TWI268183B - Capacitive ultrasonic transducer and method of fabricating the same - Google Patents

Capacitive ultrasonic transducer and method of fabricating the same

Info

Publication number
TWI268183B
TWI268183B TW094137938A TW94137938A TWI268183B TW I268183 B TWI268183 B TW I268183B TW 094137938 A TW094137938 A TW 094137938A TW 94137938 A TW94137938 A TW 94137938A TW I268183 B TWI268183 B TW I268183B
Authority
TW
Taiwan
Prior art keywords
ultrasonic transducer
capacitive ultrasonic
same
fabricating
stacking
Prior art date
Application number
TW094137938A
Other languages
English (en)
Chinese (zh)
Other versions
TW200716265A (en
Inventor
Ming-Wei Chang
Tsung-Ju Gwo
Tse-Min Deng
Zhen-Yuan Chung
Original Assignee
Ind Tech Res Inst
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ind Tech Res Inst filed Critical Ind Tech Res Inst
Priority to TW094137938A priority Critical patent/TWI268183B/zh
Priority to US11/324,408 priority patent/US20070097791A1/en
Priority to JP2006181649A priority patent/JP4425245B2/ja
Priority to KR1020060060509A priority patent/KR100791821B1/ko
Application granted granted Critical
Publication of TWI268183B publication Critical patent/TWI268183B/zh
Publication of TW200716265A publication Critical patent/TW200716265A/zh
Priority to US12/049,224 priority patent/US7937834B2/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
    • B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
    • B06B1/0292—Electrostatic transducers, e.g. electret-type
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/005—Electrostatic transducers using semiconductor materials
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R31/00—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
    • H04R31/006—Interconnection of transducer parts
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/43—Electric condenser making
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49005—Acoustic transducer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49128—Assembling formed circuit to base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49156—Manufacturing circuit on or in base with selective destruction of conductive paths

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Manufacturing & Machinery (AREA)
  • Transducers For Ultrasonic Waves (AREA)
  • Ultra Sonic Daignosis Equipment (AREA)
TW094137938A 2005-10-28 2005-10-28 Capacitive ultrasonic transducer and method of fabricating the same TWI268183B (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
TW094137938A TWI268183B (en) 2005-10-28 2005-10-28 Capacitive ultrasonic transducer and method of fabricating the same
US11/324,408 US20070097791A1 (en) 2005-10-28 2006-01-04 Capacitive ultrasonic transducer and method of fabricating the same
JP2006181649A JP4425245B2 (ja) 2005-10-28 2006-06-30 容量性超音波振動子およびその製造方法
KR1020060060509A KR100791821B1 (ko) 2005-10-28 2006-06-30 용량성 초음파 변환기 및 그것의 제조방법
US12/049,224 US7937834B2 (en) 2005-10-28 2008-03-14 Method of fabricating capacitive ultrasonic transducers

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW094137938A TWI268183B (en) 2005-10-28 2005-10-28 Capacitive ultrasonic transducer and method of fabricating the same

Publications (2)

Publication Number Publication Date
TWI268183B true TWI268183B (en) 2006-12-11
TW200716265A TW200716265A (en) 2007-05-01

Family

ID=37996106

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094137938A TWI268183B (en) 2005-10-28 2005-10-28 Capacitive ultrasonic transducer and method of fabricating the same

Country Status (4)

Country Link
US (2) US20070097791A1 (OSRAM)
JP (1) JP4425245B2 (OSRAM)
KR (1) KR100791821B1 (OSRAM)
TW (1) TWI268183B (OSRAM)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112485775A (zh) * 2020-04-10 2021-03-12 友达光电股份有限公司 换能装置、换能结构及其制造方法

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ITRM20060238A1 (it) * 2006-05-03 2007-11-04 Esaote Spa Trasduttore ultracustico capacitivo multipiano
US7721397B2 (en) * 2007-02-07 2010-05-25 Industrial Technology Research Institute Method for fabricating capacitive ultrasonic transducers
JP5269090B2 (ja) * 2007-12-03 2013-08-21 コロ テクノロジーズ インコーポレイテッド 静電変換器およびアレイにおけるスルーウエハ相互接続部
CN101874343B (zh) 2007-12-03 2014-09-10 科隆科技公司 静电换能器阵列的封装和连接
US8847159B2 (en) 2011-03-28 2014-09-30 Tokyo Electron Limited Ion energy analyzer
JP5896665B2 (ja) * 2011-09-20 2016-03-30 キヤノン株式会社 電気機械変換装置の製造方法
CN105122488B (zh) 2013-03-14 2018-01-26 火山公司 晶片级换能器涂覆和方法
US10315224B2 (en) 2015-05-20 2019-06-11 uBeam Inc. Ultrasonic transducer
US10058892B2 (en) 2015-05-20 2018-08-28 uBeam Inc. Membrane bonding
US10065854B2 (en) * 2015-05-20 2018-09-04 uBeam Inc. Membrane bonding with photoresist
KR102244601B1 (ko) * 2019-05-29 2021-04-26 인하대학교 산학협력단 정전용량형 미세가공 초음파 트랜스듀서 및 그 제조방법
CN110510573B (zh) * 2019-08-30 2023-01-10 中国科学院深圳先进技术研究院 一种电容式微机械超声换能器及其制备方法和应用
TWI718073B (zh) * 2020-06-19 2021-02-01 友達光電股份有限公司 電容式換能裝置及其製造方法

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Publication number Priority date Publication date Assignee Title
US1975801A (en) * 1930-12-15 1934-10-09 Sound Lab Corp Ltd Microphone
US4262399A (en) * 1978-11-08 1981-04-21 General Electric Co. Ultrasonic transducer fabricated as an integral park of a monolithic integrated circuit
US5894452A (en) * 1994-10-21 1999-04-13 The Board Of Trustees Of The Leland Stanford Junior University Microfabricated ultrasonic immersion transducer
US5619476A (en) * 1994-10-21 1997-04-08 The Board Of Trustees Of The Leland Stanford Jr. Univ. Electrostatic ultrasonic transducer
US6295247B1 (en) * 1998-10-02 2001-09-25 The Board Of Trustees Of The Leland Stanford Junior University Micromachined rayleigh, lamb, and bulk wave capacitive ultrasonic transducers
JP3440037B2 (ja) 1999-09-16 2003-08-25 三洋電機株式会社 半導体装置、半導体エレクトレットコンデンサマイクロホンおよび半導体エレクトレットコンデンサマイクロホンの製造方法。
US6443901B1 (en) * 2000-06-15 2002-09-03 Koninklijke Philips Electronics N.V. Capacitive micromachined ultrasonic transducers
ITRM20030318A1 (it) 2003-06-25 2004-12-26 Esaote Spa Trasduttore ultracustico capacitivo microlavorato e
JP4193615B2 (ja) 2003-07-04 2008-12-10 セイコーエプソン株式会社 超音波変換装置
US20050177045A1 (en) 2004-02-06 2005-08-11 Georgia Tech Research Corporation cMUT devices and fabrication methods
WO2005084284A2 (en) 2004-02-27 2005-09-15 Georgia Tech Research Corporation Multiple element electrode cmut devices and fabrication methods
US7646133B2 (en) * 2004-02-27 2010-01-12 Georgia Tech Research Corporation Asymmetric membrane cMUT devices and fabrication methods
US7530952B2 (en) 2004-04-01 2009-05-12 The Board Of Trustees Of The Leland Stanford Junior University Capacitive ultrasonic transducers with isolation posts
US7251884B2 (en) * 2004-04-26 2007-08-07 Formfactor, Inc. Method to build robust mechanical structures on substrate surfaces
US7470232B2 (en) * 2004-05-04 2008-12-30 General Electric Company Method and apparatus for non-invasive ultrasonic fetal heart rate monitoring
TWI260940B (en) 2005-06-17 2006-08-21 Ind Tech Res Inst Method for producing polymeric capacitive ultrasonic transducer

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112485775A (zh) * 2020-04-10 2021-03-12 友达光电股份有限公司 换能装置、换能结构及其制造方法
CN112485775B (zh) * 2020-04-10 2023-06-23 友达光电股份有限公司 换能装置、换能结构及其制造方法

Also Published As

Publication number Publication date
US7937834B2 (en) 2011-05-10
US20070097791A1 (en) 2007-05-03
JP4425245B2 (ja) 2010-03-03
KR100791821B1 (ko) 2008-01-04
TW200716265A (en) 2007-05-01
US20080235936A1 (en) 2008-10-02
JP2007124613A (ja) 2007-05-17
KR20070045898A (ko) 2007-05-02

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Legal Events

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MM4A Annulment or lapse of patent due to non-payment of fees