TWI263798B - Optical shaping device - Google Patents

Abstract

This invention is to provide a high speed shape formed optical shaping device and a high precision optical shaping device. At the DMD50 used in exposure head, in main scan direction there are 800 quantities of micro mirrors disposed in a micro mirror row and there are 600 rows of them disposed in side scan direction, using a control unit to control only part of micro mirror rows (for example: 800x100 rows) to be driven. The data processing speed of DMD 50 has its own limit. The modulation speed of each line is in proportional to the pixel numbers to be used. Thus, merely using part of micro mirror rows makes the modulation speed of every line sooner.

Description

1263798 IX. Description of the Invention: [Technical Field] The present invention relates to a light-forming device, and more particularly to forming a light-curable resin by exposing a light beam modulated by an @光光: modulation element in response to image data. Dimensional light forming device. [Prior Art] In recent years, along with the popularization of 3D CAD (Computer Aided Design) system, a light forming system is used, which is based on a 3D shape of an imaginary space created by a 3D CAD on a computer, and then a beam according to CAD data. The photocurable resin is exposed to form a three-dimensional model. In this photoforming system, the CAD data is cut at a specified interval on the computer and then made into a plurality of cross-sectional data, and the surface of the liquid photocurable resin is scanned by laser light according to the cross-section data to harden the layer, and then The resin hardened layer was sequentially laminated to form a three-dimensional model. In the photo-forming method, the liquid-curable resin is stored in the upper open type in advance, and then placed on the molding table close to the liquid surface of the photocurable resin, and sequentially suspended from the free liquid surface of the resin. The free liquid surface method of hardening the resin layer is widely known. In the past, the optical molding apparatus used in the optical molding system has the following, as shown in "Kyuko Yaji: Foundation, Current Status, Problems, Model Technology, Vol. 7, No. 10, PP18-23, 1 992". The laser scanner is used to perform scanning and to perform scanning according to the movable mirror mode. A laser patterning device in the form of a laser plotter is shown in Fig. 28. In this device, the laser light oscillated by the laser source 250 passes through the optical fiber 256 having the shutter 252 to reach the XY plotter 2 5 6, and then the XY plotter 256 illuminates the 1263798 into the container 260. The liquid level 2 66 of the photocurable resin 262. Further, the position of the X Y plotter 256 in the X direction and the Y direction is controlled by the XY positioning mechanism 2 5 8 having the X positioning mechanism 2 58 a and the Y positioning mechanism 2 5 8 b. Therefore, by moving the XY plotter 256 while moving in the X direction and the Y direction, the laser light irradiated by the XY plotter 256 is turned on and off by the shutter 252 in response to the cross section data, and is hardened. The photocurable resin 262 ° of the specified portion of the liquid surface 2 6 6 However, in the laser forming apparatus according to the laser plotter mode, there is a limit in the shutter speed or the moving speed of the plotter, and it is required to be long in molding. The problem of time. Next, a light-mold forming apparatus of a conventional movable mirror type using a galvanometer mirror will be described with reference to Fig. 29. In this apparatus, the laser beam 270 is reflected by the X-axis rotating mirror 272 and the Y-axis rotating mirror 274, and is irradiated onto the photocurable resin 262. The X-axis rotating mirror 272 rotates with the Z axis as a rotation axis to control the position of the irradiation position in the X direction, and the Y-axis rotation mirror 274 rotates with the X axis as the rotation axis to control the position of the irradiation position in the Y direction. In this movable mirror mode, the scanning speed can be improved compared to the laser plotter mode. However, in the light-shaping apparatus according to the movable mirror type, since the scanning is performed with a minute laser spot, even if a high-speed scanning of, for example, 2 to 12 m/s is performed, a 3 dimensional model of 10 cm cubic size needs to be formed in the molding. ~24 hours of time, it takes a long time to form on the molding. Further, since the laser light 270 is reflected only when the Y-axis rotating mirror 274 is incident at an angle of a predetermined range, the irradiation region is limited to, in order to enlarge the irradiation region, the Y-axis rotating mirror 274 is disposed at the light-curing property. When the position of the resin 262 is high, the diameter of the laser spot becomes 1263798, which greatly deteriorates the positioning accuracy and reduces the molding accuracy. Further, when the rotation angle of the γ-axis rotating mirror 274 is increased, the irradiation range is enlarged, but the positioning accuracy is deteriorated in the same manner, and the orthodontic error increases. Further, in the optical molding apparatus using the galvano mirror, the adjustment of the optical system such as strain correction or optical axis adjustment is complicated, the optical system is complicated, and the entire apparatus is enlarged. In addition, in any type of light-forming device, a high-output ultraviolet laser light source is used as a laser light source, and conventionally, a gas laser such as an argon laser or a HG (third harmonic) is used. In the case of a solid laser, the gas laser is inconvenient for the maintenance of the exchange of the pipe, and the price of the optical molding device is increased, and the equipment such as a cooler for cooling is required to be large. In the THG solid-state laser, the pulse train of the Q switch is slow in repetition and is not suitable for high-speed exposure. Further, since the wavelength conversion efficiency is deteriorated by using THG light, it is not possible to increase the output, and it is necessary to use a high output as an excitation semiconductor laser, which is a very high cost. In view of the above, a photoforming apparatus is disclosed in Japanese Laid-Open Patent Publication No. Hei. No. Hei. No. Hei. No. Hei. The light source in the exposed area is multi-exposure of the pixels according to a plurality of light sources. In this device, pixels are multiple-exposed by a plurality of light sources, so even if the output of each light source is small, an inexpensive light-emitting diode (LED) can be used as a light source. However, in the optical molding apparatus described in Japanese Laid-Open Patent Publication No. Hei. No. Hei. No. Hei. No. Hei. And according to a plurality of light sources, the pixels are used for multiple exposures, -8 - 1263798, so there is a lot of waste in the action, and it also has a problem that it takes a long time to form. Further, since the number of light sources is increased, there is also a problem that the exposure portion is enlarged. Furthermore, even if multiple exposures are made with the amount of light output from the LED, there is a possibility that sufficient resolution cannot be obtained. SUMMARY OF THE INVENTION The present invention has been made in view of the above problems of the prior art, and it is an object of the present invention to provide a high speed molding light forming apparatus. Further, another object of the present invention is to provide a light forming apparatus which can be formed with high precision. [Means for Solving the Problem] In order to achieve the above object, a photo-forming apparatus according to the present invention includes: a molding groove for accommodating a photocurable resin; and a support table for supporting lifting in the molding groove a molding provided by the ground; an exposure head comprising: a laser device, irradiating the laser light; and a spatial light modulation element, wherein the plurality of pixels corresponding to the respective control signals are changeable in the light modulation state are arranged on the substrate in a two-dimensional manner a portion for modulating the laser light irradiated by the laser device; and the control means controlling a total number of pixels of the pixel portion arranged on the substrate by using a control signal generated by the corresponding exposure information a plurality of pixel units; an optical system that images the laser light modulated in each pixel portion on a liquid surface of the photocurable resin contained in the molding groove; and a moving means to make the exposure head photohardenable The liquid level of the resin is relatively moved. In the optical molding apparatus of the present invention, the laser light modulated by the respective pixel portions of the spatial light modulation element of the exposure head is imaged on the liquid surface of the photocurable resin contained in the molding residue, and is utilized at the same time. The moving means relatively moves the liquid level of the photocurable resin by the exposure head to scan and expose the liquid surface of the light-hardened -9-1263798 resin contained in the molding groove. The exposed resin is cured to form a hardened resin layer. After the hardened resin layer is formed into one layer, it is used to support the formation of the molded article. The support table in the molding groove is lowered to form a new resin surface, and the secondary-hardened resin layer is formed in the same manner. As a result, the hardening and lowering of the support resin causes the hardened resin layers to be sequentially laminated to form a three-dimensional model. In the optical molding apparatus of the present invention, the spatial light modulation component of the exposure head controls the signal generated by the exposure information to control the number of pixels corresponding to the pixel portion arranged on the substrate. A plurality of pixel parts each. That is, it is not controlled to control all of the pixel parts arranged on the substrate, but to control a part of the picture portion. Therefore, the number of pixels to be controlled is reduced, and the transfer speed of the control signal is shorter than when the control signals of all the pixel units are transferred. According to this, the speed can be adjusted quickly and the mold can be formed at a high speed. In the above-described optical molding apparatus, the pixel unit controlled by the control means has a length corresponding to a direction in a predetermined direction that is longer than a length of a direction longer than a direction intersecting the designated direction. good. By using a pixel portion in a long region in the direction in which the light-emitting points of the laser device are arranged, the number of exposure heads to be used can be reduced. Further, in the above-described optical forming apparatus, the laser device may be configured to include a plurality of optical fiber light sources that emit laser light incident from an incident end of the optical fiber from an exit end thereof, and in an exit end of the plurality of optical fiber light sources The light-emitting points are each arranged in a 1-dimensional or 2-dimensional array as an optical fiber array light source. Further, a fiber bundle light source in which the light-emitting points of the plurality of optical fiber light sources are arranged in a bundle shape may be used. The output can be plotted and increased by arraying or beaming. In the case of the optical fiber, it is preferred to use an optical fiber having a uniform core diameter and a cladding diameter which is smaller than the cladding diameter of the -10- 1263798 incident end. It is preferable that each of the optical fiber light sources constituting the optical fiber array light source and the like is a combined laser light source that combines the laser light and enters the optical fiber. High-brightness and high output can be achieved by combining laser light sources. Moreover, since the number of optical fibers which are arrayed to obtain the same light output can be solved without much, the cost is low. Further, since the number of optical fibers is small, the light-emitting area at the time of array formation is small (high luminance). Since the above-mentioned optical fiber having a small cladding diameter is used, the light-emitting area at the time of array formation is small and can be increased in brightness. Even when a spatial light modulation element is partially used, by using a high-intensity fiber array light source or a fiber bundle light source, it is possible to efficiently irradiate the laser light to the use portion, particularly to the illumination NA of the spatial modulation element. Smaller, the depth of focus of the imaging beam after passing through the spatial modulation component can be deepened, and the laser light can be irradiated with high optical density. Accordingly, high-speed and high-definition exposure and molding systems are possible. For example, the formation of a fine shape of 1 // m grade is also possible. For example, the optical fiber source may be configured as follows: a complex semiconductor laser; a complex semiconductor laser; a fiber; and a collecting optical system that collects the laser beams emitted by the respective plurality of semiconductor lasers and sets the light beam The beam is coupled to the incident end of the fiber. Further, the optical fiber light source may also be configured as: a multi-cavity laser having a plurality of light-emitting points; an optical fiber; and a collecting optical system that collects the laser beams emitted from the respective complex light-emitting points and sets the light beams The beam is coupled to the incident end of the fiber. Furthermore, it is also possible to combine the laser beams emitted from the respective light-emitting points of the plurality of cavity lasers and combine them to one optical fiber. In the spatial modulation element used in the above-described optical molding apparatus, it is possible to use a two-dimensional arrangement of a plurality of micromirrors which can change the reflection surface angle by a range of 1 1 to 1263798 degrees in accordance with each control signal. A micromirror device (dmd) or a liquid crystal shutter array formed by arranging a plurality of liquid crystal cells that transmit light in response to respective control signals is arranged in two dimensions on a substrate. Like DMD, it uses a spatial light modulation component with a plurality of halogen elements to expose it in most channels to prevent power dispersion and thermal strain. In the laser device using the above-described photoforming apparatus, a laser light having an irradiation wavelength of 3 50 to 4 50 nm is preferable. For example, by using a GaN-based semiconductor laser in a semiconductor laser, a laser device that irradiates laser light having a wavelength of 305 to 450 nm can be formed. By using laser light having a wavelength of 3 50 to 450 nm, the light absorptivity of the photocurable resin can be greatly increased as compared with the case of using laser light having an infrared wavelength region. The laser light with a wavelength of 3 50 to 4 50 nm has a short wavelength, so the photon energy is large and it is easy to convert it into a thermal energy system. As a result, the laser light having a wavelength of from 3 5 0 to 45 nm has a large light absorptivity and is easily converted into a thermal energy system. Therefore, the photocurable resin can be molded at a high speed. The wavelength of the laser light is preferably 350 to 420 nm. In terms of utilizing a low-cost GaN-based semiconductor laser, the wavelength of 40 5 nm is particularly good. Further, the above-described optical molding apparatus can be configured as a multi-head type optical molding apparatus including a plurality of exposure heads. The speed of molding can be increased by multi-heading. [Embodiment] [Configuration of Light Forming Apparatus] The light forming apparatus according to the embodiment of the present invention has a container 156 that is open at the top as shown in Fig. 1, and contains liquid photocuring property in the container 156. Resin 150. Further, a flat lifting stage 15 2 is disposed in the container 156, and the lifting stage 15 2 is supported by a support - 12 - 1263798 part 154 disposed outside the container 156. The support portion 1 5 4 is provided with a male screw portion 1 5 4 A, and the male screw portion 1 5 4 A is screwed to a lead screw 15 5 that is rotatable by a drive motor (not shown). Along with the rotation of the lead screw 150, the lifting stage 15 2 is lifted. Above the liquid surface of the photocurable resin 152 housed in the container 156, the box-shaped scanner 162 is disposed such that its longitudinal direction faces the width direction of the container 156. The scanner 1 62 is supported by two support arms 160 that are mounted on both sides in the width direction. Further, the scanner 1 62 is connected to a controller (not shown) for controlling it. Further, on both side faces in the longitudinal direction of the container 1 56, guide portions 158 extending in the sub-scanning direction are provided. The lower end portions of the two support arms 160 are attached to the guide portions 158 to follow the pair. The scanning direction is reciprocally mounted. Further, the optical molding apparatus is provided with a driving means (not shown) for driving the support arm 160 together with the scanner 162 along the guiding portion 158. As shown in Fig. 2, the scanner 1 62 (for example, three rows and five columns) is provided with a plurality of (for example, 14) exposure heads 166 arranged in a matrix. In this example, four exposure heads 166 are arranged in the third row because of the relationship with the width direction of the container 156. Further, when the respective exposure heads arranged in the nth column of the mth row are indicated, they are indicated as the exposure heads 166mn. The exposure region 168 according to the exposure head 166 has a rectangular shape in which the sub-scanning direction is the short side. Therefore, with the movement of the scanner 162, an exposed region (hardened region) 1 70 of a strip shape of each exposure head 166 is formed on the liquid surface of the photocurable resin 15 2 . Further, when an exposure region formed by each of the exposure heads arranged in the nth column of the mth row is to be indicated, it is expressed as an exposure region 168 mn. 1263798 Further, as shown in FIGS. 3(A) and 3(B), the strip-shaped exposed regions 170 are arranged in a direction orthogonal to the sub-scanning direction without a gap, and the exposure heads of the respective rows in the line arrangement are respectively It is arranged in the arrangement direction at a predetermined interval (a natural multiple of the long side of the exposure area, twice in the present embodiment). Therefore, the unexposed portion between the exposed area 168n and the exposed area 168 12 of the first row can be exposed by the exposure area 1 6 8 21 of the 2nd line and the exposure area 1 6 8 31 of the 3rd line. The exposure heads 166^-16 6^ are each shown in Figures 4, 5(Α) and 5(B), and have a digital micromirror device (DMD) 50 as the corresponding image data to reflect the incident light beam to the image data. Each pixel is used as a spatial light modulation component for modulation. The DMD 50 is connected to a controller having a data processing unit and a mirror drive control unit (not shown). The data processing unit of the controller generates control signals for controlling the respective micromirrors in the control region of the DMD 50 of each exposure head 166 based on the input image data. In addition, the area to be controlled is described later. The light incident side of the DMD 50 is arranged in the following order: an optical fiber having an exit end portion (light-emitting point) of the optical fiber arranged in a row in a direction corresponding to the longitudinal direction of the exposure region 168 Array light source 66; a lens system 67 that corrects the laser light emitted by the fiber array light source 66 and condenses the light on the DMD; and a mirror that reflects the laser light from the transmission lens system 67 toward the DMD 50. a pair of combined lenses 71 that are made to collimate the laser light emitted from the fiber array light source 66 in parallel, and a pair of combined lenses 7 3 that correct the light amount distribution of the laser light that is parallelized to be uniform. A light collecting lens 75 in which the corrected amount of laser light is collected on the DMD by a light amount of 14 to 1263798. The combined lens 713 is provided with a direction in which the laser emitting end is arranged, and a portion close to the optical axis of the lens is a portion that expands the light beam and is separated from the optical axis, and