JP2007227856A - Wiring board connection structure and method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To reduce the cost required for connecting the wiring electrically with the other wiring, and to provide a wiring board connection structure of simple structure. <P>SOLUTION: A connection terminal 9 conducting with wiring 3 is provided on one surface of a substrate joint, the other connection terminal 10 conducting with the other wiring 5 and bonded to the connection terminal 9 is provided on one surface of the other substrate joint 7a, and a reinforcing plate 12 is provided on the other surface of the substrate joint. The reinforcing plate 12 can be stuck to the other surface of the substrate joint, and extends from the tip side of the substrate joint to a part overlapping the forward end face of the other substrate joint 7a. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a wiring board connection structure and a wiring board connection method for electrically connecting a wiring of a flexible wiring board and a counterpart wiring of a counterpart wiring board.

  Various developments have been made on a wiring board connection structure for electrically connecting a wiring of a flexible wiring board and a counterpart wiring of a counterpart wiring board such as a counterpart rigid wiring board. Patent Document 1 discloses a prior art of a wiring board connection structure. There is something to show. The configuration of the wiring board connection structure according to the prior art will be briefly described as follows.

  That is, the wiring board connection structure (the wiring pattern connection structure (1) in Patent Document 1) includes a board connecting portion which is a part of an insulating substrate (FPC (10) in Patent Document 1) of a flexible wiring board. The main board includes a mating board connecting portion (RPC (20) in Patent Document 1) which is a part of the mating insulating substrate of the mating wiring board and overlaps the board connecting portion. In addition, a plurality of mounting holes (positioning holes (13) in Patent Document 1) are formed in the board connecting portion by drilling, and wiring of a flexible wiring board (patent) is formed on one surface of the board connecting portion. In the literature 1, a connection terminal (the wiring pattern (12) in the patent document) that is conducted to the electrical wiring pattern (11) is provided. Furthermore, a plurality of mating mounting holes (engagement holes (21) in Patent Document 1) are formed in the mating board connecting portion by drilling, and the mating wiring board is formed on one surface of the mating board connecting portion. The mating connection terminal (the wiring pattern (22) in Patent Document 1) that is conducted to the mating wiring (in Patent Document 1, the electrical wiring pattern (21)) is provided, and this mating connection terminal is solder (Patent Document). In FIG. 1, it is joined to the connection terminal by solder (25)).

  A metal fitting (clamp (31) in Patent Document 1) is provided on the other surface of the board connecting portion, and a plurality of attachments that can be fitted into corresponding fitting holes and mating fitting holes are provided on the back side of the metal fitting. A claw (in Patent Document 1, a clamp fixing portion (36)) is formed. Here, by twisting the tip of each mounting claw in the inserted state, each mounting claw is locked to one surface of the mating board connection part, and the metal fitting is attached to the other surface of the board connection part. It can be installed. Further, on the end of the metal fitting (the end on the base end side of the board connecting portion), a bay portion (the curved portion (35) in Patent Document 1) is formed by bending.

Therefore, when the flexible wiring board is bent, an external force accompanying the bending of the flexible wiring board can be received by the bay portion of the metal fitting. In other words, an external force accompanying the bending of the flexible wiring board can be received at a location deviated from the joint portion between the connection terminal and the counterpart connection terminal. Thereby, the stress applied to the joint portion between the connection terminal and the mating connection terminal can be reduced, and the connection strength between the wiring and the mating wiring can be increased.
Japanese Patent No. 3635585

  By the way, in the wiring board connection structure according to the prior art, in order to reduce the stress applied to the joint portion between the connection terminal and the mating connection terminal, and to increase the connection strength between the wiring and the mating wiring, it is a substrate that is a component It is necessary to form a plurality of mounting holes and a plurality of mating mounting holes in the connecting portion and the mating substrate connecting portion by drilling, or to form a curved portion by bending at the end side of the metal fitting that is a component. Therefore, there is a problem that the cost required for electrically connecting the wiring and the counterpart wiring is increased, and the configuration of the wiring board connection structure is complicated.

  Therefore, in order to solve the above-described problem, the present invention reduces the stress applied to the joint portion between the connection terminal and the mating connection terminal without subjecting the component to drilling and bending, thereby enabling the wiring and the mating wiring. It is an object of the present invention to provide a wiring board connection structure and a wiring board connection method having a novel configuration that can increase the connection strength.

  A first feature of the present invention is a wiring board connection structure for electrically connecting a wiring of a flexible wiring board and a counterpart wiring of a counterpart wiring board, and is a part of an insulating substrate constituting the flexible wiring board. Provided on one surface of the board connecting portion, the mating board connecting portion that is arranged to overlap the board connecting portion and is a part of the mating insulating substrate that constitutes the mating wiring board, and the board connecting portion A connection terminal that is an end portion of the wiring, a mating connection terminal that is provided on one surface of the mating substrate connection portion and is joined to the connection terminal, and the board connection portion And a reinforcing plate provided at least in a region extending from the leading edge of the board connecting portion to the leading edge of the mating board connecting portion.

  According to the first feature, when the flexible wiring board is bent, the reinforcing plate can be attached to the other surface of the board connecting portion and extends at least from the front end side of the board connecting portion to the overlapping portion. In addition, an external force accompanying bending of the flexible wiring board can be received by the end portion of the reinforcing plate (the end portion on the base end side of the board connecting portion). In other words, an external force accompanying the bending of the flexible wiring board can be received at a location deviated from the joint portion between the connection terminal and the counterpart connection terminal. As a result, the connecting portion between the connecting terminal and the mating connecting terminal is added without drilling holes in the board connecting portion and the mating board connecting portion that are the constituent elements or bending the reinforcing plate that is the constituent element. By reducing the stress, the connection strength between the wiring and the counterpart wiring can be increased.

  According to a second aspect of the present invention, there is provided a wiring board connection method for electrically connecting a wiring of a flexible wiring board and a counterpart wiring of a counterpart wiring board, wherein the board connection is a part of an insulating substrate of the flexible wiring board. And a connection terminal that is provided on one surface of the substrate connection portion and is an end portion of the wiring, and a mating substrate connection portion that is a part of a mating insulating substrate of the counterpart wiring board. A joining step of joining a mating connection terminal which is provided on one surface of the mating board connection portion and is an end of the mating wiring, and when joining the connection terminal and the mating connection terminal, at least, An affixing step of affixing a reinforcing plate that reinforces the board connecting part to the other surface of the board connecting part so as to be located from the tip side of the board connecting part to a position overlapping the tip edge of the mating board connecting part; The summary is prepared .

  According to the second feature, in the attaching step, the flexible wiring board is bent because the reinforcing plate is attached to the other surface of the substrate connecting portion so as to be positioned at least from the front end side of the substrate connecting portion to the overlapping portion. In this case, an external force accompanying the bending of the flexible wiring board can be received by the end portion of the reinforcing plate (the end portion on the base end side of the board connecting portion). In other words, an external force accompanying the bending of the flexible wiring board can be received at a location deviated from the joint portion between the connection terminal and the counterpart connection terminal. As a result, the connecting portion between the connecting terminal and the mating connecting terminal is added without drilling holes in the board connecting portion and the mating board connecting portion that are the constituent elements or bending the reinforcing plate that is the constituent element. By reducing the stress, the connection strength between the wiring and the counterpart wiring can be increased.

  ADVANTAGE OF THE INVENTION According to this invention, when a flexible wiring board is bent, it can suppress that a stress is added to a junction part. Further, according to the present invention, it is possible to reduce the cost required to electrically connect the wiring and the counterpart wiring, and to simplify the configuration of the wiring board connection structure.

(First embodiment)
A first embodiment of the present invention will be described with reference to FIGS.

  Here, FIG. 1 is a plan view of the wiring board connection structure according to the first embodiment, FIG. 2 is an exploded perspective view of the wiring board connection structure according to the first embodiment, and FIG. The side view of the wiring board connection structure which concerns on a form, FIG.3 (b) is a side view of the wiring board connection structure which concerns on 1st Embodiment provided with the sealing part.

  As shown in FIGS. 1 and 2, the wiring board connection structure 1 according to the first embodiment electrically connects a plurality of wirings 3 of the flexible wiring board 2 and a plurality of mating wirings 5 of the mating rigid wiring board 4. The specific structure of the wiring board connection structure 1 according to the first embodiment as a connection structure is as follows. Here, the flexible wiring board 2 includes an insulating substrate 6 made of polyimide or the like, the plurality of wirings 3 provided on one surface of the insulating substrate 6, and one surface of the insulating substrate 6. And a resist (not shown) covering the plurality of wirings 3. Further, the mating rigid wiring board 4 is formed on the mating insulating substrate 7, the plurality of mating wirings 5 provided on one surface of the mating insulating substrate 7, and one surface of the mating insulating substrate 7. And a plurality of mating wirings 5 and a mating resist 8.

  That is, the wiring board connection structure 1 includes a substrate connection portion 6a that is a part of the insulating substrate 6, and a counterpart substrate connection portion 7a that is a part of the counterpart insulating substrate 7 that overlaps the substrate connection portion 6a. As a main component.

  A plurality of connection terminals 9 that are conductive to the corresponding wiring 3 are provided on one surface of the substrate connection portion 6a, and each connection terminal 9 extends to the tip of the substrate connection portion 6a. In addition, a plurality of mating connection terminals 10 that are electrically connected to the corresponding mating wiring 5 are provided on one surface of the mating board connection portion 7 a, and each mating connection terminal 10 is soldered to the corresponding connection terminal 9. 11 respectively, and extends to the front side of the front end of the mating substrate connecting portion 7a. Note that the mating connection terminal 10 may be bonded to the connection terminal 9 by the anisotropic conductive film or ultrasonic waves instead of being bonded by the solder 11.

  A rectangular reinforcing plate 12 that reinforces the substrate connecting portion 6a is provided on the other surface of the substrate connecting portion 6a. The reinforcing plate 12 can be attached to the other surface of the substrate connecting portion 6a with an adhesive. It is. Further, the portion where the reinforcing plate 12 is bonded has higher rigidity than the flexible wiring board 2 where the reinforcing plate 12 is not bonded. Further, the reinforcing plate 12 has the same width as the board connecting portion 6a, and extends from a location S1 that overlaps the front end surface of the board connecting portion 6a to a location S2 that overlaps the front end surface of the mating board connecting portion 7a. It extends. Note that the reinforcing plate 12 does not have to extend from the portion S1 that overlaps the front end surface of the substrate connecting portion 6a, as long as it extends at least from the front end side of the substrate connecting portion 6a.

  As shown in FIG. 3B, a sealing portion for sealing a plurality of connection terminals 9 and a plurality of counterpart connection terminals 10 between and around the board connection portion 6a and the counterpart substrate connection portion 7a. 13 is provided, and the sealing portion 13 is made of an insulating resin such as underfill. In the wiring board connection structure 1, the sealing portion 13 may be omitted as shown in FIG.

  Next, the wiring board connection method according to the first embodiment will be described.

  The wiring board connection method according to the first embodiment is a method of electrically connecting a plurality of wirings 3 of the flexible wiring board 2 and a plurality of mating wirings 5 of the mating rigid wiring board 4, and is as follows. It has a joining process, a sticking process, and a sealing process.

Joining Step The mating connection terminals 10 corresponding to the connection terminals 9 are joined by the solder 11 while the board connection portion 6a and the mating substrate connection portion 7a are overlapped. Instead of joining the connection terminal 9 and the mating connection terminal 10 with the solder 11, they may be joined with an anisotropic conductive film or ultrasonic waves.

Affixing process From the part S1 overlapping the front end surface of the board connection part 6a to the part S2 overlapping the front end face of the mating board connection part 7a when the mating connection terminals 10 corresponding to the respective connection terminals 9 are respectively joined. The reinforcing plate 12 is affixed to the other surface of the substrate connecting portion 6a so as to be positioned. In addition, even if the reinforcing plate 12 is not located from the portion S1 that overlaps the tip surface of the substrate connection portion 6a, it may be located at least from the tip side of the substrate connection portion 6a.

  Here, the attaching step may be included in the manufacturing process of the flexible wiring board 2 independently of the joining step. Further, after the joining process is finished, the pasting process may be started, or before the joining process is started, the pasting process may be finished.

