TWI264763B - Load-lock technique - Google Patents

Load-lock technique

Info

Publication number
TWI264763B
TWI264763B TW093136911A TW93136911A TWI264763B TW I264763 B TWI264763 B TW I264763B TW 093136911 A TW093136911 A TW 093136911A TW 93136911 A TW93136911 A TW 93136911A TW I264763 B TWI264763 B TW I264763B
Authority
TW
Taiwan
Prior art keywords
load
chamber housing
capacity
lock
reducing
Prior art date
Application number
TW093136911A
Other languages
English (en)
Chinese (zh)
Other versions
TW200527502A (en
Inventor
Kazuyuki Kasumi
Original Assignee
Canon Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Kk filed Critical Canon Kk
Publication of TW200527502A publication Critical patent/TW200527502A/zh
Application granted granted Critical
Publication of TWI264763B publication Critical patent/TWI264763B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67751—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber vertical transfer of a single workpiece
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
    • G03F7/70841—Constructional issues related to vacuum environment, e.g. load-lock chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67201—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the load-lock chamber

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Public Health (AREA)
  • Health & Medical Sciences (AREA)
  • Epidemiology (AREA)
  • Environmental & Geological Engineering (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Electron Beam Exposure (AREA)
TW093136911A 2003-12-02 2004-11-30 Load-lock technique TWI264763B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003402488A JP4478440B2 (ja) 2003-12-02 2003-12-02 ロードロック装置および方法

Publications (2)

Publication Number Publication Date
TW200527502A TW200527502A (en) 2005-08-16
TWI264763B true TWI264763B (en) 2006-10-21

Family

ID=34726036

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093136911A TWI264763B (en) 2003-12-02 2004-11-30 Load-lock technique

Country Status (5)

Country Link
US (2) US7218382B2 (enExample)
JP (1) JP4478440B2 (enExample)
KR (1) KR100704297B1 (enExample)
CN (1) CN1326229C (enExample)
TW (1) TWI264763B (enExample)

Families Citing this family (36)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006165371A (ja) * 2004-12-09 2006-06-22 Canon Inc 転写装置およびデバイス製造方法
JP2007142337A (ja) * 2005-11-22 2007-06-07 Canon Inc ロードロック装置、デバイス製造装置及びデバイス製造方法
JP5156192B2 (ja) * 2006-01-24 2013-03-06 ギガフォトン株式会社 極端紫外光源装置
JP4963678B2 (ja) * 2007-04-06 2012-06-27 キヤノン株式会社 雰囲気置換方法
FR2933812B1 (fr) * 2008-07-11 2010-09-10 Alcatel Lucent Dispositif de chargement/dechargement de substrats
JP4611409B2 (ja) * 2008-09-03 2011-01-12 晃俊 沖野 プラズマ温度制御装置
NL2003223A (en) * 2008-09-30 2010-03-31 Asml Netherlands Bv Projection system, lithographic apparatus, method of postitioning an optical element and method of projecting a beam of radiation onto a substrate.
JP5315100B2 (ja) * 2009-03-18 2013-10-16 株式会社ニューフレアテクノロジー 描画装置
WO2011013779A1 (ja) * 2009-07-29 2011-02-03 株式会社小松製作所 極端紫外光源装置、極端紫外光源装置の制御方法、およびそのプログラムを記録した記録媒体
US8693856B2 (en) 2010-09-03 2014-04-08 Kla-Tencor Corporation Apparatus and methods for vacuum-compatible substrate thermal management
JP5541274B2 (ja) * 2011-12-28 2014-07-09 東京エレクトロン株式会社 基板処理装置、基板処理方法及び記憶媒体
CN104421437B (zh) * 2013-08-20 2017-10-17 中微半导体设备(上海)有限公司 活动阀门、活动屏蔽门及真空处理系统
US20150367415A1 (en) 2014-06-20 2015-12-24 Velo3D, Inc. Apparatuses, systems and methods for three-dimensional printing
JP6495707B2 (ja) 2015-03-25 2019-04-03 株式会社Ｓｃｒｅｅｎホールディングス 露光装置および基板処理装置
JP6543064B2 (ja) 2015-03-25 2019-07-10 株式会社Ｓｃｒｅｅｎホールディングス 露光装置、基板処理装置、基板の露光方法および基板処理方法
US10065270B2 (en) 2015-11-06 2018-09-04 Velo3D, Inc. Three-dimensional printing in real time
WO2017100695A1 (en) 2015-12-10 2017-06-15 Velo3D, Inc. Skillful three-dimensional printing
WO2017143077A1 (en) 2016-02-18 2017-08-24 Velo3D, Inc. Accurate three-dimensional printing
EP3492244A1 (en) 2016-06-29 2019-06-05 VELO3D, Inc. Three-dimensional printing system and method for three-dimensional printing
US11691343B2 (en) 2016-06-29 2023-07-04 Velo3D, Inc. Three-dimensional printing and three-dimensional printers
US20180093418A1 (en) 2016-09-30 2018-04-05 Velo3D, Inc. Three-dimensional objects and their formation
US20180126462A1 (en) 2016-11-07 2018-05-10 Velo3D, Inc. Gas flow in three-dimensional printing
US10611092B2 (en) 2017-01-05 2020-04-07 Velo3D, Inc. Optics in three-dimensional printing
US10357829B2 (en) 2017-03-02 2019-07-23 Velo3D, Inc. Three-dimensional printing of three-dimensional objects
US20180281237A1 (en) 2017-03-28 2018-10-04 Velo3D, Inc. Material manipulation in three-dimensional printing
JP2018174186A (ja) * 2017-03-31 2018-11-08 東京エレクトロン株式会社 基板処理装置
CN107968275B (zh) * 2017-09-30 2019-10-08 武汉船用机械有限责任公司 一种电气连接装置
EP3479848B1 (de) * 2017-11-07 2022-10-05 Metall + Plastic GmbH Oberflächen-dekontaminationsvorrichtung sowie betriebsverfahren
US10272525B1 (en) 2017-12-27 2019-04-30 Velo3D, Inc. Three-dimensional printing systems and methods of their use
US10144176B1 (en) 2018-01-15 2018-12-04 Velo3D, Inc. Three-dimensional printing systems and methods of their use
CA3148849A1 (en) 2019-07-26 2021-02-04 Velo3D, Inc. Quality assurance in formation of three-dimensional objects
JP7360308B2 (ja) * 2019-11-25 2023-10-12 キヤノン株式会社 露光装置、露光方法、および物品製造方法
CN114672781B (zh) * 2022-04-06 2023-12-05 盛吉盛半导体科技(无锡)有限公司 应用于装载锁定腔内载具的定位工装及定位方法
JP2024008279A (ja) * 2022-07-07 2024-01-19 株式会社ニューフレアテクノロジー マルチ荷電粒子ビーム照射装置、マルチ荷電粒子ビーム照射方法およびブランキングアパーチャアレイ実装基板の交換方法
US12381109B2 (en) 2022-10-27 2025-08-05 Applied Materials, Inc. Hermetic tubular linear motor based wafer lift actuator
WO2025113901A1 (en) * 2023-11-27 2025-06-05 Asml Netherlands B.V. Reticle load lock system and method

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3311126B2 (ja) 1993-12-20 2002-08-05 キヤノン株式会社 ミラーユニットおよび該ミラーユニットを備えた露光装置
US5835560A (en) 1994-05-24 1998-11-10 Canon Kabushiki Kaisha Exposure apparatus
JP2000174091A (ja) * 1998-12-01 2000-06-23 Fujitsu Ltd 搬送装置及び製造装置
JP2001102281A (ja) 1999-09-28 2001-04-13 Canon Inc ロードロック室、チャンバ、半導体製造装置およびデバイス製造方法
JP4689064B2 (ja) 2000-03-30 2011-05-25 キヤノン株式会社 露光装置およびデバイス製造方法
JP4560182B2 (ja) 2000-07-06 2010-10-13 キヤノン株式会社 減圧処理装置、半導体製造装置およびデバイス製造方法
JP2003031639A (ja) 2001-07-17 2003-01-31 Canon Inc 基板処理装置、基板の搬送方法及び露光装置
JP2003045947A (ja) * 2001-07-27 2003-02-14 Canon Inc 基板処理装置及び露光装置
JP2003059801A (ja) 2001-08-14 2003-02-28 Canon Inc 露光装置及び露光方法
JP2003133388A (ja) 2001-10-25 2003-05-09 Ulvac Japan Ltd 基板搬送装置
JP2004047517A (ja) 2002-07-08 2004-02-12 Canon Inc 放射線生成装置、放射線生成方法、露光装置並びに露光方法
DE20219191U1 (de) * 2002-12-11 2003-02-20 Lu, Jin-Chu, Lu Zhou Shi, Taipeh Bandmass
JP4164414B2 (ja) 2003-06-19 2008-10-15 キヤノン株式会社 ステージ装置
JP2005158926A (ja) 2003-11-25 2005-06-16 Canon Inc ロードロック装置および方法

Also Published As

Publication number Publication date
CN1658380A (zh) 2005-08-24
US20070178748A1 (en) 2007-08-02
TW200527502A (en) 2005-08-16
KR100704297B1 (ko) 2007-04-10
JP4478440B2 (ja) 2010-06-09
US7218382B2 (en) 2007-05-15
KR20050053343A (ko) 2005-06-08
CN1326229C (zh) 2007-07-11
US20050186716A1 (en) 2005-08-25
JP2005166862A (ja) 2005-06-23
US7411655B2 (en) 2008-08-12

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Legal Events

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MM4A Annulment or lapse of patent due to non-payment of fees