TW200702785A - Display and tape carrier package structure - Google Patents
Display and tape carrier package structureInfo
- Publication number
- TW200702785A TW200702785A TW094123505A TW94123505A TW200702785A TW 200702785 A TW200702785 A TW 200702785A TW 094123505 A TW094123505 A TW 094123505A TW 94123505 A TW94123505 A TW 94123505A TW 200702785 A TW200702785 A TW 200702785A
- Authority
- TW
- Taiwan
- Prior art keywords
- inspecting
- display panel
- substrate
- disposed
- tape carrier
- Prior art date
Links
- 239000000758 substrate Substances 0.000 abstract 5
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1345—Conductors connecting electrodes to cell terminals
- G02F1/13452—Conductors connecting driver circuitry and terminals of panels
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1345—Conductors connecting electrodes to cell terminals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3157—Partial encapsulation or coating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12044—OLED
Landscapes
- Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- General Physics & Mathematics (AREA)
- Mathematical Physics (AREA)
- Optics & Photonics (AREA)
- Crystallography & Structural Chemistry (AREA)
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Liquid Crystal (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Wire Bonding (AREA)
Abstract
A display, which comprises a display panel, a printed circuits board (PCB) and a tape carrier package (TCP), is provided. The printed circuits board is disposed beside the display panel. And the tape carrier package comprises a substrate, a plurality of inspecting leads, a chip and a protruding. Wherein, the substrate has an opening, and the substrate is disposed between the display panel and the printed circuits board. The inspecting leads are disposed on the substrate and are around the opening. Each inspecting lead has an inter inspecting lead and an outer inspecting lead. Wherein, parts of outer inspecting leads are electrically connected with the display panel. And other parts of outer inspecting leads are electrically connected with the printed circuits board. The chip has a plurality of contacting points. And the chip is disposed on the opening. The contacting points is electrically connected with the inter inspecting leads. The protruding is disposed on the substrate and between the chip and the display panel. By the package structure which has the protruding, the yield of display panel can be improved.
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW094123505A TWI258032B (en) | 2005-07-12 | 2005-07-12 | Display and tape carrier package structure |
JP2005296805A JP4252568B2 (en) | 2005-07-12 | 2005-10-11 | Display and tape carrier package structure |
GB0608759A GB2428327B (en) | 2005-07-12 | 2006-05-03 | Display And Tape Carrier Package Structure |
DE102006020853A DE102006020853A1 (en) | 2005-07-12 | 2006-05-04 | Display and tape carrier package setup |
FR0604708A FR2888666B1 (en) | 2005-07-12 | 2006-05-24 | DISPLAY AND STRUTURE OF PROCESSOR ENCLOSURE BOX |
GB0712713A GB2437665B (en) | 2005-07-12 | 2007-06-29 | Display and carrier package structure |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW094123505A TWI258032B (en) | 2005-07-12 | 2005-07-12 | Display and tape carrier package structure |
Publications (2)
Publication Number | Publication Date |
---|---|
TWI258032B TWI258032B (en) | 2006-07-11 |
TW200702785A true TW200702785A (en) | 2007-01-16 |
Family
ID=36603861
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW094123505A TWI258032B (en) | 2005-07-12 | 2005-07-12 | Display and tape carrier package structure |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP4252568B2 (en) |
DE (1) | DE102006020853A1 (en) |
FR (1) | FR2888666B1 (en) |
GB (1) | GB2428327B (en) |
TW (1) | TWI258032B (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9978674B2 (en) | 2016-04-05 | 2018-05-22 | Samsung Electronics Co., Ltd. | Chip-on-film semiconductor packages and display apparatus including the same |
CN108447396B (en) * | 2018-02-26 | 2020-11-03 | 上海天马微电子有限公司 | Display device |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3501316B2 (en) * | 1995-06-16 | 2004-03-02 | 株式会社ルネサステクノロジ | Semiconductor device and manufacturing method thereof |
JP3039507B2 (en) * | 1998-03-06 | 2000-05-08 | 日本電気株式会社 | Liquid crystal display device and method of manufacturing the same |
JP2000183470A (en) * | 1998-12-16 | 2000-06-30 | Sony Corp | Wiring where migration is prevented and its prevention method |
-
2005
- 2005-07-12 TW TW094123505A patent/TWI258032B/en not_active IP Right Cessation
- 2005-10-11 JP JP2005296805A patent/JP4252568B2/en not_active Expired - Fee Related
-
2006
- 2006-05-03 GB GB0608759A patent/GB2428327B/en not_active Expired - Fee Related
- 2006-05-04 DE DE102006020853A patent/DE102006020853A1/en not_active Ceased
- 2006-05-24 FR FR0604708A patent/FR2888666B1/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
FR2888666A1 (en) | 2007-01-19 |
GB2428327A (en) | 2007-01-24 |
FR2888666B1 (en) | 2010-06-11 |
DE102006020853A1 (en) | 2007-02-15 |
JP2007027672A (en) | 2007-02-01 |
TWI258032B (en) | 2006-07-11 |
GB2428327B (en) | 2008-01-23 |
JP4252568B2 (en) | 2009-04-08 |
GB0608759D0 (en) | 2006-06-14 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |