1246752 九、發明說明： 【發明所屬之技術領域】 本發明係關於一種半導體封裝製程用之清模板，尤指 用以清除模具模穴内之殘餘膠體的半導體封裝製程用 之4模板。 【先前技術】 :於以導線架作為晶片承載件的封裝技術而言 =衣程往往係先將晶片黏貼於該導線架之晶片座上，再与 =線電性連接該晶片與導線架之導腳，復於模壓製到 :成—封裝膠體，俾將該晶片與銲線包覆於該封裝膠體 片免受灰塵等雜物之污染而破壞其功能。 m二般而言’用以封裝之封裝膠體多為例如熱固性環韋 等高分子材料’其係先將該材料加熱溶化後, 具巾，再依模穴之形狀填 =績’而完成模壓製程；因此，該模具在二 i作業後，其模穴⑽然將殘留—些殘餘的 不予以適當清除，賴殘㈣封歸體將料附著於^ 之内壁’亚將於下次㈣製程之脫模 :?封裝件的封裝膠體上，導致該封輪觀不;:::封 1¾ xtt 但守綠/米之脣犋扳（LeadFra ase)解決此問題’其係將該清模板置於該封裝模且 中二以-清模膠料（娜用之封農膠體不同材、 仃相同之漏㈣，科該清模膠料填充於 / 18003 5 1246752 覆該清模板，模壓完成後，原本殘留於該模穴内的 體將被該清模膠料所吸附，而可於脫模後藉該清盘: 模膠料一起移除。 > 習知之清模板即如第1圖之上視圖所示，為—與產品 所用之導線架相同的現成導線架】，其優點為不需再叩 製備或設計新式清模板，而其缺點則在於該導線架！於= 模後其晶片座10與周圍各導腳n會與該清模膠料咬合: 無法分離，導致清模後該導線架卜必需連同該清模膠^所 形成的膠塊-併丢棄，而無法再重複使用，形成材料之卞 費，亦使得清模操作之成本過高，不符經濟效益。“ 因此，繁於前述缺點，遂有另一口型清模板，如 專利公告第270612號案所揭露，其中央係具有一 口，騎脫模後之清模膠料集中於該開σ，俾於完成清幵模 後了精由人力將該清模膠料輕易施壓去除；第2圖所示 為違習知π型清模導線架2 ’該口型清模導線架2上係 ^ 一開口 20’且該開口 2〇之大小及位置係配合該封裳模 :之5又计，同時，該開口 20之内緣邊上係具有突出物21，( 皁於^清模注膠後，該清模_所形成的膠塊為該開口 “之大出物21所支樓，而得將清模膠料自模具取出 =將膠料從顧口2()之突出㈣剝離該膠塊與該導線 木2 ’從而發揮可重複使用之功效。 里惟，此類口型清模導線架2於使用過程中亦有其缺 ，因该封裝模具上之排氣口（Vent)位置將受到該清模 之遮蓋，故而清模膠料將無法填充至該些排氣口 18003 1246752 位置4賴氣口位置的殘留膠體不易 封裝模具於模㈣程時，產生排氣不良之心 後之封裝膠體内產生氣泡，影響封裝品質甚巨1致柄壓 ㈣=出針:Γ:缺點’中華民國專利公告第觀57 唬案逐k出一改良式清模板3 示，於其口型開口 3。之四角落位置=:方^ 有温膠穴31 ’該口型開口 3〇之位置係 月:夕伸 模穴’而該些溢谬穴31之位置係對應於二因之 此’當該清模板3如第3B圖般放置於上、下 別對應於该上、下模穴3 2 〇、3 3 〇各 肘刀 故而’當封裝模具開始注膠時，流向該：3口21 331。 =之：量清模膠料將填充於該溢膠穴31中，而於 该開口 3〇内的清模膠塊結合為-體，並可於㈣掇柄 =脫模：該清模膠塊一併移除，俾防止:= ^排孔口，解決習知口型清模板之問題。 、 然而，口型清模板具有結構上之缺點 二模；而言，其最大的缺點在於該口型開口區域之面 U ❹而V致原先設計的灌膠量不足，而如第％圖所示， =吏1些灌人之_34無法填滿該料模具之模穴功、 上模穴:=:現未填充膠料之區域，並使得該 =八之内壁咖未與該清模膠料34接觸，而失去 命:餘膠體之功能；此外’該口型清模板之開口 30挖 工、可此有強度不足之問題，而容易造成清模板3變形 18003 7 1246752 或損壞等問題。 因此，如何提出一種低成本且可確實發揮清模效果之 ==復不致堵塞該封裝模具之排氣口，實已成爲 目則亟待解決之課題。 【發明内容】 鑒於上述習知技術之缺點，本發明之一目的在於提供 #種可令清㈣料確實填滿模穴的半導體封裝製程用之产 模板。 