Sealing process After the bonding process is completed, an insulating resin such as underfill is filled between the substrate connecting portion 6a and the mating substrate connecting portion 7a and the periphery thereof and cured, thereby sealing the insulating resin. The plurality of connection terminals 9 and the plurality of mating connection terminals 10 are sealed by the portion.

  As described above, a plurality of wirings 3 of the flexible wiring board 2 and a plurality of mating wirings 5 of the mating rigid wiring board 4 can be electrically connected. In addition, you may abbreviate | omit a sealing process from the connection method of the wiring board which concerns on 1st Embodiment.

  Next, functions and effects of the first embodiment will be described.

  The reinforcing plate 12 can be attached to the other surface of the board connecting portion 6a and extends at least from the tip side of the board connecting portion 6a to the overlapping portion S2 (in the attaching step, the tip of the board connecting portion 6a). Since the reinforcing plate 12 is attached to the other surface of the substrate connecting portion 6a so as to be located from the side to the overlapping portion S2, the end portion (the substrate) of the reinforcing plate 12 when the flexible wiring board 2 is bent. The upward external force (tensile force) accompanying the bending of the flexible wiring board 2 can be received by the end portion on the proximal end side of the connecting portion 6a. In other words, an upward external force associated with the bending of the flexible wiring board 2 can be received at a location deviated from the joint portion between the connection terminal 9 and the mating connection terminal 10. Accordingly, the connecting terminal 9 and the mating connection terminal 10 can be connected to each other without subjecting the board connecting portion 6a and the mating board connecting portion 7a, which are constituent elements, to drilling or bending the reinforcing plate 12, which is the constituent element. By reducing the stress applied to the joint portion, the connection strength between the wiring 3 and the counterpart wiring 5 can be increased.

  Moreover, since the sealing part 13 which seals the several connection terminal 9 and the several mating connection terminal 10 is provided between the board | substrate connection part 6a and the mating board connection part 7a, and its periphery (board | substrate) A plurality of connection terminals 9 and a plurality of mating connections are made by the sealing portion 13 made of an insulating resin by filling and curing an insulating resin between and around the connecting portion 6a and the mating board connecting portion 7a. Since the terminal 10 is sealed), the connection strength between the wiring 3 and the counterpart wiring 5 can be sufficiently increased.

  Further, when the reinforcing plate 12 is made of a metal such as stainless steel, the thermal conductivity of the reinforcing plate 12 is good, and the connecting terminal 9 and the mating member 9 are not heated without excessively heating the solder 11 (or anisotropic conductive film). The connection terminal 10 can be joined.

  As described above, according to the first embodiment, the board connection portion 6a and the mating board connection portion 7a that are constituent elements are connected without drilling or bending the reinforcing plate 12 that is a constituent element. Since the stress applied to the joint portion between the terminal 9 and the mating connection terminal 10 can be reduced and the connection strength between the wiring 3 and the mating wiring 5 can be sufficiently increased, the wiring 3 and the mating wiring 5 are electrically connected. In addition to reducing the cost required for this, it is possible to simplify the configuration of the wiring board connection structure 1.

  Further, when the attaching step in the wiring board connecting method is included in the manufacturing process of the flexible wiring board 2, the connection work of the wiring 3 and the counterpart wiring 5 can be simplified, and the wiring 3 and the counterpart wiring can be simplified. The efficiency of the connection work of the wiring 5 can be improved.

(Second Embodiment)
A second embodiment of the present invention will be described with reference to FIGS.

  4 is a plan view of the wiring board connection structure according to the second embodiment, FIG. 5 is an exploded perspective view of the wiring board connection structure according to the second embodiment, and FIG. 6A is the second embodiment. The side view of the wiring board connection structure which concerns on a form, FIG.6 (b) is a side view of the wiring board connection structure which concerns on 2nd Embodiment provided with the sealing part.

  As shown in FIGS. 4, 5, 6A and 6B, the wiring board connection structure 14 according to the second embodiment has substantially the same configuration as the wiring board connection structure 1 according to the first embodiment. Of the specific configuration of the wiring board connection structure 14 according to the second embodiment, only parts different from the specific configuration of the wiring board connection structure 1 according to the first embodiment will be described. Of the plurality of components in the wiring board connection structure 14 according to the second embodiment, those corresponding to the components in the wiring board connection structure 1 according to the first embodiment are denoted by the same reference numerals in the drawing. Description is omitted.

