TWI272313B - Copper alloy for electronic material - Google Patents

Abstract

To provide a copper alloy for electronic materials which has excellent electroconductivity as well as strength and bendability and can be suitably used for various electronic equipment parts, such as lead frames, terminals, connectors, switches and relays. The copper alloy for electronic materials with high strength and high bendability is a copper alloy having a composition consisting of, by mass, 1.0 to 4.8% Ni, 0.30 to 1.2% Si, 0.03 to 0.5%, in total, of either or both of Mn and Mg and the balance Cu with inevitable impurities. In this copper alloy, working and heat treatment in a manufacturing process are regulated to control the electroconductivity (EC) of a final product to a value within the range satisfying ECalloy+20 <= EC <= ECalloy+30, wherein, the electroconductivity of the final product is represented by EC(%IACS); [Ni] and [Si] represent the additive quantities (mass%) of Ni and Si in the alloy composition, respectively; and ECalloy is an electroconductivity in the case where Ni and Si are allowed to enter into solid solution in the alloy and is represented by ECalloy=150/(1.72+1.5[Ni]+4[Si]).

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a copper alloy for electronic materials, which is used for a lead frame, a terminal, a connector, a switch, a relay, etc. When it comes to various electronic machine parts, it has suitable strength and bending workability and has excellent electrical conductivity. [Prior Art] The materials used in electronic equipment are expected to have higher strength, higher electrical conductivity, and higher quality and heat resistance as the parts are miniaturized and highly reliable. Conventionally, a copper alloy used in an electronic device is widely used as a solid solution strengthening type called phosphor bronze or brass, and &lt;a high conductivity is used, such as a Cu-Ni-Si-based cors〇n. Precipitation hardening copper alloys of alloys are also being used. In the precipitation hardening type copper alloy, a Cu_N-Si alloy is also used, and it is an alloy system which has high strength and high electrical conductivity. The strengthening mechanism is to increase the strength by separating the Ni-Si intermetallic compound particles from the Cu matrix (matHx). In recent years, in order to cope with the high integration, miniaturization, or high-density mounting of semiconductor devices, the thickness of materials used in electronic devices tends to be thinner. When the thickness is thin, sufficient contact pressure is ensured during energization. The data conveys speed and heat dissipation characteristics, and requires high strength and 胄 conductivity. In addition, the use of complex bending processing is expanding as the equipment is integrated and miniaturized. Therefore, it is demanding that it is stronger than ever and can withstand severe bending. 1272313 Processing, conveying sufficient electrical conductivity of the tribute, and sufficient thermal conductivity of heat dissipation characteristics are increasing. (Patent Document 1) Japanese Laid-Open Patent Publication No. 2001-207229 (Patent Document 1) In Patent Document 1, in order to obtain good strength, electrical conductivity, bending workability, etc., Ni/ is adjusted. Si = 3 to 7, and forms a copper alloy for an electronic material excellent in strength, electrical conductivity, and bending workability. However, in order to ensure high bending strength and high V electric rate of the precipitation hardening type copper alloy and to ensure good bending workability, it is more important to design a step which does not impair the bending workability in the manufacturing step. In general, the manufacturing step of the hardened copper alloy is carried out by using a raw material strip prepared by a predetermined step such as melt casting, annealing annealing, or the like, to effect solid solution of the elements constituting the second phase particles in the copper matrix. Solution treatment. Solution

The annealing step is less ductile. That is, the desired characteristics can be exhibited by repeating the ruthenium after annealing, but the order and the second order are preferably to maintain the precipitation rate of the alloy at the solution temperature, but usually recrystallize. When the temperature is accompanied by the recrystallization of the solution, the strength of the material is lowered by the recrystallization of the solution, and the yoke is added once or more. The aging treatment and the high pressure are expected to increase the strength. Conversely, the design is high in bending. The processability is in the step %1 of the acceptable degree of 12,723,313. In order to maintain the ductility of the solution after the solution treatment, the high workability and the high workability are formed. : Final To ensure good f-curability and conductivity. When the annealing condition of the precipitation is over-aging condition, the strength is effective and the purpose is to increase the strength of the low-workability material =:. When the crystal grain is refined, the grain is only inscribed in the fourth step, and the fixed phase phase puller is used to suppress the enchantment movement. The phase puller is coarsened during the annealing with the aging effect, and the Y-county says that the J·I j is electrically conductive. Rate 2 gives reinforcement and may also be the starting point for bending processability.丨心, = Invented to solve the problem, is to provide a copper alloy for electronic materials, copper alloy for electronic materials used in lead frames, terminals, connectors: relays and other electronic machine parts, can have a suitable strength / test It has good workability and excellent electrical conductivity. Further, as a result of intensive studies by the inventors, it has been found that by controlling the processing and heat treatment of the manufacturing steps to control the electrical conductivity of the final product, it is possible to obtain a copper alloy for electronic materials having high strength and high flexural properties. ', that is, (1) - a copper alloy for high-strength, high-bending workability electronic materials, characterized in that the beans contain N1:1. ~4.8% by mass to: 3〇~12质量%4 At least one of Mg or a total of 2 kinds 〇〇3{5 mass%, the remainder is U and unavoidable impurities·'Set the conductivity of the final product A (Li, alloy composition The amount of addition of h and Si (% by mass) is [called and [the conductivity of the solution when it is dissolved in the alloy &amp; ECaU〇y, when · ιι〇Υ = 15〇 / {1.72H.5 [Nl When +4[s(1), the processing step 1272313 of the manufacturing step is adjusted and the heat treatment is performed to control the conductivity (E/C) of the final product to the range of ECal 1〇y+2〇$ECSECalloy + 30. (2) The copper alloy for high-strength and high-bending workability electronic materials described in the above (丨) contains 〜·〇〇3 to 2.0% by mass selected from Sn, Ti, Zr, A1, Co' Cr, Fe, Zn, One or two or more types of Ag. [Embodiment] The reason for the limitation of the present invention will be described below. 1 · Μη and Mg

Mg-based elements with high work hardening ability have high effect on improving stress relaxation characteristics and final strength. However, when the addition amount is less than 3%, the effect cannot be obtained. On the other hand, if the addition amount is 0.50% or more, it is melt-casting. Deterioration of the casting surface or the like causes a decrease in castability. Further, Mn can significantly improve the strength of the alloy by solid solution strengthening, and can reinforce the strength-increasing effect of the co-addition of Ni and Si. If the amount of Mn added is less than (10), the effect cannot be obtained. On the other hand, if the amount of addition is more than G.5G%, the conductivity is remarkably lowered. If the addition amount is less than 0. 03% 'the effect cannot be obtained, the other is the addition of 0. 50% or more', the conductivity will be Significantly lower. Therefore, the amount of one or two of the dry mouth Μη and Mg is 〇· 03~0·5 mass%. Conductivity (Ecaii〇y) of the most -2 system 2 LSi solid solution in the alloy and its conductivity (Ec)

Ni and Si are solid-solubilized in the alloy. This is different from the E-blocking (Ecal l〇y) due to various heating conditions, and it is heated to the full solid solution temperature and kept. After 127 hour 1272313 or more, after rapid cooling, the conductivity expressed by ECau〇y = l5 〇 / ( l-72 + l, 5 [Ni] + 4 [Si]} can be achieved. By controlling the processing and heat treatment conditions, the electrical conductivity (E/c) of the final product is at ECalloy + 20g ECS ECall〇y + 30, which can be used to increase the strength without causing significant damage to the bending process. The Xe condition after the annealing of the solution is not limited in order to exhibit the characteristics of the calendering or more, and the order and the number of times are not limited, and the annealing step can be removed as needed. The conductivity of the final product is replaced. (E/c) is loy + 20&gt; EC, because the precipitation by aging is not fully carried out without the door strength &amp; poor or because of the very high force application of cold drying ▲ due to stress The accumulation or the breakage of the precipitated particles reduces the electrical conductivity, and the bending workability is also remarkable. On the other hand, when ECall〇y+30, the large particles make the bending plus the conductivity of the final product (E/C) as Ec &gt; because of overaging, the strength is insufficient, or the rough workability is deteriorated. Therefore, it is not good. In the high-frequency smelting furnace, the copper alloys of the various compositions shown in Table 1 are refining, and I, people A!., ,,,,,,,,,,,,,仃 仃: rolling, cold rolling, solution treatment, cold rolling, aging treatment, and final cold rolling, stress relief annealing, etc. Specifically, the solution; to maintain the temperature at 700~90η. In the dry circumference of the day 900 C, it is carried out for more than 1 minute, and then directly water-cooled. Then, Ding-_~6, each, and 1% of the temperature are cold-rolled, and the square r is called the Kui's dish. Effective treatment, but the optimum conditions at this time

攸 攸 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利Also 1272313 and a part of the material is subjected to stress relief after the final cold rolling. The strength was measured by tensile tester using a tensile tester, and the electrical conductivity was measured using a double bridge. In the bending test, a test piece having a width of 1 〇 _ was taken, and the same bending radius and load weight as the thickness of the plate were used to mock the γ亍w and the test. Also, after the full bow test, the optical microscopy == twice or more) is used to observe the parallel direction of the calendering (the bending axis (four) is extended to capture the good product (no cracks and no rough surface) Large), rough surface and cracked are indicated by X.

11 1272313 Table 1

No. Component (mass » Conductivity (%IACS) Tensile strength Bending processing Ni Si Mg Μη Subcomponent EC ECall〇y (MPa) Properties 1 2.5 0.5 0.15 - 47 20 710 〇2 2.5 0.5 0.15 - 0.22Sn, 0.36Zn 46 20 700 〇3 2.5 0.5 0.15 - O.lCr, 0.07Fe 41 20 720 〇4 2.5 0.5 0.15 0.06 45 20 730 〇5 2.5 0.5 0.15 0.13 43 20 750 〇6 2.5 0.5 0.15 0.13 0.2C〇43 20 750 〇7 2.5 0.5 0.15 0.28 0.03Ti, 0.07Fe 40 20 770 〇8 3.8 0. 85 0.13 - 39 14 830 〇4r 9 3.8 0.85 0.13 - 0. lCr 39 14 840 〇不路10 3.8 0.85 0.13 - 0. 06Sn, 0. 05Ag 39 14 860 〇明11 3.8 0.85 0.13 0. 08 38 14 850 Example 12 3.8 0.85 0.13 0.13 37 14 860 〇13 3.8 0.85 0.13 0.04 0.04Ti, 0.05Zr, 0.03Fe 34 14 860 〇14 3.8 0.85 0.13 0.28 0.1 A1 34 14 860 〇15 4.5 1.0 0.15 - 37 12 900 〇16 4.5 1.0 0.15 - 0. 2Cr 37 12 900 〇17 4.5 1.0 0.15 - 0. 08Zr, 0. ICo, 0. lCr 36 12 920 〇18 4.5 1.0 0.15 0.13 35 12 940 〇18 4.5 1.0 0.15 0.28 33 12 960 〇20 4.5 1.0 0.15 0.13 0. lCr, 0.07Fe 32 12 980 〇21 4.5 1.0 0.15 0.28 0.2A1, 0. lCr 32 12 970 〇22 2.5 0.5 0.15 0.13 55 20 480 〇23 2.5 0.5 0.15 0.13 52 20 690 X 24 2.5 0.5 0.15 0.13 55 20 510 〇25 2.5 0.5 0.15 0.13 54 20 670 X 26 3.8 0.85 0.13 0. 08 28 14 780 X Ratio 27 0.9 0.2 0.15 - 44 39 510 28 28 28 0.8 0.15 - 27 12 730 Example 29 2.5 1.9 0.15 - - 11 - - 30 3.8 0. 85 0.13 2 18 14 860 X 31 3.8 0.85 0.13 - l.OSn, 1.4A1, 0.3Zn 13 14 850 X 32 3.8 0.85 0.13 0.08 0.8Ti, 0.2Zr, l.lFe - 14 - - 33 4.5 1.0 0.15 - 0. 06Sn, 0 .lCr, 0. 03Ag 34 12 610 X

