TWI268429B - Systems, maintenance units and substrate processing systems for wirelessly charging and wirelessly communicating with sensor apparatus as well as methods for wirelessly charging and communicating with sensor apparatus - Google Patents
Systems, maintenance units and substrate processing systems for wirelessly charging and wirelessly communicating with sensor apparatus as well as methods for wirelessly charging and communicating with sensor apparatusInfo
- Publication number
- TWI268429B TWI268429B TW093136293A TW93136293A TWI268429B TW I268429 B TWI268429 B TW I268429B TW 093136293 A TW093136293 A TW 093136293A TW 93136293 A TW93136293 A TW 93136293A TW I268429 B TWI268429 B TW I268429B
- Authority
- TW
- Taiwan
- Prior art keywords
- sensor apparatus
- communicating
- wirelessly
- maintenance unit
- systems
- Prior art date
Links
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Arrangements For Transmission Of Measured Signals (AREA)
- Charge And Discharge Circuits For Batteries Or The Like (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US52571003P | 2003-11-29 | 2003-11-29 | |
US10/888,526 US7282889B2 (en) | 2001-04-19 | 2004-07-10 | Maintenance unit for a sensor apparatus |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200532465A TW200532465A (en) | 2005-10-01 |
TWI268429B true TWI268429B (en) | 2006-12-11 |
Family
ID=34830427
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW093136293A TWI268429B (en) | 2003-11-29 | 2004-11-25 | Systems, maintenance units and substrate processing systems for wirelessly charging and wirelessly communicating with sensor apparatus as well as methods for wirelessly charging and communicating with sensor apparatus |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP4874540B2 (ja) |
TW (1) | TWI268429B (ja) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI411193B (zh) * | 2006-09-29 | 2013-10-01 | Semiconductor Energy Lab | 無線電力儲存裝置,包括該無線電力儲存裝置的半導體裝置,和其操作方法 |
US8853995B2 (en) | 2009-06-12 | 2014-10-07 | Qualcomm Incorporated | Devices for conveying wireless power and methods of operation thereof |
TWI488402B (zh) * | 2009-11-17 | 2015-06-11 | Qualcomm Inc | 用於電力管理之方法、裝置及非暫態電腦可讀媒體 |
TWI586067B (zh) * | 2012-12-28 | 2017-06-01 | 精工半導體有限公司 | 電子零件、受電裝置及供電系統 |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101356623B1 (ko) | 2011-11-10 | 2014-02-03 | 주식회사 스파콘 | 전력전송코일 및 무선 전력전송장치 |
US9548621B2 (en) * | 2012-05-28 | 2017-01-17 | Panasonic Intellectual Property Management Co., Ltd. | Contactless connector system tolerant of position displacement between transmitter coil and receiver coil and having high transmission efficiency |
US9356822B2 (en) * | 2012-10-30 | 2016-05-31 | Kla-Tencor Corporation | Automated interface apparatus and method for use in semiconductor wafer handling systems |
JP2014029860A (ja) * | 2013-08-27 | 2014-02-13 | Advantest Corp | 電源装置および測定用デバイス |
JP6855774B2 (ja) | 2016-12-13 | 2021-04-07 | Tdk株式会社 | ウエハ搬送容器内雰囲気計測装置、ウエハ搬送容器、ウエハ搬送容器内清浄化装置及びウエハ搬送容器内清浄化方法 |
JP7467152B2 (ja) | 2020-02-13 | 2024-04-15 | 東京エレクトロン株式会社 | 収容容器及び基板状センサの充電方法 |
KR102584512B1 (ko) * | 2020-12-31 | 2023-10-05 | 세메스 주식회사 | 버퍼 유닛 및 온도 변화가 수반되는 기판 지지 부재의 수평 측정용 기판형 센서의 보관 방법 |
KR102650610B1 (ko) * | 2021-05-31 | 2024-03-26 | 세메스 주식회사 | 기판 처리 장치 및 기판 처리 시스템 |
KR102594075B1 (ko) * | 2021-05-31 | 2023-10-24 | 세메스 주식회사 | 용기 및 기판 처리 시스템 |
TW202314938A (zh) | 2021-08-04 | 2023-04-01 | 日商東京威力科創股份有限公司 | 收容容器及基板狀感測器之充電方法 |
WO2023089795A1 (ja) * | 2021-11-22 | 2023-05-25 | 三菱電機株式会社 | 送電装置、無線電力伝送システム及び電圧制御装置 |
WO2024166739A1 (ja) * | 2023-02-09 | 2024-08-15 | 東京エレクトロン株式会社 | 基板処理装置 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5466614A (en) * | 1993-09-20 | 1995-11-14 | At&T Global Information Solutions Company | Structure and method for remotely measuring process data |
JPH10142068A (ja) * | 1996-11-14 | 1998-05-29 | Sony Corp | 温度測定装置及びこれを用いた温度測定方法 |
US6691068B1 (en) * | 2000-08-22 | 2004-02-10 | Onwafer Technologies, Inc. | Methods and apparatus for obtaining data for process operation, optimization, monitoring, and control |
US7289230B2 (en) * | 2002-02-06 | 2007-10-30 | Cyberoptics Semiconductors, Inc. | Wireless substrate-like sensor |
-
2004
- 2004-11-25 TW TW093136293A patent/TWI268429B/zh active
- 2004-11-29 JP JP2004344135A patent/JP4874540B2/ja not_active Expired - Fee Related
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI411193B (zh) * | 2006-09-29 | 2013-10-01 | Semiconductor Energy Lab | 無線電力儲存裝置,包括該無線電力儲存裝置的半導體裝置,和其操作方法 |
US8853995B2 (en) | 2009-06-12 | 2014-10-07 | Qualcomm Incorporated | Devices for conveying wireless power and methods of operation thereof |
TWI488402B (zh) * | 2009-11-17 | 2015-06-11 | Qualcomm Inc | 用於電力管理之方法、裝置及非暫態電腦可讀媒體 |
TWI552479B (zh) * | 2009-11-17 | 2016-10-01 | 高通公司 | 用於電力管理之方法、裝置及非暫態電腦可讀媒體 |
US9680313B2 (en) | 2009-11-17 | 2017-06-13 | Qualcomm Incorporated | Authorized based receipt of wireless power |
TWI586067B (zh) * | 2012-12-28 | 2017-06-01 | 精工半導體有限公司 | 電子零件、受電裝置及供電系統 |
Also Published As
Publication number | Publication date |
---|---|
JP4874540B2 (ja) | 2012-02-15 |
JP2005202933A (ja) | 2005-07-28 |
TW200532465A (en) | 2005-10-01 |
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