the light beam is reduced in a direction orthogonal to the arrangement direction. The function of passing through as it is, the light quantity distribution is generally corrected for the laser light. Further, on the light reflection side of the DMD 50, lens systems 54, 58 for imaging the laser light reflected by the DMD 50 on the scanning surface (exposure surface) 56 of the photosensitive material 150 are disposed. The lens systems 54 and 58 are arranged such that the DMD 50 and the exposed surface 56 are in a conjugate relationship. As shown in Fig. 6, the DMD 50 is a small mirror (microscope) 62 supported by a pillar on a SRAM cell (memory cell) 60, and is configured to be a plurality of pixels (PIXEL) (for example, 600 X 800) micro mirrors are arranged in a lattice arrangement. The uppermost part of each pixel is provided with a micromirror 62 supported by a pillar, and the surface of the micromirror 62 is vapor-deposited with a material having a high reflectance such as aluminum. Further, the reflectance of the micromirror 62 is 90% or more. In addition, the CMOS SRAM cell 60 of the gate of the normal semiconductor memory production line is disposed in the front of the micromirror 62 through the pillar including the hinge and the yoke, and the whole system is configured as a monolith (integrated type). . When the SRAM cell 60 of the DMD 50 is written with a digital signal, the micromirror 62 supported by the post is centered on the diagonal and is at a degree (for example, ± 1 相对) with respect to the substrate side on which the DMD 50 is disposed. The range of the slope is inclined. The 7th (A) diagram shows that the tilt of the micromirror 6 2 in the on state is at +α degrees, and the seventh (B) diagram is in the state in which the tilt of the micromirror 62 in the off state is -α degrees. Therefore, in response to the image signal, by making the tilt control 1263798 of the micromirrors 6 2 of the respective elements of D M D 5 0 as shown in Fig. 6, the light beams incident on the DMD 50 are reflected toward the oblique directions of the respective micromirrors 62. Further, Fig. 6 is an enlarged view of a portion of the DMD 50, and shows that the micromirror 62 is controlled by one state of + degree or one degree of α. The opening and closing control of the respective micromirrors 6 2 is performed by a controller (not shown) connected to the DMD 50. Further, a light absorber (not shown) is disposed in the direction in which the micromirrors 6 and the light beams are reflected in the closed state. Further, it is preferable that the DMD 50 is disposed such that its short side is slightly inclined at a predetermined angle of 0 (e.g., 1 ° to 5 °) in the sub-scanning direction. The eighth (a) diagram shows the scanning trajectory of the reflected light image (exposure beam) 53 of each micromirror when the DMD 50 is not tilted, and the eighth (B) image of the exposure beam 5 3 when the DMD 50 is tilted. Scan the track. In the DMD 50, a micromirror array in which a plurality of micromirrors (for example, 800) are arranged in the longitudinal direction is arranged in a plurality of arrays in the width direction (for example, a group of 6 〇〇), as shown in FIG. 8(B). By tilting the DMD 50, the pitch pi of the scanning trajectory (scanning line) of the exposure beam 53 of each micromirror becomes narrower than the pitch P2 of the scanning line when the DMD 50 is not tilted, and the resolution can be greatly improved. On the other hand, since the inclination angle of the DMD 50 is small, the scanning width W2 when the DMD 50 is tilted is slightly the same as the scanning width W1 when the DMD 50 is not tilted. Further, depending on the different micromirror columns and the same scanning line, the overlap is exposed (multiple exposure). Thus, by being subjected to multiple exposures, a small amount of exposure position can be controlled to achieve high-definition exposure. Further, by the digital image processing such as a small amount of exposure position control, the connection between the plurality of exposure heads arranged in the main scanning direction can be connected without any difference. - 1 6 - 1263798 In addition, instead of the tilt of the DMD 50, the same effect can be obtained by arranging the micromirrors in a direction orthogonal to the sub-scanning direction and at a predetermined interval offset in a checkerboard configuration. The fiber array light source 66 is provided with a plurality (e.g., six) of laser modules 64 as shown in Fig. 9(A), and each of the laser modules 64 is coupled to one end of the multimode fiber 30. The end of the multimode fiber 30 is combined with an optical fiber 31 having a core diameter smaller than that of the multimode fiber 30 and having a larger cladding diameter and a larger mode fiber 30. As shown in Fig. 9(C), the exit end of the optical fiber 3 1 The portion (light-emitting point) is arranged in one line along the main scanning direction orthogonal to the sub-scanning direction to constitute the laser emitting portion 68. Further, as shown in Fig. 9 (D), the light-emitting points may be arranged in two rows along the main scanning direction. The exit end of the optical fiber 3 1 is fixed as shown in Fig. 9(B), and the surface is held by the flat two support plates 65. Further, the light-emitting side of the optical fiber 31 is provided with a transparent protective plate 63 such as glass to protect the end faces of the optical fibers 31. The protective plate 63 may be disposed in close contact with the end surface of the optical fiber 31, or the end surface of the optical fiber 31 may be arranged in a sealed manner. Although the exit end of the optical fiber 31 is degraded by optical density and easy to collect dust, by arranging the protective plate 63, it is possible to prevent dust from adhering to the end surface and to delay deterioration. In this example, in order to arrange the exit end of the optical fiber 3 1 having a small cladding diameter as 1 歹 ij without gaps, the multimode optical fiber is interposed between two adjacent multimode optical fibers 30 having a large cladding diameter. 30 is gathered, and the exit end of the optical fiber 3 1 combined with the aggregated multimode optical fiber 30 is arranged to be bundled with the optical fiber 3 1 combined with the two multimode optical fibers 30 adjacent to each other with a large cladding diameter. Between 2 exits. Such an optical fiber, for example, as shown in Fig. 10, has a cladding diameter of 1 to 3 Qcm in length by the front end portion of the laser light exiting side of the multi-mode optical fiber 30 of - 17 - 1263798 having a large cladding diameter. The small optical fibers 31 are obtained by coaxially combining them. The incident end faces of the two fiber-optic fibers 31 are bonded to each other at the exit end faces of the multimode fibers 30 in such a manner that the central axes of the two fibers are uniformly welded. As described above, the diameter of the core 31a of the optical fiber 3 1 is the same as the diameter of the core 30 a of the multimode fiber 30. Further, a short-length optical fiber in which an optical fiber having a small cladding diameter is welded to a fiber having a small cladding diameter can be bonded to the exit end of the multimode optical fiber 30 via a set of 圏 or optical connectors. By detachably joining by a connector or the like, it is easy to exchange the tip end portion when the optical fiber having a small cladding diameter is broken, and the cost of maintenance of the exposure head can be reduced. Further, the fiber 31 is sometimes referred to as an exit end of the multimode fiber 30 hereinafter. The multimode optical fiber 30 and the optical fiber 31 may be any of a STEP INDEX type optical fiber, a GRATED INDEX type optical fiber, and a composite type optical fiber. For example, a STEP INDEX type optical fiber manufactured by Mitsubishi Electric Industries, Ltd. can be used. In the present embodiment, the multimode fiber 30 and the optical fiber 31 are STEP INDEX type fibers, and the multimode fiber 30 has a cladding diameter of 125/zm, a core diameter of 25/zm, ΝΑ = 0.2, and a transmittance of the incident end face coating. = 99·5% or more, the optical fiber 31 is a cladding diameter of two 60//m, a core diameter = 25//m, and ΝΑ = 0.2. Generally, in the case of laser light in the infrared region, if the cladding diameter of the optical fiber is set small, the transmission loss increases. Therefore, the appropriate cladding diameter is determined in response to the wavelength band of the laser light. However, the shorter the wavelength, the less the transmission loss is. In the case of laser light having a wavelength of 40 5 nm emitted by a GaN-based semiconductor laser, even if the thickness of the cladding {{cladding diameter-core diameter)/2} is 800 nm. The wave 1263798 is about 1 / 2 of the infrared light in the long band, or about 1 / 4 of the infrared light in the wavelength band of 1.5 / m, and the transmission loss hardly increases. Therefore, the cladding diameter can be made small to 60 # m. A light beam having a high optical density can be easily obtained by using an LD of the G a N system. However, the cladding diameter of the optical fiber 31 is not limited to 60/zm. In the past, the cladding diameter of the fiber used in the fiber source is 1 2 5 // m, but the smaller the cladding diameter is, the deeper the depth of focus is, so the cladding diameter of the multimode fiber is preferably 80 // m or less. , 60 / m or less is better, 40 / m or less is better. On the one hand, the core diameter needs to be at least 3 to 4 #m, so the cladding diameter of the optical fiber 3 1 is preferably more than 10 // m. The laser module 64 is composed of a multiplexed laser light source (optical fiber source) as shown in Fig. 11. The multiplexed laser light source is composed of a plurality of (for example, seven) wafer-shaped transverse multimode or single mode GaN-based semiconductor lasers LD1, LD2, LD3 fixed on the thermal block 10. LD4, LD5, LD6, and LD7; collimating lenses 1 1 , 12 , 13 , 14 , 15 , 16 , and 17 corresponding to respective GaN-based semiconductor lasers LD1 to LD 7 ; 1 collecting lens 20 ; Strip multimode fiber 30. In addition, the number of semiconductor lasers is not limited to seven. For example, a multimode fiber with a cladding diameter = 60 /zm, a core diameter = 50 // m, and a NA = 0.2 can inject more than 20 semiconductor lasers to achieve the necessary amount of light for the exposure head 5, and the fiber strip can be The number is reduced to less.

