200426233 玖、發明說明： 【發明所屬之技術領域】 用 關 曲 本發明係有關於一種電子材料用銅合金，該電子村 銅合金使用於導線架（lead frame)、端子、連接号、門 、繼電器等各種電子機器零件時，具有適合的強度、； 加工性之同時並具有優良導電率。 【先前技術】 電子機器所使用的材料，隨著零件的小型化及高可靠 性的需求，期盼高強度、高電導性、以及耐㈣與耐^ 等更為優良者。以往電子機器所使用之鋼合金，廣泛地使 用稱為麟青銅、黃銅等固溶強化型，但以高導電性的觀點 ’如Cu-Ni-Si系之科森心瞻）合金之析出硬化型銅合金 亦漸漸被使用。 析出硬化型銅合金中亦以Cu„Ni_Si系合金，為且備高 強度同時並兼具較高導電率之合金系。其強化機構，為科 由使Ni-Sl系之金屬間化合物粒子“ u基質(他⑴中析 出來提升強度。 —近年來為了因應半導體設備的高積體化、小型化、或 高密度構裝，電子機器所使用的材料之板厚亦傾向於薄化 ’板厚變薄時為確保通電時充分的接觸壓力、資料傳達速 度、以及散熱特性’而要求高強度、高導電化。而且隨著 設備之高積體化、小型化等’施加複雜彎曲加工之用途正 擴大中。因此，針餅士 # $古：^ d 丫 t比以彺更冋強度且能忍受嚴苛之彎曲 200426233 加工、傳達貧料之充分的導電率、以及散熱特性之充分的 熱傳導率等要求正升高中。（例如，參照日本專利文獻1) 專利文獻1 :特開2001-207229號公報 【發明内容】 於專利文獻1中，為了得到良好的強度、導電性及彎 曲加工性等’藉由調整Ni/Si = 3〜7，而形成強度、導電性 及彎曲加工性優異之電子材料用銅合金。 但是，為了既可確保析出硬化型銅合金之高強度、高 導電率’還能確保良好的彎曲加工性，在製造步驟中設計 不損害彎曲加工性之步驟則更為重要。一般而t，硬化型 銅合金之製造步驟，係使用經由溶解鑄造、肖質化退火 、卜i吨）壓延專既定步驟而製成之原料條，進行使構 成第一相粒子之元素在銅基質中固溶之溶體化處理。溶體 化處理後之原料條’藉由於退火後反覆進# 1以次以上的 塵延：時效處理，可以發揮所期望之特性，但其順序及次 數並沒有限制，視需要亦可以伴隨去除應力之退火步驟替 二士 β々體化處理’較佳為保持該合金系於固溶溫度下既 ^夺間後進行急速冷卻以增加析出率，但通常於再結晶溫 、_之回’皿進行。伴隨該溶體化之退火時，由於與溶體 化不同之，他機構同時生成之再結晶組織而使材料強度降 低。為了提昇降低之強度而施加1次以上的時效處理及壓 延，但此時最終加工度高時雖可期待高強度化，相反地， 延展性卻降低。亦即，設計高彎曲加工性在可以接受程度 133 之步驟時，為了维柱、六 、'持〉谷體化處理後之延展性，俜選擇最炊 加工度為低加工户而丄 係k擇取終 ^形成兩導電、高彎曲加工性之步驟。 ‘，、、確保良好的彎曲加工性和導電率，若使 析出之退火條件為過時效條件時，強产合* # χ Λ ^, 條件強度會隨著明顯降低。 又暴方；使低加工度材料 結晶粒微細化時，在粒=:的’而嘗試預先進行 ；在粒界移動抑制上發揮固定作用之第二 ，:曰曰不僅：時效之退火時會粗大化，雖可得到高導電率 丄疋不僅無法賦予強化作用且亦可能成為彎曲加工性惡 化的起點。 〜 本I明奴解決之課題，係提供一種電子材料用銅合金 ，“電子材料用銅合金使用於導線架、端子、連接器、開 關、繼電器等各種電子機器零件時，能具有適合的強度、 彎曲加工性之同時並具有優良導電率，。 本^月人等經致力研究之結果，發現藉由調整製造步 驟之加工和熱處理來控制最終製品之導電率，可以得到具 有高強度且高彎曲加工性之電子材料用銅合金。 亦即， ⑴-種高強度、高弯曲加工性電子材料用銅合金，其 特徵為含有^1沁1.0〜4.8質量％、以：〇.3〇〜12質量％、如 、Mg之至少！種或2種合計〇 〇3〜〇 5質量％、剩餘部份為 Cu與無法避免的雜質；設最終製品之導電率為ec(%iacs) 、合金組成中Ni及Si之添加量（質量、其 等在合金中固溶時之導電率為ECall〇y，當ECall〇y = 150/ { 1.72 + 1.5[Ni]+4[Si]丨時，係調整製造步驟之加工 200426233 和熱處理而將最終製品之導電率（E/C)控制於ECall〇y + 20 S ECall〇y + 30 之範圍。 (2) —種如上述（1)所述之高強度、高彎曲加工性電子 材料用銅合金，係含有0 003〜2.〇質量％之擇自Sn、Ti、 、A1、Co、Cr、Fe、Zn、Ag 之 1 種或 2 種以上。 【實施方式】 以下說明本發明之限定理由。 1 · Μη 及 Mg200426233 发明 Description of the invention: [Technical field to which the invention belongs] The invention relates to a copper alloy for electronic materials. The electronic village copper alloy is used in lead frames, terminals, connection numbers, doors, relays When it is used in various electronic equipment parts, it has suitable strength and workability, and has excellent electrical conductivity. [Prior technology] As the materials used in electronic equipment are miniaturized and highly reliable, the expectation is for higher strength, higher electrical conductivity, and better resistance to rubbing and resistance. In the past, steel alloys used in electronic equipment were widely used as solid solution-strengthened types such as bronze and brass. However, from the viewpoint of high conductivity, such as the precipitation of hardened Cu-Ni-Si based Corson) alloys Type copper alloys are also gradually being used. The