TWI266862B - Method of and system for determining the aberration of an imaging system, test object and detector for use with the method - Google Patents

Method of and system for determining the aberration of an imaging system, test object and detector for use with the method

Info

Publication number
TWI266862B
TWI266862B TW091110169A TW91110169A TWI266862B TW I266862 B TWI266862 B TW I266862B TW 091110169 A TW091110169 A TW 091110169A TW 91110169 A TW91110169 A TW 91110169A TW I266862 B TWI266862 B TW I266862B
Authority
TW
Taiwan
Prior art keywords
detector
test object
determining
imaging system
aberration
Prior art date
Application number
TW091110169A
Other languages
English (en)
Inventor
Peter Dirksen
Casparus Anthonius Juffermans
Augustus Josephus Eliz Janssen
Original Assignee
Koninkl Philips Electronics Nv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koninkl Philips Electronics Nv filed Critical Koninkl Philips Electronics Nv
Application granted granted Critical
Publication of TWI266862B publication Critical patent/TWI266862B/zh

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70591—Testing optical components
    • G03F7/706—Aberration measurement
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/7085—Detection arrangement, e.g. detectors of apparatus alignment possibly mounted on wafers, exposure dose, photo-cleaning flux, stray light, thermal load

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Testing Of Optical Devices Or Fibers (AREA)
  • Analysing Materials By The Use Of Radiation (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
TW091110169A 2001-12-24 2002-05-15 Method of and system for determining the aberration of an imaging system, test object and detector for use with the method TWI266862B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP01205085 2001-12-24

Publications (1)

Publication Number Publication Date
TWI266862B true TWI266862B (en) 2006-11-21

Family

ID=8181508

Family Applications (1)

Application Number Title Priority Date Filing Date
TW091110169A TWI266862B (en) 2001-12-24 2002-05-15 Method of and system for determining the aberration of an imaging system, test object and detector for use with the method

Country Status (6)

Country Link
US (1) US7423739B2 (zh)
EP (1) EP1461666A1 (zh)
JP (1) JP4467982B2 (zh)
KR (1) KR100847154B1 (zh)
TW (1) TWI266862B (zh)
WO (1) WO2003056392A1 (zh)

Cited By (6)

* Cited by examiner, † Cited by third party
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TWI398338B (zh) * 2008-04-03 2013-06-11 Nat Applied Res Laboratories 光學模仁加工補償方法
TWI497032B (zh) * 2012-08-10 2015-08-21 Toshiba Kk 缺陷檢查裝置
TWI631600B (zh) * 2017-05-26 2018-08-01 緯創資通股份有限公司 光學裝置
TWI735226B (zh) * 2019-05-08 2021-08-01 德商卡爾蔡司Ｓｍｔ有限公司 用於以三維方式確定微影光罩的空照影像之方法
CN113391523A (zh) * 2020-07-10 2021-09-14 台湾积体电路制造股份有限公司 光微影系统控制方法、其设备及非暂时性计算机可读取媒体
CN113614644A (zh) * 2019-03-20 2021-11-05 Asml荷兰有限公司 量测方法和设备、计算机程序和光刻系统