The GaN-based semiconductor lasers LD1 to LD7 are all common in oscillation wavelengths (for example, 40 5 nm), and the maximum output is also common (for example, multimode laser is i〇〇mw and single mode laser is 30 mW). Further, in the GaN-based semiconductor lasers LD1 to LD7, a laser having a resonance wavelength other than the above-described 1263798 4 Ο 5 n m can be used in the wavelength range of 350 nm to 450 nm. The above-described combined laser light source is housed in a box-like package 40 having an opening as shown in Figs. 1 and 2, together with other optical elements. The package 40 is provided with a package cover 4 1 made by closing its opening, and a sealing gas is introduced after the degassing process, by closing the opening of the package 40 with the package cover 41, and by the package 40 and the package cover. In the closed space (sealed space) formed by 4 1 , the above-mentioned combined laser light source is hermetically sealed. A substrate 42 is fixed on the bottom surface of the package 40. The upper surface of the substrate 42 is mounted with the thermal block 10, a collecting lens holder for holding the collecting lens 20, and an incident end for holding the multimode fiber 30. Part of the fiber holder 46. The exit end of the multimode fiber 30 is led out of the package by an opening formed in the wall surface of the package 40. Further, a collimator lens holder 44 is attached to the side surface of the thermal block 10, and the collimator lenses 1 1 to 17 are held. An opening is formed in the lateral wall surface of the package 40, and the wiring 47 for supplying a driving current to the GaN-based semiconductor lasers LD1 to LD7 is led out of the package. Further, in Fig. 13, in order to avoid cumbersome drawing, only the plurality of GaN-based semiconductor lasers are numbered with respect to the GaN-based semiconductor laser LD7, and only a plurality of collimating lenses are given collimation. The lens 1 7 is numbered. Fig. 14 shows the front shape of the mounting portions of the above-described collimating lenses 1 1 to 17 . Each of the collimator lenses 1 1 to 17 is formed so as to be elongated in a plane parallel to the optical axis including the aspherical circular lens. The elongated shape of the collimating lens can be formed, for example, by molding a resin or an optical glass. The collimator lenses 11 to 17 are arranged such that the longitudinal direction thereof is closely arranged in the arrangement direction of the light-emitting points of the GaN-based semiconductor Rays-20 - 1263798 to the LDs LD1 to LD7 (the left-right direction of FIG. 14). Arrangement direction. On the other hand, in the GaN-based semiconductor lasers LD1 to LD7, an active layer having a light-emitting width of 2 #m is used, and a direction parallel to the active layer and a viewing angle in a direction perpendicular to each other are, for example, 10° and 30°. The lasers of the respective laser beams B1 to B7 are emitted. These GaN-based semiconductor lasers LD1 to LD7 are arranged in a line in a direction in which the light-emitting points are parallel to the active layer. Therefore, the laser beams B1 to B7 emitted from the respective light-emitting points are as described above, and the collimating lenses 1 1 to 17 7 of the elongated shape are aligned in the direction in which the viewing angle is large, and the viewing angle is the same. The small direction is incident in a state in which the width direction (the direction orthogonal to the longitudinal direction) coincides. That is, the width of each of the collimating lenses 1 1 to 17 is 1.1 mm and the length is 4.6 mm, and the beam diameters of the horizontal and vertical beams incident on the laser beams B1 to B7 are 0. 9 mm, 2, respectively. · 6mm. Further, each of the collimator lenses 1 1 to 17 has a focal length of 2 mm, NA = 0.6, and a lens arrangement pitch = 1.25 mm. The collecting lens 20 is formed by extending a region including an optical axis of a circular lens having an aspherical surface in a parallel plane, and the alignment direction of the collimator lenses 1 1 to 17 is formed to be long in the horizontal direction. And a shape that is short in a direction perpendicular thereto. This collecting lens 20 has a focal length f 2 = 2 3 mm and N A = 0. The collecting lens 20 is also formed by, for example, molding a resin or an optical glass. [Operation of Light Forming Apparatus] The operation of the light forming apparatus will be described below. In each of the exposure heads 166 of the scanner 162, the GaN-based semiconductor lasers LD1 to LD7 constituting the 1263798 multiplexed laser light source of the optical fiber array light source 66 are respectively emitted in a diverging light state, and the laser beams B1, B2, B3, and B4 are emitted. Each of B5, B6, and B7 is parallelized by the corresponding collimating lenses 1 1 to 17 . The laser beams B1 to B7 which are collimated in parallel are collected by the collecting lens 20 and converged to the incident end face of the core 30 a of the multimode fiber 30. In this example, the collimating lenses 11 to 17 and the collecting lens 20 constitute a collecting optical system, and the collecting optical system and the multimode optical fiber 3 constitute a combined optical system. That is, the laser beam 20 is collected by the collecting lens 20, and the laser beam B1 to B7 collected as described above is incident on the core 30a of the multimode fiber 30 to be transmitted in the optical fiber, and is combined into one laser beam B. The fiber 31 is coupled to the exit end of the multimode fiber 30. In each of the laser modules, when the combined efficiency of the laser beams B1 to B7 to the multimode fiber 30 is 〇85, and the outputs of the GaN-based semiconductor lasers LD1 to LD7 are 30 mW, the fibers arranged in an array are arranged. The 3 1 series can obtain a combined laser beam B with an output of about 180 m W (= 3 0 M w X 0 . 8 5 X 7 ). Therefore, the output of the laser emitting portion 68 in which six optical fibers 31 are arranged in an array is about 1 W (= 180 mW X 6 ). The laser emitting portion 68 of the optical fiber array light source 66 has such high-luminance light-emitting points arranged in a row along the main scanning direction. Since a conventional optical fiber light source that combines laser light from a single semiconductor laser to one optical fiber has a low output, if a plurality of columns are not arranged, a desired output cannot be obtained, but the combined laser used in the present embodiment The light source is high output, so a few columns, for example even one column, can achieve the desired output. For example, in a conventional optical fiber source in which a semiconductor laser and an optical fiber are combined in a one-to-one relationship, generally, in the case of a semiconductor laser, a laser having an output of 30 mW (milli-22 - 1263798 watts) is used, and an optical fiber is used. In this case, since a multimode fiber having a core diameter of 5 Ο μ m and a cladding diameter of 1 2 5 " m, ΝΑ (number of openings) 〇. 2 is used, if an output of about 1 W (watt) is to be obtained, The mode fiber must be bundled with 4 8 (8 X 6 ), and the area of the light-emitting area is 0.62 mm2 (0.675 mm x 〇.925 mm), so the degree of the laser exit portion 68 is i.6xi06 (W/m2). The brightness of each fiber is 3.2X106 (W/m2). On the other hand, in the present embodiment, as described above, the output of 1 IV can be obtained by the multimode fiber 6 treaty, and the area of the light-emitting region of the laser emitting portion 68 is 0.008 x 1 mm 2 (0.3 2 5 mm×0.025_), so that the laser is emitted. The luminance of the incident portion 68 is 123 xi06 (W/m 2 ), which is 80 times higher than that of the conventional image. Further, the brightness of each of the optical fibers is 90X1 O6 (W/m2), which is 28 times higher than that of the conventional image. Here, the difference between the focus depths of the conventional exposure head and the exposure head of the present embodiment will be described with reference to Figs. 1 5 (A) and 1 5 (B). The diameter of the light-emitting region of the bundled fiber-optic light source of the conventional exposure head in the sub-scanning direction is 0.675 mm, and the diameter of the light-emitting region of the optical fiber array light source of the exposure head in the sub-scanning direction is 0. 05 5 mm. As shown in the first 5 (-A)-picture, in the conventional exposure head, since the light-emitting area of the light source (bundle fiber light source) 1 is large, the angle of the light beam incident on the DMD 3 is increased, and as a result, the scanning surface is applied. 5 The angle of the incident beam becomes larger. For this reason, the beam diameter is easily too wide with respect to the collecting direction (deviation of the focus direction). On the other hand, as shown in Fig. 15(B), in the exposure head of the present embodiment, since the diameter of the light-emitting region of the optical fiber array light source 66 is small in the sub-scanning direction, the angle of the light beam incident on the DMD 50 by the lens system 67 is small. The result is smaller, and the result 'the angle of the beam incident on the sweep -23-1263798 is smaller. That is, the depth of focus becomes deeper. In this example, the diameter of the light-emitting region in the sub-scanning direction is about 30 times that of the conventional one, and a depth of focus equivalent to a slightly wound limit can be obtained. Therefore, it is suitable for exposure of minute spots. The effect of this depth of focus is that the greater the amount of light necessary for the exposure head, the more significant and effective. In this example, the 1 pixel size projected onto the exposure surface is 1 〇 M m χ 1 Ο # m. In addition, the DMD-based reflective spatial modulation elements, such as the 15th (A) and 15(B) diagrams, are used to illustrate the development of the optical relationship. The image data corresponding to the exposure pattern of one layer is input to a controller (not shown) connected to the DMD 50, and is temporarily stored in the frame of the controller. This image data indicates the density of each pixel constituting the image in binary (the presence or absence of dot recording). The scanner 162 is moved at a constant speed from the upstream side to the downstream side in the sub-scanning direction along the guide portion 158 by a driving device (not shown). When the scanner 1 62 starts moving, the complex lines of the portrait data stored in the frame memory are sequentially read, and the control of each exposure head 1 66 is generated based on the image data read by the data processing unit. signal. Then, the mirror driving control unit controls the opening and closing of the micromirrors of the DMDs 50 of the respective exposure heads 166 in accordance with the generated control signals. When the laser light is irradiated to the DMD 50 by the