12 1272313 No, in the invention examples No. 1 to 21, it is possible to obtain a copper alloy having excellent properties in strength and bending workability in the patent range of the present invention. Invention = one = surface, Comparative Example No. 22 to 26, although the alloy composition is within the scope of the present example, the solution temperature of the target No. 22 cannot be obtained because the manufacturing steps are not appropriate. The amount of unsolidified solution is increased, so that the conductivity EC>Ecalloy+30 after the thermal treatment is insufficient, the strength is insufficient, and the final cold rolling is applied to the strength of the second layer, but high workability is required in order to obtain the desired strength. , to reduce the elongation, bending processing ten generations / μ xr. 士心,化. No. 24 because of the high degree of cold rolling before aging annealing, the gradual 'high phoenix is also high temperature, thus leading to excessive thermal annealing On the other hand, in order to improve the strength of the No. 24, the cold rolling of the low-workability is applied. The cold rolling of the crystal grains before the aging causes the crystal grains to be rolled, and the flatness deteriorates the testability. No. 26 Cold rolling is applied after the solution is dissolved at high temperature. Aging treatment, but the aging time is higher than the strength, and the electrical conductivity after the aging treatment is lowered, and the crystal grain size is coarsened at the time of the high-temperature solution treatment, resulting in deterioration of the bending workability, and No. 27 because Ni, ς; μ 旦 r r , ^ 篁 篁 少 ^ ^ ^ 。 。 r r r r r 比较 比较 比较 比较 比较 比较 比较 比较 比较 比较 比较 比较 比较 比较 比较 比较 比较 比较 比较 比较 比较 比较 比较 比较 比较 比较 比较 比较 比较 比较However, the characteristic cracking of the cracks in the hot rolling was not possible.

No. 30 Because the amount of Μη is higher, the conductivity is significantly lower. In No. 31, since the enthalpy of the subcomponent exceeds the range of the present invention, the conductivity of the lead smear solid is remarkably lowered. No. 32 because the amount of the subcomponent exceeded the present invention 笳jfj, a # &amp; i solid crack occurred in the hot rolling and could not be evaluated 13 1272313. No. 33 has coarse particles remaining due to insufficient solution treatment, and the strength and bending workability are deteriorated after the final aging treatment. As described above, by controlling the electrical conductivity of the final product by adjusting the processing and heat treatment of the manufacturing steps, a copper alloy for electronic materials having high strength and high bending workability can be obtained. [Simple description of the map] None 14

Claims (1)

No. - Amendment in August) Corrected page picking and application of special oil range: 1. - High-strength and high-bending processing materials are processed and heat-treated. The electronic components are made of copper alloy: I 〇~4·8 The mass %, Si · 〇 3 〇, is characterized by the copper alloy material being Ni species or a total of two kinds of 〇〇3~〇5 denier. · 2% by mass, Μη, Mg, at least 1 impurity-free; set electron::/°, the remainder is Cu and the composition of the unavoidable alloy material...and the conductivity of the cow is the ICUIACS), copper, complex The addition amount (% by mass) of the strange celebrity η 1 is [Ni] and [Si] =1,0/ r 1 70 , v is ECalloy, when ECalloy 50/ { 1.72 + 1.5[Ni]+4[ When Si1 ι ^ 4m 1"1, the processing and heat treatment of the manufacturing steps are adjusted to control the conductivity (EC) of the electron broadcast + + to ECalloy + 20 $EC$ECall〇y + 30. 2. For example, in the first step of the patent application, the high-strength bending process of the electric component, wherein the copper alloy 铋&gt; material 0 contains 0·003~2. 0 mass% of the selection from Sn, Ti, One or two types of Zr, Al, c〇, cr, pn, Fe, Zn, Ag. Pick up, pattern: