1253499 九、發明說明： 【發明所屬之技術領域】 本發明係與被檢測元件的定位技術有關，更詳而言之， 乃是指一種檢測覆晶基板之定位方法。 5【先前技術】 按，覆晶基板（flip chip substrate)是一種體積小且具有 高密度接點及電路的電路板，其具有體積小、高腳數、良 好電氣特性等優點，然而，在將晶粒接合於覆晶基板之前， 有必要對覆晶基板進行測試，如此可避免因為覆晶基板本 10 身的瑕龜而導致晶粒的損耗。 而在以測試機對覆晶基板進行測試之前，必須將覆晶 基板定位於待檢測位置，而由於覆晶基板上的接點密度極 高，其接點間間距極小，稍有一點差距即會導致檢測結果 的不正確，傳統的定位方法，例如利用覆晶基板的板緣定 15 位，已無法符合覆晶基板的極精密需求。 【發明内容】 本發明之主要目的即在提供一種檢測覆晶基板之定位 方法，其利用單一攝影機攝影取像，並配合各測試頭的位 20 移與旋轉，可完成極為精密且快速之定位。 緣是，為達成上述目的，依據本發明所提供之一種檢 測覆晶基板之定位方法，包含有下列步驟：A、提供一檢測 設備，具有一上檢測頭、一下檢測頭、一承座、以及一攝 影機，該上檢測頭及該下檢測頭均可於X轴方向、Y轴方 -4- 1253499 向、Z軸方向上位移，且可水平旋轉0角度，該承座可於一 第一位置及一第二位置間位移，當該承座位於該第二位置 時，係位於該上檢測頭與該下檢測頭之間，該承座中央具 有一鏤空部位，可供該下檢測頭由下方進入，該承座可相 5 對於該攝影機於該第一位置及一第三位置間位移；B、設定 基準位置：備置一基準覆晶基板，具有二定位標記，將該 基準覆晶基板置於該承座上，於該承座位於該第二位置時， 調整該上檢測頭及該下檢測頭，使該二檢測頭對正於基準 覆晶基板，於該承座分別位於該第一位置及該第三位置時， 10 該二定位標記係分別對正於該攝影機，並紀錄此基準位置; C、待檢測覆晶基板定位：將一待檢測覆晶基板置於該承座 上，調整該承座分別位於該第一位置及該第三位置，供該 攝影機分別對該待檢測覆晶基板之二定位標記分別進行取 像；D、比對該待檢測覆晶基板與該基準覆晶基板之二定位 15 標記之位置，可得出各個定位標記在X軸座標及Y軸座標 的差距，藉此得到待檢測覆晶基板相對於基準位置之X 軸、Y軸、以及0角度之差；E、使該承座位於該第二位置, 將該上檢測頭及該下檢測頭依前述步驟所得之X軸、Y 軸、以及0角度之差進行位移及旋轉，藉以補償誤差，進而 20 使該上檢測頭及下檢測頭對準該待檢測覆晶基板；藉由上 述步驟，可達成待檢測覆晶基板在檢測前的定位。 【實施方式】 為了詳細說明本發明之特點所在，茲舉以下一較佳實 -5- 1253499 施例並配合圖式說明如后： 請參閱第一圖至第四圖，本發明一較佳實施例所提供 之一種檢測覆晶基板之定位方法，主要包含有下列步驟： A、提供一檢測設備（11)，具有一上檢測頭（12)、一下 5 檢測頭（14)、一承座（16)、以及一攝影機（18)，該上檢測頭 (12)及該下檢測頭（14)均可於X軸方向、γ轴方向、z軸方 向上位移，且可水平旋轉0角度，且該二檢測頭（12)(14)上 具有探針（探針之構造係為習知，且非本案之申請重點，容 不贅述）；該承座（16)用以承接覆晶基板（22)，可於一第一 10位置及一第二位置間位移，請參閱第三圖，當該承座（16)位 於δ玄第一位置時係用以進/出料；再參閱第四圖，當該承座 (16)位於該第二位置時係位於該上檢測頭（12)與該下檢測 頭（14)之間，可讓待檢測覆晶基板(21，)供檢測，該承座（16) 中央具有一鏤空部位（17)，可供該下檢測頭（14)由下方進入， 15並與位於承座（16)上的覆晶基板底面的接點接觸來進行檢 測，該攝影機（18)於本實施例中，係為一 CCD(電荷耦合裝 置）攝影鏡頭，該承座（16)可相對於該攝影機（18)於該第一 位置（如第二圖A所示）及一第三位置（如第二圖b所示）間 位移； 2〇 B '設定基準位置：備置一基準覆晶基板(21)，具有二 疋位‘ ό己（22)，將该基準覆晶基板（21)置於該承座（π)上， 使該承座（16)位於該第二位置時，調整該上檢測頭（a)及該 下檢測頭（14)，使該二檢測頭（12)(14)上之探針（圖中未示） 對正於該基準覆晶基板(21)之接點，調整該承座（16)之位置， -6- 1253499 使其分別位於該第一位置及該第三位置時，該攝影機（18) 分別位於該二定位標記（22)的正上方取像，並然後紀錄此 基準位置； C、 待檢測覆晶基板（21，）定位：將一待檢測覆晶基板 5 (21’）置於該承座（16)上，調整該承座（16)分別位於該第一位 置及該第二位置，供該攝影機（18)分別對該待檢測覆晶基 板（2 Γ)之二定位標記（22’）分別進行取像； D、 比對該待檢測覆晶基板(21，)與該基準覆晶基板(21) 之二定位標記（22’)(22)之位置，可得出各個定位標記（22，） 10 (22)在X轴座標及Y軸座標的差距，藉此得到待檢測覆晶 基板(2 Γ)相對於基準位置之X轴、γ轴、以及0角度之差； E、 使該承座（16)位於該第二位置，將該上檢測頭（12) 及該下檢測頭（14)依前述步驟所得之X軸、γ軸、以及0 角度之差進行位移及旋轉，藉以補償誤差3進而使該上檢 15測頭（12)及下檢測頭（Μ)對準該待檢測覆晶基板(21，）。 藉由上述步驟可知，本發明是先對一基準覆晶基板(21) 上的定位標記（22)進行基準位置的設定，之後在檢測待檢 測覆晶基板(2Γ)時，即可與該基準位置進行比對，並找出 位置差距，再將上檢測頭（丨2)及下檢測頭（14)於X轴、γ軸 20 上位移，並旋轉0角度來補償該位置差距，達到定位的效 果0 本發明於圖式中所示之定位標記（22)係為十字形，此 僅為舉例而已，本案之定位標記P2)亦可為其他形狀：如 矩形，圓形等。 1253499 本發明之承座（16)相對於該攝影機（18)在該第一位置 及該第三位置時，該攝影機（18)—次僅針對一定位標記（22) 進行取像，此係由於精度上的考量，因此，該承座（16)需要 在該第一位置及該第三位置間移動。 5 由上可知，本發明可產生之優點為：利用單一攝影機 攝影取像藉以取得基準覆晶基板位置與待測覆晶基板間的 位置差距，並配合各測試頭的位移與旋轉來補償該位差距， 較習用以板緣定位之方式更為精密，良率更高。 -8- 1253499 【圖式簡單說明】 第一圖係本發明一較佳實施例之結構示意圖，顯示上 測試頭、承座、以及下測試頭間之空間形態； 第二圖A係本發明一較佳實施例之動作示意圖，顯示 5 承座位於第一位置時之狀態； 第二圖B係本發明一較佳實施例之動作示意圖，顯示 承座位於第三位置時之狀態； 第三圖係本發明一較佳實施例之實施狀態示意圖，顯 示承座於第一位置之狀態； 10 第四圖係本發明一較佳實施例之實施狀態示意圖，顯 示承座於第二位置之狀態。 【主要元件符號說明】 (11)檢測設備 （12)上檢測頭 （14)下檢測頭 15 (16)承座 （17)鏤空部位 （18)攝影機 (21)基準覆晶基板 (21 ’)待檢測覆晶基板 （22)(22’）定位標記 -9-1253499 IX. Description of the Invention: [Technical Field] The present invention relates to a positioning technique of a device to be inspected, and more particularly, to a method for detecting a flip chip substrate. 