TWI264331B - Source liquid supply apparatus having a cleaning function - Google Patents

Source liquid supply apparatus having a cleaning function

Info

Publication number
TWI264331B
TWI264331B TW091133357A TW91133357A TWI264331B TW I264331 B TWI264331 B TW I264331B TW 091133357 A TW091133357 A TW 091133357A TW 91133357 A TW91133357 A TW 91133357A TW I264331 B TWI264331 B TW I264331B
Authority
TW
Taiwan
Prior art keywords
source
port
supply apparatus
source liquid
liquid supply
Prior art date
Application number
TW091133357A
Other languages
English (en)
Other versions
TW200305463A (en
Inventor
Jean-Marc Girard
Olivier Letessier
Masao Kimura
Akinobu Nasu
Original Assignee
Air Liquide
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2001350168A external-priority patent/JP4440505B2/ja
Application filed by Air Liquide filed Critical Air Liquide
Publication of TW200305463A publication Critical patent/TW200305463A/zh
Application granted granted Critical
Publication of TWI264331B publication Critical patent/TWI264331B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B9/00—Cleaning hollow articles by methods or apparatus specially adapted thereto 
    • B08B9/02—Cleaning pipes or tubes or systems of pipes or tubes
    • B08B9/027—Cleaning the internal surfaces; Removal of blockages
    • B08B9/032—Cleaning the internal surfaces; Removal of blockages by the mechanical action of a moving fluid, e.g. by flushing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B9/00—Cleaning hollow articles by methods or apparatus specially adapted thereto 
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B9/00—Cleaning hollow articles by methods or apparatus specially adapted thereto 
    • B08B9/02—Cleaning pipes or tubes or systems of pipes or tubes
    • B08B9/027—Cleaning the internal surfaces; Removal of blockages
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/4401—Means for minimising impurities, e.g. dust, moisture or residual gas, in the reaction chamber
    • C23C16/4402—Reduction of impurities in the source gas
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
    • C23C16/45561—Gas plumbing upstream of the reaction chamber
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/56—After-treatment

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Cleaning In General (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Chemical Vapour Deposition (AREA)
TW091133357A 2001-11-15 2002-11-14 Source liquid supply apparatus having a cleaning function TWI264331B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001350168A JP4440505B2 (ja) 2001-03-08 2001-11-15 洗浄機能を有する原料液供給装置

Publications (2)

Publication Number Publication Date
TW200305463A TW200305463A (en) 2003-11-01
TWI264331B true TWI264331B (en) 2006-10-21

Family

ID=19162726

Family Applications (1)

Application Number Title Priority Date Filing Date
TW091133357A TWI264331B (en) 2001-11-15 2002-11-14 Source liquid supply apparatus having a cleaning function

Country Status (7)

Country Link
US (1) US7487806B2 (zh)
EP (2) EP1854559A2 (zh)
KR (1) KR100949026B1 (zh)
CN (1) CN1247323C (zh)
DE (1) DE60223710T2 (zh)
TW (1) TWI264331B (zh)
WO (1) WO2003041881A1 (zh)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100806113B1 (ko) * 2006-12-26 2008-02-21 주식회사 코윈디에스티 박막증착 장치의 원료가스 공급장치 및 잔류가스 처리장치및 그 방법
JP4337890B2 (ja) * 2007-02-27 2009-09-30 セイコーエプソン株式会社 半導体製造システム、制御装置、半導体製造システムの制御方法、及び処理液の回収方法
EP2052792A3 (en) * 2007-10-09 2011-06-22 Gas Turbine Efficiency Sweden AB Drain valve, washing system and sensing of rinse and wash completion
KR100888958B1 (ko) * 2008-06-12 2009-03-17 주식회사 에스티에스 세정 장치
KR101597008B1 (ko) * 2010-08-05 2016-02-23 가부시키가이샤 에바라 세이사꾸쇼 배기 시스템
JP5573666B2 (ja) * 2010-12-28 2014-08-20 東京エレクトロン株式会社 原料供給装置及び成膜装置
US8974606B2 (en) 2011-05-09 2015-03-10 Intermolecular, Inc. Ex-situ cleaning assembly
US9313379B2 (en) * 2012-09-24 2016-04-12 Illinois State Toll Highway Authority Camera washing system
NO337224B1 (no) * 2013-12-17 2016-02-15 Aker Subsea As Undervanns påfyllingssystem
JP6295107B2 (ja) 2014-03-07 2018-03-14 株式会社荏原製作所 基板処理システムおよび基板処理方法
US20150259797A1 (en) * 2014-03-17 2015-09-17 Jiangsu Nata Opto-electronic Material Co., Ltd. Liquid-Metal Organic Compound Supply System
JP5880627B2 (ja) * 2014-06-17 2016-03-09 東京エレクトロン株式会社 原料供給装置及び半導体製造装置
CN104297964B (zh) * 2014-11-11 2017-03-15 合肥京东方光电科技有限公司 一种清洗装置及其清洗方法
WO2017110118A1 (ja) * 2015-12-24 2017-06-29 株式会社島津製作所 Ｉｃｐ質量分析装置
CN107472912B (zh) * 2017-08-14 2018-11-13 苏州中远物流有限公司 一种灌装物料加压输送系统
CN108480328A (zh) * 2018-05-25 2018-09-04 太和县人民医院 一种负压管道维护装置
CN109578811B (zh) * 2019-01-31 2024-05-14 苏州普耀光电材料有限公司 一种mo源灌装容器余料的回收处理装置及回收处理方法
JP6943911B2 (ja) * 2019-03-07 2021-10-06 古河電気工業株式会社 気化器の洗浄方法および気化装置
CN110176414B (zh) * 2019-04-16 2020-10-16 北京北方华创微电子装备有限公司 反应气体供应系统及其控制方法
CA3206964A1 (en) * 2021-02-01 2022-08-04 Jon Hylbert Weldment test system
TWI765584B (zh) * 2021-02-25 2022-05-21 江德明 液體傳輸設備
CN114857497A (zh) * 2022-04-18 2022-08-05 广东韶钢松山股份有限公司 一种碱液输送装置及酸气管道清洗方法
CN117282356B (zh) * 2023-11-24 2024-04-02 常州新一产生命科技有限公司 一种流体系统
CN117399376B (zh) * 2023-12-13 2024-03-08 苏州元脑智能科技有限公司 一种服务器清洁系统以及数据中心

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1150045A (en) 1967-09-26 1969-04-30 In Place Electronics Ltd Cleaning Beer Lines
US4738693A (en) 1987-04-27 1988-04-19 Advanced Technology Materials, Inc. Valve block and container for semiconductor source reagent dispensing and/or purification
US4723967A (en) 1987-04-27 1988-02-09 Advanced Technology Materials, Inc. Valve block and container for semiconductor source reagent dispensing and/or purification
JPH0623941Y2 (ja) 1987-08-11 1994-06-22 オリオン機械株式会社 乳の流量測定装置
US5362328A (en) 1990-07-06 1994-11-08 Advanced Technology Materials, Inc. Apparatus and method for delivering reagents in vapor form to a CVD reactor, incorporating a cleaning subsystem
JP3122311B2 (ja) 1994-06-29 2001-01-09 東京エレクトロン株式会社 成膜処理室への液体材料供給装置及びその使用方法
US5846338A (en) * 1996-01-11 1998-12-08 Asyst Technologies, Inc. Method for dry cleaning clean room containers
TW471031B (en) * 1997-01-08 2002-01-01 Ebara Corp Vapor feed supply system
US6026762A (en) * 1997-04-23 2000-02-22 Applied Materials, Inc. Apparatus for improved remote microwave plasma source for use with substrate processing systems
US6199599B1 (en) 1997-07-11 2001-03-13 Advanced Delivery & Chemical Systems Ltd. Chemical delivery system having purge system utilizing multiple purge techniques
US6079426A (en) * 1997-07-02 2000-06-27 Applied Materials, Inc. Method and apparatus for determining the endpoint in a plasma cleaning process
US5964230A (en) 1997-10-06 1999-10-12 Air Products And Chemicals, Inc. Solvent purge mechanism
US6033479A (en) 1998-04-22 2000-03-07 Applied Materials, Inc. Process gas delivery system for CVD having a cleaning subsystem
AU6766600A (en) * 1999-08-12 2001-03-13 Lancer Partnership, Ltd. Aseptic product dispensing system
US6178925B1 (en) * 1999-09-29 2001-01-30 Advanced Technology Materials, Inc. Burst pulse cleaning method and apparatus for liquid delivery system
US6848458B1 (en) * 2002-02-05 2005-02-01 Novellus Systems, Inc. Apparatus and methods for processing semiconductor substrates using supercritical fluids

Also Published As

Publication number Publication date
WO2003041881A1 (en) 2003-05-22
KR20050044472A (ko) 2005-05-12
TW200305463A (en) 2003-11-01
DE60223710T2 (de) 2008-10-30
US7487806B2 (en) 2009-02-10
EP1854559A2 (en) 2007-11-14
EP1448319A1 (en) 2004-08-25
DE60223710D1 (de) 2008-01-03
US20050109374A1 (en) 2005-05-26
EP1448319B1 (en) 2007-11-21
CN1585676A (zh) 2005-02-23
KR100949026B1 (ko) 2010-03-23
CN1247323C (zh) 2006-03-29

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