WO2009083487A3 - Procédé de fabrication d'une microstructure métallique et microstructure obtenue selon ce procédé - Google Patents

Procédé de fabrication d'une microstructure métallique et microstructure obtenue selon ce procédé Download PDF

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Publication number
WO2009083487A3
WO2009083487A3 PCT/EP2008/067966 EP2008067966W WO2009083487A3 WO 2009083487 A3 WO2009083487 A3 WO 2009083487A3 EP 2008067966 W EP2008067966 W EP 2008067966W WO 2009083487 A3 WO2009083487 A3 WO 2009083487A3
Authority
WO
WIPO (PCT)
Prior art keywords
microstructure
metal
obtaining
obtained according
photosensitive resin
Prior art date
Application number
PCT/EP2008/067966
Other languages
English (en)
Other versions
WO2009083487A2 (fr
Inventor
Jean-Charles Fiaccabrino
Original Assignee
Nivarox-Far S.A.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nivarox-Far S.A. filed Critical Nivarox-Far S.A.
Publication of WO2009083487A2 publication Critical patent/WO2009083487A2/fr
Publication of WO2009083487A3 publication Critical patent/WO2009083487A3/fr

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • C25D5/022—Electroplating of selected surface areas using masking means
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/003—3D structures, e.g. superposed patterned layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
    • C25D5/14—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium two or more layers being of nickel or chromium, e.g. duplex or triplex layers
    • G—PHYSICS
    • G04—HOROLOGY
    • G04B—MECHANICALLY-DRIVEN CLOCKS OR WATCHES; MECHANICAL PARTS OF CLOCKS OR WATCHES IN GENERAL; TIME PIECES USING THE POSITION OF THE SUN, MOON OR STARS
    • G04B13/00—Gearwork
    • G04B13/02—Wheels; Pinions; Spindles; Pivots
    • G—PHYSICS
    • G04—HOROLOGY
    • G04B—MECHANICALLY-DRIVEN CLOCKS OR WATCHES; MECHANICAL PARTS OF CLOCKS OR WATCHES IN GENERAL; TIME PIECES USING THE POSITION OF THE SUN, MOON OR STARS
    • G04B15/00—Escapements
    • G04B15/14—Component parts or constructional details, e.g. construction of the lever or the escape wheel
    • G—PHYSICS
    • G04—HOROLOGY
    • G04B—MECHANICALLY-DRIVEN CLOCKS OR WATCHES; MECHANICAL PARTS OF CLOCKS OR WATCHES IN GENERAL; TIME PIECES USING THE POSITION OF THE SUN, MOON OR STARS
    • G04B17/00—Mechanisms for stabilising frequency
    • G04B17/04—Oscillators acting by spring tension
    • G04B17/06—Oscillators with hairsprings, e.g. balance
    • G04B17/066—Manufacture of the spiral spring
    • G—PHYSICS
    • G04—HOROLOGY
    • G04B—MECHANICALLY-DRIVEN CLOCKS OR WATCHES; MECHANICAL PARTS OF CLOCKS OR WATCHES IN GENERAL; TIME PIECES USING THE POSITION OF THE SUN, MOON OR STARS
    • G04B17/00—Mechanisms for stabilising frequency
    • G04B17/32—Component parts or constructional details, e.g. collet, stud, virole or piton
    • G—PHYSICS
    • G04—HOROLOGY
    • G04D—APPARATUS OR TOOLS SPECIALLY DESIGNED FOR MAKING OR MAINTAINING CLOCKS OR WATCHES
    • G04D3/00—Watchmakers' or watch-repairers' machines or tools for working materials
    • G04D3/0069—Watchmakers' or watch-repairers' machines or tools for working materials for working with non-mechanical means, e.g. chemical, electrochemical, metallising, vapourising; with electron beams, laser beams
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/202—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using self-supporting metal foil pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/205—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using a pattern electroplated or electroformed on a metallic carrier

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Electrochemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Micromachines (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)

Abstract

La présente invention concerne un procédé de fabrication d'une microstructure métallique caractérisé en ce qu'il comprend les étapes consistant à former par un procédé du type LIGA -UV un moule en résine photosensible et à déposer alternativement galvaniquement des couches d'un premier métal et d'au moins un deuxième métal à partir de ladite couche conductrice pour former un bloc atteignant sensiblement la surface supérieure de la résine photosensible, ledit bloc étant formé d'un empilement de couches des premier et deuxième métal.
PCT/EP2008/067966 2007-12-31 2008-12-19 Procédé de fabrication d'une microstructure métallique et microstructure obtenue selon ce procédé WO2009083487A2 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CH02035/07A CH704955B1 (fr) 2007-12-31 2007-12-31 Procédé de fabrication d'une microstructure métallique et microstructure obtenue selon ce prodédé.
CH02035/07 2007-12-31

Publications (2)

Publication Number Publication Date
WO2009083487A2 WO2009083487A2 (fr) 2009-07-09
WO2009083487A3 true WO2009083487A3 (fr) 2010-01-14

Family

ID=40757008

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2008/067966 WO2009083487A2 (fr) 2007-12-31 2008-12-19 Procédé de fabrication d'une microstructure métallique et microstructure obtenue selon ce procédé

Country Status (2)

Country Link
CH (1) CH704955B1 (fr)
WO (1) WO2009083487A2 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109856948A (zh) * 2013-11-08 2019-06-07 尼瓦洛克斯-法尔股份有限公司 由合成的碳同素异形体基材料制成并具有多个功能层级的单件式空心微机械部件

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9600080B2 (en) 2014-10-02 2017-03-21 Google Inc. Non-line-of-sight radar-based gesture recognition
US10139916B2 (en) 2015-04-30 2018-11-27 Google Llc Wide-field radar-based gesture recognition
EP3168057A1 (fr) * 2015-11-11 2017-05-17 Nivarox-FAR S.A. Procede de fabrication d'une piece metallique avec au moins un motif a illusion d'optique
EP3171229A1 (fr) * 2015-11-19 2017-05-24 Nivarox-FAR S.A. Composant d' horlogerie
EP3467151B1 (fr) * 2017-10-06 2020-06-17 Nivarox-FAR S.A. Moule pour galvanoplastie et son procédé de fabrication
CH714739A2 (fr) 2018-03-09 2019-09-13 Swatch Group Res & Dev Ltd Procédé de fabrication d’un décor métallique sur un cadran et cadran obtenu selon ce procédé.
EP3575447A1 (fr) 2018-05-28 2019-12-04 The Swatch Group Research and Development Ltd Procede de fabrication d'un decor metallique sur un cadran et cadran obtenu selon ce procede

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06300114A (ja) * 1993-04-13 1994-10-28 Seiko Epson Corp ギヤ及びその製造方法
US20040031691A1 (en) * 2002-08-15 2004-02-19 Kelly James John Process for the electrodeposition of low stress nickel-manganese alloys
US20050103637A1 (en) * 2003-11-14 2005-05-19 Tohru Yamasaki Laminated metal thin plate formed by electrodeposition and method of producing the same
US20060280961A1 (en) * 2005-06-09 2006-12-14 Fuji Xerox Co., Ltd. Laminated structure, donor substrate, and method for fabricating laminated structure

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06300114A (ja) * 1993-04-13 1994-10-28 Seiko Epson Corp ギヤ及びその製造方法
US20040031691A1 (en) * 2002-08-15 2004-02-19 Kelly James John Process for the electrodeposition of low stress nickel-manganese alloys
US20050103637A1 (en) * 2003-11-14 2005-05-19 Tohru Yamasaki Laminated metal thin plate formed by electrodeposition and method of producing the same
US20060280961A1 (en) * 2005-06-09 2006-12-14 Fuji Xerox Co., Ltd. Laminated structure, donor substrate, and method for fabricating laminated structure

Non-Patent Citations (5)

* Cited by examiner, † Cited by third party
Title
LEE M. GOLDMAN ET AL: "Short wavelength compositionally modulated Ni/Ni-P films prepared by electrodeposition", JOURNAL OF APPLIED PHYSICS, vol. 60, no. 4, 15 August 1986 (1986-08-15), pages 1374 - 1376, XP002556315 *
PRASAD S V ET AL: "LIGA Microsystems: Surface Interactions, Tribology, and Coatings", JOURNAL OF MANUFACTURING PROCESSES, SOCIETY OF MANUFACTURING ENGINEERS, DEARBORN, MI, US, vol. 6, no. 1, 1 January 2004 (2004-01-01), pages 107 - 116, XP025410215, ISSN: 1526-6125, [retrieved on 20040101] *
ROSS C A ET AL: "AN ELECTRODEPOSITION TECHNIQUE FOR PRODUCING MULTILAYERS OF NICKEL-PHOSPHORUS AND OTHER ALLOYS", JOURNAL OF THE ELECTROCHEMICAL SOCIETY, ELECTROCHEMICAL SOCIETY. MANCHESTER, NEW HAMPSHIRE, US, vol. 140, no. 1, 1 January 1993 (1993-01-01), pages 91 - 98, XP000548044, ISSN: 0013-4651 *
T. BIEGER: "Fabrication, metallographic and tribologic investigations of LIGA-microstructures made of nickelphosphorus alloys", MICROSYSTEM TECHNOLOGIES, vol. 3, 1997, pages 155 - 163, XP002556314 *
YU G ET AL: "Automated stress control of electroplated nickel-phosphorus alloy", INTELLIGENT PROCESSING AND MANUFACTURING OF MATERIALS, 1999. IPMM '99. PROCEEDINGS OF THE SECOND INTERNATIONAL CONFERENCE ON HONOLULU, HI, USA 10-15 JULY 1999, PISCATAWAY, NJ, USA,IEEE, US, vol. 2, 10 July 1999 (1999-07-10), pages 785 - 788, XP010351491, ISBN: 978-0-7803-5489-0 *

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109856948A (zh) * 2013-11-08 2019-06-07 尼瓦洛克斯-法尔股份有限公司 由合成的碳同素异形体基材料制成并具有多个功能层级的单件式空心微机械部件

Also Published As

Publication number Publication date
WO2009083487A2 (fr) 2009-07-09
CH704955B1 (fr) 2012-11-30

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