TWI266808B - Vacuum evaporation plating machine - Google Patents

Vacuum evaporation plating machine

Info

Publication number
TWI266808B
TWI266808B TW094102723A TW94102723A TWI266808B TW I266808 B TWI266808 B TW I266808B TW 094102723 A TW094102723 A TW 094102723A TW 94102723 A TW94102723 A TW 94102723A TW I266808 B TWI266808 B TW I266808B
Authority
TW
Taiwan
Prior art keywords
vapor deposition
vapor
glass substrate
substrate
vacuum evaporation
Prior art date
Application number
TW094102723A
Other languages
English (en)
Chinese (zh)
Other versions
TW200532036A (en
Inventor
Susumu Kamikawa
Hirohiko Morisaki
Kozo Wada
Etsuro Hirai
Toshiro Kobayashi
Original Assignee
Mitsubishi Hitachi Metals
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Hitachi Metals filed Critical Mitsubishi Hitachi Metals
Publication of TW200532036A publication Critical patent/TW200532036A/zh
Application granted granted Critical
Publication of TWI266808B publication Critical patent/TWI266808B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/243—Crucibles for source material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/12—Organic material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/246—Replenishment of source material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/26—Vacuum evaporation by resistance or inductive heating of the source
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/54—Controlling or regulating the coating process

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
TW094102723A 2004-01-29 2005-01-28 Vacuum evaporation plating machine TWI266808B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004020950A JP4475968B2 (ja) 2004-01-29 2004-01-29 真空蒸着機

Publications (2)

Publication Number Publication Date
TW200532036A TW200532036A (en) 2005-10-01
TWI266808B true TWI266808B (en) 2006-11-21

Family

ID=34879076

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094102723A TWI266808B (en) 2004-01-29 2005-01-28 Vacuum evaporation plating machine

Country Status (4)

Country Link
JP (1) JP4475968B2 (ja)
KR (1) KR100669062B1 (ja)
CN (1) CN100510163C (ja)
TW (1) TWI266808B (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI496920B (zh) * 2013-05-21 2015-08-21 Everdisplay Optronics Shanghai Ltd 蒸鍍裝置及利用該蒸鍍裝置進行的蒸鍍方法
US9957607B2 (en) 2014-10-31 2018-05-01 Industrial Technology Research Institute Evaporation method

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4576326B2 (ja) * 2005-01-21 2010-11-04 三菱重工業株式会社 真空蒸着装置
US7918940B2 (en) 2005-02-07 2011-04-05 Semes Co., Ltd. Apparatus for processing substrate
JP4535908B2 (ja) * 2005-03-14 2010-09-01 日立造船株式会社 蒸着装置
US20070231490A1 (en) * 2006-03-29 2007-10-04 Eastman Kodak Company Uniformly vaporizing metals and organic materials
EP1947210A1 (fr) 2007-01-16 2008-07-23 ARCELOR France Procede de revetement d'un substrat, installation de mise en oeuvre du procede et dispositif d'alimentation en metal d'une telle installation
JP5411481B2 (ja) * 2008-10-22 2014-02-12 国立大学法人東北大学 マグネトロンスパッタ装置
DE102009029236B4 (de) * 2009-09-07 2023-02-16 Robert Bosch Gmbh Verdampfer, Anordnung von Verdampfern sowie Beschichtungsanlage
KR101620639B1 (ko) 2009-09-29 2016-05-13 주식회사 포스코 합금 코팅장치
JP5578345B2 (ja) * 2009-11-02 2014-08-27 キヤノントッキ株式会社 蒸着装置における蒸発源及び蒸着装置
KR20120081932A (ko) * 2011-01-12 2012-07-20 가부시키가이샤 한도오따이 에네루기 켄큐쇼 성막 장치 및 제조 장치
JP2012186158A (ja) 2011-02-14 2012-09-27 Semiconductor Energy Lab Co Ltd 照明装置及び発光装置の作製方法及び製造装置
WO2013005448A1 (ja) * 2011-07-07 2013-01-10 パナソニック株式会社 真空蒸着装置
JP2013159841A (ja) * 2012-02-08 2013-08-19 Tokyo Electron Ltd 成膜装置
KR102084707B1 (ko) * 2012-12-03 2020-04-16 삼성디스플레이 주식회사 증착원, 이를 포함한 증착 장치 및 증착 방법
US9953829B2 (en) * 2015-08-27 2018-04-24 Toshiba Memory Corporation Image processing apparatus with improved slide printout based on layout data
WO2020251696A1 (en) 2019-06-10 2020-12-17 Applied Materials, Inc. Processing system for forming layers

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3901773B2 (ja) * 1996-11-26 2007-04-04 三菱重工業株式会社 真空蒸着装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI496920B (zh) * 2013-05-21 2015-08-21 Everdisplay Optronics Shanghai Ltd 蒸鍍裝置及利用該蒸鍍裝置進行的蒸鍍方法
US9957607B2 (en) 2014-10-31 2018-05-01 Industrial Technology Research Institute Evaporation method

Also Published As

Publication number Publication date
CN100510163C (zh) 2009-07-08
TW200532036A (en) 2005-10-01
KR100669062B1 (ko) 2007-01-15
JP4475968B2 (ja) 2010-06-09
KR20060042875A (ko) 2006-05-15
JP2005213570A (ja) 2005-08-11
CN1648279A (zh) 2005-08-03

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Legal Events

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MM4A Annulment or lapse of patent due to non-payment of fees