  That is, the reinforcing plate 12 in the wiring board connection structure 14 according to the second embodiment protrudes in the extending direction (right direction in FIG. 3) of the mating substrate connecting portion 7a from the tip surface of the mating substrate connecting portion 7a. ing. The wiring board connection structure 14 may include a sealing portion 13 as shown in FIG. 6B, or the sealing portion 13 may be omitted as shown in FIG. 6A. .

  Accordingly, in the second embodiment, in addition to the effects and effects substantially the same as those of the first embodiment, the reinforcing plate 12 extends in the extending direction of the mating board connecting portion 7a rather than the tip surface of the mating board connecting portion 7a. Therefore, the upward external force accompanying the bending of the flexible wiring board 2 can be received at a place further away from the joint portion between the connection terminal 9 and the mating connection terminal 10. Thereby, the stress applied to the joint portion between the connection terminal 9 and the mating connection terminal 10 can be further reduced, and the connection strength between the wiring 3 and the mating wiring 5 can be further increased.

(Third embodiment)
A third embodiment of the present invention will be described with reference to FIGS.

  Here, FIG. 7 is a plan view of the wiring board connection structure according to the third embodiment, FIG. 8 is an exploded perspective view of the wiring board connection structure according to the third embodiment, and FIG. 9A is the third embodiment. The side view of the wiring board connection structure which concerns on a form, FIG.9 (b) is a side view of the wiring board connection structure which concerns on 3rd Embodiment provided with the sealing part.

  As shown in FIGS. 7, 8, 9A and 9B, the wiring board connection structure 15 according to the third embodiment has substantially the same configuration as the wiring board connection structure 14 according to the second embodiment. Of the specific configuration of the wiring board connection structure 15 according to the second embodiment, only parts different from the specific configuration of the wiring board connection structure 1 according to the first embodiment will be described. Of the plurality of components in the wiring board connection structure 14 according to the second embodiment, those corresponding to the components in the wiring board connection structure 1 according to the first embodiment are denoted by the same reference numerals in the drawing. Description is omitted.

  That is, the reinforcing plate 12 in the wiring board connection structure 15 according to the third embodiment is added to the region A that overlaps the joint portion between the connection terminal 9 and the mating connection terminal 10 on the other surface of the board connection portion 6a. It is provided so as to avoid a region where a chip for pressing, heating, or applying ultrasonic waves is pressed to make a connection. The wiring board connection structure 15 may include a sealing portion 13 as shown in FIG. 9B, or the sealing portion 13 may be omitted as shown in FIG. 9A. .

  Therefore, in the third embodiment, the reinforcing plate 12 is connected to the connection terminal 9 on the other surface of the board connecting portion 6a and the other connection, in addition to the effects and effects substantially the same as those of the first and second embodiments. Of the region A that overlaps with the joint portion with the terminal 10, it is provided so as to avoid the region where the chip for applying pressure, heating, or ultrasonic waves is pressed against the connection terminal 9. When the connection terminal 10 is joined by the solder 11 or the anisotropic conductive film, the reinforcing plate 12 does not become a thermal resistance, and heat from the heater chip 16 is easily transmitted to the solder or the anisotropic conductive film, and the connection is made. When the terminal 9 and the mating connection terminal 10 are joined by ultrasonic waves, the reinforcing plate 12 does not become an energy absorber, and ultrasonic energy applied from a horn (not shown) is compatible with the connection terminals 9. More likely to be transmitted to the connection terminal 10. Thereby, the connection terminal 9 and the other party connection terminal 10 can be joined in a short time. By adopting such a structure, even if a reinforcing plate is attached in advance in the process of manufacturing the flexible printed circuit board, there is no restriction on the connection method and connection conditions at the time of connection.

  The present invention is not limited to the description of the above-described embodiment, and can be implemented in an appropriate manner, for example, using a mating flexible wiring board instead of the mating rigid wiring board 4 as the mating wiring board. .

  Further, the scope of rights encompassed by the present invention is not limited to the embodiment of the present invention.

It is a top view of the wiring board connection structure concerning a 1st embodiment. It is a disassembled perspective view of the wiring board connection structure which concerns on 1st Embodiment. FIG. 3A is a side view of the wiring board connection structure according to the first embodiment, and FIG. 3B is a side view of the wiring board connection structure according to the first embodiment provided with a sealing portion. It is a top view of the wiring board connection structure concerning a 2nd embodiment. It is a disassembled perspective view of the wiring board connection structure which concerns on 2nd Embodiment. FIG. 6A is a side view of the wiring board connection structure according to the second embodiment, and FIG. 6B is a side view of the wiring board connection structure according to the second embodiment provided with a sealing portion. It is a top view of the wiring board connection structure concerning a 3rd embodiment. It is a disassembled perspective view of the wiring board connection structure which concerns on 3rd Embodiment. FIG. 9A is a side view of the wiring board connection structure according to the third embodiment, and FIG. 9B is a side view of the wiring board connection structure according to the third embodiment provided with a sealing portion.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Wiring board connection structure 2 Flexible wiring board 3 Wiring 4 Mating rigid wiring board 5 Mating wiring 6 Insulating board 6a Board connecting part 7 Mating insulating board 7a Mating board connecting part 8 Mating resist 9 Connecting terminal 10 Mating connecting terminal 11 Solder 12 Reinforcing plate 13 Sealing portion 14 Wiring board connection structure 15 Wiring board connection structure

Claims (9)

A wiring board connection structure for electrically connecting the wiring of the flexible wiring board and the counterpart wiring of the counterpart wiring board,
A substrate connection part which is a part of an insulating substrate constituting the flexible wiring board;
A mating substrate connecting portion which is arranged to overlap the substrate connecting portion and is a part of a mating insulating substrate constituting the mating wiring board;
A connection terminal which is provided on one surface of the substrate connection part and is an end of the wiring;
A mating connection terminal that is provided on one surface of the mating substrate connection portion and is an end of the mating wiring joined to the connection terminal;
A reinforcing plate provided on the other surface of the board connecting portion, at least in a region extending from the tip edge of the board connecting portion to the tip edge of the mating board connecting portion;
A wiring board connection structure characterized by comprising:   The wiring board connection structure according to claim 1, further comprising a sealing portion made of an insulating resin that seals the connection terminal and the mating connection terminal.   The wiring board connection structure according to claim 1, wherein the reinforcing plate is higher in rigidity than the insulating substrate.   The said reinforcement board is arrange | positioned so that it may protrude in the extending | stretching direction of the said board | substrate connection part rather than the front-end edge of the said board | substrate connection part. Wiring board connection structure.   The reinforcing plate is a region where the heater chip at the time of soldering or a horn at the time of ultrasonic connection is pressed among the regions overlapping the joint portion between the connection terminal and the mating connection terminal on the other surface of the substrate connection part. The wiring board connection structure according to any one of claims 1 to 4, wherein the wiring board connection structure is provided so as to be avoided.   The wiring board connection structure according to claim 1, wherein the mating wiring board is a rigid wiring board or a flexible wiring board. A wiring board connection method for electrically connecting a wiring of a flexible wiring board and a counterpart wiring of a counterpart wiring board,
Arranging the board connecting part which is a part of the insulating substrate of the flexible wiring board and the mating board connecting part which is a part of the mating insulating board of the mating wiring board so as to overlap, one of the board connecting parts A joining step of joining a connection terminal provided on a surface and being an end portion of the wiring and a mating connection terminal provided on one surface of the counterpart substrate connection portion and being an end portion of the counterpart wiring;
Reinforcing plate that reinforces the board connecting portion so as to be positioned at least from the tip end side of the board connecting portion to a portion overlapping the tip edge of the counterpart substrate connecting portion when the connecting terminal and the counterpart connecting terminal are joined. A pasting step of pasting on the other surface of the substrate connection part,
A method for connecting a wiring board, comprising:   The wiring board connecting method according to claim 7, wherein the attaching step is included in a manufacturing process of the flexible wiring board. After the joining step is completed, the connecting terminal and the mating member are sealed by the sealing portion made of the insulating resin by filling and curing the insulating resin between the substrate connecting portion and the mating substrate connecting portion. A sealing step for sealing the connection terminal;
The wiring board connection method according to claim 7 or 8, further comprising:

Images