修改，因此本發明之保难範 圍當視.後附之申請專利範圍所界定者為準。 &1288453· V. INSTRUCTION DESCRIPTION (6) FIG. 4 is not a tape carrier 300 according to a second embodiment of the present invention, which is characterized in that the barrier metal layer 2 is directly formed on the barrier metal layer 2 The entire surface 导电 of the conductive line 204 is overlaid on the barrier metal layer 21, and only the area corresponding to the end portion 20 Θ of the conductive line 206 is exposed, and the tin layer 2 The 1 2 is formed on the barrier metal layer 2 1 0 exposed to the solder resist layer 2 〇 8 . The present invention also provides a method of manufacturing the tape carrier 2 〇 shown in Fig. 3. First, a conductive layer is formed on the insulating film 220. In detail, an insulating adhesive can be used to fix a copper foil to the insulating film 2 〇 2 々 as an electrical layer of the 'Electric layer'. The adhesive used here is preferably heat-resistant and resistant in addition to good adhesion. Chemical, flexible and other properties. Then, a photoresist is coated on the surface of the conductive layer, and the photoresist is formed into a predetermined pattern through exposure and display steps, and then read according to the photoresist pattern; the etching is performed, and the conductive layer is patterned to form Conductive line 2〇4. f, the solder resist is applied on the conductive line 2 〇 4, and then removed on the end portion 2 0 6 of the conductive line 220 by means of, for example, a two-two t-shirt, and then heated or ultraviolet light The dry solder resist d is cured by irradiation or the like to form a solder resist layer 202. 9 ns step, using a pickling agent containing, for example, 4S 〇 4 to clean the surface of the conductive trace 204 exposed to the solder mask = and then exposed to the solder resist layer by means of electrowinning or HeCtr SS SS PU PU PU The ohmic terminal portion 206 forms a barrier metal layer 210. A tin layer 2 1 2 is formed on the barrier gold by eleCtroless plating. 00542.ptd Page 9 1288453 --------- V. INSTRUCTION DESCRIPTION (7) The present invention also provides a method of manufacturing the * shown in FIG. First, the square-belt type carrier 300 which is substantially the same as the above is formed on the insulating film 20 2 . Then, the surface of the entire conductive line 204 on the conductive line 206-shaped 202 is first pickled by acid pickling, and then washed by an insulating film (electroless plating) in the whole, # plating or electroless plating. Barrier metal layer 2 10 0. Next, a solder resist layer 58 is formed on the barrier metal layer 210 corresponding to the surface shape of the electric circuit 220, and the outer portion is cleaned to expose the barrier layer outside the solder resist layer. Now, the surface of the smear layer is connected with a pickle, and the tin layer 212 is exposed to the barrier layer of the barrier layer 208. The feature of the invention is that it is in the copper line and the tin layer. In the meantime, a metal layer is provided to prevent the copper circuit from directly contacting the tin layer to cause a local battery, thereby improving the problems faced by the prior art. The present invention has been disclosed in the foregoing preferred embodiments, and it is not intended to be construed as the invention, and the invention may be variously modified and modified without departing from the spirit and scope of the invention. The scope of the warranty is subject to the definition of the patent application scope attached. &
00542.ptd 第10頁 1288453 圖式簡單說明 - 【圖示說明】 第1圖：係為習用之捲帶式承載件的局部剖視圖； 第2圖：根據習用之捲帶式承載件，局部電池效應示意 圖， 第3圖：根據本發明第一實施例之捲帶式承載件的局部 剖視圖；以及 第4圖：根據本發明第二實施例之捲帶式承載件的局部 剖視圖。 【圖號說明】 104 銅箱 108 末端部分 112 凹陷 204 導電線路 208 防銲層 212 錫層 m 102 薄膜 10 6 防銲層 110 錫層 2 0 0 捲帶式承載件 2 0 2 薄膜 20 6 末端部分 210 阻障金屬層 30 0 捲帶式承載件00542.ptd Page 10 1288453 Brief Description of the Drawing - [Illustration] Fig. 1 is a partial cross-sectional view of a conventional tape carrier; Figure 2: Tape and reel carrier according to conventional use, local battery effect Fig. 3 is a partial cross-sectional view of a tape carrier according to a first embodiment of the present invention; and Fig. 4 is a partial cross-sectional view of the tape carrier according to a second embodiment of the present invention. [Description of the number] 104 copper box 108 end portion 112 recess 204 conductive line 208 solder mask 212 tin layer m 102 film 10 6 solder mask layer 110 tin layer 2 0 0 tape carrier 2 0 2 film 20 6 end portion 210 barrier metal layer 30 0 tape carrier
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