1258032 15382twf.doc/r 九、發明說明： 【發明所屬之技術領域】 j發明是有關於一種顯示器，且特別是有關於—種應 用捲▼承載封裝結構（Tape Carrier Package，TCP)或是敕 性電路板上有晶片之封裝結構（Qlip on FPC，COF )之荔g 示器。 續 【先前技術】1258032 15382twf.doc/r IX. Description of the invention: [Technical field to which the invention pertains] The invention relates to a display, and in particular to an application volume (Tape Carrier Package, TCP) or 敕There is a chip package structure (Qlip on FPC, COF) on the board. Continued [Prior Art]
^隨著視訊技術的飛躍發展，各式各樣的顯示器亦隨之 發展出來。-般而言’顯示器中具有用以顯示資訊的顯示 ，板（disPlaypanel) ’而顯示面板係由電路板所控制’，^ 藉由電路板上的晶片運算並提供數位訊號，以控制顯示 板上各晝素單元之顯示效果並進而產生晝面。然而，電路 板與顯示面板1 封储構觸者電性連接。 捲帶承載賴結構(tape eaffief paekage，Tep) 性電路板上有“（ehipiFPC，⑽)職結構是=With the rapid development of video technology, a variety of displays have also developed. Generally speaking, the display has a display for displaying information, and the display panel is controlled by the circuit board. ^ The chip is calculated by the chip on the circuit board and provides a digital signal to control the display panel. The display effect of each element unit and the resulting surface. However, the circuit board is electrically connected to the display panel 1 reservoir. The tape eafief paekage (Tep) circuit board has "(ehipiFPC, (10)) job structure =
計用來將半導體晶片封糾小尺寸單元的最佳化封包。= ，技，被廣泛使用在縣液晶顯示面板之驅動集成晶片。 (iquid crystal display driving integrated chip, LDI) 〇 圖=_為，技射—種·捲帶承載封裝結構 之頒不裔的上視不忍圖。請參照圖i，顯示器⑽包括一 ?==少:電路板120以及至少-捲帶承載封 t ’ /、中’轉板12G配置在顯示面板u〇的側 ，，且捲V承載封裝結構m酉己置在顯示面板110與電路 板120之間，並使得兩者電性連接。 1258032 15382twf.doc/r 圖2所緣示為圖1中沿A-Λ’剖面線之捲帶承載封裝結 構之剖面示意圖，請共同參照圖1與圖2，捲帶承載封裝 結構130包括一基板132、複數引腳134以及一晶片136。 基板132具有一開口 132a。而引腳134位於基板132上之 開口 132a的周圍，且每一引腳134具有一内引腳134a以 及一外引腳134b。透過異方性導電膠（anisotropic conductive film，ACF) 140，可使得部分的外引腳134b與An optimized package for encapsulating a semiconductor wafer to a small size unit. = , technology, is widely used in the county LCD panel to drive integrated wafers. (iquid crystal display driving integrated chip, LDI) 〇 Figure = _, the technical shooting - species / tape bearing package structure of the aristocratic upper view can not bear. Referring to FIG. 1 , the display (10) includes a “== less: the circuit board 120 and at least the tape carrier seal t′ /, the middle turn plate 12G is disposed on the side of the display panel u〇, and the roll V bears the package structure m The 酉 is placed between the display panel 110 and the circuit board 120, and the two are electrically connected. 1258032 15382twf.doc/r FIG. 2 is a cross-sectional view of the tape bearing package structure along the line A-Λ' in FIG. 1 . Referring to FIG. 1 and FIG. 2 together, the tape carrier structure 130 includes a substrate. 132, a plurality of pins 134 and a wafer 136. The substrate 132 has an opening 132a. The pin 134 is located around the opening 132a of the substrate 132, and each of the pins 134 has an inner pin 134a and an outer pin 134b. Through the anisotropic conductive film (ACF) 140, part of the outer lead 134b can be
顯示面板110電性連接，而另一部份之外引腳134b與電路 板U0電性連接。晶片m位於基板132之開口 132a處， 且晶片136具有複數接點136a，其與内引腳134a電性連 接:另外，-密封材料15G包覆捲帶封裝結構130中 的晶片13 6。 .牡貝干J用捲贡承載封裝結構130進行顯干而 板110與電路板W之封裝時 ^不面 良率的影響。 ❿要考慮顺物對於封裝 圖3所繞示為圖1中沿bThe display panel 110 is electrically connected, and the other portion of the lead 134b is electrically connected to the circuit board U0. The wafer m is located at the opening 132a of the substrate 132, and the wafer 136 has a plurality of contacts 136a electrically connected to the inner leads 134a: in addition, the sealing material 15G covers the wafers 136 in the tape package structure 130. The mussel dry J is used to carry out the drying of the package structure 130 and the package of the board 110 and the board W is not affected by the yield. ❿Immediate consideration for the package for the package Figure 3 is shown in Figure 1 along the b
構、部分_硫以及部分電㈣狀鱗承载封敦結 參照圖3，習知的捲帶承載剖面侧視示意圖。請 膠14〇 ’而與顯示面板u。以d13°藉由異方性導電 而，由於通常顯示面板110合^路板120電性連接。然 且在進行封裝結構與顯示面〗=有—倒角區域112，而 差的考量下，一般都會將異方性之接合時可能有些微偏 之内側處移動來貼覆，以使、謂14()往顯示面板110 區域112。 、 導電膠140能避開倒角 1258032 15382twf.doc/r 但是，也正因為這樣，而造成了在顯示面板 方性導電膠M0之接合區域附近會出現了—較大 異 因此異物160即容祕藏於此㈣之巾，進而二 、=m與顯示面板11G之間產生了異常 短ς (Short line)或斷路（〇penline)。 f生短路 【發明内容】 有鑑於此，本發明的目的就是在提供一種顯 ， 防止異物累積在顯示面板與封震結構之間的區域，二二 顯示器之製作良率與使用壽命。 明的再—目的是提供—種捲帶式封裝結構，可防 :封结構之間的區域，有利於顯示 板以種顯示器’其包括-顯示面板、-電路 側邊。而=1構。·電路板配置在顯示面板的- tfr凸物，其中，基板具有—開σ，且基板配置在領 板:間。複™^ 苴 且母—引腳具有一内引腳以及一外引腳， 與電路板i性=與?示面板電性連接’另一部份外引腳 處，且接點盘m曰曰片具有複數接點，晶片配置於開口 晶片二==電性連接。凸物配置於基板上且位在 例如實施顺狀顯示8，上述之凸物 1258032 15382twf.doc/r 依照本發明的較佳實施例所 例如是複數塊狀物。 ^丁^ 依照本發明的較佳實施例所述之顯示器 與基板為一體成型之結構。 ^ 依照本發明的較佳實施例所述之顯示器 之材質例如是非導電性材質。 ^ 依照本發明的較佳實施例所述之顯示器， 之材質例如是有機高分子。 "" 依照本發明的較佳實施例所述之… 二例如更包括—㈣材料，包覆住捲帶二 的晶片。 上述之凸物 上述之凸物 上述之凸物 上述之凸物 ’上述之顯示 载封裝結構中 本發明再提出一種顯示器，其包括 上有晶片之封裝結構⑽二口 =之：及—凸物。其中，軟性電路板配置在顯示 而晶片配置 凸物配置於 上述之凸物 上述之凸物 上述之凸物 絕緣心：’ ίί:電路板具有複數絕緣層以及配置在 ，層之間的一導電層。晶片具有複數接點 ^人性電路板上，且接點與導電層電性連接 人性電路板上且位在絕緣層與晶片之間。 依照本發明的較佳實施例所述之顯示器 例如是一條狀物。 ”…口口 依知、本發明的較佳實施例所述之顯哭 例如是複數塊狀物。 依照本發明的較佳實施例所述之顯示器 1258032 15382twf.doc/r 示器，上述之凸物 與軟性電路板的絕緣層為一體成型之結構 依照本發明的較佳實施例所述之領 之材質例如是非導電性材質。 ，' 之材爾之㈣，上述之凸物 ::(T-— —凸物。基板且有^ 板、—晶片、複數引腳以及 • 署二 有，口。晶片具有複數接畔，此曰b 籲 置於基板之開π處。複數引1占此日曰片配 包括一内引腳以及—外引胳基板上’且每一引腳 物設置於晶片一側的基二p :内引腳與接點電性連接。凸 依照本發明的較佳實施例所述 例如是一條狀物。 頌不的，上述之凸物 依照本發明的較佳實施例所述 例如是複數塊狀物。 4不时’上述之凸物 依照本發明的較佳實施例所 口口 _ 與基板為一體成型之結構。 頌不為，上述之凸物 依照本發明的較佳實施例所 π 、、 之材質例如是非導電性材質。 ”、、、不為，上述之凸物 依照本發明的較佳實施一 之材質例如是有機高分子。斤、之頌不裔，上述之凸物 哭依照本發明的較佳實施例所述之顯示哭-口口，例如更包括一密封材料， 、、/、叩上述之顯示 中的該晶片。 /、，匕復住該捲帶承載封裝結構 1258032 】53 82twf.d〇c/r 凡你本^具有凸物之捲帶式封裝結構或是且有 干哭路板上有晶片之封裝結構，當應用於各種顯 2 ’具有可防止異物進人面板與封I结構之間 之；產如此一來，將可防止封裝結構與顯示面板 ^產生異巾的電性短路觸路，並可提升麻器製作之 良率，與延長顯示器的使用壽命。 為讓本發明之上述和其他目的、魏和伽能更明顯 ，下文特舉較佳實施例，並配合所關^，細說 明如下。 【實施方式】 _第一 f施你f 、一®^4!會福本發明之—較佳實施例巾—麵示器的上 視不意圖。請參照圖4 ’顯示器200包括顯示面板21〇、電 路板22G以及捲帶承載封裝結構230。其中，顯示面板21〇 具有-顯示區域212與—非顯示區域214。賴示區域犯 中具有複數條掃猫線212a與複數條資料線職，掃瞒線 21=與資料線212b劃分出複數晝素單元⑽。倘若此顯 =〇。200為液晶顯示益（iiquid 此phy，)，則 母一晝素單tl 212c中，例如包括一薄膜電晶體（未繪示）、 ^晶層（未緣示）以及一彩色濾'光片（未繪示）。藉由掃 目田線212a與貧料線212b所傳遞之電位訊號，可讓晝素單 元212c產生顯不之效果。而非顯示區域2丨4上則具有一些 周邊線路，可用以與捲帶承載封裝結構23〇連接。— 請繼續參照圖4,電路板22〇配置在顯示面板21〇的— 1258032 15382twf.doc/r 側邊，且捲帶承載封褒結構23〇配置在顯示面板2ι〇 之^，帶承_結構23G使得顯示面板 210 14 %路板220之間相互連接。 圖5續示為圖4中沿^，剖 構之剖面示意圖，嗜夂『囬c W丨秋町衣、、口 括—基板232、複數5 ’ f帶承載封裝結構別包 对，加：晶片236以及一凸物238。 L ^板^有―開口加，且基板232配置在顯示 面板210與電路板22〇 _ 且你J丁 配置於基板议i，_二^4所示。而複數引腳234 -⑽川古一〜 於開σ 232a的周圍，且每 立m丨有一内引腳234a以及一外引腳234b，豆中， 刀的外引腳234b藉由異方性導帝. ’: 電性連接，而另一部^二^务240與顯不面板训 240盥帝路柘：>川千，刀卜引腳210亦藉由異方性導電膠 4路板220電性連接，如圖4所示。 請繼續參照圖5，曰H Me « ^ u 日日片236具有複數接點236a，而晶 片236配置於開口 232a處， 性連接。在本發明之一點加與内引腳23乜電 勺舜片战册7 貝轭例中，更包括一密封材料250 包覆住捲料轉23 斯+ 250 界水氣、異物或氧氣侵襲Ί的曰曰片236 ’用以防止外 之接點236a。以下以及與内引腳加接觸 加以詳細綱。 圖4闕5巾所描述之凸物238 圖6所繪示為圖4中VL n n 構、部分顯示面板以及科電之捲帶承載封裝結 7所緣示為圖4中之其中—J面侧視示意圖。圖 示意圖。請共構之局部背面 值侍，主思的疋，凸物238 1258032 15382twf.doc/r 配置於基板232上且位在晶片236與顯示面板210之間， 其可防止異物260進入顯示面板21〇與捲帶式封裝結構 230之間的區域，因此具備凸物238之封裝結構，將可減 少異物260所引起之元件異常的短路或斷路等現象。在一 車乂仏貝施例中，凸物238例如是一條狀物。且凸物238之 材質例如是非導電性材質或是有機高分子。Structure, Partial Sulfur, and Partial Electric (Quad) Scales Carrying Seals Referring to Figure 3, a schematic view of a conventional tape bearing profile is shown. Please glue 14〇 ' with the display panel u. The display panel 110 is electrically connected by the anisotropic conduction at d13°. However, in the encapsulation structure and the display surface, there is a chamfered area 112, and under the consideration of the difference, the inside of the anisotropy may be slightly moved to the inside of the micro-bias to be attached, so that 14 () to the display panel 110 area 112. The conductive adhesive 140 can avoid the chamfering 1258032 15382twf.doc/r However, because of this, it will appear near the joint area of the display panel square conductive adhesive M0 - a large difference, so the foreign matter 160 is the secret The towel (4) is hidden in this (4), and further, an abnormal line or a line is formed between the display panel 11G and the display panel 11G. In view of the above, it is an object of the present invention to provide a display that prevents the accumulation of foreign matter between the display panel and the sealed structure, and the production yield and service life of the two-second display. The re-purpose is to provide a tape-and-reel package structure that prevents: the area between the sealing structures, which facilitates the display panel to include a display panel, which includes a display panel and a circuit side. And = 1 structure. The circuit board is disposed on the -tfr projection of the display panel, wherein the substrate has an -open σ and the substrate is disposed between the collars: The TM^ 苴 and the mother-pin have an inner pin and an outer pin, and the board is electrically connected to the display panel, and the other part is externally connected, and the contact pad is 曰曰The sheet has a plurality of contacts, and the wafer is disposed on the open wafer 2 == electrical connection. The projections are disposed on the substrate and are positioned, for example, in a sequential display 8, and the above-described projections 1258032 15382 twf.doc/r are, for example, a plurality of blocks in accordance with a preferred embodiment of the present invention. The display and the substrate according to the preferred embodiment of the present invention are integrally formed. The material of the display according to the preferred embodiment of the present invention is, for example, a non-conductive material. The display according to the preferred embodiment of the present invention is made of, for example, an organic polymer. "" In accordance with a preferred embodiment of the present invention, the second, for example, further comprises - (iv) material covering the wafer of the tape web 2. The above-mentioned protrusions, the above-mentioned protrusions, the above-mentioned protrusions, the above-mentioned protrusions, and the above-mentioned display package structure. The present invention further provides a display comprising a package structure (10) on which a wafer is mounted. Wherein, the flexible circuit board is disposed on the display and the wafer arrangement protrusion is disposed on the protrusions and the protrusions and the convex insulation core: ' ίί: the circuit board has a plurality of insulating layers and a conductive layer disposed between the layers . The wafer has a plurality of contacts on the human circuit board, and the contacts are electrically connected to the conductive layer on the human circuit board and between the insulating layer and the wafer. The display in accordance with a preferred embodiment of the present invention is, for example, a strip. The mouth is known to be a plurality of blocks, as described in the preferred embodiment of the present invention. The display 1258032 15382 twf.doc/r according to the preferred embodiment of the present invention, the above-mentioned convex The structure of the material and the insulating layer of the flexible circuit board is integrally formed. The material according to the preferred embodiment of the present invention is, for example, a non-conductive material. , 'The material of the material (4), the above-mentioned protrusion:: (T- —Protruding. The