fiber array light source 66, the laser light reflected when the micromirror of the DMD 50 is turned on is imaged on the liquid surface of the photocurable resin 150 via the lens systems 54 and 58 ( The exposed surface is 56. In this way, the laser light emitted by the fiber array light source 66 is turned on and off in each pixel, and the photocurable resin 150 is in the same number of pixel units as the number of pixels used in the DMD 50 (exposure area 168). ) is hardened by exposure. - 2 4 - 1263798 Further, by the scanner 1 62 being moved at a constant speed, the liquid surface of the photocurable resin 15 5 is subjected to sub-scanning to form a strip-shaped sintered region of each exposure head 1 66. In the present embodiment, in the present embodiment, in the DMD 50, the micromirror array in which 800 micromirrors are arranged in the main scanning direction has 600 groups arranged in the sub-scanning direction, but in the present embodiment. In the form, only a part of the micromirror columns (for example, 800 X 1 00 columns) are controlled by the controller. As shown in Fig. 16(A), a micromirror array disposed at the center of the DMD 50 may be used. As shown in Fig. 16 (Β), a micromirror array disposed at the end of the DMD 50 may be used. Further, when a part of the micromirrors is defective, it is necessary to use a micromirror array or the like which does not cause a defect, and the micromirror array to be used can be appropriately changed depending on the situation. The data processing speed of the DMD50 has its limit, and the modulation speed per line is determined in proportion to the number of pixels to be used. Therefore, the modulation speed per line is used by using only a part of the micromirror column. Faster. On the other hand, in the case of continuously exposing the exposure head to the relative movement mode, it is not necessary to use all of the pixels in the sub-scanning direction. For example, among the 600 sets of micromirror columns, when only 300 sets are used, compared with the case where all 600 sets are used, the line can be adjusted twice as fast. Further, among the 600 sets of micromirror rows, when only 200 sets are used, compared with the case where all 600 sets are used, it is possible to change the number of lines per line three times faster. That is, an area of 50 mm can be exposed in the sub-scanning direction for 17 seconds. Furthermore, when only the 100 group is used, the line can be adjusted 6 times faster. That is, an area of 500 mm can be exposed in the sub-scanning direction for 9 seconds. -25 - 1263798 The number of micromirror columns to be used, that is, the number of micromirrors arranged in the sub-scanning direction is preferably 10 or more and 200 or less, more preferably 1 〇 or more and 1 〇 〇 or less. Since the area of each micromirror corresponding to 1 pixel is 丨5 V m X丨5 V m, the area converted to the right side of DMD50 is better than the area of 12 mm X 3 mm or less, and 1 2 mm X 1 The area of 50 // m or more and 1 2mm X 1. 5mm or less is better. If the number of micromirror columns to be used is within the above range, the laser light emitted from the fiber array light source 66 is applied to the lens system 67 as shown in Figs. 1 7 (A) and 17 (B). The DMD 50 can be irradiated by parallel photochemicalization. It is preferable that the irradiation area in which the laser light is irradiated by the DMD 50 coincides with the use area of the DMD 50. If the irradiation area is wider than the use area, the utilization efficiency of the laser light is lowered. On the one hand, in view of the number of micromirrors arranged in the sub-scanning direction of the lens system 67, although it is necessary to set the diameter of the sub-scanning direction of the light beam collected on the DMD 50 to be small, the number of micromirror columns used is not When the time is 10, the angle of the light beam incident on the DMD 50 becomes large, and the depth of focus of the light beam on the scanning surface 56 becomes shallow, which is not preferable. Further, from the viewpoint of the modulation speed, it is preferable that the number of micromirrors used is 200 or less. In addition, the DMD is a reflective spatial modulation element, and the 17th (7) and 17(B) diagrams are used to illustrate the development of the optical relationship. When the one-stage sub-scanning of the scanner 162 is completed, the scanner 162 returns to the origin on the most upstream side along the guide portion 158 by a driving device (not shown). Then, the lead screw 155 is rotated by a drive motor (not shown) to lower the lift stage 152 by a predetermined amount, and the hardened portion of the photocurable resin 150 is allowed to sink below the liquid surface to form a liquid photocurable resin 1 50 is filled with the top of the hardened part. Then, the image data of the sub-layer is again subjected to the sub-scanning by the scanner 162 after being input to the controller (not shown) connected to the -26 - 1263798 MD50. Thus, the exposure (hardening) by the sub-scan and the lowering of the stage are repeatedly performed, and the three-dimensional model is formed via the laminated hardened portion. As described above, the optical molding apparatus of the present embodiment includes a DMD having 600 micromirrors arranged in the main scanning direction in the sub-scanning direction, and 600 sets are arranged in the sub-scanning direction. Since the micromirror train is controlled in a driving manner, the modulation speed per line becomes faster than in the case of driving all the micromirror rows. According to this, high-speed exposure and molding can be achieved. Moreover, since the light source system for illuminating the DMD uses a high-intensity optical fiber array light source in which the emission end portions of the optical fibers of the multiplexed laser light source are arrayed, a high output and a deep depth of focus can be obtained, and high visibility is obtained. The optical density output allows high speed and high precision molding to be performed. Further, since the output of each of the optical fiber light sources is increased, the number of optical fiber sources necessary for obtaining a desired output is reduced, so that the cost of the optical molding apparatus can be reduced. In particular, in the present embodiment, since the cladding diameter of the exit end of the optical fiber is set to be smaller than the cladding diameter at the incident end, the diameter of the light-emitting portion is changed little, and the optical fiber array light source can be made more bright. This makes it possible to make a more elaborate form. Further, in the above-described embodiment, an example in which the micromirror of the DMD is partially driven has been described, but the length in the direction corresponding to the specified direction is longer than the length in the direction crossing the specified direction. On the substrate, an elongated DMD having a plurality of micromirrors that can change the angle of the reflecting surface in two dimensions in response to each control signal is used, and since the number of micromirrors for controlling the angle of the reflecting surface is small, the modulation can be accelerated. speed. -27 - 1263798 Hereinafter, a modification of the embodiment described above will be described. [Other Spatial Modulation Element] In the above-described embodiment, an example in which the micromirror of the DMD is partially driven has been described. However, the length in the direction corresponding to the specified direction is longer than the direction intersecting the designated direction. On the substrate having a long length in the direction, an elongated DMD having a plurality of micromirrors that can change the angle of the reflecting surface in two dimensions in response to the respective control signals is used, and the number of micromirrors for controlling the angle of the reflecting surface is small. Therefore, the modulation speed can be accelerated. In the above-described embodiment, an exposure head including a DMD as a spatial modulation element has been described. For example, even a MEMS (Micro Electro Mechanical System) type spatial modulation element (SLM) or an electric device is used. The optical element (PLZT element) and the liquid crystal shutter (FLC) that are transmitted through the optical effect are modulated, and even when a spatial modulation element other than the MEMS type is used, all the pixel parts arranged on the substrate are By using a part of the pixel portion, the same effect can be obtained because the modulation speed per one pixel and one main scanning line can be accelerated. In addition, the so-called MEMS is a general term for micro-sized sensors and actuators based on micro-mechanical technology based on IC process technology, and then the control system is integrated. The so-called MEMS type space modulation A variable component means a spatially modulated component driven by an electromechanical action of electrostatic force. [Laser Driving Method] Each of the GaN-based semiconductor laser systems included in the optical fiber array light source may be continuously driven or pulse-driven. Exposure to laser light driven by pulse waves prevents thermal diffusion and enables high speed and high precision molding. The pulse width is shorter, preferably 1 p s e c -28- 1263798 ~ lOOnsec, and lpsec ~ 300 psec is better. Further, the GaN-based semiconductor laser system is less likely to cause breakage of the light-emitting end face called COD (optical damage), and is highly reliable, and can easily realize a pulse width of lpsec to 300 sec. [Other exposure method] As shown in Fig. 18, in the same manner as in the above embodiment, the photosensitive material 150 may be entirely exposed by the scanner 1 62 for one scan in the X direction, as in the 19th (A). As shown in FIG. 19(B), after the scanner 162 scans the photosensitive material 150 in the X direction, the scanner 162 is moved by one step in the Y direction, and then scanned and moved repeatedly in the X direction to perform scanning. The scanning may also fully expose the photosensitive material 150. Further, in this example, the scanner 162 is provided with 18 exposure heads 166. Generally, in the photoforming method for molding a three-dimensional model, a resin which is heated at a high temperature due to the recombination shrinkage of the resin and the heat of recombination generated during curing is cooled at a normal temperature to cause hardening and shrinkage by thermal strain, accompanied by The shrinkage of these hardenings has a problem of thermal strain of the molded product and a decrease in molding precision. In particular, when a region including a plurality of pixels is simultaneously exposed (surface exposure) to be formed into a flat shape, the molded article is warped toward the lower side in a convex shape with respect to the lamination direction. In order to prevent