5 [Prior Art] According to the flip chip substrate, it is a small-sized circuit board with high-density contacts and circuits, which has the advantages of small size, high number of pins, good electrical characteristics, etc. Before the die is bonded to the flip chip substrate, it is necessary to test the flip chip, so that the loss of the crystal grain due to the turtle of the flip chip substrate 10 can be avoided. Before testing the flip-chip substrate with the tester, the flip-chip substrate must be positioned at the position to be inspected, and since the density of the contacts on the flip-chip substrate is extremely high, the spacing between the contacts is extremely small, and a slight gap will occur. As a result of the incorrect detection results, the conventional positioning method, for example, using the 15-position of the edge of the flip-chip substrate, has been unable to meet the extremely precise requirements of the flip-chip substrate. SUMMARY OF THE INVENTION The main object of the present invention is to provide a method for detecting a flip chip substrate which is imaged by a single camera and matched with the position 20 movement and rotation of each test head to achieve extremely precise and rapid positioning. In order to achieve the above object, a method for detecting a flip chip substrate according to the present invention includes the following steps: A. providing a detecting device having an upper detecting head, a lower detecting head, a socket, and In a camera, the upper detecting head and the lower detecting head can be displaced in the X-axis direction, the Y-axis side -4- 1253499 direction, and the Z-axis direction, and can be horizontally rotated by 0 degrees, and the socket can be in a first position. And a displacement between the second position, when the socket is located at the second position, between the upper detecting head and the lower detecting head, the center of the socket has a hollow portion for the lower detecting head to be lower Entering, the socket can be displaced between the first position and the third position by the camera; B, setting the reference position: preparing a reference flip chip substrate, having two positioning marks, placing the reference flip chip substrate Adjusting the upper detecting head and the lower detecting head when the socket is in the second position, the two detecting heads are aligned with the reference flip chip, and the sockets are respectively located at the first position And the third position, 1 0, the two positioning marks are respectively aligned with the camera, and the reference position is recorded; C. The flip chip substrate to be inspected is positioned: a flip chip substrate to be inspected is placed on the socket, and the socket is respectively located at the first a position and the third position, wherein the camera separately images the two positioning marks of the flip-chip substrate to be inspected; D, the positioning of the two sides of the to-be-detected flip-chip substrate and the reference flip-chip substrate Position, the difference between the X-axis coordinate and the Y-axis coordinate of each positioning mark can be obtained, thereby obtaining the difference between the X-axis, the Y-axis, and the 0 angle of the flip-chip substrate to be detected relative to the reference position; E, making the socket Located in the second position, the upper detecting head and the lower detecting head are displaced and rotated according to the difference between the X-axis, the Y-axis, and the 0-angle obtained in the foregoing steps, thereby compensating for the error, and further, the upper detecting head and the lowering The detecting head is aligned with the flip chip substrate to be inspected; by the above steps, the position of the flip chip substrate to be inspected before detection can be achieved. [Embodiment] In order to explain the features of the present invention in detail, the following preferred embodiment of the present invention is described below with reference to the following drawings: Referring to the first to fourth figures, a preferred embodiment of the present invention The method for detecting the flip chip substrate provided by the example mainly comprises the following steps: A. providing a detecting device (11) having an upper detecting head (12), a lower 5 detecting head (14), and a socket ( 16), and a camera (18), the upper detecting head (12) and the lower detecting head (14) are both displaceable in the X-axis direction, the γ-axis direction, and the z-axis direction, and can be horizontally rotated by 0 degrees, and The two detecting heads (12) and (14) have probes (the structure of the probes is conventional, and the application is not focused on the present application, and the details are not described above); the sockets (16) are used to receive the flip-chip substrate (22). ), can be displaced between a first 10 position and a second position, please refer to the third figure, when the seat (16) is located at the first position of δ 玄, used for feeding/discharging; When the socket (16) is in the second position, between the upper detecting head (12) and the lower detecting head (14), Detecting the flip-chip substrate (21,) for inspection, the socket (16) has a hollow portion (17) at the center for the lower detecting head (14) to enter from below, 15 and to be located on the socket (16) In the present embodiment, the camera (18) is a CCD (Charge Coupled Device) photographic lens, and the cradle (16) can be opposite to the camera (18). Displacement between the first position (as shown in Figure 2A) and a third position (as shown in Figure 2b); 2〇B' set reference position: a reference flip-chip substrate (21) is provided, having two疋 position ' ό ( (22), the reference flip chip substrate (21) is placed on the socket (π), when the socket (16) is located in the second position, the upper detection head (a) is adjusted And the lower detecting head (14), the probe (not shown) on the two detecting heads (12) (14) is aligned with the contact of the reference flip chip substrate (21), and the socket is adjusted ( 16) position, -6- 1253499, when the first position and the third position are respectively located, the camera (18) is respectively positioned directly above the two positioning marks (22), and After recording the reference position; C. Positioning the flip-chip substrate to be inspected (21,): placing a flip-chip substrate 5 (21') to be placed on the socket (16), and adjusting the sockets (16) respectively The first position and the second position are respectively used by the camera (18) to image the two positioning marks (22') of the flip chip (2 Γ) to be detected; D. The positions of the substrate (21,) and the two