MY149204A - Deposition material supply system - Google Patents

Deposition material supply system

Info

Publication number
MY149204A
MY149204A MYPI20081004A MYPI20081004A MY149204A MY 149204 A MY149204 A MY 149204A MY PI20081004 A MYPI20081004 A MY PI20081004A MY PI20081004 A MYPI20081004 A MY PI20081004A MY 149204 A MY149204 A MY 149204A
Authority
MY
Malaysia
Prior art keywords
deposition material
ring
deposition
supplied
hearths
Prior art date
Application number
MYPI20081004A
Inventor
Iijima Eiichi
Fujiwara Akihiro
Masuda Yukio
Original Assignee
Ulvac Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ulvac Inc filed Critical Ulvac Inc
Publication of MY149204A publication Critical patent/MY149204A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/246—Replenishment of source material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/08—Oxides
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J9/00—Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
    • H01J9/02—Manufacture of electrodes or electrode systems

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Physical Vapour Deposition (AREA)
  • Gas-Filled Discharge Tubes (AREA)

Abstract

TO ALLOW A DEPOSITION MATERIAL TO BE EVENLY SUPPLIED TO THREE OR MORE RING HEARTHS(50). [SOLVING MEANS] IN A VACUUM DEPOSITION APPARATUS WHICH EVAPORATES A DEPOSITION MATERIAL SUPPLIED FROM A DEPOSITION MATERIAL SUPPLY CHAMBER (10) ACCOMMODATING A LARGE QUANTITY OF THE DEPOSITION MATERIAL LASTING LONG-PERIOD CONTINUOUS RUNNING ON A RING HEARTH (50) IN A DEPOSITION CHAMBER (20) TO THEREBY FORM A FILM ON A SUBSTRATE (G) TRANSFERRED ABOVE THE RING HEARTH (50), THREE OR MORE OF THE RING HEARTHS (50) ARE ARRANGED SIDE BY SIDE IN A WIDTH DIRECTION OF THE TRANSFERRED SUBSTRATE (G), AND THE DEPOSITION MATERIAL IS SUPPLIED TO AT LEAST A MIDDLE RING HEARTH (50) OTHER THAN RING HEARTHS. AT BOTH ENDS BY AN ELECTROMAGNETIC VIBRATING FEEDER (F) ALLOWED TO ADJUST THE SUPPLY QUANTITY OF THE DEPOSITION MATERIAL.
MYPI20081004A 2005-10-19 2006-10-11 Deposition material supply system MY149204A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005304972A JP4824381B2 (en) 2005-10-19 2005-10-19 Film forming material supply device

Publications (1)

Publication Number Publication Date
MY149204A true MY149204A (en) 2013-07-31

Family

ID=37962377

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI20081004A MY149204A (en) 2005-10-19 2006-10-11 Deposition material supply system

Country Status (5)

Country Link
JP (1) JP4824381B2 (en)
KR (1) KR101132693B1 (en)
CN (1) CN101292058B (en)
MY (1) MY149204A (en)
WO (1) WO2007046281A1 (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5284821B2 (en) * 2008-03-03 2013-09-11 東邦チタニウム株式会社 Metal oxide vapor deposition material, method for producing the same, and method for producing metal oxide vapor deposited film
US20110214966A1 (en) * 2008-10-27 2011-09-08 Kaname Mizokami Film forming material feeding apparatus
US8361229B2 (en) 2010-04-22 2013-01-29 Primestar Solar, Inc. Seal configuration for a system for continuous deposition of a thin film layer on a substrate
CN101845617A (en) * 2010-06-07 2010-09-29 崔铮 Continuous coating material conveying device for linear metal coating evaporation source
CN104388909B (en) * 2014-12-11 2017-07-04 北京泰科诺科技有限公司 A kind of automatic feeding for continuous vacuum evaporation
CN113981378B (en) * 2021-10-22 2023-08-18 成都中建材光电材料有限公司 Vacuum refining filler evaporation equipment and application method thereof
CN115595550A (en) * 2022-10-24 2023-01-13 广东振华科技股份有限公司（Cn） Automatic material changing and continuous evaporation coating device and method for AF particle coating material

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3567570B2 (en) * 1995-11-28 2004-09-22 神鋼電機株式会社 Vibration equipment
JPH1112722A (en) * 1997-06-30 1999-01-19 Tateho Chem Ind Co Ltd Magnesium oxide for vacuum-deposition
JP4219476B2 (en) * 1999-04-05 2009-02-04 パナソニック株式会社 Thin film forming method and thin film forming apparatus
JP3624234B2 (en) * 2002-07-17 2005-03-02 パイオニアプラズマディスプレイ株式会社 Plasma display panel manufacturing apparatus and plasma display panel manufacturing method
JP2004339529A (en) * 2003-05-12 2004-12-02 Nec Plasma Display Corp Protective film formation device, protective film formation method, method of producing plasma display panel, and method of producing plasma display
JP4318504B2 (en) * 2003-08-05 2009-08-26 キヤノンアネルバ株式会社 Deposition equipment substrate tray
JP4185448B2 (en) * 2003-12-05 2008-11-26 新明和工業株式会社 Evaporating material supply method and vacuum film forming apparatus
JP4355239B2 (en) * 2004-03-17 2009-10-28 株式会社アルバック In-line type electron beam vapor deposition apparatus and method for forming a vapor deposition film on the surface of a substrate using the apparatus

Also Published As

Publication number Publication date
JP2007113058A (en) 2007-05-10
KR101132693B1 (en) 2012-04-02
JP4824381B2 (en) 2011-11-30
KR20080037121A (en) 2008-04-29
CN101292058A (en) 2008-10-22
CN101292058B (en) 2012-10-31
WO2007046281A1 (en) 2007-04-26

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