the occurrence of strain due to such hardening shrinkage, it is preferred to divide the exposed area into a plurality of areas and then sequentially expose them. For example, the same liquid surface of the photocurable resin is scanned in a plurality of times, and after the first scanning, the photocurable resin is cured in the exposure molding shape, and after the second and subsequent scanning, the exposure rotation line is exposed. The photocurable resin is hardened inside, and the occurrence of strain is prevented. -29- 1263798 Further, as shown in the figure 30 (A), the exposure area is divided into a plurality of pixels, and the plurality of pixels are divided into the first group consisting of pixels 102 that are not adjacent to each other. And two groups, such as the second group consisting of pixels 104 that are not adjacent to each other, may be scanned and exposed for each group. The alizarin 102 and the pixel 1〇4 are arranged in a black-and-white pattern. In the 30th (A) diagram, a part of the exposure area is shown. However, when an exposure head having a DMD of, for example, 1 million halogen is used, the exposure area can be divided into 100,000 units in accordance with the number of pixels of the DMD. Prime. First, in the first scan, as shown in the 30th (B) diagram, the pixels 102 belonging to the first group are exposed, and in the second scan, as shown in the 30th CC), the exposure is the second group. The picture is 104. Thereby, the gap between the pixels and the pixels is buried, and the exposed area of the liquid surface of the photohardenable resin is completely exposed. The pixels of the first group which are simultaneously exposed and scanned at the same time are not adjacent to each other, and the pixels of the second group which are simultaneously exposed and scanned at the same time are not adjacent to each other. Since the adjacent pixels are not exposed at the same time, the strain system according to the hardening contraction is not transmitted to the adjacent pixels. In other words, when the entire exposed area is simultaneously exposed, the strain strain depending on the hardening shrinkage increases with the spread of the exposed region, and although considerable strain occurs, in this example, the hardening shrinkage is only in the range of 1 pixel. The strain generated by the hardening shrinkage is not transmitted to the adjacent pixels. Thereby, the generation of strain in the laminated molded product is remarkably suppressed, and molding with high precision can be achieved. In the exposure apparatus of the above-described embodiment, the liquid surface of the photocurable resin can be exposed in an arbitrary pattern by scanning once by the scanner. Therefore, it is relatively easy to expose the respective regions divided by the plurality of scans. - 30- 1263798 [Photocurable resin] A liquid photocurable resin used for photo-forming is generally a polyurethane-based resin which is cured by photopolymerization or photo-resistance. An epoxy resin which is cured by cationic polymerization. Further, a sol-gel conversion type photocurable resin which is in a gel state at normal temperature and is transferred to a sol state when heat energy is applied by laser irradiation can be used. In the photoforming method using a sol-gel conversion type photocurable resin, since the exposure and hardening are performed on a molding surface in a gel state rather than a liquid state, the molded product is formed in a gel-like resin. Therefore, there is an advantage that a support portion or a joint portion for supporting the molded product is not required. In the case of performing line exposure or area exposure of simultaneous exposure to a predetermined area, it is preferable to use a resin having heat conductivity imparted to the sol-gel conversion type photocurable resin. By adding a thermally conductive ruthenium, thermal diffusivity is exerted, and the occurrence of thermal strain in the molded product is prevented. In particular, in the plastisol-gel-type photocurable resin, unlike the usual resin, the chelating agent can be uniformly dispersed without sedimentation, so that thermal diffusibility can be maintained. [Other laser device (light source)] In the above embodiment, an example of using a fiber array light source including a plurality of multiplexed laser light sources is described, but the laser device is not limited to the multiplexed laser light source. Arrayed fiber array light sources. For example, an optical fiber array having an optical fiber source having one optical fiber for emitting laser light incident from a single semiconductor laser having one light-emitting point can be used. But better for the depth of focus is taken deep into the combined laser source. Further, in the case of a light source having a plurality of light-emitting points, for example, as shown in FIG. 2, a plurality of (for example, seven) wafer-shaped semiconductor mines may be arranged on the heat block 100. Laser arrays of LD 1 to LD7. Further, as shown in Fig. 2 (A), a wafer-shaped multi-cavity laser 110 in which a plurality of (e.g., five) light-emitting points 1 1 〇 a are arranged in a predetermined direction is known. Compared with a wafer-shaped semiconductor laser, the multi-cavity laser 1 1 可 can accurately arrange the light-emitting points, and can easily combine the laser beams emitted from the respective light-emitting points. However, when the number of light-emitting points is increased, the multi-cavity laser is easily deformed at the time of laser production, and the number of light-emitting points 1 1 0 a is preferably 5 or less. In the exposure head of the present invention, the multi-cavity laser 110 or as shown in Fig. 21(B) can be arranged in the same direction on the thermal block 100 in the same direction as the arrangement direction of the light-emitting points 1 10a of the respective wafers. A multi-cavity laser array of cavity lasers 110 is used as a laser device (light source). Further, the multiplexed laser light source is not limited to those used to multiplex the laser light emitted from a plurality of wafer-shaped semiconductor lasers. For example, as shown in Fig. 2, a multi-chamber laser 1 1 合 combined laser light source having a plurality of (for example, three) light-emitting points 1 10 a can be used. The multiplexed laser light source is configured to include a multi-cavity laser 110, a multimode fiber 130, and a collecting lens 120. The multi-cavity laser 110 can be configured, for example, by oscillating a GaN-based laser diode having a wavelength of 405 nm. In the above configuration, the laser beam B emitted from the plurality of light-emitting points ii 〇 a of the multi-cavity laser is collected by the collecting lens 丨 20 and incident on the core 1 3 0 of the multimode fiber 130. a. The laser light incident on the core 130 h is transmitted in the optical fiber and is split into one and is emitted. -32- 1263798 A plurality of light-emitting points 11〇a are disposed within a width equal to the core diameter of the multimode fiber 丨3, 〇, and serve as a collecting lens 120, and a core of the multimode fiber 丨3 0 A convex lens or a cavity laser with a slightly equal focal length of diameter 1 1 0 of the outgoing beam is only collimated in the plane perpendicular to the active layer, thereby enhancing the bonding of the laser beam B to the multimode fiber 130 As shown in Fig. 23, a multi-cavity laser 具备 10 having a plurality of light spots (for example, three light spots, and a plurality of cavity lasers having an equal interval (for example, nine) on the heat block 11 1 can be used. The radiation source of the laser array 140 of 110 is emitted. The plurality of multi-cavity lasers 110 are arranged in the same direction as the arrangement direction of the 110a of each wafer, and the multiplexed laser light source shown in Fig. 23 is fixed. The system is provided with: a plurality of lens arrays 1 1 4 arranged in a laser array corresponding to each multi-cavity laser 110; a rod 1 13 between the laser array 140 and the plurality of lens arrays 1 14 ; a mode fiber 130; and a collecting lens 120. The lens array is provided with a plurality of microlenses corresponding to the light-emitting points of the multi-cavity laser 110. The source system is provided with: a laser array 1 40; a plurality of lens arrays 1 1 4 corresponding to each of the 1 1 0 shots; and a rod lens 1 disposed between the laser array and the plurality of lens arrays 1 1 4 1 3 ; 1 fiber 1 3 0 ; and collecting lens 1 20. Lens array 1 1 4 is a plurality of microlenses having a light-emitting point of multi-cavity laser 110. In the above configuration, a plurality of multi-cavity lasers 110 The laser beams B emitted from the respective illuminating points are respectively designated by the rod lens 1 1 3, and then the laser beams L which are parallelized and actinically paralleled by the respective microlenses of the lens array 1 14 are collected. The light lens 120 collects light into the -3 3 - multi-cavity mine system using a plurality of rod-type (rates) hair-distributing composite wave-ray light-emitting points 140; and is arranged in the lens array 1 1 4 〇 multi-chamber lightning column 1 4 0 multimodes have a corresponding set of 10a in the actinic light. Shoot at most 1263798 mode fiber 1 3 0 core 1 3 0 a. The laser light incident on the core Π 0 a is transmitted in the fiber, and the combined wave becomes one The following is an example of other multiplexed laser sources, as shown in Figures 24 (A) and 24 (B). A heat block 182 having an L-shaped cross section in the optical axis direction is mounted on the heat block 180 having a substantially rectangular shape, and a storage space is formed between the two heat blocks. The upper surface of the L-shaped heat block 182 is The plurality of (for example, two) multi-cavity lasers 110 arranged in a plurality of arrays of light-emitting points (for example, five) are arranged at equal intervals in the same direction as the arrangement direction of the light-emitting points 11a of the respective wafers. The slightly rectangular heat block 180 is formed with a concave portion, and a plurality of light-emitting points (for example, five) of a plurality of light-emitting points (for example, two) are arranged in an array on the space side of the heat block 180. The radiation 110 is arranged such that its light-emitting point is positioned on the same vertical plane as the light-emitting point of the laser chip disposed above the thermal block 128. The multi-chamber laser 110 light exiting side is provided with a collimating lens array 184 in which a collimating lens is arranged in response to the light emitting point 110a of each wafer. The collimating lens array 1 84 has the length direction of each collimating lens and the direction in which the viewing angle of the laser beam is large (the direction of the speed axis), and the width direction and the viewing angle of each collimating lens are small (latent axis) The direction is consistently configured. By integrating the collimating lenses into an array, the space utilization efficiency of the laser light is improved, and the output of the multiplexed laser light source can be increased, and the number of parts can be reduced and the cost can be reduced. Further, the laser light exiting side of the collimator lens array 184 is provided with one multimode fiber 130, and a collecting lens that combines the laser beam to the incident end of the multimode fiber 130. 