positioning marks (22') (22) of the reference flip chip (21) can be obtained by taking the respective positioning marks (22,) 10 (22) at the X-axis coordinates and the Y-axis coordinates. The difference between the X-axis, the γ-axis, and the 0-angle of the flip-chip substrate (2 Γ) to be detected relative to the reference position; E, the holder (16) is located at the second position, The detecting head (12) and the lower detecting head (14) are displaced and rotated according to the difference between the X-axis, the γ-axis, and the 0-angle obtained by the foregoing steps, thereby compensating for the error 3 and further causing the upper detecting 15 probe (12) and The lower detecting head (Μ) is aligned with the flip chip substrate (21,) to be inspected. According to the above steps, the present invention firstly sets the reference position of the positioning mark (22) on a reference flip chip substrate (21), and then, when detecting the flip chip substrate (2Γ) to be detected, the reference can be used. The position is compared, and the position difference is found, and then the upper detecting head (丨2) and the lower detecting head (14) are displaced on the X-axis and the γ-axis 20, and the 0-angle is rotated to compensate the position difference to achieve the positioning. Effect 0 The positioning mark (22) shown in the figure is a cross shape, which is merely an example. The positioning mark P2) of the present invention may also have other shapes such as a rectangle, a circle, and the like. 1253499 The camera (18) of the present invention is imaged only for a positioning mark (22) in the first position and the third position relative to the camera (18), because Accuracy considerations, therefore, the socket (16) needs to move between the first position and the third position. 5 It can be seen from the above that the invention can produce the advantages that the image is taken by a single camera to obtain the position difference between the position of the reference flip chip substrate and the flip chip substrate to be tested, and the displacement and rotation of each test head are used to compensate the bit. The gap is more sophisticated and the yield is higher. -8- 1253499 BRIEF DESCRIPTION OF THE DRAWINGS The first drawing is a schematic structural view of a preferred embodiment of the present invention, showing the spatial configuration between the upper test head, the socket and the lower test head; The operation diagram of the preferred embodiment shows the state when the 5 socket is in the first position; the second diagram B is a schematic diagram of the operation of the preferred embodiment of the present invention, showing the state when the socket is in the third position; BRIEF DESCRIPTION OF THE DRAWINGS FIG. 10 is a schematic view showing a state of implementation of a preferred embodiment of the present invention; FIG. 4 is a schematic view showing a state of implementation of a preferred embodiment of the present invention, showing a state in which the socket is in the second position. [Explanation of main component symbols] (11) Detection head (14) on the detection head (14) Next detection head 15 (16) Bearing seat (17) Hollow part (18) Camera (21) Reference flip chip substrate (21 ') to be Detecting the flip chip substrate (22) (22') positioning mark -9-