I278643 九、發明說明： 【發明所屬之技術領域】 本發明係有關於一種介面板，特別係有關於一種探測卡 之介面板。 【先前技術】 在半導體製造過程中，每顆晶片都必須在晶圓型態與完 成封裝後進行測試以確保其功能與效能，而用以測試半導體 之測試設備（test apparatus )係裝設有一探測卡（pr〇be card)，該探測卡係組配於測試設備之探測頭（沈以以以），φ 作為測試設備與受測晶圓之傳輸界面，原申請人於我國專利 公告第493756號「晶圓通用探測卡」專利案中係揭示有一 種探測卡，其包含有一探測頭（pr〇be head )、一介面板 (interp0ser )及一印刷電路板，該探測頭係為可替換式，其 具有複數個料，該介面卡係裝配於該印刷電路板與該探測 頭之間，以供模組化裝配該探測頭，該介面板的一面具有複 數個第一針點，而另一面具有複數個第二針點，該些第一針 點之間距固定，且該些第二針點之間距固定，但未揭露該介· 面板之第一針點與第二針點之相關構造。 · 此外，如美國專利第5,974,662號「探測卡之探測元件之* 尖端之平坦化方法」所揭示之介面板，其係包含有一基板及 複數個内接合元件（interconnecti〇n elemenU )，該基板之每 一銲墊係接合一内接合元件，每一内接合元件係具有一芯部 (core)及一殼部（shell)，該芯部之材質係較該殼部之材 質軟，利用該芯部成形為所需之形狀，再於該芯部外利用電 、1278643 〃弋形成"亥设部，然而，該介面板與探測頭或印刷電路 板電ϋ連接時’其係以該些内接合元件與探測頭或印刷電路 板相壓觸而電性導通，且每一相對應之銲墊係僅靠單一之内 接口兀件相互電性導通，當其中任一内接合元件偏斜即會造 成電性無法傳輸。 【發明内容】 本t月之主要目的係在於提供一種探測卡之介面板，其 係在一基板之每一銲墊係結合有複數個銲線，並以該些銲線 乍為省’丨面板之接觸端，以供該介面板接合探測頭。 本發明之次一目的係在於提供一種探測卡之介面板，利 用複數個父錯排列之銲線結合在一基板之銲墊，並以該些交 錯排列之銲線作為該介面板之接觸端，以供該介面板接合探 測頭。 本發明之再一目的係在於提供一種探測卡，其係主要包 含一介面板及一探測頭，該介面板之銲墊係結合有複數個銲 線，並對應於該探測頭之接合墊，以增進該介面板與該探測 頭之電性接觸，不會受到該介面板或該探測頭之平面平整度 之影響。 依本發明之探測卡之介面板，其係包含一基板，該基板 係具有一上表面、一下表面及複數個導通孔，該些導通孔係 貫穿該基板之該上表面與該下表面，該些導通孔係形成有複 數個銲墊，每一銲墊係結合有複數個銲線，每一銲線係具有 一結合端及一接觸端，該些結合端係以球型接合（ball bond) 方式結合於該些銲墊，該些接觸端係朝向銲墊中心軸。 w w1278643 【實施方式】 參閱所附圖式’本發明將列舉以下之實施例說明。 依本發明之第一具體實施例，請參閱第丨及2圖，一種 探測卡之介面板1 〇〇，其係包含一基板丨丨〇，該基板丨丨〇係 選自於陶竞基板、玻璃基板與石夕基板之其中之一，該基板 係具有一上表面111、一下表面丨丨2及複數個導通孔丨丨3， 該些導通孔113係貫穿該基板11〇之上表面U1與下表面 112 ,每一導通孔113之兩端係分別形成有一銲墊114，在本 實施例中，每一銲墊114係結合有複數個銲線12〇，該些銲 _ 線120係可為金線或鋁線，每一銲線12〇係具有一結合端i 21 及一接觸端122，該些銲線120之結合端121係以熱壓接合 之打線方式所形成之球型接點，並以球型接合（ball b〇nd ) 方式結合於該銲墊114，該些銲線120之接觸端122係朝向 銲墊114之中心軸114a。 再請參閱第3圖，當該介面板1〇〇應用於一包含有一電 路板200、一探測頭300與該介面板1〇〇之探測卡時，該介 面板100係設於該電路板200與該探測頭300之間，該電路 ® 板200係具有複數個接合墊210,該電路板200之接合墊210 ' 係對應該基板11 0之上表面111之銲墊11 4，並與該些銲線 120之接觸端122接觸，以達到與該些銲塾12〇電性連接之 功效’該探測頭3 0 0係具有一探測面3 1 0及一接合面3 2 0， 該探測面3 10係形成有複數個探觸端3 3 0，該些探觸端3 1 0 係用以接觸待測半導體（圖未繪出），該接合面32〇形成有 複數個連接端340，該探測頭300之連接端34〇係對應該基 7 ^ 1278643 板110之下表面112之銲墊114，並與該些銲線120之接觸 端122接觸，以達到與該些銲墊12〇電性連接之功效，在本 實施例中，該介面板1 〇〇與該探測頭300之間係設有一填充 膠400，以穩固接合該介面板ι〇〇與該探測頭3〇〇，該填充 膠400係包覆該些銲線12〇，該填充膠4〇〇係為底部填充材 (underfilling material )或非導電性熱固膠，該探測卡可再 利用一夾持件500將該探測頭300與該介面板100固定於該 電路板200。 由於上述介面板1〇〇之每一銲墊114係結合有該些銲線鲁 120，且該些銲線12〇之接觸端122係朝向銲墊114之中心 轴114a，使得每一銲線12〇均可作為該介面板1〇〇之接觸 ^ 用以分別與該電路板200之接合墊210或該探測頭3〇〇 之連接端340接觸，以供傳輸電性，此外，由於該些銲線12〇 係具有彈性，該探測卡不會受到該介面板100、該電路板200 或該探測頭300之平面平整度之影響，以增進該介面板1〇() 與該探測頭300以及該介面板100與該電路板2〇〇之電性接 觸。 · 本發明例舉第二具體實施例，請參閱第4及5圖，一種 探測卡之介面板6〇〇，其係包含一基板6丨〇，該基板6丨〇係· 選自於陶究基板、玻璃基板與矽基板之其中之一，該基板610 係具有一上表面611、一下表面612及複數個貫穿該基板610 之上表面611與下表面612之導通孔6U，每一導通孔613 之兩埏係分別形成有一銲墊614，在本實施例中，每一銲墊 614係結合有複數個交錯排列之銲線620，即該些銲線620 Ϊ278643 係呈網狀，該些銲線620係可為金線或鋁線，每一鲜線62〇 係具有一第一結合端621、一第二結合端622及一接觸端 6 2 3 ’该接觸端6 2 3係没於該第一結合6 21端與該第二纟士人 端622之間，並位於該銲墊614上，用以傳輸電性，該些鲜 線6 2 0之第一結合端6 2 1係以熱壓接合之打線方式所形成之 球型接點，並以球型接合（ball bond)方式結合於該銲塾 614，該些銲線620之第二結合端係可以楔形接合（ bond)或球型接合方式結合於該銲墊614。 本發明之保護範圍當視後附之申請專利範圍所界定者為 準，任何熟知此項技藝者，在不脫離本發明之精神和範圍内 所作之任何變化與修改，均屬於本發明之保護範圍。 【圖式簡單說明】 第1圖…依據本發明之第一具體實施例，一種探測卡之介面 板之截面示意圖； 第2圖：依據本發明之第—具體實施例，該探測卡之介面板 之上視示意圖； 第3圖：依據本發明之探測卡之截面示意圖； "圖依據本發明之第二具體實施例，一種探測卡之介面 板之截面示意圖；及 圖依據本發明之第二具體實施例，該探測卡之介面板 之上視示意圖。 【主要元件符號說明】 100介面板 110 基板 Π1上表面 112下表面 1278643 11 3導通孔 120銲線 200電路板 300探測頭 3 3 0探觸端 400填充膠 500夾持件 600介面板 6 1 0基板 613導通孔 620銲線 623接觸端 114銲墊 12 1結合端 210接合墊 3 1 0探測面 340連接端 611上表面 614銲墊 621第一結合端 114a中心軸 122接觸端 320接合面 612下表面 622第二結合端I278643 IX. Description of the Invention: [Technical Field] The present invention relates to a dielectric panel, and more particularly to a dielectric panel for a probe card. [Prior Art] In the semiconductor manufacturing process, each wafer must be tested after wafer type and package to ensure its function and performance, and the test apparatus for testing semiconductors is equipped with a probe. Card (pr〇be card), the probe card is assembled with the probe of the test equipment ( sinking and sinking), φ is used as the transmission interface between the test equipment and the tested wafer. The original applicant is in China Patent Announcement No. 493756 In the "wafer universal probe card" patent, a probe card is disclosed, which comprises a probe head, a panel (interp0ser) and a printed circuit board. The probe is replaceable. Having a plurality of materials, the interface card is mounted between the printed circuit board and the detecting head for modular assembly of the detecting head, the one side of the medium panel has a plurality of first pin points, and the other side has a plurality of a second pin point, the distance between the first pin points is fixed, and the distance between the second pin points is fixed, but the related structure of the first pin point and the second pin point of the media panel is not disclosed. In addition, as disclosed in U.S. Patent No. 5,974,662, the disclosure of the disclosure of the disclosure of the disclosure of the disclosure of the present invention is incorporated herein by reference. Each of the pads is bonded to an inner joint member, each inner joint member having a core and a shell, the material of the core being softer than the material of the shell, and the core is utilized Formed into a desired shape, and then formed outside the core with a voltage of 1279643 ,, but when the panel is electrically connected to the probe or the printed circuit board, the inner joint is The component is electrically connected to the probe or the printed circuit board, and each of the corresponding pads is electrically connected to each other only by a single inner connector. When any of the inner components are deflected, the component is caused. Electrical cannot be transmitted. SUMMARY OF THE INVENTION The main purpose of this month is to provide a mesa for detecting cards, which is a combination of a plurality of bonding wires for each pad of a substrate, and the panel is used as a '丨 panel. a contact end for the interface panel to engage the probe. A second object of the present invention is to provide a mesa for detecting a card, which is bonded to a pad of a substrate by a plurality of bonding wires arranged by a parent, and the staggered bonding wires are used as a contact end of the interposer. For the interface panel to engage the probe. A further object of the present invention is to provide a probe card, which mainly comprises a dielectric panel and a probe. The solder pads of the dielectric panel are combined with a plurality of bonding wires and corresponding to the bonding pads of the detecting head to enhance The electrical contact between the interface panel and the probe is not affected by the planar flatness of the interface panel or the probe. The interface panel of the probe card of the present invention comprises a substrate having an upper surface, a lower surface and a plurality of via holes, the through holes extending through the upper surface and the lower surface of the substrate, The via holes are formed with a plurality of solder pads, each solder pad is combined with a plurality of bonding wires, each bonding wire has a bonding end and a contact end, and the bonding ends are ball bonds. The method is coupled to the pads, the contact ends being toward the central axis of the pad. w w1278643 [Embodiment] Referring to the drawings, the present invention will be described by way of the following examples. According to a first embodiment of the present invention, reference is made to FIGS. 2 and 2, a interface card 1 of a probe card, which comprises a substrate, the substrate is selected from the ceramic substrate, One of the glass substrate and the stone substrate, the substrate has an upper surface 111, a lower surface 丨丨2 and a plurality of via holes 3, the through holes 113 extending through the upper surface U1 of the substrate 11 A soldering pad 114 is formed on each of the two ends of each of the vias 113. In the embodiment, each of the pads 114 is bonded with a plurality of bonding wires 12, and the soldering wires 120 are A gold wire or an aluminum wire, each wire 12 has a joint end i 21 and a contact end 122, and the joint ends 121 of the wire wires 120 are ball joints formed by hot pressing bonding. And bonding to the pad 114 in a ball bonding manner, the contact ends 122 of the bonding wires 120 are directed toward the central axis 114a of the bonding pad 114. Referring to FIG. 3, when the interface panel 1 is applied to a probe card including a circuit board 200, a probe 300, and the interface panel, the interface panel 100 is disposed on the circuit board 200. The circuit board 200 has a plurality of bonding pads 210, and the bonding pads 210' of the circuit board 200 are solder pads 11 4 corresponding to the upper surface 111 of the substrate 110, and The contact ends 122 of the bonding wires 120 are in contact with each other to achieve the electrical connection with the soldering pads 12 '. The detecting head 300 has a detecting surface 310 and a bonding surface 3 2 0, and the detecting surface 3 The 10 series is formed with a plurality of probe terminals 3 3 0 for contacting the semiconductor to be tested (not shown), and the joint surface 32 is formed with a plurality of connection ends 340, the detection The connecting end 34 of the head 300 is corresponding to the soldering pad 114 of the lower surface 112 of the base 7 ^ 1278643, and is in contact with the contact end 122 of the bonding wires 120 to electrically connect the pads 12 In this embodiment, a filler 400 is disposed between the interface panel 1 and the probe 300 to firmly engage the interface. The ITO and the detecting head 3 〇〇, the filling adhesive 400 is coated with the bonding wires 12 , and the filling adhesive 4 is an underfilling material or a non-conductive thermosetting adhesive. The card can be used to fix the probe 300 and the interface panel 100 to the circuit board 200 by means of a clamping member 500. Since each of the pads 114 of the dielectric panel 1 is bonded to the bonding wires 120, and the contact ends 122 of the bonding wires 12 are directed toward the central axis 114a of the bonding pads 114, each bonding wire 12 is formed. The 〇 can be used as the contact of the interface panel for contacting the bonding pad 210 of the circuit board 200 or the connecting end 340 of the detecting head 3 , for transmitting electrical properties, and further, due to the soldering The cable 12 is elastic, and the probe card is not affected by the flatness of the panel 100, the circuit board 200 or the probe 300 to enhance the interface panel 1 and the probe 300 and the The interface panel 100 is in electrical contact with the circuit board 2 . The present invention exemplifies a second embodiment. Referring to FIGS. 4 and 5, a sandwich panel 6A of a probe card includes a substrate 6丨〇, which is selected from the group of ceramics. One of a substrate, a glass substrate and a germanium substrate, the substrate 610 having an upper surface 611, a lower surface 612 and a plurality of vias 6U extending through the upper surface 611 and the lower surface 612 of the substrate 610, each via 613 Each of the two bismuth systems is formed with a bonding pad 614. In this embodiment, each bonding pad 614 is combined with a plurality of staggered bonding wires 620, that is, the bonding wires 620 Ϊ 278643 are mesh-shaped, and the bonding wires are formed. The 620 series may be a gold wire or an aluminum wire, and each fresh wire 62 has a first joint end 621, a second joint end 622 and a contact end 6 2 3 '. The contact end 6 2 3 is not in the first a combination of the 6 21 end and the second gentleman end 622, and located on the solder pad 614 for transmitting electrical properties, the first bonding end of the fresh wire 60 2 0 6 1 is hot pressed Ball-shaped contacts formed by bonding wire bonding methods are coupled to the soldering 614 in a ball bond manner, and the bonding wires 620 Two lines can be combined wedge bonding end (Bond) or ball bonded to the pad binding mode 614. The scope of the present invention is defined by the scope of the appended claims, and any changes and modifications made by those skilled in the art without departing from the spirit and scope of the invention are within the scope of the present invention. . BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a cross-sectional view of a mesa of a probe card according to a first embodiment of the present invention; FIG. 2 is a cross-sectional view of the probe card according to the first embodiment of the present invention. FIG. 3 is a schematic cross-sectional view of a probe card according to the present invention; and FIG. 2 is a schematic cross-sectional view of a mesa of a probe card according to a second embodiment of the present invention; and FIG. In a specific embodiment, the top view of the interface panel of the probe card is shown. [Main component symbol description] 100 interface panel 110 substrate 上1 upper surface 112 lower surface 1278643 11 3 via hole 120 bonding wire 200 circuit board 300 detection head 3 3 0 probe end 400 filling glue 500 clamping member 600 interface panel 6 1 0 Substrate 613 via 620 bonding wire 623 contact end 114 solder pad 12 1 bonding end 210 bonding pad 3 1 0 detecting surface 340 connecting end 611 upper surface 614 pad 621 first bonding end 114a central axis 122 contact end 320 bonding surface 612 under Surface 622 second joint end
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