precipitation-hardening copper alloy also uses Cu „Ni_Si-based alloys, which are alloy systems with high strength and high electrical conductivity. The strengthening mechanism is made of Ni-Sl-based intermetallic compound particles“ u Substrates are precipitated to enhance strength. —In recent years, in response to the high integration, miniaturization, or high-density packaging of semiconductor devices, the thickness of materials used in electronic equipment has also tended to be thinner. When thin, high strength and high electrical conductivity are required to ensure sufficient contact pressure, data transmission speed, and heat dissipation characteristics at the time of energization. In addition, the use of complex bending processes is expanding as equipment becomes more compact and smaller. Therefore, the needle cake man # $ 古 ： ^ d γt is stronger than 彺 and can withstand severe bending 200426233 processing, sufficient conductivity to convey poor materials, and sufficient thermal conductivity for heat dissipation characteristics (See, for example, Japanese Patent Document 1) Patent Document 1: Japanese Patent Application Laid-Open No. 2001-207229 [Summary of the Invention] In Patent Document 1, in order to obtain good strength, electrical conductivity, and bending Workability, etc. 'By adjusting Ni / Si = 3 to 7, copper alloys for electronic materials that are excellent in strength, conductivity, and bendability are formed. However, in order to ensure the high strength and high conductivity of the precipitation-hardened copper alloy The rate can also ensure good bending workability, and it is more important to design the steps that do not damage the bending workability in the manufacturing steps. Generally, t, the manufacturing steps of hardened copper alloys are made by dissolving casting and quenching annealing. (B) Ton) The raw material strip prepared by a specific step is calendered and subjected to a solution treatment in which elements constituting the first phase particles are solid-dissolved in a copper matrix. After the solution treatment, the raw material strips are re-introduced # 1 times or more due to the post-annealing: the aging treatment can exert the desired characteristics, but the order and number of times are not limited, and if necessary, it can also be accompanied by stress removal. The annealing step replaces the β-carotidization treatment. It is better to keep the alloy at a solid solution temperature, and then quench it quickly to increase the precipitation rate, but it is usually performed at the recrystallization temperature and the temperature. . In the annealing accompanied by the solution, the strength of the material is reduced due to the recrystallized structure that is generated simultaneously by other mechanisms. Aging treatment and rolling are applied more than once to increase the reduced strength. However, in this case, when the final processing degree is high, high strength can be expected, and conversely, the ductility is reduced. That is, when designing a high bending processability at an acceptable level of 133 steps, in order to maintain the ductility of the column, six, and “holding” glutenization treatment, 俜 choose the lowest processing degree and do not choose The final step is to form two conductive, high bending workability steps. ‘,,, and ensure good bending workability and electrical conductivity. If the annealing conditions for precipitation are made to be over-aged conditions, the high-strength combination * # χ Λ ^, the strength of the conditions will be significantly reduced. It's also violent; when miniaturizing the crystal grains of low-process materials, try to do it before the grain =: '; play a fixed role in suppressing the movement of the grain boundary. Second, it is not only: the aging will be coarse when annealing. Although it is possible to obtain high electrical conductivity, it is not only incapable of imparting a reinforcing effect, but may also be a starting point for deterioration in bending workability. ~ The problem solved by this Minnu is to provide a copper alloy for electronic materials. "The copper alloy for electronic materials can have appropriate strength when used in various electronic equipment parts such as lead frames, terminals, connectors, switches, relays, etc. Bending workability and excellent electrical conductivity at the same time. As a result of dedicated research, this month's person and others found that by adjusting the processing and heat treatment of the manufacturing steps to control the conductivity of the final product, high strength and high bending processing can be obtained. Copper alloys for electronic materials, that is, ⑴—a copper alloy for electronic materials with high strength and high bending workability, which is characterized by containing 1.0 to 4.8% by mass, and 0.3 to 12% by mass. For example, at least one of Mg! One or two kinds in total 〇03 ~ 〇5% by mass, the remaining part is Cu and unavoidable impurities; suppose the electrical conductivity of the final product is ec (% iacs), Ni and The amount of Si added (mass, its electrical conductivity when dissolved in the alloy is ECall〇y, when ECall〇y = 150 / {1.72 + 1.5 [Ni] +4 [Si] 丨, it is the adjustment of the manufacturing steps Processing 200426233 and heat treatment while The electrical conductivity (E / C) of the final product is controlled within the range of ECall〇y + 20 S ECall〇y + 30. (2)-a kind of copper for electronic materials with high strength and high bendability as described in (1) above The alloy contains 0 003 ~ 2.0% by mass of one or two or more selected from Sn, Ti, Al, Co, Cr, Fe, Zn, and Ag. [Embodiment] The reasons for limitation of the present invention will be described below. 1 · Μη and Mg