2 0. In the above configuration, the laser beams B respectively emitted by the plurality of light-emitting points i 〇 a of the plurality of multi-cavity lasers disposed on the laser blocks 18 〇 182 are respectively collimated lens array 1 8 4 parallelized photons are collected by the collecting lens 120 to be incident on the core 1 3 0 a of the multimode fiber 130. The laser light incident on the core 130 h is transmitted in the optical fiber and is combined into one to be emitted. The multiplexed laser light source is as described above, and is multi-chambered in a multi-segment laser array and an array of collimating lenses, and is particularly capable of high output. By using this combined laser light source, it is particularly suitable as a fiber source for a laser light source constituting the exposure apparatus of the present invention because it can constitute a high-intensity fiber array light source or a bundle fiber light source. Further, by accommodating the above-described respective combined laser light sources in the cover, a laser module for guiding the exit end of the multimode optical fiber 130 from its cover can be constructed. Further, in the above embodiment, it has been explained that the exit end of the multimode optical fiber of the multiplexed laser light source is combined with another optical fiber having a core diameter which is the same as that of the multimode optical fiber and whose cladding diameter is smaller than that of the larger mode fiber. For example, in order to increase the brightness of the fiber array light source, for example, the multimode fiber 30 having a cladding diameter of 1 2 5 /zm, 80 //m, 60 //m, etc. is not combined with other fibers at the exit end. It can also be used. [Light quantity distribution correction optical system] In the above embodiment, the light amount distribution correction optical system composed of a pair of combined lenses is used in the exposure head. The light quantity distribution correction optical system changes the beam width at each of the exit positions so that the ratio of the peripheral portion to the beam width near the central portion of the optical axis is smaller than the incident side, and the outgoing side becomes smaller when When the parallel light beam of the light source is irradiated to the DMD, the light quantity distribution on the illuminated surface is slightly uniform and generally corrected. Hereinafter, the action of the light amount distribution correction optical system will be described. First, as shown in Fig. 25(A), the case where the incident beam and the outgoing beam have the same beam width (full beam width) HO and H1 are the same. Further, in the 25th (5th) diagram, the portions indicated by the symbols 5 1 and 5 2 are assumed to be the incident surface and the outgoing surface in the light quantity distribution correction optical system. In the light quantity distribution correction optical system, the beam width hO, hi of the light beam incident on the center portion close to the optical axis Z 1 and the light beam incident on the peripheral portion is set to be the same (hO 2 h 1 ). The light quantity distribution correction optical system amplifies the incident beam of the central portion with respect to the incident beam on the incident side with the same beam width hO, h 1 , and vice versa, and applies the beam width to the incident beam of the peripheral portion. The role of shrinking. That is, the width h 1 0 of the outgoing beam of the central portion and the width hll of the outgoing beam of the peripheral portion become hll <hlO. When expressed by the ratio of the beam width, the ratio of the beam width ratio [h 1 1 / h 1 0 ] of the peripheral portion to the incident side (h 1 / hO = 1 ) is lower than the ratio of the beam width at the center of the exit side. Become smaller (hi 1/hlO) < 1) ° By changing the beam width, the light beam at the center portion where the normal light amount distribution is increased can be generated in the peripheral portion where the amount of light is insufficient, and the entire surface is irradiated without reducing the light use efficiency. The light quantity distribution is slightly uniformized. The degree of homogenization is, for example, that the bright spot in the effective area is within 30%, preferably within 20%. The function and effect of the optical system for correcting the optical quantity distribution are also the same as when the entire beam width is changed on the incident side and the outgoing side (25th (B), 2 5 (C)). -36- 1263798 2 2 · < B shows a case where the total beam width HO on the incident side is reduced to a width H2 and emitted (HO > H2 ). In this case, the light quantity distribution correction optical system has light beams of the same beam width h0 and h1 on the incident side, and the beam width h 1 0 at the center side is larger than the peripheral portion on the emission side, and vice versa. The beam width h 1 1 of the portion becomes smaller than the center portion. When the reduction ratio of the light beam is taken into consideration, the reduction ratio of the incident light beam to the center portion is set to be smaller than that of the peripheral portion, and the reduction ratio of the incident light beam to the peripheral portion is set to be larger than the center portion. In this case, the ratio of the beam width of the peripheral portion to the beam width at the center portion "Η 1 1 / Η 1 0" is smaller than that at the incident side (h 1 / hO 2) ((h 1 1 / h 1 0 ) < 1). The 25th (C) diagram shows a case where the beam width HO of the entire incident side is enlarged to a width H3 and is emitted (HO) < H3). In this case, the light amount distribution correction optical system is set such that the light beam width h 1 0 at the center side and the light beam width h 1 0 at the center side are lower than those in the peripheral portion on the emission side. Large, on the other hand, the beam width hll of the peripheral portion becomes smaller than that at the center portion. Considering the magnification of the light beam, the amplification factor of the incident light beam to the center portion is set larger than that of the peripheral portion, and the magnification of the incident light beam to the peripheral portion is set to be smaller than that at the center portion. effect. In this case, the beam width ratio "hll/hlO" at the peripheral portion of the beam width at the center portion becomes smaller than that at the incident side (h 1 / hO = 1 ) ((h 1 1 / h) 1 0 ) < 1). In this manner, the light quantity distribution correction optical system changes the beam width at each of the emission positions because the ratio of the beam width of the peripheral portion to the beam width of the central portion close to the optical axis Z1 is set to be lower than that of the incident side. Since the emission side is small, the light having the same beam width on the incident side is larger on the emission side than the peripheral portion, and the beam width at the peripheral portion becomes larger than the center. The ministry is still small. Thereby, the light beam at the center portion can be generated in the peripheral portion, and the beam profile in which the light amount distribution is slightly uniform can be formed without reducing the light use efficiency of the entire optical system. Hereinafter, an example of specific lens data of a pair of combined lenses used as a light amount distribution correction optical system will be described. In this case, as in the case where the light source is a laser array light source, the lens data is shown when the light quantity distribution of the cross section of the outgoing light beam is Gaussian. Further, when one semiconductor laser is connected to the incident end of the single mode fiber, the light quantity distribution of the outgoing light beam from the optical fiber becomes a Gaussian distribution. This embodiment can also be applied to such a case. Further, by setting the core diameter of the multimode fiber to be close to the configuration of the single mode fiber or the like, the amount of light close to the central portion of the optical axis can be applied to a case where the amount of light is larger than that of the peripheral portion. Table 1 below shows the basic lens data. [Table 1] Basic lens data Si ri di Νι (face number) (radius of curvature) (area spacing) (refractive index) 01 Aspherical surface 5.000 1.52811 02 〇〇50.000 03 〇〇7.000 1.52811 04 Aspheric surface is known from Table 1, The pair of combined lenses consists of two aspherical lenses that are rotationally symmetric. The surface on the light incident side of the first lens disposed on the light incident side is referred to as a first surface, and the surface on the light exit side is referred to as a second surface, and the first surface has an aspherical shape of -38 to 1263798. In addition, the surface on the light incident side of the second lens on the light exit side is the third surface, and the light exit side is the fourth surface, and the fourth surface is aspherical. In Table 1, the surface number Si indicates the number of the i-th (i=l~4) plane, the curvature radius ri indicates the radius of curvature of the i-th surface, and the surface spacing di indicates the light of the i-th surface and the first-th surface. The area spacing on the shaft. The unit of the surface spacing d i値 is mm (1 mm). The refractive index Ni represents 値 with respect to the refractive index of the wavelength of 40 5 nm of the optical element having the second surface. The following Table 2 shows the aspherical data of the first surface and the fourth surface. [Table 2] Aspherical data, first surface, fourth surface, C-1, 4098E- 02, 9. 8 5 06Ε— 03 K, 4 · 2192E, 10, 00, 3, 6 2, 5, 3, +1, 3, 1, 0, 0, 0 — 04 — 8 · 9980Ε- 05 a 4 3.0591E — 05 2 · 3060Ε— 05 a 5 —4.5115E— 07 A 2·2860Ε— 06 a 6 -8 . 2819E- 09 S . 766 1 Ε- 08 a7 4 . 1 020E - 12 4 · 4028Ε- 10 a8 1.223 1 - 1 3 1 · 3624Ε- 12 a9 5·3753E- 16 3 . 3 9 6 5 Ε - 1 5 a 1 0 1 · 6315Ε— 18 7 . 4823Ε- 18 The aspherical data is represented by a coefficient in the formula (A) representing the aspherical shape. -39- 1263798 [Expression 1]

C u small -k(c .Py- 10 :+Σα/·

The coefficients in the above formula (A) are defined as follows. Z: the length (mm) of the perpendicular line from the point on the aspheric surface located at a position from the height P of the optical axis to the plane of the aspherical surface (the plane perpendicular to the optical axis) P: the distance from the optical axis ( Mm) K: conic coefficient C: paraxial curvature (1/r, r: paraxial radius of curvature) ai : the aspheric coefficient of the i-th (i = 3 to 1 0) is in the number shown in Table 2, The symbol "E" indicates that the number following it is an index which should be based on 10, and the number represented by the exponential function of 10 is the number 値 before the "E". For example, taking "1.〇E-02" as an example, it means "1.OxlO·2". Fig. 27 is a view showing the light amount distribution of the illumination light which can be obtained by the paired combined lenses shown in Tables 1 and 2 above. The horizontal axis represents the coordinate from the optical axis, and the axis represents the light amount ratio (%). Further, for comparison, the light amount distribution (Gaussian distribution) of the illumination light when the correction is not performed is shown in Fig. 26. As can be seen from Fig. 26 and Fig. 27, the correction is performed by the light quantity distribution correction optical system, and the slightly uniformized scene distribution can be obtained as compared with the case where the correction is not performed. Thereby, the spot-free exposure can be performed with uniform laser light without lowering the light utilization efficiency in the exposure head. In addition, a commonly used rod integrator or fly-eye lens can also be used. [Other imaging optical system] -40 - 1263798 In the above embodiment, although two sets of lenses as the imaging optical system are provided on the light reflection side of the DMD used for the exposure head, the laser light may be enlarged and imaged. Imaging optical system. The area of the exposed area (the image area) in the exposed surface can be enlarged to a desired size by enlarging the sectional area of the beam line reflected by the DMD. For example, the exposure head can be constructed as shown in Fig. 31(A), illuminating device 144 for irradiating laser light to DMD50, DMD50, and lens system 454, 458 for magnifying laser light reflected by DMD50; a microlens array 472 having a plurality of microlenses 474 disposed corresponding to respective pixels of the DMD 50; a pupil array 476 having a plurality of apertures 478 disposed corresponding to the respective microlenses of the microlens array 472; and imaging laser light passing through the pupil The lens of the exposed surface 56 is 480, 482. With this exposure head, when the laser beam is irradiated by the illumination device 144, the area of the beam line reflected by the DMD 50 in the opening direction is amplified several times (for example, twice) via the lens systems 454 and 458. The amplified laser light is collected by the respective microlenses of the microlens array 472 corresponding to the respective pixels of the DMD 50, and passes through the corresponding apertures of the aperture array 476. The laser light passing through the aperture is imaged on the exposed surface 56 via the lens systems 480, 482. In this imaging optical system, the laser light reflected by the DMD 50 is magnified several times by the magnification lenses 454 and 458 and projected onto the exposure surface 56, so that the entire image area is widened. At this time, if the microlens array 472 and the aperture array 476 are not disposed, as shown in the third figure (1), the pixel size of each of the beam spots BS projected onto the exposed surface 56 is light. The dot size is larger depending on the size of the exposed region 468, and the MTF (optical transfer function) characteristic indicating the sharpness of the exposed region 468 is lowered. -41- 1263798 On the one hand, in the case where the microlens array 47 2 and the pupil array 476 are disposed, the laser light reflected by the DMD 50 is based on each microlens of the microlens array 472, corresponding to each of the DMDs 50 It is collected by light. Thereby, as shown in Fig. 31(C), even when the exposure area is enlarged, the spot size of each beam spot BS can be reduced to a desired size (for example, 1 〇V m X 1 〇V m ), which prevents the degradation of the MTF characteristics to perform high-definition exposure. Further, the exposure region 468 is inclined so that the DMD 50 is obliquely arranged in order to prevent a gap between the pixels. Further, even if the beam of the aberration of the microlens is wide, the beam can be shaped by the aperture so that the size of the spot on the exposed surface 56 becomes a certain size, and at the same time, by passing it corresponding to each pixel. Aperture prevents crosstalk between adjacent pixels. Further, by using the high-intensity light source similar to that of the above-described embodiment in the illumination device 144, since the beam angle of each microlens incident on the microlens array 472 by the lens 458 becomes small, the adjacent pixel beam can be prevented. Part of the incident. That is, a high extinction ratio can be achieved. [Effects of the Invention] The optical molding apparatus of the present invention can obtain an effect of being able to perform high-speed molding. Further, in the case where a high-intensity light source is used for the light source, an effect of performing high-precision molding can be obtained. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a perspective view showing the appearance of a light molding apparatus according to a first embodiment. Fig. 2 is a perspective view showing the structure of a scanner of the optical molding apparatus of the first embodiment. -42- 1263798 The third (A) diagram shows a plan view of the exposed area formed on the liquid surface, and the third (B) diagram shows the arrangement of the exposure areas of the respective exposure heads. Fig. 4 is a perspective view showing a schematic configuration of an exposure head of the optical molding apparatus according to the first embodiment. Figure 5 (A) is a cross-sectional view in the sub-scanning direction of the optical axis of the exposure head shown in Figure 4, and Figure 5 (B) shows the side view shown in Figure 5 (A) . Fig. 6 is a partially enlarged view showing the configuration of a digital micromirror device (DMD). Figures 7(A) and 7(B) are diagrams for explaining the operation of the DMD. The 8th (A) and 8(B) diagrams show the arrangement of the exposure beam and the comparison of the scan lines when the DMD is not tilted and when it is tilted. The 8th (B) diagram shows the configuration and scanning of the DMD exposure beam. Plan of the line. The 9th (A) diagram shows a perspective view of the configuration of the fiber array light source, the 9th (B) diagram is a partial enlarged view of the 9th (A) diagram, and the 9th (C) and 9th (D) diagrams are shown in the A plan view of the arrangement of the light-emitting points in the exit portion. Fig. 10 is a view showing the configuration of a multimode optical fiber. Fig. 1 is a plan view showing the configuration of a multiplexed laser light source. Fig. 12 is a plan view showing the configuration of the laser module. Fig. 13 is a side view showing the configuration of the laser module shown in Fig. 2. Fig. 14 is a partial side view showing the configuration of the laser module shown in Fig. 12. The first and fifth aspects (5) and (5) show a cross-sectional view of the optical axis of the focal depth in the conventional exposure apparatus and the optical axis of the focal length in the optical molding apparatus according to the first embodiment. - 4 3 - 1263798 The first 16 (A) and 16 (B) diagrams show an example of the use area of D M D . Fig. 17(A) is a side view showing a region where the DMD is used, and the 17th (7) diagram is a cross-sectional view in the sub-scanning direction along the optical axis of the 1st (7th) diagram. Fig. 18 is a plan view showing an exposure mode in which the liquid level of the photocurable resin is fully exposed by one scan of the scanner. The 19th (9) and 19(B) drawings are plan views for explaining an exposure mode in which the liquid level of the photocurable resin is fully exposed by a plurality of scans of the scanner. Figure 20 is a perspective view showing the configuration of a laser array. The 2 1 (A) diagram shows a perspective view of the configuration of the multi-cavity laser, and the 2 1 (B) diagram is a multi-chamber laser array in which the multi-cavity lasers shown in the 2 1 (A) diagram are arrayed. An oblique view of the array. Fig. 22 is a plan view showing another configuration of the combined laser light source. Figure 23 is a plan view showing another configuration of the combined laser light source. Fig. 24(A) is a plan view showing another configuration of the multiplexed laser light source, and Fig. 24B is a sectional view taken along the optical axis of Fig. 24(A). The 25th (A), (B), and (C) diagrams are explanatory diagrams of the correction of the optical quantity distribution correction optical system. Fig. 26 is a graph showing the light amount distribution when the light source is Gaussian and the light amount distribution is not corrected. Fig. 27 is a graph showing the distribution of the amount of light corrected by the light quantity distribution correction optical system. Fig. 28 is a perspective view showing the configuration of a conventional layer forming apparatus for a laser scanning method. Fig. 29 is a perspective view showing a configuration of a conventional movable mirror type laminated molding apparatus -44-1263798. Fig. 30(A) is a plan view showing an example of an exposure pattern in an exposure region, and Fig. 30(B) is a perspective view showing a state in which a pixel of a first group in the 30th (A) is exposed, The 3 0 (C) diagram is a perspective view showing a state in which the pixels of the second group of the 3 0 (A) map are exposed. The 3rd (A) diagram shows a cross-sectional view of the optical axis along the configuration of other different exposure heads that are combined with the optical system, and the 30th (B) diagram shows the projection when the microlens array or the like is not used. A plan view of the light image to the exposed surface. The 30th (C) diagram shows a plan view of a light image projected onto the surface to be exposed when a microlens array or the like is used. [Main component symbol description] 10 · · · •• Thermal block 1 1 ～17 · • • Collimating lens 20 · · · •• Collecting lens 30 · · · • Multimode fiber 50 · · · •• Digital micro Mirror device (DMD) 53 · —— •• Exposure beam 54 , 58 , •• Lens system 5 6 · · · • • Scanning surface (exposure surface) 64 · · · •• Laser module 66 · · · • • Fiber array light source 68 – • • • Laser exit section 73 · · · • • Combination lens 150 ·· · _ • Photosensitive material - 45- 1263798 152 · ·· • •• Stage 156· · • · Set up the station 158. . Guide 162 ·.. * • Scanner 166· ·. • ••Exposure head 168· ·. > · Exposure area 170· · _ > · • Exposure area

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