1279560 、 n 九、發明說明： 【發明所屬之技術領域】 本發明係有關使用在電子機器中的可撓性印刷電 路板之電氣檢查裝置，特別是有關用以檢測在可撓性印 刷電路板之導體圖案上產生的微小裂紋之電氣檢查裝 置。 一 【先前技術】 可挽性印刷電路板在其特性方面，係為由薄材料所 作成且易於彎曲之構成。可撓性印刷電路板之構成係 為，在導體圖案之表面上依用途而利用絕緣性薄膜或絕 緣性之樹脂施予絕緣處理。又，在有必要增加硬度或厚 度的部位上追加用以補強之薄膜或玻璃環氧積層板、金 屬板等等。 依此種構成的不同，會在彎曲強度上產生差異，而 在對該既產生有彎曲容易度不同的境界附近施加彎曲應 力或拉伸應力之後，有時會因為該應力而在導體圖案上 產生微小裂紋。 在先前技術當中可知有，為了檢查微小裂紋，係形 成有將具有2個端部且連接著的電阻密接設置在至少略沿 鋁基板單面的外周部位置上的一片電路基板，且對前述電 阻之兩端通以交流電流而實施第三諧波失真（third harmonic wave)等之檢查，藉此可檢測電阻所在的部分有 無微小裂紋者(例如，參照專利文獻〗）。 又’在先前技術當中亦可知有，在陶瓷基板之至少 5 1279560 單面上配置著具導電性的液體’而败基板的電氣特性值 以進行裂紋檢測的方法(例如，參照專利文獻2)。 又，在先前技術當中亦可知有一種將可撓性印刷電 路板挾持於上側板構件和下侧板構件之間而對基板上所 搭載的裝配零件進行固定，並使力量作用在裝配零件與 基板分離的方向而進行基板與零件間之導通測試以檢查 銲接的狀態之裝置(例如，參照專利文獻3)。 【專利文獻1】日本國專利特開平7一66520號公報 【專利文獻2】曰本國專利特開平9一304324號公報 【專利文獻3】日本國專利特開2〇〇4—273726號公報 【發明内容】 【發明所欲解決之課題】 專利文獻1所記載的發明中，有必要在鋁基板上預 先設置測定用之電阻而成為在電路上搭載多餘的零件。 又，專利文獻2所記載的發明中，因為在陶瓷基板之至 少單面上配置導電性的液體，所以裝置規模變大，在檢 查上亦繁雜。 專利文獻3所記載的發明係用以確認裝配零件之銲 接良否的裝置，其難以檢測導體圖案之微小裂紋。且，對 銲接部分或可撓性印刷電路板施加過度的應力，係具有對 正吊製品造成損傷的危險性。 又，在既裝配著零件的可撓性印刷電路板之情況，若 疋裝配零件的外侧部分，倒是可藉由脊曲撓性印刷電路板 並利用以往顯微鏡等方式之放大檢查來檢測某程度之微 6 1279560 小裂紋，但是在裝配零件下侧的微小裂紋並無法使用顯微 鏡進行放大檢查。 於是，本發明之目的為，在不損及可撓性印刷電路板 的情況下，且針對即便是裝配零件的下侧也可檢測出產生 在導體圖案上之微小裂紋為技術課題。 【解決課題之手段】 本發明係為達成上述目的而提案者，申請專利範圍第 1項所§己載之發明係提供一種可撓性印刷電路板之電氣檢 查裝置，其特徵為，具備有用以挾持可撓性印刷電路板之 上基座和下基座，且在上基座和下基座當中至少任一方的 基座凹設有凹口部，並在該凹口部設置壓力調整機構，且 具備對設置在前述可撓性印刷電路板上的導體圖案之電 阻值(electrical resistivity)進行測定的電阻值檢測機 依該構成’係在上基座和下基狀職射撓性印刷 電路板’且由壓力調整機構對凹口部的壓力進行調整，則 位在可撓性_板之凹口部上的部分係些卿报。这BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electrical inspection apparatus for a flexible printed circuit board used in an electronic device, and more particularly to detecting an optical printed circuit board. An electrical inspection device for microcracks generated on a conductor pattern. [Prior Art] A printable printed circuit board is constructed of a thin material and is easily bent in terms of its characteristics. The flexible printed circuit board is constructed by applying an insulating film or an insulating resin to the surface of the conductor pattern for the purpose of insulation treatment. Further, a film or a glass epoxy laminate, a metal plate or the like for reinforcement is added to a portion where it is necessary to increase the hardness or the thickness. Depending on the composition, there is a difference in bending strength, and after bending stress or tensile stress is applied in the vicinity of the boundary where the bending is different, sometimes the conductor pattern is generated due to the stress. Tiny cracks. In the prior art, in order to inspect a microcrack, a circuit board having a plurality of end portions and connected resistors is disposed in close contact with at least an outer peripheral portion of a single side of the aluminum substrate, and the resistor is formed. The two ends are subjected to an inspection of a third harmonic wave or the like by an alternating current, whereby the presence or absence of microcracks in the portion where the resistor is located can be detected (for example, refer to Patent Document). Further, in the prior art, a method in which a conductive liquid is disposed on at least 5 1279560 of a ceramic substrate to reduce the electrical characteristic value of the substrate to detect cracks (see, for example, Patent Document 2). Further, in the prior art, it is also known to hold a flexible printed circuit board between an upper side plate member and a lower side plate member to fix an assembly component mounted on the substrate, and to apply force to the assembly part and the substrate. A device for conducting a conduction test between the substrate and the component to check the state of the solder in the direction of separation (for example, refer to Patent Document 3). [Patent Document 1] Japanese Patent Laid-Open Publication No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. [Problems to be Solved by the Invention] In the invention described in Patent Document 1, it is necessary to provide a resistor for measurement on an aluminum substrate in advance, and to mount an unnecessary component on the circuit. Further, in the invention described in Patent Document 2, since a conductive liquid is disposed on at least one surface of the ceramic substrate, the scale of the apparatus is increased, and