Mg係加工硬化能力高之元素，改善應力緩和特性及最 終強度效果大，但是添加量未滿〇 〇3%時無法得到其效果 L另一方面，添加量若在〇5〇%以上時，因熔解鑄造時鑄 造表面之劣化等會造成鑄造性降低。又，Μη藉由固溶強化 可以顯著地改善合金強度，並可補強Ni及si之共同添加 所產生之強度提昇效果。Mn之添加量若未m，盈法 L效果’另-方面，添加量若在0.50%以上時，導雷 率會顯著降低。此蓉+ | | m i ^ 素冋心加時，添加量若未滿 二，無法得到其效果，另一方面，添加量…5。%以 上，則導電率會顯著降低。因此，使^及…種或2 種之添加量為〇· 03〜0· 5質量％。 ’ 及Si m合金中時之導電率（ECa_)及並 取終製品之導電率（此） 八 件而L及·Si固溶於合金中之導電率（£caii〇y)雖因加熱條 的不同’但加熱至完全固溶溫度並保持】小時 200426233 以上、再急速冷卻後，可以 m.5叫邮⑴所表示之導電率㈤^叫50、/1 準，藉由控制加工及熱處理條 炊^亥導電率為基 在 ECau〇y+20SECSECall〇y+ 品之導電率（㈤ …性下謀求高強度化，此時°，二=大幅損害弯 後的製造條件，為發揮特性現者洛體化之退火 為佳，但其順序及次數沒有限tT::以上的壓延及時效 隨之退火步驟替代。今H 可以去除應力伴 £CaU〇ym>EC時，因^由/ 1品之導電率（E/C)為 法提高強度，故不佳。二:效之析出並未充分進行而無 ，由於應力之積蓄或是二高的加工度施加冷軋 彎曲加工性亦顯著地惡Γ 斷裂等使導電率降低， 另一方面，最終製 ECaU〇y+30時，因為㈣/〇之導電率（E/C)為EC> 大粒子使彎曲加工性 又 或疋生成粗 丨土勿恶化，故不佳。 貫施例 =頻炫解爐中炫製表2所示各組成 =乳、冷乾、溶體化處理、冷乾、時效處理二 後 °具體而言’溶體化 後直接進行水冷。^頻内1分鐘以上進行，之 _〜6〇(TC之各溫度進種加工度進行冷軋，及於 從申請專利範圍第時之最心条件係以 保持溫度及保持時間。、巧"'之文值°周整加工度、 200426233 又，一部分材料在施加最終冷乳後，進行去除應力退 火。強度係於拉伸試驗機測定拉伸強度，導電率係使用雙 電橋（double bridge)測定電阻。彎曲試驗係取寬度為 10賴之試片，以與板厚同樣之彎曲半徑、負載重量5噸進 行W f曲試驗。又’彎曲試驗後之評價，係使用光學顯微 鏡（倍率50肖以上）觀察壓延平行方向（彎曲軸與壓延方向 垂之幫曲表面’良好品(未有裂痕及表面粗糙程度不大) 以〇表示、表面粗糙及有裂痕者以χ表示。 200426233 表iMg is an element with high work hardening ability. It has a large effect of improving stress relaxation properties and final strength. However, the effect cannot be obtained when the amount is less than 0.02%. On the other hand, if the amount is more than 5%, Deterioration of the casting surface during melt casting and the like may cause a reduction in castability. In addition, Mn can significantly improve the strength of the alloy by solid solution strengthening, and can strengthen the strength improvement effect produced by the combined addition of Ni and si. If the addition amount of Mn is less than m, the effect of the surplus method L 'is another aspect. If the addition amount is more than 0.50%, the lightning conductivity will be significantly reduced. ++ | | m i ^ When the heart is added, if the amount is less than two, the effect will not be obtained. On the other hand, the amount ... 5. % Or more, the conductivity will be significantly reduced. Therefore, the amount of addition of ^ and ... or 2 kinds is set to 0.03 to 0.5 mass%. 'And the conductivity of the Si m alloy (ECa_) and the conductivity of the final product (this) eight pieces, while the conductivity of L and · Si solid solution in the alloy (£ caii〇y) Different ', but heated to the complete solution temperature and maintained] hours 200426233 or more, and then quickly cooled, you can m.5 called the post conductivity ⑴ ^ 50, / 1 standard, by controlling the processing and heat treatment bar ^ Hai conductivity is based on the conductivity of ECau〇y + 20SECSECall〇y + products (㈤… to achieve high strength, at this time °, 2 = significantly damage the manufacturing conditions after bending, the characteristics of the present body Annealing is better, but there is no limit to the order and number of times tT :: The above rolling and aging will be replaced by the annealing step. Now H can remove the stress associated with CaCaOym &EC; due to the conductivity of 1 product ( E / C) is not good for improving the strength. Second: The precipitation of the effect is not fully performed without it. Due to the accumulation of stress or the second high degree of processing, the cold rolling bending workability is also significantly worse than the fracture. The conductivity decreases. On the other hand, when ECaUy + 30 is finally produced, the conductivity of ㈣ / 〇 E / C) is EC > Large particles do not deteriorate bending workability or coarseness, so the soil is not deteriorated, so it is not good. Exemplary Examples = Compositions shown in Table 2 in the frequency-reduction furnace = milk, cold-dry, After solution treatment, cold-drying, and aging treatment ° Specifically, 'the solution is directly water-cooled after the solution is melted. It is performed for more than 1 minute within the frequency range, and cold rolling is performed at a temperature of TC at each temperature. The most important conditions at the time of applying for the patent range are to maintain the temperature and the retention time. Qiao "quote's value ° week finishing process, 200426233 In addition, some materials are subjected to stress removal after the final cold milk is applied Annealing. The strength is measured by a tensile tester, and the electrical conductivity is measured by a double bridge. The bending test is a test piece with a width of 10 lai, with the same bending radius and load as the plate thickness. The W f-curve test was performed with a weight of 5 tons. The evaluation after the bending test was performed using an optical microscope (magnification over 50 Shaw) to observe the parallel rolling direction (the bending surface perpendicular to the rolling axis of the rolling axis). Good product (no cracks or cracks) Surface roughness is not great) Shown, there are cracks and surface roughness indicated in χ. 200426233 Table i
No. 成分（質量》 導電率(％I ACS) 拉伸強度 彎曲加工 Ni Si Mg Μη 副成分 EC ECalloy (MPa) 性 1 2.5 0.5 0.15 - 47 20 710 〇 2 2.5 0.5 0.15 - 0.22Sn, 0.36Ζη 46 20 700 〇 3 2.5 0.5 0.15 0. lCr, 0.07Fe 41 20 720 〇 4 2.5 0.5 0.15 0.06 45 20 730 〇 5 2.5 0.5 0.15 0.13 43 20 750 〇 6 2.5 0.5 0.15 0.13 0. 2Co 43 20 750 〇 7 2.5 0.5 0.15 0.28 0.03Ti, 0.07Fe 40 20 770 〇 8 3.8 0. 85 0.13 - 39 14 830 〇 本 發 明 例 9 3.8 0.85 0.13 O.lCr 39 14 840 〇 10 3.8 0. 85 0.13 - 0. 06Sn, 0. 05Ag 39 14 860 〇 11 3.8 0. 85 0.13 0.08 38 14 850 〇 12 3.8 0.85 0.13 0.13 37 14 860 〇 13 3.8 0. 85 0.13 0. 04 0.04Ti, 0.05Zr, 0.03Fe 34 14 860 〇 14 3.8 0.85 0.13 0.28 0.1A1 34 14 860 〇 15 4.5 1.0 0.15 ~ 37 12 900 〇 16 4.5 1.0 0.15 - 0. 2Cr 37 12 900 〇 17 4.5 1.0 0.15 - 0. 