substrate has a board, a wafer, a plurality of pins, and a port. The chip has a plurality of ports, and the 曰b is placed at the opening π of the substrate. The chip is provided with an inner lead and an outer lead substrate and each of the pins is disposed on one side of the wafer. The inner pin is electrically connected to the contact. The bump is in accordance with a preferred embodiment of the present invention. Said, for example, a strip. The above-mentioned projections are, for example, a plurality of blocks in accordance with a preferred embodiment of the invention. 4 From time to time, the above-mentioned projections are in accordance with a preferred embodiment of the present invention. Mouth _ is a structure that is integrally formed with the substrate. According to a preferred embodiment of the present invention, the material of π, is, for example, a non-conductive material. ",, or not, the material of the above-mentioned protrusion according to a preferred embodiment of the present invention is, for example, an organic polymer.颂 颂 , , , , , , , , 依照 依照 依照 依照 依照 依照 依照 依照 依照 依照 依照 依照 依照 依照 依照 依照 依照 依照 依照 依照 依照 依照 依照 依照 依照 依照 依照 依照 依照 依照 依照 依照 依照 依照 依照 依照 依照 依照 依照 依照Rewinding the tape bearing package structure 1258032] 53 82twf.d〇c/r Where you have a tape-and-reel package with a protrusion or a package structure with a wafer on a dry cheat board, when applied to various The display 2' has the function of preventing the foreign matter from entering between the panel and the sealing structure; the production is such that the electrical short circuit of the package structure and the display panel can be prevented from being generated, and the good manufacturing of the device can be improved. The rate and the extended life of the display. In order to make the above and other objects, the Wei and the gamma energy of the present invention more obvious, the following preferred embodiments are described below, and the following is described in detail. [Embodiment] _ One f, you f, one ®^4! The preferred embodiment is a top view of the facet. Referring to Figure 4, the display 200 includes a display panel 21A, a circuit board 22G, and a tape carrier package structure 230. The display panel 21 has a display. The area 212 and the non-display area 214. The display area has a plurality of sweeping cat lines 212a and a plurality of data lines, and the broom line 21= and the data line 212b divide the plurality of element units (10). 200 is a liquid crystal display (iiquid phy,), and the parental monolithic single t1 212c includes, for example, a thin film transistor (not shown), a crystal layer (not shown), and a color filter 'light sheet. (not shown) By the potential signal transmitted by the sweeping line 212a and the lean line 212b, the halogen element 212c can be rendered ineffective. The non-display area 2丨4 has some peripheral lines that can be used to connect to the tape carrier package structure 23〇. — With continued reference to FIG. 4, the circuit board 22〇 is disposed on the side of the display panel 21〇—1258032 15382twf.doc/r, and the tape bearing carrying structure 23〇 is disposed on the display panel 2〇, the bearing structure 23G causes the display panel 210 14% of the road boards 220 to be connected to each other. FIG. 5 is a cross-sectional view of the cross-section of FIG. 4, which is a cross-sectional view of the structure of the structure, and the engraving of the 丨 回 回 回 回 回 回 回 、 、 、 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 , , , 236 and a protrusion 238. The L ^ board has an "opening", and the substrate 232 is disposed on the display panel 210 and the circuit board 22 〇 _ and is arranged on the substrate i, _2^4. The plurality of pins 234 - (10) Chuangu 1 ~ around the opening σ 232a, and each leg has an inner pin 234a and an outer pin 234b, in the bean, the outer pin 234b of the knife is guided by an anisotropy Emperor. ': Electrical connection, and the other ^ ^ ^ ^ 240 and the display panel training 240 盥 柘 柘: > Chuan Qian, knife pin 210 also by the anisotropic conductive adhesive 4 way board 220 Electrical connection, as shown in Figure 4. Referring to Figure 5, the MeH Me « ^ u day slice 236 has a plurality of contacts 236a, and the wafer 236 is disposed at the opening 232a for sexual connection. In the embodiment of the present invention, the inner lead 23 is further provided with a sealing material 250 covering the coil material and the water vapor, foreign matter or oxygen attacking the crucible. The cymbal 236' is used to prevent the outer contact 236a. The following and the contact with the inner pin are detailed. Figure 4阙5 The convex object 238 described in Fig. 6 is shown in Fig. 4 as the VL nn structure, part of the display panel, and the electrical and electrical tape carrier package 7 are shown as the side of Fig. 4 See the schematic. Schematic diagram. The partial back value of the co-construction, the main object of the symmetry, the protrusion 238 1258032 15382twf.doc/r is disposed on the substrate 232 and located between the wafer 236 and the display panel 210, which prevents the foreign matter 260 from entering the display panel 21〇 The area between the tape and tape package structure 230 and the package structure of the protrusions 238 can reduce the short circuit or open circuit of the abnormalities caused by the foreign matter 260. In a car mussel embodiment, the protrusion 238 is, for example, a strip. Further, the material of the protrusion 238 is, for example, a non-conductive material or an organic polymer.
請再繼續參照圖6與圖7,在本發明之另一實施例中， 每-捲帶承載封裝結構23G更可以包括另—凸物2撕，配 置在晶片236與電路板220之間的基板232上，以阻擂異 物26〇進入捲帶式封裝結構23〇與電路板22〇之間^區 域，換言之，藉由同時設置了兩個凸物238、23%，可提 升捲帶式封裝結構230阻擋異物260之效能。 此外，在本發明之一實施例中，凸物238與基板232 T構，換言之，在製作鮮承_裝結構 230之捲常日守，即可將凸物238製作於捲帶上。另 物238亦可貼覆在基板232上。 ' J 俯幂不戟蚵衮結構之局部背面示 圖。請夢照® 8，在另一實施例中，凸物2娜例如 塊狀物。塊狀物可以是任何形狀，並不限於如圖 的圓形。且塊狀物以一定的間隔d排列，間隔 ·^ 小於異物260之粒徑，進而能有效地阻擋異物％〇見a 請再同時參照圖4與圖6，在本發明一實施例° 包括-異方性導電膠，位於各捲帶承載封裝 之外引腳234b與顯示面板21〇之間，以使捲帶承载封穿 13 1258032 15382twf.doc/r 構230與顯示面㈣〇電性連接。而另一異方 位於各捲帶承載封裝結構230之外弓丨腳234b與電路板22〇 之間’以使捲帶承載封裝結構230與電路板2 ;方，電膠240為金屬粒子與高分子材料所組二 體’透過異錄導轉·之作用，可帶 、，、顯示面板210以及電路板22〇 性連接以傳遞電子訊號。 相私 在本發明中，由於此捲帶承載封裝結構23g中 # 彳凸物⑽1"置於晶片攻-側邊的基板232 上=由凸物2料阻擔異物26〇進入晶片说與顯示面 ^ 〇之間的區域’因此可減少因為異物26 常的短路及斷路之現象。 當然，每一捲帶承載封裝結構23〇例如可 =8a (:圖6所_，配置在晶片a之另一侧邊的 ς，32上。且凸物238a與基板232例如 或是以貼覆之方式設置在基板232上。此 •承载；!裝結構⑽，可有效地防止異物勝因此 之捲"^承載封裝結構230將可提升電性接觸之良率。所 產品等之封裝結構中，以使得電子產 差施例 f 9所_林發㈣—實施财 *上有晶片之職構_裝临 14Referring to FIG. 6 and FIG. 7 again, in another embodiment of the present invention, the per-reel carrying package structure 23G may further include a further protrusion 2, and a substrate disposed between the wafer 236 and the circuit board 220. On the 232, the foreign matter 26〇 is inserted into the area between the tape and reel package structure 23〇 and the circuit board 22〇, in other words, by providing two protrusions 238 and 23% at the same time, the tape and reel package structure can be improved. 