the inspection is complicated. The invention described in Patent Document 3 is a device for confirming the welding quality of an assembled component, and it is difficult to detect minute cracks in the conductor pattern. Moreover, excessive stress is applied to the welded portion or the flexible printed circuit board, which poses a risk of damage to the hanging product. Moreover, in the case of a flexible printed circuit board in which a component is mounted, if the outer portion of the component is mounted, it is possible to detect a certain degree by using a ridge-curved flexible printed circuit board and using an amplification inspection by a conventional microscope or the like. Micro 6 1279560 Small crack, but the micro crack on the underside of the assembly part cannot be magnified by the microscope. Accordingly, an object of the present invention is to prevent the occurrence of microcracks generated on a conductor pattern even on the lower side of an assembly member without damaging the flexible printed circuit board. [Means for Solving the Problem] The present invention proposes an object of the present invention, and an invention of the invention of the first aspect of the invention is to provide an electrical inspection device for a flexible printed circuit board, which is characterized in that it is useful Holding the pedestal and the lower pedestal on the flexible printed circuit board, and at least one of the upper pedestal and the lower pedestal is recessed with a notch portion, and a pressure adjusting mechanism is disposed at the notch portion, Further, the resistance value detecting device for measuring the electrical resistivity of the conductor pattern provided on the flexible printed circuit board is configured to be attached to the upper base and the lower base-like flexible printed circuit board. 'And the pressure of the notch is adjusted by the pressure adjusting mechanism, and the portion located on the notch of the flexible plate is a few. This
【項所記載的可撓性印刷電路板之電氣檢查裝 1下基座巾設置有可撓性_電路板之定位 且>、備有用以對導體圖案電氣導通之接續端 1279560 氧 · 子，以及上基座檢測用感測器。 依該構成，利用定位導件使可撓性印、刷電路板的特定 部分以會來到凹口部的方式被定位。接著，用以對可撓性 印刷電路板之導體圖案電氣插通的部位係定位於設置有 接續端子的場所。然後，在上基座朝向下基座下押到規定 位置時，上基座檢測用感測器即對其進行檢測而使壓力調 整機構作動’且由接續端子朝可撓性印刷電路板的導體圖[Electrical inspection device 1 of the flexible printed circuit board according to the present invention, the pedestal towel is provided with a flexible _ the position of the circuit board, and the susceptor is electrically connected to the conductor pattern. And a sensor for detecting the upper base. According to this configuration, the positioning portion is used to position a specific portion of the flexible printed circuit board and the brush board so as to come to the notch portion. Next, the portion for electrically inserting the conductor pattern of the flexible printed circuit board is positioned at a place where the connection terminal is provided. Then, when the upper base is lowered to a predetermined position toward the lower base, the upper base detecting sensor detects the pressure adjusting mechanism and operates the conductor to the flexible printed circuit board. Figure
案電氣導通，使電阻值測定機構可測定導體圖案的電阻 值0 T明f们祀固乐J孭所記戟之發明係如申請專利範 圍第1或2項所記載的可撓性印刷電路板之 置，其中’在上述可撓性印刷電路板之導體圖案容易j 微小裂紋的部位會位在上述任一方的凹口部 上述定位用導引板。 夏 依該構成，有關在可撓性印刷電路板之導 產生微小狀的躲，可㈣糾如魏 (瞻r 環氧積層板等之厚度錢度不同的 iH) 是在裝配零件之銲點附近，以所假想這樣的 藉定位特it行粒。 ^ μ。卩的方式 申請翻_第4項所記狀翻係 =杳2二任一，載的可挽性印心 微小裂二==== 口部突出而彎曲的方式設置上述壓力調整機構。▲的凹 1279560 t *» 依該賊’ t壓力娜機構作树 電路板之裏面侧會以朝上述凹口部突m性印刷 若在導體圖案之表面產生微小裂紋的話，因 間隙變寬而使電阻值上昇，故可檢測微小裂纹、、’ 申請專職圍第5項所記狀㈣係提^；The electric conduction of the case enables the resistance value measuring mechanism to measure the resistance value of the conductor pattern. The invention of the invention is as described in claim 1 or 2 of the flexible printed circuit board described in claim 1 or 2. In the case where the conductor pattern of the flexible printed circuit board is likely to be slightly cracked, the positioning guide plate may be positioned in any of the notch portions. Xia Yi should be constructed, and the micro-shaped hiding in the flexible printed circuit board can be (4) correcting the Wei (the thickness of the epoxy laminate, etc. iH) is near the solder joint of the assembled parts. With the imaginary of such a privilege, it is a special feature. ^ μ.卩 申请 申请 第 第 第 第 第 杳 杳 杳 杳 杳 杳 杳 杳 杳 杳 杳 杳 杳 杳 杳 杳 杳 杳 杳 杳 杳 杳 杳 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第▲The recessed 1279560 t *» According to the thief's pressure, the inner side of the circuit board will be printed toward the above-mentioned notch. If a micro crack occurs on the surface of the conductor pattern, the gap becomes wider. The resistance value rises, so it is possible to detect micro-cracks, and 'Apply for the full-time report on item 5 (4).
z圍第項中任一項所記載的可撓性= 路板之電讀錄置，其中，設置有上 構’其係祕由上結和下基麵鱗的上财 電路板之容易產生微小裂紋的部位產生變形時，利用4端 子法來測定導體圖案之電阻值的變化以檢測有無 紋。 衣 依•該構成’係利用4端子法來測定導體圖案之電阻值 的變化。而利用2端子法來進行測定的情況，從檢查對象 部位到檢錄置之接點為止___成為誤差了而無 法測定正確的電阻值，但若以4端子法進行_的話，因、 為電壓測定端子和電流測定端子係分開的，所以可去除接 觸電阻之影響而測定正確的電阻值。 【發明效果】 本發明係如同上述，藉由在可撓性印刷電路板之導體 圖案容易產生微小裂紋的部位之裏面侧設置凹口部，並作 動廢力調整機構以使可撓性印刷電路板在凹口部侧·弯曲 的方式變形’在導體圖案存在有微小裂紋的情況，微小裂 紋係產生間隙而會造成電阻值上昇。因此可在不對可撓性 印刷電路板施加過度的應力而造成損傷的情況下，即便是 1279560 在裝配零件的下侧，也可確實地檢測出微小裂紋。 【實施方式】 【發明最佳實施形態】 以下’有關本發明中之可撓性印刷電路板之電氣檢查 裝置，茲舉出較佳實施例進行說明。其係將所謂不對可撓 性印刷電路板造成損傷之下可檢測導體圖案上產生的微 小裂紋之目的，藉由例如以下的方式來實現，亦即，在可 撓性印刷電路板之導體圖案容易產生微小裂紋的部位之 裏面侧設置凹口部，並作動壓力調整機構使可撓性印刷電 路板以弯曲於凹口部侧的方式進行—曲變形，於導體圖案 上存在有微小裂紋的情況，在微小裂紋係產生間隙，藉由 讀取該電阻值的變化以檢測微小裂紋。 【實施例1】 圖1為電氣檢查裝置1〇之概念圖，係設置有可開閉 的上基座11和下基座12 ,且在上基座n和下基座12當 中至少任一方的基座上凹設凹口部13，並在該凹口部 設置，力調整機構14。在關中，以―例而言，係於被凹 没在刖述上基座11的凹口部13上裝設有配管接續部 並透過吸引用配管16將附切換閥的吸引系17連接至該配 管接續部15以構成壓力調整機構14。 前述下基座12係設有可撓性印刷電路板3〇之定位用 導引板18 ’且具備用以對可撓性印刷電路板3〇之導體 案電氣導的接續端子19，以及賴對上基座^既降 1279560 至規定位置進行測的上基座檢測用感測器2〇。如同後面 將述及般，係構成了從前述接續端子19對導體圖案進行 電氣通電而進行測定導體圖案之電阻值的電阻值測定機 構。 此外，在前述定位用導引板18設有將可撓性印刷電 路板30定位於規定部位的引導銷以及前述接續端子19用 之貫通孔（圖示省略）。且，在前述上基座檢測用感測器2〇 方面，除了使用近接感測器以外，也可使用極限開關等之 開關’又，該上基座檢測用感測器2〇也可不裝設在下基 座12而是裝設在上基座n之外周部或上下動機構部。土 其次，說明上述電氣檢查裝置1〇的動作。若將檢查 對象的可撓性印刷電路板3〇載置於下基座12的定位用導 引板18的話，則容易產生微小裂紋的部位被設定位於凹 口。M3’接續端子19係與可撓性印刷電路板3Q的導體圖 案接觸。 、在f述上基座11被下押至規定位置時，上基座檢測 用感測器2。係開啟並切換切換閥使吸引泵ιγ成為開啟而 使壓力，賴構I4作動。因此，開始從被裝設在凹口部 13之配管接續部15吸引空氣，可撓性印刷電路板3〇係依 該吸引而被拉伸，前述凹卩部13的部分係會稍微變形。 在可撓性印刷電路板3〇之導體圖案產生微小裂紋的 情況’微小裂紋的間隙係依可撓性印刷電路板3〇的變形 而變賴為由電阻值測賴構所測定的導體圖案之電 阻值會上昇’所以可檢測出產生微小裂紋。此時的電阻值 係上昇數十毫Q以上。 11 1279560 又’在可撓性印刷電路板為平坦狀態時，預先將導體 圖案的電阻值記憶作為械值，之後，開啟前述吸引系17 進行吸引時，測定導體圖案之電阻值。若計算出此時的測 定值和前述初期值之差而進行微小裂紋產生之檢測的 話可進行更正碟的檢測D不論是那種測定方法，電阻值 之測疋係以4端子法來進行測定者為較佳。 在此，針對4端子法作簡單說明。圖2(1)是顯示2 端子法之電路圖，電阻值會因雙方端子T1 , T2與被測定 體私間之接觸電阻的影響而被檢測出比實際還高。圖2(2) 疋顯示4端子法之電路圖，係藉由分離電流施加用之端子 Τ1 , 12及電壓施加用之Τ3，Τ4，以去除接觸電阻之影響 而可進行高精度測定。 其次’茲針對檢測在導體圖案產生之微小裂紋的原理 作說明。圖3所示，可撓性印刷電路板3〇係為在基底膜 (base film)31的表面上隔著接著劑32設置有導體圖案 33 ’並在該導體圖案33上產生虛線A所示那樣的微小裂 紋者。 該微小裂紋因為是在導體金屬之結晶間產生的龜 裂，所以係成平坦狀態，或是在以導體圖案33為内侧的 彎曲變形中，微小裂紋部分之導體成為緊密接觸的狀態， 所以在電阻值檢測機構所測定的電阻值未產生變化之 下，並無法檢測微小裂紋。又，即使是在導體圖案33的 厚度方向整體上產生裂紋的情況，因為存在有多數個接觸 點’所以電阻值的上昇小，在測定裝置之誤差或導體抵抗 的誤差被合計的情況，電阻值之上昇量成為誤差範圍而無 12 1279560 法進行裂紋的檢測。 於是，本發明中，如圖4所示，利用可撓性印刷電路 板30的特性，藉由以基底膜31成為内側般地使其彎曲變 形，微小裂紋係如虛線B所示般裂開，裂紋内的接觸點係 大幅減少。因此，依該接觸點之減少係使導體圖案33的 電阻值上昇，如同前述，藉由以電阻值檢測機構測定電阻 值的變化，成為可容易且確實地檢測有無微小裂紋◊此 _ 外’可撓性印刷電路板30之變形量因為光是微小裂紋部 分移動數微米的距離就可獲知，所以正常的可撓性印刷電 路板30並不會產生微小裂紋。 【實施例2】 一般而言，可撓性印刷電路板中，在具有保護膜的部 分與未具有保護膜的部分係具有彎曲強度上的差異，特別 是，在保護膜之境界附近，彎曲應力係集中而容易產生微 春 小裂紋。而為了檢測該微小裂紋，係有必要使之在導體圖 案之微小裂紋擴展的方向上產生變形。亦即，藉由從可撓 性印刷電路板的基底膜側進行吸引，使導體圖案所產生的 微小裂紋擴展而依電阻值的變化可檢測有無裂紋。依該方 法，即便是在基底膜之裏面被黏貼有補強用薄膜或玻璃環 氧積層板的情況下也可檢測微小裂紋。 圖5係顯示在下基座12凹設凹口部13並在該凹口部 13 u又置有吸引用貫通口 21的構成，在可撓性印刷電路板 30之導體圖案33的一部分上，係隔著接著劑34而黏貼著 保護膜35。如同前述，因為在虛線c所示之保護膜35的 13 1279560 土兄界附近容易產生微小裂紋，所以為了以使該部分位元在 外侧的方式進行變形，係以基底膜31成為下側的狀離下 將可撓性印職雜30載置於下基座12。 〜、 圖1既說明過的定位用導引板18及接續端子19，係 以可撓性印刷電路板30的檢查部位會來到圖5所示凹口' 部13之方式被設置，而在該狀態，若使上基座n下押至 規定位置的話，則上基座檢測用感測器開啟並切換閥進行 切換而開始從下基座12的吸引用貫通口 21吸引空氣，如 圖6所示，可撓性印刷電路板3〇係依該加壓而被拉伸， 且以基底膜31侧朝前述凹口部13突出的方式彎曲。 因此，若萬一在虛線C所示之檢查部位存在有微小裂 紋的話，則如同圖4所作之說明，即，在可撓性印刷電路 板30既產生的微小裂紋（圖4中之虛線β部分)會變寬而 造成導體圖案33之電阻值變化，藉此係可檢測有無裂紋。 在除了吸引以外的壓力調整機構方面，係有從可撓性 印刷電路板30的零件裝配面進行加壓的方法。例如，如 圖7所示’在上基座η凹設上侧凹口部i3a，同時設置加 壓用貫通口 22，而下基座12上設置下側凹口部i3b和貫 通孔23。上基座11的加壓用貫通口22係與加壓果（未圖 示）的吐出口連接。 與圖5及圖6的情況同樣地，以可撓性印刷電路板 30的檢查部位會來到圖7所示凹口部i3b的方式作定位， 在該狀態，若使上基座11下押至規定位置的話，則上基 座檢測用感測器係開啟並切換切換閥而使壓縮空氣從上 基座11的加壓用貫通口 22被注入，如圖8所示，可撓性 印刷電路板30係依該加壓而被推壓，且以基底膜31侧朝 前述凹口部13突出的方式彎曲。 此外，取代利用前述空氣加壓的方式，而改以發泡胺 甲酸酯（foam i ng urethane)等之固形物體對可撓性印刷電 路板30之零件裝配面進行加壓（圖示省略）的方式也可獲 得同樣的作用效果。而發泡胺甲酸醋等之固形物體係可反 覆使用，所以有助於檢查裝置的成本降低。 【實施例3】 通常’在將零件裝配於可撓性印刷電路板之情況，係 以回流銲或是無銲(solder-free)等方式進行銲接，可撓 性印刷電路板及裝配零件係被加熱到銲料熔融溫度以 上，而在成為固相溫度以下之後，裝配零件係被固定在可 撓性印刷電路板。可撓性印刷電路板及裝配零件係依加熱 而一起膨脹，而在之後的冷卻也會一起收縮。 裝配零件與可撓性印刷電路板在線膨脹係數上大多 具有很大的差異。例如，以陶瓷零件而言，其線膨脹係數 約為7ppm/°C，而相對的，被使用作為可撓性印刷電路板 之導體圖案的銅之線膨脹係數係約為17ppm/〇c，兩者具有 相當大的差距。因此，以無鉛錫銲的場合而言，陶瓷零件 與銅之收縮差係成為如下式所示。 [17(ppm) - 7(ppm)]χ 240(〇C ) = 2400(ppm) 如圖9所示，在裝配零件36既銲接於可撓性印刷電 路板30上的情況，虛線j)及e所示的保護膜35與鲜點 間之境界部分在強紅録弱，在該部分容聽力集中而 1279560 產生微小裂紋。 於疋’如圖1〇所示’在下基座12上凹設有凹口部 13 ’同時在該凹口部13上設置吸引用貫通口 21 ,並以例 如圖9之虛線D所示之檢查部位會來到圖1〇所示凹口部 13的+方式對可撓性印刷電路板3〇進行定位，而在該^ 態，若使上基座下押至規定位置的話，則切換閥進行切換 而開始從下基座12的吸引用貫通口 21吸引空氣，如圖u 所示，可撓性印刷電路板30係依該吸引而被拉伸，且以 基底膜31侧朝前述凹口部13突出的方式彎曲。 •因此’若萬一在虛線D所示之檢查部位上存在有微小 ，紋的話，則在可撓性印刷電路板3〇既產生的微小裂紋 係變寬而使導體贿33的電阻值產生變化，藉此可檢測 有無裂紋。如此一來，就算是在裝配零件36的下侧且為 以往所無法進行檢查的微小裂紋的部位，藉由使可撓性印 刷電路板30的基底膜31侧朝凹口部13吸引而成為可容 易且確實地檢測有無微小裂紋。 又，也可自可撓性印刷電路板3〇的零件裝配面進行 加壓而使其變形。例如，如圖12所示，在上基座n上凹 設有上侧凹口部13a同時設置加壓用貫通口 22，而下基座 12上設置有下侧凹口部13b和貫通孔23。然後，若從上 基座11之加壓用貫通口 22注入壓縮空氣或壓縮瓦斯的 話，如圖13所示，可撓性印刷電路板3〇係依該加壓而被 推壓，且以基底膜31侧朝前述凹口部ub突出的方式彎i 曲。 此外，在本實施形態中，係使可撓性印刷電路板3〇 16 1279560 的基底膜31在下基座12侧朝下基座的凹口部變形，而與 此相反的，也可使基底膜31在上基座11侧朝上基座π 的凹口部變形。又，也可以是不將上基座和下基座設置成 水平狀態’而設置成垂直狀態或傾斜狀態用以挾持可撓性 印刷電路板者。 再者，本發明可在未逸脫本發明精神的範圍内進行各 種改變，而且本發明可及於該改變者亦理所當然。 【圖式簡單說明】 圖1係顯示實施例1之電氣檢查裝置的概念圖。 圖2(1)是2端子法之電路圖，（2)是4端子法之電路圖。 圖3係針對微小裂紋檢測的原理之說明圖，可撓性印刷電路 板為平坦狀態的剖面圖。 圖4係針對微小裂紋檢測的原理之說明圖，為可撓性印刷電 路板既變形的狀態之剖面圖。 圖5係顯示實施例2中之可谢生印刷電路板呈平坦狀態之剖 面圖。 圖6係顯示圖5所示之可撓性印機路板既變形的狀態之剖: 面圖。 圖7係顯示實施例2的變形例中之可撓性印刷電路板呈平坦 狀態之剖面圖。 圖8係顯示圖7所示的可撓性印刷電路板既變形的狀態之剖 面圖。 圖9係顯示實施例3中之既裝配著零件的可撓性印刷電路板 之剖面圖。 17The flexibility described in any one of the following paragraphs = the electrical reading of the road board, wherein the upper structure is provided with the upper structure and the lower surface of the upper surface of the board. When the cracked portion is deformed, the change in the resistance value of the conductor pattern is measured by the 4-terminal method to detect the presence or absence of the grain. The clothing composition was measured by the 4-terminal method to measure the change in the resistance value of the conductor pattern. In the case where the measurement is performed by the two-terminal method, the ___ becomes an error from the inspection target portion to the contact point of the inspection, and the correct resistance value cannot be measured. However, if the _ is performed by the 4-terminal method, the voltage is Since the measurement terminal and the current measurement terminal are separated, the correct resistance value can be measured by removing the influence of the contact resistance. According to the present invention, as described above, the notch portion is provided on the inner side of the portion where the conductor pattern of the flexible printed circuit board is likely to cause microcracks, and the waste force adjustment mechanism is actuated to make the flexible printed circuit board. When the notch portion side is bent and deformed, the micro-crack may be present in the conductor pattern, and the micro-crack may cause a gap to cause an increase in the resistance value. Therefore, even if excessive stress is applied to the flexible printed circuit board and damage is caused, even if 1279560 is on the lower side of the mounted component, minute cracks can be reliably detected. [Embodiment] BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, an electrical inspection apparatus for a flexible printed circuit board according to the present invention will be described with reference to a preferred embodiment. The purpose of detecting microscopic cracks generated on the conductor pattern without causing damage to the flexible printed circuit board is achieved by, for example, the following, that is, the conductor pattern on the flexible printed circuit board is easy A notch portion is provided on the inner side of the portion where the microcrack is generated, and the flexible pressure-adjusting mechanism is configured to bend the flexible printed circuit board so as to be bent on the side of the notch portion, and micro-cracks are present on the conductor pattern. A gap is generated in the microcrack, and a micro crack is detected by reading a change in the resistance value. [Embodiment 1] Fig. 1 is a conceptual view of an electrical inspection device 1A, which is provided with an openable and closable upper base 11 and a lower base 12, and at least one of the upper base n and the lower base 12 A notch portion 13 is recessed in the seat, and a force adjustment mechanism 14 is provided at the notch portion. In the case of Guanzhong, the piping connection portion is attached to the notch portion 13 of the base 11 which is recessed, and the suction system 17 with the switching valve is connected to the suction pipe 16 The pipe connecting portion 15 constitutes the pressure adjusting mechanism 14. The lower base 12 is provided with a positioning guide plate 18' for the flexible printed circuit board 3'' and is provided with a connection terminal 19 for electrically guiding the conductive case of the flexible printed circuit board 3, and The upper base ^ is lowered from 1279560 to the predetermined position for measuring the upper base detecting sensor 2〇. As will be described later, a resistance value measuring means for measuring the resistance value of the conductor pattern by electrically energizing the conductor pattern from the connection terminal 19 is constructed. Further, the positioning guide plate 18 is provided with a guide pin for positioning the flexible printed circuit board 30 at a predetermined portion and a through hole (not shown) for the connection terminal 19. Further, in the above-described upper susceptor detecting sensor 2, in addition to the proximity sensor, a switch such as a limit switch may be used. Further, the upper pedestal detecting sensor 2 may not be mounted. The lower base 12 is attached to the outer peripheral portion of the upper base n or the vertical movement mechanism portion. Soil Next, the operation of the above-described electrical inspection device 1A will be described. When the flexible printed circuit board 3 to be inspected is placed on the positioning guide 18 of the lower base 12, the portion where the microcracks are likely to occur is set in the recess. The M3' connection terminal 19 is in contact with the conductor pattern of the flexible printed circuit board 3Q. When the susceptor 11 is pushed down to a predetermined position, the upper pedestal detecting sensor 2 is used. The switch is opened and the switching valve is switched so that the suction pump ιγ is turned on and the pressure is applied, and the I4 is actuated. Therefore, air is sucked from the pipe connecting portion 15 provided in the notch portion 13, and the flexible printed circuit board 3 is stretched by the suction, and the portion of the concave portion 13 is slightly deformed. In the case where a microcrack is generated in the conductor pattern of the flexible printed circuit board 3, the gap of the microcrack is changed by the deformation of the flexible printed circuit board 3 to the conductor pattern measured by the resistance value measurement. The resistance value will rise' so that micro cracks can be detected. The resistance value at this time is increased by several tens of milliseconds or more. 11 1279560 Further, when the flexible printed circuit board is in a flat state, the resistance value of the conductor pattern is previously stored as a mechanical value, and then the resistance value of the conductor pattern is measured when the suction system 17 is opened for suction. When the detection of microcrack generation is performed by calculating the difference between the measured value at this time and the initial value, the detection of the correction disc can be performed. D. Regardless of the measurement method, the measurement of the resistance value is performed by the 4-terminal method. It is better. Here, the 4-terminal method will be briefly described. Fig. 2(1) is a circuit diagram showing the 2-terminal method, and the resistance value is detected to be higher than the actual one due to the influence of the contact resistance between the terminals T1 and T2 and the measured object. Fig. 2 (2) shows a circuit diagram of the 4-terminal method, which is capable of high-accuracy measurement by separating the terminals Τ1 and 12 for current application and Τ3, Τ4 for voltage application to remove the influence of contact resistance. Secondly, the principle of detecting micro cracks generated in the conductor pattern will be described. As shown in FIG. 3, the flexible printed circuit board 3 is formed such that a conductor pattern 33' is provided on the surface of the base film 31 via the adhesive 32, and a broken line A is formed on the conductor pattern 33. The tiny cracker. Since the microcracks are cracks generated between the crystals of the conductor metal, they are in a flat state or in a bending deformation in which the conductor pattern 33 is inside, and the conductors of the microcracks are in close contact with each other. The resistance value measured by the value detecting mechanism is not changed, and micro cracks cannot be detected. In addition, even if cracks are generated in the entire thickness direction of the conductor pattern 33, since there are a plurality of contact points, the rise in the resistance value is small, and the error in the measuring device or the error in the conductor resistance is totaled, and the resistance value is obtained. The amount of rise is the error range and no crack is detected by the 12 1279560 method. Therefore, in the present invention, as shown in FIG. 4, the base film 31 is bent and deformed by the inside of the base film 31 by the characteristics of the flexible printed circuit board 30, and the micro cracks are broken as shown by the broken line B. The contact points within the crack are greatly reduced. Therefore, according to the decrease in the contact point, the resistance value of the conductor pattern 33 is increased. As described above, by measuring the change in the resistance value by the resistance value detecting means, it is possible to easily and surely detect the presence or absence of microcracks. The amount of deformation of the flexible printed circuit board 30 is known because the light is a minute crack portion moving a few micrometers, so that the normal flexible printed circuit board 30 does not cause minute cracks. [Embodiment 2] In general, in a flexible printed circuit board, there is a difference in bending strength between a portion having a protective film and a portion having no protective film, in particular, a bending stress near a boundary of the protective film. It is concentrated and easy to produce micro-spring cracks. In order to detect the microcrack, it is necessary to deform it in the direction in which the microcracks of the conductor pattern expand. In other words, by attracting from the base film side of the flexible printed circuit board, the micro cracks generated in the conductor pattern are expanded, and the presence or absence of cracks can be detected depending on the change in the resistance value. According to this method, even when a reinforcing film or a glass epoxy laminate is adhered to the inside of the base film, microcracks can be detected. 5 shows a configuration in which the notch portion 13 is recessed in the lower base 12, and the suction through opening 21 is further provided in the notch portion 13u, and is formed on a part of the conductor pattern 33 of the flexible printed circuit board 30. The protective film 35 is adhered via the adhesive 34. As described above, since the microcracks are likely to be generated in the vicinity of the 13 1279560 in the protective film 35 shown by the broken line c, the base film 31 is in the lower side in order to deform the partial portion so as to be on the outer side. The flexible printing job 30 is placed on the lower base 12 from the lower side. The positioning guide plate 18 and the connection terminal 19 which have been described in Fig. 1 are provided such that the inspection portion of the flexible printed circuit board 30 comes to the notch portion 13 shown in Fig. 5, and In this state, when the upper base n is pushed down to a predetermined position, the upper base detecting sensor is turned on and the switching valve is switched to start sucking air from the suction through opening 21 of the lower base 12, as shown in FIG. 6. As shown in the figure, the flexible printed circuit board 3 is stretched by the pressurization, and is bent so that the base film 31 side protrudes toward the notch portion 13. Therefore, if there is a microcrack in the inspection portion shown by the broken line C, as described with reference to Fig. 4, that is, a micro crack generated in the flexible printed circuit board 30 (the dotted line β portion in Fig. 4) It is widened to cause a change in the resistance value of the conductor pattern 33, whereby the presence or absence of cracks can be detected. In addition to the pressure adjusting mechanism other than suction, a method of pressurizing from the component mounting surface of the flexible printed circuit board 30 is employed. For example, as shown in Fig. 7, the upper recess portion i3a is recessed in the upper base η, and the pressure applying through hole 22 is provided, and the lower base portion 12 is provided with the lower recess portion i3b and the through hole 23. The pressurizing through hole 22 of the upper base 11 is connected to a discharge port of a pressurized fruit (not shown). Similarly to the case of Figs. 5 and 6, the inspection portion of the flexible printed circuit board 30 is positioned so as to come to the notch portion i3b shown in Fig. 7, and in this state, the upper base 11 is pushed down. When the predetermined position is reached, the upper susceptor detecting sensor is turned on and the switching valve is switched to inject compressed air from the pressurizing through-port 22 of the upper susceptor 11, as shown in FIG. The plate 30 is pressed by the pressurization, and is bent so that the base film 31 side protrudes toward the notch portion 13. Further, instead of the above-described air pressurization, the component mounting surface of the flexible printed circuit board 30 is pressurized by a solid object such as foaming urethane (not shown). The same effect can be obtained by the same method. The solid system of foaming urethane vinegar or the like can be used in reverse, so that the cost of the inspection device is lowered. [Embodiment 3] Generally, when a component is mounted on a flexible printed circuit board, soldering is performed by means of reflow soldering or solder-free, and the flexible printed circuit board and the mounting component are The heating is performed above the solder melting temperature, and after becoming the solid phase temperature or lower, the assembled component is fixed to the flexible printed circuit board. The flexible printed circuit board and the assembled parts are expanded together by heating, and the subsequent cooling will also shrink together. There is a large difference in the coefficient of linear expansion between the assembled parts and the flexible printed circuit board. For example, in the case of ceramic parts, the coefficient of linear expansion is about 7 ppm/° C., and the coefficient of linear expansion of copper used as the conductor pattern of the flexible printed circuit board is about 17 ppm/〇c, There is a considerable gap. Therefore, in the case of lead-free soldering, the difference in shrinkage between the ceramic component and the copper is as follows. [17 (ppm) - 7 (ppm)] χ 240 (〇C) = 2400 (ppm) As shown in Fig. 9, in the case where the fitting member 36 is welded to the flexible printed circuit board 30, the broken line j) and The boundary between the protective film 35 and the fresh spot shown by e is weak in the strong red, and the hearing concentration is concentrated in this portion and the micro-crack is generated in 1279560. As shown in FIG. 1A, a notch portion 13' is recessed in the lower base 12, and a suction through opening 21 is provided in the notch portion 13, and is inspected by, for example, a broken line D in FIG. The portion is brought to the position of the notch portion 13 shown in FIG. 1A to position the flexible printed circuit board 3A. In this state, if the upper base is lowered to a predetermined position, the switching valve is operated. When the switching is started, air is sucked from the suction through-hole 21 of the lower susceptor 12, and as shown in Fig. u, the flexible printed circuit board 30 is stretched by the suction, and the base film 31 is directed toward the notch. 