TWI271842B - Array circuit substrate - Google Patents

Array circuit substrate Download PDF

Info

Publication number
TWI271842B
TWI271842B TW095100316A TW95100316A TWI271842B TW I271842 B TWI271842 B TW I271842B TW 095100316 A TW095100316 A TW 095100316A TW 95100316 A TW95100316 A TW 95100316A TW I271842 B TWI271842 B TW I271842B
Authority
TW
Taiwan
Prior art keywords
test
wire
circuit substrate
line
wires
Prior art date
Application number
TW095100316A
Other languages
English (en)
Other versions
TW200727435A (en
Inventor
Ying-Chih Chen
Yun-Hsiang Tien
Original Assignee
Advanced Semiconductor Eng
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Semiconductor Eng filed Critical Advanced Semiconductor Eng
Priority to TW095100316A priority Critical patent/TWI271842B/zh
Priority to US11/309,680 priority patent/US20070152348A1/en
Application granted granted Critical
Publication of TWI271842B publication Critical patent/TWI271842B/zh
Publication of TW200727435A publication Critical patent/TW200727435A/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0268—Marks, test patterns or identification means for electrical inspection or testing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93—Batch processes
    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0555—Shape
    • H01L2224/05552—Shape in top view
    • H01L2224/05554—Shape in top view being square
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/4554—Coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/859—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector involving monitoring, e.g. feedback loop
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
    • H05K3/242—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus characterised by using temporary conductors on the printed circuit for electrically connecting areas which are to be electroplated

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)

Description

12 7184^twf.d〇c/r 九、發明說明·· 【發明所屬之技術領域】 -種於—辩列線路基板，且特別是有關於 rl重不黏測試的陣列線路基板。 【先丽技術】 的H版產業中，積體電路（integrateddrcuits，ic)
d ., 可刀為二個階段··積體電路的設計（IC !：SJ process) ^ PaC啡。在積體電路的製作中，晶片（di )是 ，晶圓製作、形成積體電路以及切‘圓= 7寻步驟而完成。晶圓具有一主動面（active m晶圓之具有主動元件（―㈣的 =。“®之频電路完叙後，㈣之 ：!f^T；b：d：ngpad) 的曰曰片，可經由這些銲墊而向外電性連接於 (^) 〇 (leadframe) (mpchipbonding) ^^4；" 、上，使得晶片之這些輝墊可分別電性連接 多個接點，以構成一晶片封裝體。 就打線接合技術（wireb〇ndingtechn〇1〇gy)而+，米 晶片以-膠層（epoxy)黏著於封裝基板上後，接^用: 壓合（thermal compression)銲接或超音波銲接的方 =、 各個銲線（bonding wire )的兩端分別連接至晶片與^壯1 12 7 1 板上，以使得晶片與封裝基板彼此 ㈣的兩端是否良好地銲接於晶== 封I基板之接點上，關係著晶月 二之1于墊和 這” If鮮不黏測試—爾“的目= -1 ® ^ ^ f〇^；f f ^ ^平夕】綠路基板100包括多數個基板單 二一 έ弟一電鑛線120與多數個切割窗13 僅 =，片)配置於基板單元110上，並藉由^ 鄰的打線接合墊112電性連接。其中，相 =之間係以方格狀之第一電麟⑽ =4:: 10内具有多數個第二電鍍線114， 112 I便成N式訊唬可經由第一電鍍線丨 122到達第二電鑛線114,再由第二電鑛線114傳導= 接之_合墊112與晶片1〇上的=泉114傳衫相連 怂所迹’當藉由此測試訊號回報銲不黏測試系统之 統可判斷銲線12是否鐸接於晶片10之銲墊1 = 甚至1所不，當切割窗13。將第二電鑛線114切斷：、 士入=一電鑛線120也切斷時，將使得銲不黏測試機制 至:ι"ί成測試訊號無法經由完整的第一電鍍線⑶ 122 °若以人工目視的方式取代測執系統 ::二’：’以發現是否有銲不黏的現象發生時，由於人卫 ―，阳 > 確性較低且必須在打線接合製程完成後才可進 此白知目測銲不黏技術的準確性不佳且無法及時發 現銲不黏的問題。 【發明内容】 本％明之目的b蔣 黏測試的準雜且在^種陣列線路基板，以提高鮮不 為達上述或是心、、泉衣程中及時發現銲不黎的問題。 板，其包括多數提出一種陣列線路基 數個切割窗。這料、多數條銲不黏測試線路與多 及多數個電鑛線，^ 分別具有多數個打線接合墊以 合墊之-，其中這此電=鑛線之一對應連接這些打線接 黏測試線路分別配之為測試線。這些銲不 這些 之外的這些電鍍線，且未切斷 _窗分別切斷除了測_ 二基板早兀中 這些銲不黏測試線路。 wire bonder)將 之一上。 -第3:'之一實施例中，-打線機 弟鋅線之弟一端銲接於一曰片夕夕虹乂 一在本發明之-實施例中，：打線 :端銲接於-晶片之多數個銲墊之—上二一銲線之第 上。以―一接於與職線電性連接之打線接合墊 之—實施射，上述這些切割窗可 以光钱刻 在本發明 所形成。 刻或實珊，上物靖可以赚 在本發明之-實施例中，上述這些切割窗可大致上平 1271842twf*doc/r 打於相鄰之這些銲不黏測試線路。 ⑽〜之—實施例巾，上述這些切贿寬度大約為 絲實施例巾，上述這些切㈣與相鄰之銲 不站測试線路相隔約50微米。 utt4’由於本發明之_線路基板可提供作為銲 =ί:測試電流流動的媒介，因此本發明之陣列線路 i=r:不黏測試的準確性提高。此外，由於本發明之 本發明之ϋΐ在打線接合時立即進行銲不黏測試，因此 合_銲不可及時發現打線接 易僅為和其他目的、特徵和優雜更明顯 明如下 ^貫施例，並配合所附圖式，作詳細說 【實施方式】 基板二2圖其:;本發明-實施例之-種陣列線路 數個基板單元Γο、多線路基板200包括多 塾3以單元210分別具有多數個打線接合 上212以及多數個醜線別，且這些電 二 之-對應連接這些打線接合墊212的其中:久二 板單元210的這些電錢線214中£ ㈣口個基 稱測試線陶不被切割窗230切斷下 相鄰之銲不黏測試線路22〇。 "此包性連接至 8 12 718碎这twf.d〇c/r ^所二4線路22G與電鍍線214為習知電鍍製 二之；央二因此在_製程之後，利用電鍍製程所 佈¥、、泉來作為鋒不黏測試線路22〇及測試線2Ha，則 線路基板2〇0上配線。其中，銲不黏測試 ..泉路22W別配置於相鄰二基板單元21〇《間，並連接測 试線f4a至一測試接點τ，以形成一完整的測試線路。值 付Ϊ意的fi在麵製程讀，赌每—絲料210中 的14些切割窗23〇分別切斷除了測試線施之外的這些電 鑛線別，且—未切斷這些鋒不黏測試線路,。在本實施例 可以絲刻、濕式钱刻或乾式钱刻的 方式而形U以使得除了測試線214a之外此 線2M與這些銲不黏測試線路22〇之間形成斷路。二1
就位置而言丄在本實施例中，這些切割窗23〇可大致 上平打於相鄰之这些鋒不黏測試線路22〇，且這些 230與相鄰之銲不黏測試線路22〇相隔約5〇微米:餅型 而言，在本實施例中’這些切割窗23〇的寬度％大約 100〜200微米。由於這些切割窗23〇用以使得除 2i4a之外的這些電鑛線2M與這些銲不黏測試線路-之 間形成斷路，因此在不影響上述功能下，這些 的位置與外柯依照設計者的需求而有所改變 僅用以舉例而非限定本發明。 J 以下就使用本實施例之㈣線路基板·* 進行打線接合製程與録不黏測試作一說明。&來 其繪示使用圖2之陣列線路基板而與晶片進=線=製 1271842twf*d〇c^ 私以及鲊不黏測試的示意圖 示意地緣示一個晶片20 ，為了以下說明方便僅 一上。在本實施例中，打後些基板單元21〇的其中之 一打線機30將一第一銲線妾5 ‘程包括下列步驟。首先， 之多數個銲墊22的其中之」〇之第一端42銲接於晶片20 4〇接觸晶片20的周邊區域，接者’為了不使第一銲線 -銲線4G之第二端44銲^ ^線機3G拉出—線弧且將第 線接合墊212a上。接菩4、〃測試線214a電性連接之打 一具有探針議％ t性連接於 性連接，因此經由上述打線拉幻與測試接點T相電 銲線50若銲接狀況良好;Π-銲線4〇與第二 試線細、魏 ^1πςρΗ -., 、打、、泉枝30將形成一閉合電路 第二Γ線：S’ α此時二若有一電流由打線機30而流向 地，若I，/1測試器60可接收到此電流訊號。相反 於-預言二，：Ϊ不f電流訊號或所接收的電流訊號小 狀況不π」表不第一銲線40或第二銲線50的銲接 f L行後續打線接合製程。請參考圖4，其繪示 二對^ L列泉路基板與晶片進行後續打線接合製程以及銲 測試的示意圖。打線機3〇將第二銲線5〇之第二端54 1271842twfd〇c/r =於基板單元2H)之剩餘這些打線接合墊犯的呈中之 料且切斷第二節G之第二端54與打線機％的連接 H’!1行銲不黏職。由於打線機3G與第二_ L:么’因此上述的閉合電路觸 4，：試器6。無法接收到此電流訊號。相 15ΐΓΓ收到電流訊號，則表示第二焊線％的第 Μ 之間的連接並未完全切斷，而且第二 的姉進而==未完全切斷而遭受打線機3。 22金=輩重2行上述步驟，直到晶片2G的這些銲墊 :土板早TC21G的14些打線接合墊212的打線接人 牛" 接合結構經由後續的封膠、植 同型態的晶片封裝體，在此不再詳述。 路可提供作為 測試線路被切割窗切斷而造成;不： -）由於本發明之㈣線路基板可在打線接合後立 1271841 twf.doc/r 即進行銲不黏测試 =陣列線路基板使得銲;相較’本 後的銲不黏問題。 J及~發現打線接合 本發明已以較佳實施例揭露如上，m 和範圍内，當可作也許不脫離本發明之精神 【圖式簡單說明】 示】：之一種陣列線路基板的俯視示意圖。 示意圖。、曰不本务明一實施例之一種陣列線路基板的俯視 圖3緣示使用圖2之陣列 接合製程以及鋒不_試的示意圖。板而”曰曰片進订打線 人制線路基板與晶片進行後續打線接 口衣轾以及鋅不姑測試的示意圖。 【主要元件符號說明】 10、20 :晶片 22 :銲墊 30 :打線機 40 :第一銲線 42 :第一銲線的第一端 44 :第一銲線的第二端 50 :第二銲線 52 :第二銲線的第一端 12 12 了 1 ^ly8p^twf.doc/r 54 :第二銲線的第二端 60 :測試器 62 :探針 100、200 :陣列線路基板 110、210 :基板單元 112、212、212a :打線接合墊 114 :第二電鍍線 120 :第一電鍍線 130、230 :切割窗 220 :銲不黏測試線路 214 :電鍍線 214a :測試線 T:測試接點 W :切割窗的寬度 13

Claims (1)

1271 十、申請專利範圍： 一種陣列線路基板， 多數個基板單亓，八， 數個電鍵線，且該此具有多數個打線接合墊以及多 之―，其中該也電一對應連接該些打線接合墊 多盤伙锻、、泉至少一為測試、線； 之間，If、^ 機線路，分別配置於相鄰二基板單元 之間^連接測試線至一測試接點；以及 扳早凡 別切ΐ除了固之ί於f些基板單元中，該些切割窗分 黏测試線路。1 ❸雜電鍍線，且未切斷該些銲不 墊之上。、干線之弟一端銲接於一晶片之多數個銲 % i如申請專利範圍第2項所述之陣列線路基板，並中 兮士 4·如申明專利範圍第1項所述之陣列線路基板，其中 〜二切割窗以光蝕刻所形成。 /、 5·如申請專利範圍第i項所述之陣列線路基板，其 切割窗以濕式蝕刻或乾式蝕刻所形成。 二6·如申請專利範圍第1項所述之陣列線路基板，其中 名些切割g大致上平行於婦之該些銲不侧試線路。 ^ 7·如申請專利範圍第1項所述之陣列線路基板，其中 該些切割窗寬度大約為100〜2〇〇微米。 /、 ^ 8·如申請專利範圍第1項所述之陣列線路基板，其中 該些切割窗與相鄰之銲不黏測試線路相隔5〇微米。 14
TW095100316A 2006-01-04 2006-01-04 Array circuit substrate TWI271842B (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW095100316A TWI271842B (en) 2006-01-04 2006-01-04 Array circuit substrate
US11/309,680 US20070152348A1 (en) 2006-01-04 2006-09-11 Array circuit substrate and wire bonding process using the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW095100316A TWI271842B (en) 2006-01-04 2006-01-04 Array circuit substrate

Publications (2)

Publication Number Publication Date
TWI271842B true TWI271842B (en) 2007-01-21
TW200727435A TW200727435A (en) 2007-07-16

Family

ID=38223528

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095100316A TWI271842B (en) 2006-01-04 2006-01-04 Array circuit substrate

Country Status (2)

Country Link
US (1) US20070152348A1 (zh)
TW (1) TWI271842B (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113161251A (zh) * 2020-01-22 2021-07-23 复格企业股份有限公司 芯片封装的工艺内测试方法及装置

Also Published As

Publication number Publication date
TW200727435A (en) 2007-07-16
US20070152348A1 (en) 2007-07-05

Similar Documents

Publication Publication Date Title
US9406628B2 (en) Semiconductor device and method of manufacturing the same
TW201003877A (en) Bond pad structure of integrated circuit
TWI278073B (en) Semiconductor device
JP6033011B2 (ja) 電力用半導体装置および電力用半導体装置の製造方法
JP2011071317A (ja) 半導体装置
JP2003174120A (ja) 半導体装置およびその製造方法
TW200919693A (en) Stacked semiconductor package that prevents damage to semiconductor chip when wire-bonding and method for manufacturing the same
TW201530758A (zh) 半導體裝置及半導體裝置之製造方法
TW588445B (en) Bumpless chip package
JP4635202B2 (ja) 両面電極パッケージの製造方法
TWI550740B (zh) 半導體裝置及其製造方法
TWI278110B (en) Test circuit under pad
JP7334435B2 (ja) 半導体装置および半導体装置の検査方法
TWI316741B (en) Method for forming an integrated cricuit, method for forming a bonding pad in an integrated circuit and an integrated circuit structure
TWI271842B (en) Array circuit substrate
US20040245651A1 (en) Semiconductor device and method for fabricating the same
US9410987B2 (en) Probe card
CN208045486U (zh) 晶圆级芯片封装结构
JP2007214238A (ja) 半導体装置およびその製造方法
US8614514B1 (en) Micro-spring chip attachment using ribbon bonds
US8519547B2 (en) Chip arrangement and method for producing a chip arrangement
TWI358337B (en) Method and device of continuously wire-bonding bet
JP2007258381A (ja) 半導体装置及びその製造方法
US20110241026A1 (en) Light-emitting diode chip and package structure thereof
WO2009030078A1 (en) Inner lead structure of semiconductor device