TWI255917B - Monitoring method, process and system for photoresist regeneration - Google Patents
Monitoring method, process and system for photoresist regenerationInfo
- Publication number
- TWI255917B TWI255917B TW093112001A TW93112001A TWI255917B TW I255917 B TWI255917 B TW I255917B TW 093112001 A TW093112001 A TW 093112001A TW 93112001 A TW93112001 A TW 93112001A TW I255917 B TWI255917 B TW I255917B
- Authority
- TW
- Taiwan
- Prior art keywords
- photoresist
- monitoring method
- regeneration
- solid content
- waste
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/42—Stripping or agents therefor
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
-
- H10P95/00—
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- Materials For Photolithography (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW093112001A TWI255917B (en) | 2004-04-29 | 2004-04-29 | Monitoring method, process and system for photoresist regeneration |
| KR1020040061080A KR20050105089A (ko) | 2004-04-29 | 2004-08-03 | 포토레지스트 재생의 모니터 방법, 재생 방법 및 시스템 |
| JP2004257737A JP4188294B2 (ja) | 2004-04-29 | 2004-08-09 | フォトレジスト再生のプロセス |
| US10/918,483 US7052826B2 (en) | 2004-04-29 | 2004-08-16 | Monitoring method, process and system for photoresist regeneration |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW093112001A TWI255917B (en) | 2004-04-29 | 2004-04-29 | Monitoring method, process and system for photoresist regeneration |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200535414A TW200535414A (en) | 2005-11-01 |
| TWI255917B true TWI255917B (en) | 2006-06-01 |
Family
ID=35187495
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW093112001A TWI255917B (en) | 2004-04-29 | 2004-04-29 | Monitoring method, process and system for photoresist regeneration |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US7052826B2 (enExample) |
| JP (1) | JP4188294B2 (enExample) |
| KR (1) | KR20050105089A (enExample) |
| TW (1) | TWI255917B (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI552809B (zh) * | 2009-03-31 | 2016-10-11 | Tokyo Ohka Kogyo Co Ltd | Method of manufacturing regenerative photoresist and regenerative photoresist |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7844665B2 (en) * | 2004-04-23 | 2010-11-30 | Waratek Pty Ltd. | Modified computer architecture having coordinated deletion of corresponding replicated memory locations among plural computers |
| TWI321703B (en) * | 2006-02-21 | 2010-03-11 | Ind Tech Res Inst | Process for photoresist regeneration and system thereof |
| JP2008078503A (ja) * | 2006-09-22 | 2008-04-03 | Toshiba Corp | 半導体製造工程における廃液処理方法、及び基板処理装置 |
| JP5065121B2 (ja) * | 2008-03-28 | 2012-10-31 | 東京エレクトロン株式会社 | レジスト液供給装置、レジスト液供給方法、プログラム及びコンピュータ記憶媒体 |
| TWI605075B (zh) * | 2016-07-29 | 2017-11-11 | 羅文烽 | 廢光阻劑回收再生系統與方法 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11133619A (ja) * | 1997-05-01 | 1999-05-21 | Shipley Co Llc | フォトレジストのリサイクリング方法 |
-
2004
- 2004-04-29 TW TW093112001A patent/TWI255917B/zh not_active IP Right Cessation
- 2004-08-03 KR KR1020040061080A patent/KR20050105089A/ko not_active Ceased
- 2004-08-09 JP JP2004257737A patent/JP4188294B2/ja not_active Expired - Fee Related
- 2004-08-16 US US10/918,483 patent/US7052826B2/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI552809B (zh) * | 2009-03-31 | 2016-10-11 | Tokyo Ohka Kogyo Co Ltd | Method of manufacturing regenerative photoresist and regenerative photoresist |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2005316355A (ja) | 2005-11-10 |
| US20050244761A1 (en) | 2005-11-03 |
| KR20050105089A (ko) | 2005-11-03 |
| TW200535414A (en) | 2005-11-01 |
| JP4188294B2 (ja) | 2008-11-26 |
| US7052826B2 (en) | 2006-05-30 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |