TWI280088B - Reinforcing assembly for attachment of flexible printed circuit - Google Patents

Abstract

A reinforcing assembly for attachment of flexible printed circuit is disclosed. A flexible printed circuit has an upper surface, a lower surface and at least a reinforcing holes passing through the upper surface and the lower surface. A plurality of connecting pads of the flexible printed circuit are electrically connected to a plurality of conductive ends of an electronic device through a bonding material. In addition, the bonding material is filled into the reinforcing holes of the flexible printed circuit to reinforcing attaching strength between the flexible printed circuit and the electronic device. It can prevent the flexible printed circuit from delamination. Thereof, the reinforcing hole could be formed at the side of a plurality of connecting pads of the flexible printed circuit or in the connecting pads.

Description

1280088

[Technical Field] The present invention relates to a bonded structure of a flexible circuit board, and relates to a combined structure in which a flexible flexible circuit board and an electronic device are attached less and a flexible circuit board is attached. [Prior Art] In an electronic product, an electronic device that transmits an electronic signal to a different type of electronic circuit is often used. Referring to the first and second ®, the conventional electronic device 10 includes a plurality of conductive terminals u, a soft two connections (four), and a bonding material 3 such as a solder paste. The connection pads 21 of the circuit board 20 and the conductive terminals 11 of the electronic device 1 are electrically connected to the electronic device 10 and the flexible circuit board 20. However, since the conductive terminals u of the electronic device 10 are only connected by the bonding material 3: the connection pads 21 of the flexible circuit board 20, the electronic device 1 is attached to the flexible circuit board 20 The strength is weak, especially in the portion of the flexible circuit board 2 and the connecting pads 2 on the outermost side, which may be peeled off, so that the electronic device 10 and the flexible circuit board 2 are electrically disconnected. SUMMARY OF THE INVENTION The main object of the present invention is to provide a composite structure for reinforcing a flexible circuit board. A flexible circuit board has at least one reinforcing hole extending through an upper surface and a lower surface of the flexible circuit board. The reinforcing hole can be formed on the outer side of the plurality of connecting pads of the flexible circuit board, and a bonding material is connected to the flexible circuit board and an electronic device and filled in the reinforcing hole to strengthen the flexible circuit board and the side of the electronic device. The edge is attached to the strength to prevent the flexible circuit board from being peeled off from the electronic device.

Page 7 1280088 ____ V. INSTRUCTION DESCRIPTION (2) " ~ The second object of the present invention is to provide a flexible circuit board having a top surface, a lower surface and at least one through the upper surface And the reinforcing hole of the lower surface and including a plurality of connecting pads, the flexible circuit board defines a bonding area, the connecting pads and the reinforcing holes are formed in the bonding area and the reinforcing holes are formed in the connections The outer side of the pad is used to enhance the adhesion strength of the flexible circuit board. Another object of the present invention is to provide a composite structure for reinforcing a flexible circuit board attached. A flexible circuit board has at least one reinforcing hole and includes a plurality of connecting pads extending through the outermost sides of the connecting pads. a bonding material is electrically connected to the plurality of conductive ends of the electronic device and the connecting pads of the "soft circuit board" and filled in the reinforcing holes of the flexible circuit board to prevent the flexible circuit board from being peeled off from the electronic device The electrical transmission efficiency between the two can be enhanced. A further object of the present invention is to provide a composite structure for reinforcing a flexible circuit board attached, wherein the flexible circuit board has at least one reinforcing hole and includes a plurality of connections. a pad, wherein the reinforcing hole extends through the outermost connecting pads of the connecting pads to enhance the attaching strength of the flexible circuit board to an electronic device. The combined structure of the reinforced flexible circuit board attached according to the present invention a _3 electronic device, a flexible circuit board, and a bonding material, the electronic device comprising a plurality of conductive terminals, the flexible circuit board having An upper surface, a lower surface, and at least one reinforcing hole extending through the upper surface and the lower surface, and comprising a plurality of connecting pads, wherein the reinforcing holes are formed on the outer sides of the connecting pads, and a bonding material is connected to the The conductive ends of the electronic device

1280088 — 1. Invention Description (3) ~~" ---- The connection pads of the flexible circuit board are filled in the reinforcing holes of the flexible circuit board. [Embodiment] According to a first embodiment of the present invention, referring to Figures 3 and 4, a composite structure for reinforcing a flexible circuit board is attached, which comprises an electronic device 110, a flexible circuit board 12A, and a joint. The electronic device 110 includes a plurality of conductive terminals 11 , wherein the electronic device can be selected from a wafer, a chip package, a printed circuit board, and a ceramic circuit board. For example, the conductive terminals 111 are electrically connected to the "I line (not shown) of the electronic device 11 and the conductive terminals ii 1 may be pads or bumps. The flexible circuit board 120 has an upper surface 121, a lower surface 122, and at least one reinforcing hole 123 extending through the upper surface 21 and the lower surface 122, and includes a plurality of connecting pads 124, wherein the connecting pads 124 are Formed at one end of the flexible circuit board 120. The flexible circuit board 120 defines a bonding area 125. The reinforcing holes 123 and the connecting pads 124 are formed in the bonding area 125, and the reinforcing holes 123 are formed outside the connection pads 124. In this embodiment, the two opposite sides of the joint region 1 25 have a protruding portion 126, and the protruding portions 126 are outside the connecting jaws 124. The reinforcing holes 123 are formed in the protruding portions. 126. Preferably, the reinforcing holes 123 are formed on the connecting pads 124 to increase the adhesion strength of the flexible circuit board 120 to the electronic device 110. The reinforcing holes 23 can be circular or elliptical. Or rectangular, in this embodiment, the reinforcing hole is circular. The bonding material 1300 is electrically connected to the conductive terminals 111 of the electronic device 11 and the connection pads 124 of the flexible circuit board 120, and

Page 9 1280088 V. INSTRUCTION DESCRIPTION (4) The bonding material 130 is filled in the reinforcing hole 123 of the flexible circuit board 120. Preferably, the bonding substance 30 passes through the reinforcing hole 23 and protrudes from the upper surface. 1 21 and covering the flexible circuit board 丨 2 〇 the upper surface 1 2 1 around the reinforcing hole 23 and forming a screw cap or rivet cap structure on the upper surface 1 21 to prevent the flexible circuit board丨2〇 is peeled off by the electronic device. Further, the bonding material 1 30 is selected from the group consisting of solder paste, anisotropic conductive paste (ACP), anisotropic conductive film (ACF), and non-conductive paste (Non).

Conductive Paste, NCP) is one of the resin adhesives. The flexible circuit board 120 of the above φ may further comprise a metal adhesive layer 127 formed on the upper surface 121 of the flexible circuit board 2 and surrounding the reinforcing hole 123 to enhance the The bonding strength of the bonding material 13 such as solder paste to the flexible circuit board 120. In addition, the electronic device 110 further includes a plurality of reinforcing pads 112, the bonding material 丨3 tying the reinforcing pad 112 and the metal bonding layer 127, and the metal bonding layer 12" The circuit board (not shown) of the flexible circuit board 12 is used for signal transmission or grounding. In the above-mentioned combined structure in which the flexible circuit board is attached, the bonding material connecting the conductive terminals ln and the connection pads 124 may be the same as the bonding material 13 filled in the acoustic I reinforcing holes 123 or Not the same material. And the bonding material 13 〇 passes through the reinforcing hole 123 and protrudes from the upper surface 121 of the flexible circuit board 120 to fasten the flexible circuit board 12 to the electronic device 110, which can strengthen the flexible circuit board 12〇 The attachment strength of the electronic device Π 0 to avoid the occurrence of peeling.

Page 10

In the combined structure of the reinforced flexible circuit board attached in the second embodiment, the bonding material 230 is filled in the reinforcing hole 222 of the flexible circuit board 22 and electrically connected to the electronic device 21 The conductive terminals 211 and the connecting pads 221 of the flexible circuit board 220 to strengthen the flexible circuit board 1280088. 5. Description of the invention (5) According to the second embodiment of the present invention, please refer to Figures 5 and 6, A composite structure for reinforcing a flexible circuit board is mainly composed of an electronic device 210, a flexible circuit board 220, and a bonding material 230. The electronic device 210 has a plurality of conductive terminals 2 11 . The flexible circuit board 2 2 includes a plurality of connection pads 221, wherein the flexible circuit board 220 has at least one reinforcing hole 2 2 2 formed on the outermost side of the connection pads 21 The connection pad 2 21 a ' is connected to the outermost connection pad 2 21 a. In this embodiment, the flexible circuit board 220 includes a metal adhesive layer 2 2 3 which is formed in the reinforcing hole 2 2 2 to enhance the bonding material 2 3 〇 for the flexible circuit board 220. Adhesion. The bonding material 203 is electrically connected to the conductive terminals 211 of the electronic device 21 and the connection pads 221 of the flexible circuit board 220, and the bonding material 230 is filled with the reinforcing of the flexible circuit board 220. Hole 222. Preferably, the bonding material 230 passes through the reinforcing holes 222 and protrudes from the outermost connecting pads 221a. In this embodiment, the reinforcing hole 222 penetrates into an upper surface 224 of the flexible circuit board 220, and the metal adhesive layer 223 is extended and formed on the upper surface 2 2 4 and surrounds the reinforcing hole 2 2 2 . The bonding material 230 can cover the upper surface 224 of the flexible substrate and form a rivet-like structure. The bonding material is selected from the group consisting of a solder paste, an anisotropic conductive paste, an anisotropic conductive film, and a non-conductive paste.

Page 11 1280088

The bonding strength between the outermost connecting pads 221a of the 220 and the conductive ends 211 of the electronic device 21 prevents the flexible circuit board 22 from being peeled off from the electronic device 21 0. Preferably, the The reinforcing holes 222 may also be formed in the connecting pads 221 and penetrate the connecting pads 221 . According to a third embodiment of the present invention, referring to FIG. 7, a composite structure for reinforcing a flexible circuit board is mainly provided with an electronic device 310 flexible circuit board 320 and a bonding material 330. The electronic device 310 has a plurality of The flexible circuit board 311 includes a plurality of connection pads 321 and defines a bonding area 322. The flexible circuit board 32 has an upper surface 323, a lower surface 324 and at least a first reinforcement. The first reinforcing hole 325 is formed in the joint region 322, and the first reinforcing hole 325 is formed on the outer side of the connecting jaws 31. And the bonding material 330 is connected to the connecting pads 321 of the flexible circuit board 320 and the conductive devices of the electronic device 3 1 () through the upper surface 323 and the lower surface 324 of the flexible circuit board 3 2 . The end 3n is filled in the first reinforcing hole 325 of the flexible circuit board 320 to strengthen the adhesion strength of the outermost connecting pads 3 2 1 a. Referring to FIG. 8 , the bonding material 330 at the first reinforcing hole 3 2 5 is connected to the electronic device 31 and the flexible circuit board 32 , and the bonding material is filled in the third circuit. A reinforcing hole 3 2 5 protrudes from the upper surface 323 of the flexible circuit board 320. Further, the bonding material 330 covers the upper surface 323 of the flexible circuit board 320. Referring to FIG. 9 , between the conductive ends 311 of the electronic device 310 and the connection pads 31 of the flexible circuit board 32 , the bonding material 380 is electrically connected to the conductive terminals 3 . 1 1 and the

Page 12 1280088 ___ (7) ~~ ---- Two connection pads 321. In this embodiment, at least one second reinforcing hole 326 may be additionally formed between the connection pads 321 and penetrate the upper surface 323 and the lower surface 324 of the flexible circuit board 32 () such that the bonding substance 33〇 can be filled in the second reinforcing holes 3 2 6 to improve the adhesion strength of the flexible circuit board 3 2 〇 to the electronic device 310, and the bonding substance 33 can be selected from the anisotropic conduction. One of a glue, an anisotropic conductive film and a non-conductive paste to adhesively and electrically conduct the electronic device 3 10 and the flexible circuit board 32. In addition, the bonding material 330 which is filled in the first reinforcing holes 3 2 5 and the second reinforcing holes 3 26 can be a resin adhesive which is less expensive, so as to save production cost. The scope of the present invention is defined by the scope of the appended claims, and any changes and modifications made by those skilled in the art without departing from the spirit and scope of the invention belong to the invention. protected range.

Page 13 1280088

[. Brief description of the drawing] 1st and 2nd drawings; SΞ f flexible circuit board and electronic device joint top view; α soft circuit board and electronic device jointed surface schematic 3D according to the first specific embodiment of the present invention Embodiments, a top view of a combined structure for reinforcing a flexible circuit board attached; FIG. 4 is a cross-sectional view of the reinforced flexible circuit board attached according to the first embodiment of the present invention. FIG. 5 is a top view of a combined structure for reinforcing soft electric and road board attachment according to a second embodiment of the present invention; FIG. 6 is a view showing a second embodiment of the present invention, the reinforcing softness FIG. 7 is a cross-sectional view of the combined structure of the circuit board attached along FIG. 5; FIG. 7 is a top view of the combined structure of the reinforced flexible circuit board attached according to the third embodiment of the present invention; FIG. 8: According to the present invention A third embodiment of the invention, the composite structure to which the reinforced flexible circuit board is attached is a cross-sectional view taken along line CC of FIG. 7; and FIG. 9 is a third embodiment of the present invention, the reinforced flexible circuit board is attached thereto. Combined structure along FIG. 7 D-D cross section of FIG. • Simple description of the component symbol ·· 1〇 Electronic device 11 Conductive terminal 2 0 Flexible circuit board 21 Connection pad 3 0 Bonding substance 110 Electronic device

1280088 Schematic description 111 Conductive end 112 Reinforcement pad 120 Flexible circuit board 121 Upper surface 122 Lower surface 123 Reinforcement hole 124 Connection pad 125 Bonding area 126 Projection 127 Metal adhesion layer 130 Bonding material 210 Electronic device 211 Conductive terminal 220 Flexible circuit board 221 connection pad 221a outermost connection pad 222 reinforcement hole 223 metal adhesion layer 224 upper surface 230 bonding substance 310 electronic device 311 conductive end 320 flexible circuit board 321 connection pad 321a outermost connection pad 322 bonding area 323 upper surface 324 lower surface 325 One reinforcing hole 326 second reinforcing hole 33 0 bonding substance

Claims (1)

1280088 Sixth, the scope of application for patents [Scope of application for patents] 1. A combination of reinforced flexible circuit boards, including: an electronic device, which includes a plurality of conductive ends, a flexible circuit board, which has one, one less I, the upper surface of the Wei, the lower surface, and the connecting pad of the upper surface and the lower surface of the upper surface, and the first reinforcing hole of the lower surface, and the plural and connecting the flexible circuit board and the electronic device The reinforced flexible circuit board attached to the fifth aspect of the invention, wherein the flexible circuit board defines a junction area, and the connection pads and the first reinforcement hole are formed in the joint Area. The combination structure of the reinforced flexible circuit board attached according to the second aspect of the invention, wherein the outer side of the joint portion has a protruding portion, and the first reinforcing hole is formed in the protruding portion. 4. The composite structure of the reinforced flexible circuit board attached according to claim 1, wherein the bonding material passes through the first reinforcing hole and protrudes from the upper surface of the flexible circuit board. 5. The composite structure of the reinforced flexible circuit board attached as described in claim 4, wherein the bonding material covers the upper surface of the flexible circuit board. 6. The composite structure of the reinforced flexible circuit board attached as described in claim 1, wherein the flexible circuit board further comprises a metal adhesive layer to facilitate bonding of the bonding material. 7. Attach the reinforced flexible circuit board as described in item 6 of the patent application scope. Page 16 1280088 VI. Patent Application Combination Construction 'The metal adhesion layer is formed in the first reinforcement hole. 8. The composite structure of the reinforced flexible circuit board attached according to claim 6, wherein the metal adhesive layer is formed on the upper surface of the flexible circuit board and surrounds the first reinforcing hole. 9. The composite structure of the reinforced flexible circuit board attached as described in claim 6 wherein the metal adhesive layer is electrically connected to the plurality of lines of the flexible circuit board. 10. A composite construction for reinforcing a flexible circuit board attached as described in claim 6 wherein the bonding material is a solder paste. 11. The reinforced flexible circuit board attachment according to the scope of claim ii, wherein the electronic device further comprises at least one reinforcing yoke, the bonding material bonding the reinforcing yoke and the metal bonding layer. 1 . The combined structure of the reinforced flexible circuit board attached according to the invention of claim i, wherein the bonding material is selected from the group consisting of an anisotropic conductive paste (Acp) and an anisotropic conductive film ( Anisotropic Conductive Film, ACF) ^ #^^#(Non' Conductive paste, NCP) is one of the resin adhesives. 2 2:: Please attach the I 〇 & amp 加强 加强 加强 加强 加强 加强 加强 加强 加强 加强 加强 加强 加强 加强 加强 加强 加强 加强 加强 加强 加强 加强 加强 加强 加强 加强 加强 加强 加强 软 软 软 软 软 软 软 软 软 软 软 软 软 软π main work yam / two connected. The upper surface of the bead and the lower surface are provided for the filling of the bonding material, and the reinforcing electronic device according to the first item of the printed circuit board is selected from the group consisting of One of a ceramic circuit board to which a flexible circuit board is attached, a wafer, and a chip package. Page 17 1280088 Yv = the reinforced flexible circuit board attached as described in claim 1 of the patent scope. and a configuration, wherein the first reinforcing hole is circular. 1 2, a flexible circuit board 'having an upper surface, a lower surface, and a reinforcing hole of the upper surface of the pile and the lower surface and comprising a plurality of connecting pads, the flexible circuit board defining a joint formed on The joint zone, and the reinforcing hole is shaped like:;;; < Shepherd range, the flexible circuit board described in the item 17 a, · ▼ * V ^ ^ ^ a metal adhesive layer to facilitate the joining of a bonding substance. 2 genus: The flexible circuit board described in the 171th shell, wherein the metal adhesive layer is formed in the reinforcing hole. The flexible circuit board, wherein: the flexible circuit board of the second aspect, wherein the 21, such as H, is connected to the plurality of lines of the soft ten circuit board. 21. The reinforcement hole is round as described in item 16 of the scope of the patent application. < 釈〗 〖Bearing board, wherein the 22, a reinforced flexible circuit board attached to the composite structure, comprising: · electronic device, which comprises a plurality of conductive ends; a flexible circuit board, which has a connection pad, Wherein 兮aa , , a reinforcing hole, and a plurality of pads; the pad wherein the reinforcing hole is connected to a connecting material through an outermost side of the connecting pads, and electrically connecting the electronic device and the flexible circuit board捸n is electrically connected to the child's connection pads of the device, and the bonding material is filled in T7R0088 _______ VI. Patent application scope Reinforcement hole. 23. The composite construction of the reinforced flexible circuit board attached as described in claim 2, wherein the bonding material passes through the reinforcing holes and protrudes from the outermost connecting pads. The combination structure of the reinforced flexible circuit board attached as described in claim 2, wherein the bonding material covers an upper surface of the flexible circuit board. 25. The composite construction of the reinforced flexible circuit board attached according to claim 23, wherein the flexible circuit board further comprises a metal adhesive layer for bonding the bonding material. 2. A composite structure for reinforcing a flexible circuit board attached as described in claim 25, wherein the metal adhesive layer is formed in the reinforcing hole. 27, if the application of the special combination structure, the upper surface, and 28, such as the application of a special combination of construction, glue, anisotropic guide 2, such as the application of the combination of the combination, the assembly, a printing 30, such as Applying a special combination structure, the reinforced flexible circuit board according to Item 25, wherein the metal adhesive layer is formed around the flexible hole in the flexible circuit board. The reinforced flexible circuit board attached in item 2 of the benefit range is selected from the group consisting of solder paste, anisotropic conductive film and non-conductive glue. The reinforced flexible circuit board attached according to Item 22, wherein the electronic device is selected from one of a wafer, a wafer sealing circuit board, and a ceramic circuit board. 31 kinds of softened flexible circuit board attached in item 2 of the range of interest. The reinforcing hole is circular. a circuit board having at least one reinforcing hole and including Page 19 1280088 VI. Patent Application Scope A number of connection pads, wherein the reinforcement holes are connected through the outermost sides of the connection pads. And the other package, wherein the soft circuit board according to claim 31, wherein the flexible circuit board comprises a metal adhesive layer. 33. The flexible circuit board metal adhesion layer according to claim 32 is formed in the reinforcing hole. 34. For example, the flexible circuit board metal adhesive layer described in the 32nd patent range is formed on one of the upper surfaces of the flexible circuit board to reinforce the hole. The servant 35, as in the patent application, the 31st reinforcing hole system is formed in the joints 36. As in the patent application, the 31st reinforcing hole system is circular. The flexible circuit board of the item, wherein the pad extends through the connection pads. Soft circuit board, wherein