1276376 九、發明說明： 【發明所屬之技術領域】 電線路之製作方法與結構，尤指由第—膠體和第二膠體所形成的導 【先前技術】 換言之，印刷電路板即是指件在之絕前缘的體的上么^導體重現所構成的電路板。 她賊絲m测㈣、顯影蝕刻 二的容路兮間並沒有-個良好的5緣體隔絕 ，導致線 好加大線路間的間隔距離，。若線，間的絕緣值不夠高時，為了避干擾只 整體體積。再者，由於習知‘是# = ·^路佈局的密度，也無法縮小成品的 很容易因為時間-長或1#=疋f耆黏性物質而將銅_貼於絕緣基板上，所以， 線路的斷路。另外’為i作導電線的造，導致導電 【發明内容】 在法與結構，藉著在絕緣基版内所雕刻出 的導線線路，‘高性膠體的導電線路，來取代於絕緣基版上形成鋪 ===結構，提高線路佈局的密度。 斷路。 轉躲路之1作方法與結構，避免導鎌路目_脫落而 i發明之另一目的在提供一種導電線路之製作方法與結構，避免使贿刻溶液製造公 另—目的在提供—種導電線路之製作方法與結構，藉著減少製程步驟，而降低 首先提供-,ϊ緣與結構。本發明所揭露製作方法， 緣基版產生架橋伽的第—膠體、電線路的凹槽。然後，填入會與絕 ⑽點舆精神可以藉由以下的發明詳述及所附圖式得到進一步的瞭解。 1276376 【實施方式】 第1圖為本發明導電線路之製作方法的示«。形成如心Γ f/t ttt膠體16的導電線路之結構主要可分成三個步驟，亦即ϋϊ 1Α圖所不之導電線路的凹槽12、形成如帛1β Ρ ^如弟 示之導電性膠體16的導電線路。 Q ^弟賴W，形成如第1C圖所 輪暢娜織树、齡後具= f ί道矛 如喷墨列印技術(lnkjet technology)或、網版所提供的微小細線噴塗技術， 二f電線，的凹槽12填人會與絕緣基版10產生架橋作用的第_膠體14中，如第B 於U導電線路的凹槽12形成第一膠體14後，仍需檢查第一膠體14在導電線路 是否有不連續的情況，並且，洗淨非於導電線路的凹槽12令的 膠體之所以需要能與絕緣基版10產生架橋作用，是為了使後續形成的導線性勝 咬住絕緣基版1〇，避免習知技術中，銅箔的導電線路會脫落， 圖所示，在*真人會與第一膠體14產生化學變化的第二膠體，而於導電線 槽中形成導線性膠體16的導電線路。同樣地，於此之後，洗淨非於導電線路 的凹槽12中的第二膠體，亦即避免電路之間產生不必要的通路情況。 、” ^已完成本發明導電性膠體16的導電線路之結構。因此，本發明正是藉著在絕緣 10内所雕刻出的導電線路之凹槽12，於其中形成導線性膠體16的導電線路，來取 絕緣基版10上形成銅箔的導線線路，而因為線路間均具有絕緣值原本就很高的絕 丄土版10之側壁，提高線路間的絕緣值。同時，也可因此提高線路佈局的密度。另外， 也因為本發明的製造方法完全不需使用到蝕刻溶液，避免使用蝕刻溶液製造公宝。並 比起習知技術，本發明製作方法很明顯地減少顯影、蝕刻等步驟，而降低製i成本。 =後，基於強化本發明之導電電路在導電性的能力，而於如第lc圖所示之導線性膠體 士，以噴塗方式將導電物質塗佈於之上，或是以電鍍或蒸鍍的方式於其上形成金屬導 電線路。 ，由以上較佳具體實施例之詳述，係希望能更加清楚描述本發明之特徵與精神，而並非 =士述所揭露的較佳具體實施例來對本發明之範疇加以限制。相反地，其目的是希望能 涵蓋各種改變及具相等性的安排於本發明所欲申請之專利範圍的範疇内。 1276376 【圖式簡單說明】 第1A〜1C圖為本發明導電線路之製作方法的示意圖。 【主要元件符號說明】 10絕緣基版 12導電線路之凹槽 14第一膠體 16導線性膠體1276376 IX. Description of the invention: [Technical field of the invention] The manufacturing method and structure of the electric circuit, especially the guide formed by the first colloid and the second colloid [Prior Art] In other words, the printed circuit board is the finger On the body of the imperfect body, the conductor reproduces the circuit board. Her thief silk m test (four), development etch two of the capacity of the road does not have a good 5 edge body isolation, resulting in a line to increase the separation distance between the lines. If the insulation value between the lines is not high enough, only the overall volume is to avoid interference. Furthermore, since the conventional 'is the density of the #=·^ road layout, it is not easy to reduce the finished product because the time-long or 1#=疋f耆 sticky substance is attached to the insulating substrate, so The line is broken. In addition, the construction of conductive wires for i leads to electrical conduction. [Invention] In the method and structure, the conductive lines carved in the insulating substrate are replaced by the conductive lines of the high-grade colloid. Form a shop === structure to increase the density of the line layout. Open circuit. Turning to avoid the road 1 method and structure, to avoid guiding the road head _ shedding and another purpose of the invention is to provide a method and structure for making a conductive line, to avoid making the brix solution manufacturing public - purpose to provide a kind of conductive The manufacturing method and structure of the line, by reducing the number of process steps, reduces the first to provide -, the edge and structure. According to the manufacturing method disclosed in the present invention, the edge-based plate generates a groove of the first colloid and the electric circuit of the bridge. Then, the spirit of filling in and ending (10) can be further understood by the following detailed description of the invention and the drawings. 1276376 [Embodiment] FIG. 1 is a view showing a method of manufacturing a conductive line of the present invention. The structure of the conductive line forming the core f/t ttt colloid 16 can be mainly divided into three steps, that is, the groove 12 of the conductive line which is not shown in the figure, forming a conductive colloid such as 帛1β Ρ ^ 16 conductive lines. Q ^弟赖 W, formed as shown in Figure 1C, the smooth woven tree, the age = f ί spear such as inkjet printing technology (lnkjet technology) or the screen provided by the tiny thin line spraying technology, two f In the first colloid 14 in which the recess 12 of the electric wire is filled with the insulating base 10 to form a bridging effect, after the first colloid 14 is formed in the recess 12 of the U conductive line, it is still necessary to check that the first colloid 14 is in the Whether the conductive circuit has discontinuity, and the cleaning of the groove 12 of the non-conductive circuit is required to be able to form a bridging effect with the insulating base plate 10, so as to make the subsequently formed wire lead to bite the insulating base. In the conventional technique, the conductive line of the copper foil is detached in the prior art, and the second colloid which chemically changes with the first colloid 14 is formed in the figure, and the conductive colloid 16 is formed in the conductive groove. Conductive lines. Similarly, after this, the second colloid in the recess 12 that is not in the conductive path is cleaned, i.e., an unnecessary path between the circuits is avoided. The structure of the conductive trace of the conductive paste 16 of the present invention has been completed. Therefore, the present invention is the conductive trace of the conductive colloid 16 formed therein by the recess 12 of the conductive trace engraved in the insulator 10. To obtain the wire line of the copper foil formed on the insulating base plate 10, and because the lines between the lines have the side walls of the insulating plate 10 which are originally high in insulation value, the insulation value between the lines is increased, and at the same time, the line can be improved. The density of the layout. In addition, because the manufacturing method of the present invention does not require the use of an etching solution at all, and avoids the use of an etching solution to manufacture a public treasure. Compared with the prior art, the manufacturing method of the present invention significantly reduces the steps of development, etching, and the like. And reducing the cost of the system i. After, based on the ability to enhance the conductivity of the conductive circuit of the present invention, the conductive material is sprayed onto the conductive adhesive as shown in Figure lc, or Forming a metal conductive line thereon by electroplating or evaporation. It is desirable to more clearly describe the features and spirit of the present invention from the detailed description of the preferred embodiments above, and The preferred embodiments disclosed in the above are intended to limit the scope of the invention. Conversely, it is intended to cover various modifications and equivalent arrangements within the scope of the claimed invention. BRIEF DESCRIPTION OF THE DRAWINGS FIGS. 1A to 1C are schematic views showing a method of fabricating a conductive line of the present invention. [Description of Main Components] 10 Insulation Base 12 Conductive Line Groove 14 First Colloid 16 Conductive Colloid
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