08Zr, 0. ICo, 0. lCr 36 12 920 〇 18 4.5 1.0 0.15 0.13 35 12 940 〇 18 4.5 1.0 0.15 0.28 33 12 960 〇 20 4.5 1.0 0.15 0.13 O.lCr, 0.07Fe 32 12 980 〇 21 4.5 1.0 0.15 0. 28 0.2A1, O.lCr 32 12 970 〇 22 2.5 0.5 0.15 0.13 55 20 480 〇 23 2.5 0.5 0.15 0.13 52 20 690 X 24 2.5 0.5 0.15 0.13 55 20 510 〇 25 2.5 0.5 0.15 0.13 54 20 670 X 比 較 例 26 3.8 0. 85 0.13 0. 08 28 14 780 X 27 0.9 0.2 0.15 - 44 39 510 〇 28 5 0.8 0.15 - 27 12 730 〇 29 2.5 1.9 0.15 - - 11 - - 30 3.8 0. 85 0.13 2 18 14 860 X 31 3.8 0. 85 0.13 - l.OSn, 1.4A1, 0.3Zn 13 14 850 X 32 3.8 0.85 0.13 0.08 0.8Ti, 0.2Zr, l.lFe - 14 - - 33 4.5 1.0 0.15 - 0. 06Sn, 0. lCr, 0. 03Ag 34 12 610 X 12 200426233 如表1所示，於發明例No. ：1〜21，可製得導電率（Ec) 於本發明申請專利範圍中，強度、彎曲加工性皆具良好特 性之銅合金。 另一方面，比較例No· 22〜26，其合金組成雖然於本 舍明例之範圍内，但因為製造步驟不適當而無法得到目標 之特性；比較例No· 22之溶體化溫度較低使未固溶量增加 ’因此熱成處理後的導電率EC>ECalloy + 30而使強度不足 ° No· 23係為了再提高ν〇· 22之強度而施加最終冷軋，但 是為了得到期望強度而需要高加工度，使延伸性降低、彎 曲加工性惡化。Ν〇· 24因為時效退火前之冷軋加工度較高 且夺效度亦為咼溫，因此導致過度熱成退火而使最終 強度惡化。No.25 «為了提高Ng. 24之強度而施加低加 工度的冷軋，但因為時效前之冷軋造成結晶粒呈現壓延組 織而扁平’使彎曲加工性惡化。Ν〇·26在高溫施行溶體化 處理後，雖然施加冷軋及時效處理，但是因為時效時間較 t、、i相對於強度的提高時效處理後的導電率降低，而且於 '合體化處理日寸結晶粒徑粗大化’致使彎曲加工性變 例No Μ田Μ·, 〜王π 7 π Μ漉沒變產。比較 〇· 28因Νι較高而使導雷 使埶衝Φ ^ 吏導電率紇差。No· 29因Si較高而 便熱乳中發生顯著的No. Composition (mass) Conductivity (% I ACS) Tensile strength Bending Ni Si Mg Μη Sub-component EC ECalloy (MPa) Properties 1 2.5 0.5 0.15-47 20 710 〇2 2.5 0.5 0.15-0.22Sn, 0.36Zη 46 20 700 〇3 2.5 0.5 0.15 0.lCr, 0.07Fe 41 20 720 〇4 2.5 0.5 0.15 0.06 45 20 730 〇5 2.5 0.5 0.15 0.13 43 20 750 〇6 2.5 0.5 0.15 0.13 0.2 Co 43 20 750 〇7 2.5 0.5 0.15 0.28 0.03Ti, 0.07Fe 40 20 770 〇8 3.8 0. 85 0.13-39 14 830 〇 Inventive Example 9 3.8 0.85 0.13 O.lCr 39 14 840 〇10 3.8 0. 85 0.13-0.06Sn, 0.05Ag 39 14 860 〇11 3.8 0. 85 0.13 0.08 38 14 850 〇12 3.8 0.85 0.13 0.13 37 14 860 〇13 3.8 0. 85 0.13 0. 04 0.04Ti, 0.05Zr, 0.03Fe 34 14 860 〇14 3.8 0.85 0.13 0.28 0.1A1 34 14 860 〇15 4.5 1.0 0.15 ~ 37 12 900 〇16 4.5 1.0 0.15-0.2Cr 37 12 900 〇17 4.5 1.0 0.15-0.08 Zr, 0. ICo, 0.1 lCr 36 12 920 〇18 4.5 1.0 0.15 0.13 35 12 940 〇18 4.5 1.0 0.15 0.28 33 12 960 〇20 4.5 1.0 0.15 0.13 O.lCr, 0.07Fe 32 12 980 21 4.5 1.0 0.15 0. 28 0.2A1, O.lCr 32 12 970 〇22 2.5 0.5 0.15 0.13 55 20 480 〇23 2.5 0.5 0.15 0.13 52 20 690 X 24 2.5 0.5 0.15 0.13 55 20 510 〇25 2.5 0.5 0.15 0.13 54 20 670 X Comparative Example 26 3.8 0. 85 0.13 0. 08 28 14 780 X 27 0.9 0.2 0.15-44 39 510 〇28 5 0.8 0.15-27 12 730 〇29 2.5 1.9 0.15--11--30 3.8 0. 85 0.13 2 18 14 860 X 31 3.8 0. 85 0.13-l.OSn, 1.4A1, 0.3Zn 13 14 850 X 32 3.8 0.85 0.13 0.08 0.8Ti, 0.2Zr, l.lFe-14--33 4.5 1.0 0.15-0 06Sn, 0. lCr, 0. 03Ag 34 12 610 X 12 200426233 As shown in Table 1, in Inventive Example No .: 1 ~ 21, electrical conductivity (Ec) can be obtained within the scope of the patent application for the present invention. Copper alloy with good bendability. On the other hand, in Comparative Example No. 22 to 26, although the alloy composition is within the scope of the present example, the target characteristics cannot be obtained because of inappropriate manufacturing steps; Comparative Example No. 22 has a lower solution temperature. Increasing the amount of non-solid solution '. Therefore, the electrical conductivity after thermoforming treatment EC> ECalloy + 30 makes the strength insufficient. No. 23 is subjected to final cold rolling in order to further increase the strength of ν〇 · 22, but in order to obtain the desired strength, A high workability is required to reduce the extensibility and deteriorate the bendability. No. 24 has a higher degree of cold-rolling workability before aging annealing and a high degree of efficiency, so it causes excessive thermal annealing and deteriorates the final strength. No.25 «In order to increase the strength of Ng. 24, cold rolling with a low working degree was applied, but the cold rolling before aging caused the crystal grains to appear flattened and flattened ', which deteriorated the bendability. No. 26 is subjected to solution treatment at a high temperature, although cold rolling and aging treatment are applied, but because the aging time is longer than t, and i relative to the increase in strength, the conductivity after aging treatment is reduced, and on the day of 'combination treatment' The coarsening of the crystal grain size has caused the bending workability variation No. Μ 田 Μ ·, ~ Wang π 7 π Μ 漉 did not change production. Comparison 〇 · 28 due to the high Nm lead to lightning and 埶 埶 ^ 吏 difference in electrical conductivity. No. 29 occurs significantly in hot milk due to high Si
No 30 ® μ 、…、法進行特性評價。比較例 n ου因Μη的量輕黑祜猶& + &曰# 使導電率顯著降低。No. 31因副成分 的置超過本發明範圍， J成刀 分&旦# π 4 導電率顯者降低。No. 32因副成No 30 ® μ, ..., method for characteristic evaluation. Comparative Example n υυ The amount of Mn was light, and the conductivity was significantly reduced. No. 31, because the placement of the sub-component exceeds the scope of the present invention, the J component & den # π 4 conductivity is significantly reduced. No. 32 due to vice
刀的里超過本發明笳囹 J 圍’在熱軋中發生顯著的裂痕而無法 13 200426233 進行特性評價。Νο· 33因溶體化處理不足而有粗大粒子殘 留，最終時效處理後強度及彎曲加工性皆惡化。 歹 製^^步驟之加工及熱處理來 诗到具有高強度且高彎曲加 如以上之說明，經由調 控制最終製品之導電率，可 工丨生之電子材料用銅合金。 【圖式簡單說明】The inside of the blade exceeds the present invention's "circumstances". Significant cracks occur during hot rolling, and the characteristics cannot be evaluated. No. 33 has coarse particles remaining due to insufficient solution treatment, and the strength and bending workability are deteriorated after the final aging treatment. The processing and heat treatment of the ^^ steps are performed to achieve high strength and high bending. As described above, the copper alloy for electronic materials can be produced by controlling the conductivity of the final product by adjusting it. [Schematic description]
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