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US6807503B2 (en) * 2002-11-04 2004-10-19 Brion Technologies, Inc. Method and apparatus for monitoring integrated circuit fabrication
AU2003288623A1 (en) * 2002-12-30 2004-07-22 Koninklijke Philips Electronics N.V. Method of measuring the performance of an illumination system
US7053355B2 (en) 2003-03-18 2006-05-30 Brion Technologies, Inc. System and method for lithography process monitoring and control
DE10335982A1 (de) * 2003-08-06 2005-03-03 Zounek, Alexis Dr. Verfahren und Vorrichtung zur Überprüfung der Abbildungseigenschaften von Fotomasken
KR100855074B1 (ko) * 2003-12-09 2008-08-29 에이에스엠엘 네델란즈 비.브이. 리소그래피 장치용 센서 및 측정치들을 획득하는 방법
JP2007523373A (ja) * 2004-02-23 2007-08-16 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ 画像システムにおける画像ぼけ部の決定
US7518712B2 (en) * 2004-05-12 2009-04-14 Edmund Optics, Inc. Tilted edge for optical-transfer-function measurement
CN100594430C (zh) * 2004-06-04 2010-03-17 卡尔蔡司Smt股份公司 用于测量光学成像系统的图像质量的系统
US20060072097A1 (en) * 2004-10-06 2006-04-06 Zach Franz X Method for characterization of the illuminator in a lithographic system
US7519940B2 (en) 2005-05-02 2009-04-14 Cadence Design Systems, Inc. Apparatus and method for compensating a lithography projection tool
WO2007069222A2 (en) * 2005-12-15 2007-06-21 Koninklijke Philips Electronics N.V. Analysis device with an array of focusing microstructures
JP2008177064A (ja) * 2007-01-19 2008-07-31 Hitachi High-Technologies Corp 走査型荷電粒子顕微鏡装置および走査型荷電粒子顕微鏡装置で取得した画像の処理方法
DE102010014215A1 (de) * 2010-04-08 2011-10-13 Chrosziel Gmbh Verfahren und System zum Bestimmen von optischen Eigenschaften eines Linsensystems
DE102012204704A1 (de) * 2012-03-23 2013-09-26 Carl Zeiss Smt Gmbh Messvorrichtung zum Vermessen einer Abbildungsgüte eines EUV-Objektives
TWI510059B (zh) * 2012-05-29 2015-11-21 Giga Byte Tech Co Ltd 色差測試治具、色差測試介面裝置與色差測試方法
CN103207023B (zh) * 2013-03-18 2015-06-10 中国科学院长春光学精密机械与物理研究所 相位复原测试过程中消除系统误差的绝对标定方法
DE102014210641B4 (de) * 2014-06-04 2020-12-10 Carl Zeiss Ag Testobjekt, Verwendung eines Testobjekts sowie Einrichtung und Verfahren zur Messung der Punktbildfunktion eines optischen Systems
DE102017101824A1 (de) * 2017-01-31 2018-08-02 Carl Zeiss Microscopy Gmbh Verfahren zum Bestimmen einer Abweichung auf einem Verschiebeweg einer Zoom-Optik und Verfahren zur Korrektur sowie Bildaufnahmevorrichtung
WO2021026515A1 (en) * 2019-08-07 2021-02-11 Agilent Technologies, Inc. Optical imaging performance test system and method
RU2730101C1 (ru) * 2019-10-09 2020-08-17 Публичное акционерное общество "Ракетно-космическая корпорация "Энергия" имени С.П. Королёва" Способ определения разрешающей способности оптико-электронной аппаратуры дистанционного зондирования
CN113465885B (zh) * 2021-06-18 2024-04-26 深圳市鼎鑫盛光学科技有限公司 一种贝塞尔玻璃切割头光束质量测试系统
CN116399451B (zh) * 2023-05-29 2023-08-11 长春理工大学 一种适用于平面对称光学系统的偏振像差简化获取方法

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US5866911A (en) * 1994-07-15 1999-02-02 Baer; Stephen C. Method and apparatus for improving resolution in scanned optical system
JP3297545B2 (ja) 1994-09-02 2002-07-02 キヤノン株式会社 露光条件及び投影光学系の収差測定方法
KR0146172B1 (ko) 1995-03-24 1998-08-01 김주용 노광장치의 렌즈 비점수차 측정방법
GB9820664D0 (en) * 1998-09-23 1998-11-18 Isis Innovation Wavefront sensing device
US20020041377A1 (en) * 2000-04-25 2002-04-11 Nikon Corporation Aerial image measurement method and unit, optical properties measurement method and unit, adjustment method of projection optical system, exposure method and apparatus, making method of exposure apparatus, and device manufacturing method

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI398338B (zh) * 2008-04-03 2013-06-11 Nat Applied Res Laboratories 光學模仁加工補償方法
TWI497032B (zh) * 2012-08-10 2015-08-21 Toshiba Kk 缺陷檢查裝置
TWI631600B (zh) * 2017-05-26 2018-08-01 緯創資通股份有限公司 光學裝置
CN113614644A (zh) * 2019-03-20 2021-11-05 Asml荷兰有限公司 量测方法和设备、计算机程序和光刻系统
TWI735226B (zh) * 2019-05-08 2021-08-01 德商卡爾蔡司Ｓｍｔ有限公司 用於以三維方式確定微影光罩的空照影像之方法
CN113391523A (zh) * 2020-07-10 2021-09-14 台湾积体电路制造股份有限公司 光微影系统控制方法、其设备及非暂时性计算机可读取媒体

Also Published As

Publication number Publication date
KR100847154B1 (ko) 2008-07-17
US7423739B2 (en) 2008-09-09
EP1461666A1 (en) 2004-09-29
JP4467982B2 (ja) 2010-05-26
US20050117148A1 (en) 2005-06-02
JP2005513809A (ja) 2005-05-12
WO2003056392A1 (en) 2003-07-10
KR20040070271A (ko) 2004-08-06

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