13 prominent ways to bend. • Therefore, if there is a slight grain on the inspection site indicated by the broken line D, the micro cracks generated on the flexible printed circuit board 3 are widened to change the resistance value of the conductor bribe 33. Thereby, the presence or absence of cracks can be detected. In this way, the portion of the base film 31 of the flexible printed circuit board 30 that is attracted to the notch portion 13 is formed in the lower portion of the mounting member 36 and is a portion of the micro crack that cannot be inspected in the past. It is easy and sure to detect the presence or absence of microcracks. Further, it is also possible to pressurize and deform the component mounting surface of the flexible printed circuit board 3A. For example, as shown in FIG. 12, the upper side notch portion 13a is recessed in the upper base n while the pressurizing through hole 22 is provided, and the lower base 12 is provided with a lower side notch portion 13b and a through hole 23 . Then, when compressed air or compressed gas is injected from the pressurizing through-hole 22 of the upper susceptor 11, as shown in FIG. 13, the flexible printed circuit board 3 is pressed by the pressurization, and the base is pressed. The film 31 side is curved in such a manner as to protrude toward the aforementioned notch portion ub. Further, in the present embodiment, the base film 31 of the flexible printed circuit board 3〇16 1279560 is deformed toward the notch portion of the lower base on the lower base 12 side, and conversely, the base film can also be used. 31 is deformed on the upper base 11 side toward the notch portion of the upper base π. Further, the upper base and the lower base may be disposed in a horizontal state or in a vertical state or in an inclined state for holding the flexible printed circuit board. Further, the present invention can be variously modified without departing from the spirit of the invention, and the present invention can be taken as a matter of course. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a conceptual diagram showing an electrical inspection apparatus of a first embodiment. Fig. 2 (1) is a circuit diagram of the 2-terminal method, and (2) is a circuit diagram of the 4-terminal method. Fig. 3 is an explanatory view showing the principle of microcrack detection, and the flexible printed circuit board is a cross-sectional view in a flat state. Fig. 4 is an explanatory view showing the principle of microcrack detection, which is a cross-sectional view showing a state in which the flexible printed circuit board is deformed. Fig. 5 is a cross-sectional view showing the printed circuit board of the second embodiment in a flat state. Fig. 6 is a cross-sectional view showing a state in which the flexible printer board shown in Fig. 5 is deformed. Fig. 7 is a cross-sectional view showing the flexible printed circuit board in a modified example of the second embodiment in a flat state. Fig. 8 is a cross-sectional view showing a state in which the flexible printed circuit board shown in Fig. 7 is deformed. Fig. 9 is a cross-sectional view showing the flexible printed circuit board in which the parts are assembled in the embodiment 3. 17
1279560 圖10係顯示圖9所示的可撓性印刷t路板呈和旦狀態 ffl 0 —〜口 圖讀示的可撓性印·路板既變形的狀態 面圖。 : 圖12個示實施例形例中之職 狀態之剖面圖。. W电岭极至十坦 圖13係顯示圖12所示的可撓柯£ β丨# 面圖。 的观印刷電路板既變形狀態之剖 【主要元件符號說明】 10···電氣檢查裝置 12…下基座 13a上側凹口部 14···壓力調整機構 16···吸引用配管 18···定位用導引板 20 —^基座檢測用感測器 22···加壓用貫通口 30···可撓性印刷電路板 32···接著劑 ’ 34.··接著劑 36…裝配零件 11···上基座 13···凹口部 13b下侧凹口部 15···配管接續部 Π···吸引泵 19···接續端子 21···吸引用貫通口 2&··貫通孔 31···基底膜 33···導體圖案 35···保護膜 37···銲點 181279560 Fig. 10 is a view showing a state in which the flexible printed circuit board shown in Fig. 9 is deformed in a state in which the flexible printed circuit board is in a state of ffl 0 - ~ port. Figure 12 is a cross-sectional view showing the state of the position in the embodiment. W 岭 极 pole to ten 坦 Figure 13 shows the flexible £ £ β 丨 面 surface view shown in Figure 12. Section of the printed circuit board in a deformed state [Description of main components] 10···Electrical inspection device 12... Lower pedestal 13a upper notch 14··· Pressure adjustment mechanism 16···Attraction piping 18·· - Positioning guide plate 20 - Detector for pedestal detection 22 · Pressurizing through port 30 · Flexible printed circuit board 32 · · Adhesive ' 34. · Adhesive 36... Mounting part 11···Upper pedestal 13··· Notch part 13b Lower side notch part 15···Pipe connection part ···· Suction pump 19···Continuation terminal 21···Attraction through port 2& ;··through hole 31···base film 33···conductor pattern 35···protective film 37··· solder joint 18