230 blocks the effectiveness of foreign matter 260. Further, in one embodiment of the present invention, the protrusions 238 and the substrate 232 are configured, in other words, the protrusions 238 are formed on the web in the case where the rolls of the fresh-loaded structure 230 are made. The other material 238 may also be attached to the substrate 232. ' Partially rear view of the J-powered structure. Please dreams® 8, in another embodiment, the projections 2a are, for example, chunks. The block may be of any shape and is not limited to the circular shape as shown. And the blocks are arranged at a certain interval d, the spacing is smaller than the particle diameter of the foreign matter 260, and the foreign matter can be effectively blocked. See also FIG. 4 and FIG. 6, which are included in an embodiment of the present invention. The anisotropic conductive adhesive is disposed between the lead 234b and the display panel 21A outside the tape bearing package, so that the tape carrier sealing 13 1258032 15382 twf.doc/r 230 is electrically connected to the display surface (4). The other side is located between each of the tape carrying package structures 230 and between the legs 234b and the circuit board 22' to enable the tape to carry the package structure 230 and the circuit board 2; the electrode 24 is made of metal particles and high The two bodies of the molecular material group can transmit, and display, the display panel 210 and the circuit board 22 to transmit electronic signals through the function of the recording and transduction. In the present invention, since the tape carrying package structure 23g has a #彳 protrusion (10) 1" placed on the substrate 232 on the side of the wafer attack side = the foreign material 26 is blocked by the protrusion 2 into the wafer and the display surface ^ The area between the 〇's can therefore reduce the short circuit and open circuit caused by the foreign matter 26. Of course, each of the tape carrying package structures 23 can be, for example, 8a (FIG. 6) disposed on the other side of the wafer a, 32. The protrusions 238a and 232 are, for example, or The method is disposed on the substrate 232. The loading structure of the device (10) can effectively prevent the foreign matter from winning the volume. The bearing package structure 230 can improve the yield of the electrical contact. In order to make the electronic production difference example f 9 _ Lin Fa (four) - implementation of the financial sector on the wafer structure _ installed 14
1258032 15382twf.doc/r 照圖9，此顯示哭α — 板上有曰片之包顯示面板310以及一軟性電路 板上有曰曰片之封裝結構娜⑽^—啊’⑽^其中， 颂示面板3、1◦具有_顯示區域犯與一非顯示區域叫。 ^ 0UΓ> ^ 2中具有複數條掃瞄線312a與複數條資料線 帚=、、表3l2a與資料線312b劃分出複數畫素單元 倘若此”、、員示态300為液晶顯示器，則每一晝素單元 312c中，例如包括一薄膜電晶體（tft)(未繪示）、〜 ，晶層口⑷會示）以及一彩色濾光片（未緣示）。又倘若 t顯不$細為有機電激發光顯示器（OLED)，則晝素 中例如包括—主動元件（未緣示）以及一有機電 Η發光兀件（树*)。總之，藉祕鱗灿與資料線 M2b所傳遞之電位訊號，可讓晝素單元312c產生顯示^ 效果。 請繼續參照圖9,軟性電路板上有晶片之封裝結構32〇 配置在顯不面板31〇之-側邊處。每—軟性電路板上有晶 片之封裝結構320包括軟性電路板322、晶片324以及一 凸物326。軟性電路板320配置在顯示面板31〇之一側邊。 一圖10繪示為圖9中沿ΕΧΕ，剖面線之軟性電路板的剖 面不意圖。請參照圖10,軟性電路板322具有複數絕緣層 322a、322b以及配置在絕緣層322a、322b之間的一導^ 層322c。而晶片324位於軟性電路板322上，且晶片324 具有複數接點324a，其與軟性電路板322之導電層322c 電性連接。請再參照圖9，值得注意的是，凸物32^6設置 於軟性電路板322上且位在絕緣層322b與晶片324之間。 1258032 153 82twf.d〇c/r 此凸物326可防止異物（未緣示）進入顯示面板3i〇盘晶 片似之間的區域，進而減少異物所引起之元件異= 路或斷路的現象。在一實施例中，凸物326例如是—條 物或是複數塊狀物’塊狀物可以是任何雜。此外，凸 326之材質例如是非導電性材質或是有機高分子。 請再參照圖1〇,在本發明之一較佳實施例中 326與軟性電路板322的絕緣層伽例如為—體成 ibl者是以貼覆之方式設置在軟性電路板322的絕緣^ 請繼續參照圖9，在本發明之一較佳實施例中 更包括-異方性導電膠33G，位於軟性電 封裝結構320與顯和板训之間，以使軟性電 兩者間能夠傳遞電子訊號之功效。 進而達到 綜上所述，在本發明之顯示器與捲帶 具有下列優點： ' ]衣、、、。構 ⑴本發明之顯㈣由於其封裝結構巾 異物之凸物，因此可防止異物進入晶片反：, 域’進而可避免元件異常的短路靖路之縣發生的區 土、（H過隹凸物之形狀設計或是材質的選擇，可以更 佳地避免/、物進入晶片與面板之間的區域。 ⑴應財發明之封裝、轉可提 率，且有利於延長顯示器的使用壽命，且本發 構也可顧於其他電子產品之封裝，以提升電 16 1258032 15382twf.doc/r 之穩定性。 雖然本發明已以較佳實施例揭露如上，然其並非用以 限定本發明，任何熟習此技藝者，在不脫離本發明之精神 和範圍内，當可作些許之更動與潤飾，因此本發明之保護 範圍當視後附之申請專利範圍所界定者為準。 - 【圖式簡單說明】 圖1所繪示為習知一種利用捲帶承載封裝結構之顯示 器的上視示意圖。 • 圖2所繪示為圖1中沿A_A’剖面線之捲帶承載封裝結 構之剖面示意圖。 圖3所繪示為圖1中沿B-B’剖面線之捲帶承載封裝結 構、部分顯示面板以及部分電路板之剖面侧視示意圖。 圖4繪示為本發明之一較佳實施例之顯示器的上視示 意圖。 圖5所繪示為圖4中沿C-C’剖面線之捲帶承載封裝結 構之剖面示意圖。 ¥ 圖6所繪示為圖4中沿D-D’剖面線之捲帶承載封裝結 構、部分顯示面板以及部分電路板之剖面侧視示意圖。 圖7所繪示為圖4中之其中一捲帶承載封裝結構之局 ~ 部背面示意圖。 圖8繪示為另一捲帶承載封裝結構之局部背面示意 圖。 圖9所繪示為本發明另一實施例之利用軟性電路板上 有晶片之封裝結構進行封裝的顯示器之示意圖。 17 1258032 15382twf.doc/r 圖10繪示為圖9中沿E-E’剖面線之軟性電路板的剖 面示意圖。 【主要元件符號說明】 100 :顯示器 110 :顯示面板 ， 112 :倒角區域 120 :電路板 130 :捲帶承載封裝結構 • 132 :基板 132a :開口 134 :引腳 134a :内引腳 134b :外引腳 136 :晶片 136a :接點 140 :異方性導電膠 φ 150 :密封材料 _ 160 :異物 200、300 ··顯示器 210、310 :顯示面板 212、312 :顯示區域 212a、312a :掃瞄線 212b、312b :資料線 212c、312c :晝素單元 18 1258032 15382twf.doc/r 214、314 :非顯示區域 220 :電路板 230 :捲帶承載封裝結構（TCP) 232 :基板 232a :開口 234 :引腳 234a :内引腳 234b :外引腳 • 236、324 :晶片 236a、324a :接點 238、238a、238b、326 :凸物 240、330 :異方性導電膠 250 :密封材料 260 :異物 320 :軟性電路板上有晶片之封裝結構（COF) 322 :軟性電路板 φ 322a、322b :絕緣層 „ 322c :導電層 d :間隔 191258032 15382twf.doc/r As shown in Figure 9, this shows the crying alpha-package display panel 310 with a cymbal on the board and a package structure with a cymbal on a flexible circuit board. (10)^-啊'(10)^ where The panel 3, 1◦ has a _ display area and a non-display area. ^ 0UΓ> ^ 2 has a plurality of scan lines 312a and a plurality of data lines 、 =, and the table 3l2a and the data lines 312b divide the plurality of pixel units. If the "," state 300 is a liquid crystal display, each The halogen element 312c includes, for example, a thin film transistor (tft) (not shown), a ~ crystal layer port (4), and a color filter (not shown). In the case of an organic electroluminescent display (OLED), the element includes, for example, an active element (not shown) and an organic electroluminescent element (tree*). In short, the potential transmitted by the secret line and the data line M2b The signal can cause the pixel unit 312c to produce a display effect. Please continue to refer to FIG. 9, the package structure 32 of the chip on the flexible circuit board is disposed at the side of the display panel 31. Each of the flexible circuit boards has The package structure 320 of the chip comprises a flexible circuit board 322, a chip 324 and a protrusion 326. The flexible circuit board 320 is disposed on one side of the display panel 31. Figure 10 is a soft line along the ΕΧΕ line in Figure 9. The cross section of the board is not intended. Please refer to Figure 10, the flexible board 322 has a plurality of insulating layers 322a, 322b and a conductive layer 322c disposed between the insulating layers 322a, 322b. The wafer 324 is located on the flexible circuit board 322, and the wafer 324 has a plurality of contacts 324a, which are coupled to the flexible circuit board 322. The conductive layer 322c is electrically connected. Referring again to FIG. 9, it is noted that the protrusion 32^6 is disposed on the flexible circuit board 322 and is located between the insulating layer 322b and the wafer 324. 1258032 153 82twf.d〇c /r This protrusion 326 prevents foreign matter (not shown) from entering the area between the display panel 3i and the disk, thereby reducing the phenomenon of component-to-circuit or open circuit caused by foreign matter. In one embodiment, the protrusion 326 is, for example, a strip or a plurality of chunks. The chunks may be any impurities. Further, the material of the bumps 326 is, for example, a non-conductive material or an organic polymer. Referring again to FIG. 1A, one of the present inventions In the preferred embodiment, the insulating layer 326 of the flexible circuit board 322 and the flexible circuit board 322 are, for example, ibl, and the insulating layer is disposed on the flexible circuit board 322. Referring to FIG. 9, one of the preferred embodiments of the present invention is preferred. The embodiment further includes an anisotropic conductive adhesive 33G, Between the flexible electrical package structure 320 and the display board training, the function of transmitting the electronic signal between the soft and the electric power can be transmitted. Further, in summary, the display and the tape of the present invention have the following advantages: (1) The display of the present invention (4) due to the convexity of the foreign matter in the package structure, thereby preventing the foreign matter from entering the wafer reverse: the domain 'and thus avoiding the abnormality of the component short-circuited in the county of the road, (H The shape design of the over-bump or the choice of material can better avoid the entry of the object into the area between the wafer and the panel. (1) The package and transfer rate of the invention should be extended, and it is beneficial to extend the service life of the display, and the present invention can also take into account the packaging of other electronic products to improve the stability of the electric circuit 12 1258032 15382twf.doc/r. While the present invention has been described in its preferred embodiments, the present invention is not intended to limit the invention, and the present invention may be modified and modified without departing from the spirit and scope of the invention. The scope of protection is subject to the definition of the scope of the patent application. - BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a top plan view showing a conventional display device using a tape reel package structure. • Figure 2 is a cross-sectional view of the tape carrier package structure taken along line A_A' of Figure 1. 3 is a cross-sectional side elevational view of the tape carrier package structure, a portion of the display panel, and a portion of the circuit board along the line B-B' in FIG. 4 is a top plan view of a display in accordance with a preferred embodiment of the present invention. Figure 5 is a cross-sectional view showing the tape carrier structure of the tape taken along the line C-C' in Figure 4; FIG. 6 is a cross-sectional side elevational view of the tape carrying package structure, a portion of the display panel, and a portion of the circuit board along the D-D' section line of FIG. 4. FIG. 7 is a schematic view showing the back side of a portion of the tape bearing package structure of FIG. 4. Figure 8 is a partial rear elevational view of another tape carrier package structure. FIG. 9 is a schematic diagram of a display packaged by a package structure having a chip on a flexible circuit board according to another embodiment of the present invention. 17 1258032 15382twf.doc/r Figure 10 is a cross-sectional view showing the flexible circuit board taken along the line E-E' in Figure 9. [Main component symbol description] 100: display 110: display panel, 112: chamfered area 120: circuit board 130: tape and tape carrying package structure • 132: substrate 132a: opening 134: pin 134a: inner pin 134b: external lead Leg 136: Wafer 136a: Contact 140: Anisotropic conductive paste φ 150: Sealing material _160: Foreign matter 200, 300 · Display 210, 310: Display panel 212, 312: Display area 212a, 312a: Scan line 212b 312b: data line 212c, 312c: halogen unit 18 1258032 15382twf.doc/r 214, 314: non-display area 220: circuit board 230: tape carrier package structure (TCP) 232: substrate 232a: opening 234: pin 234a: inner lead 234b: outer lead • 236, 324: wafer 236a, 324a: contact 238, 238a, 238b, 326: protrusion 240, 330: anisotropic conductive paste 250: sealing material 260: foreign matter 320: Chip package structure (COF) 322 on flexible circuit board: flexible circuit board φ 322a, 322b: insulation layer „ 322c : conductive layer d : interval 19