巧 4 本發明之另—目的在於提供—種可有效清潔模且之 排氣口的半導體封裝裝製用清模板。 、 再—目的在於提供—種低成本的半導體封 1裝製用之清模板。 。為達上逑及其他目的，本發明提供一種半導體封裝 程用之清模板’係用以清除 、 ^除封衣拉具内之殘餘膠體，其係 匕本體’该本體具有多數個預定填膠區域 :真躁=，_封裝模具之多數個模穴位置二 弟，工邛’係分別形成於每一預定填膠區域的約略中央 位置三多數個第二鏤空部，係分別形成於每—料填膠區 域的母—角緣位置；以及多數溢膠穴，係形成於每I第二 鏤空部之角緣，且該些溢膠穴係對庫' 個排氣η位置。 靖應以封裝模具之多數 前述之預定填勝區域係為一矩形形狀， 膠區域間係呈陣列排列； 7有預疋” 八係沿著該第二鏤空部 之角緣向外延伸形成，並與該第二鏤空部呈一連通區域。 18003 8 1246752 L核板置於該封裝模具中並注入-清模膠 亥清模膠料係可填滿該封裂模具之模穴，並完全 復該預定填膠區域中的第一鏤空部與第二鐘空部；同時， ^模穴中溢流至排氣口之溢膠亦將填充於該溢膠穴中， =脫模時，-併清除該些溢膠，而不致造成排氣 【實施方式】 以下係藉由特定的具體實例說明本發明之實施方 式，熟悉此技蓺之人丰W ^ 昤 了由本呪明書所揭示之内容輕易地 瞭解本發明之其他優盥 ^ /、功效。本發明亦可藉由其他不同< 日]具體貝例加以施行痞麻用 I # 丁及應用本况明書中的各項細節亦可 土於不同觀點與應用，在不悖 修飾與變吏。 以丨讀本㈣之精神下進行各種 之、、主閲第4Α圖’其係為本發明之半導體封裝製程用 製成之導線架，括係為一馬口鐵薄片所 義有夕查“门。/ 包一本體40,該本體40上係定 扩二广陣列排列的矩形預定填膠區域400，於本實 相對作:亥本體40上之多數個預定填膠區域400係以兩兩β 央付番排列；同時’每一預定填膠區域400的約略中 央位置係形成右一 J、J合甲 區域400的每—角緣^ 一鎮空部4〇1’而每一預定填膠 術，以藉該第置則形成有三角狀之第二鏤空部 ^ . 、奏空部401與第二鏤空部402，令每一預 疋真膠區域4〇〇上去^金 、 該清模板Μ复包括排列成「井」字型；此外’ 鏤空部402之角緣，介知穴4〇3，其係形成於每一第二 亦即该預定填膠區域4 0 0之角緣位置， 18003 9 1246752 此時，該些溢膠穴403係對應於該封 口位置。 x拉具之多數個排氣 每一預定填膠區域400之尺寸 配合該封裳模具之模穴的形狀與位置位置均係 模穴;==域：:均分別對應於該封裝模具的每一 的尺寸係與該封裝模具上每一模填膠區域-〇 而使得該清模板4置人該封裝模具“二相等， 彻恰可對應於一模穴空間。 、疋填膠區域 此外，該溢膠穴403係沿著該第 向外延伸而形成，而令該第二鏤空部4〇2之角緣 如圖所示相互連通而呈-漏斗形狀M〇2與该溢膠穴· 且弟4B圖即係該清模板4置於一封裝模具之上、下模 八 間進行清模作業之示意圖，此時，該第二德*邱 402角緣之溢膠穴403將分別對岸 一、婁工邛 二清時’該清模膠料將逐漸流入並填充滿該模穴：< m該預定填谬區域彻上係保留有大部分未鏤 二ϊγο區域(除第一鎮空部4〇1與第二鎮空部4〇2以 、。”）’故而若相較於習知之口型清模板，本發明中注 入之清模膠料4 3將可確實填滿該模六空間，而不致出現該 上、下模7穴410、420之内壁未與清模膠料43接觸的情形f 因此’原本沾黏於該上、下模穴41〇、42〇内壁上的殘留膠 體將於此清模步驟中沾黏至該清模膠料43上而被完全去 18003 10 1246752 除。 此外，清模過程中，少量之溢勝44將溢流至該排氣 口 41〇a、420a位置，此時，由於本發明之清模板4上的第 二鎮空部402角緣係設計有對應於該排氣口 41〇a、420a 的溢膠穴403;故，該些溢膠44將填充於該溢膠穴4〇3中， 而與填充在預定填膠區域4〇〇本體4〇的清模膠料C往人 為一體，並於該清模板4脫模時隨該硬化之清模膠料43 被移除。 第4C圖係圖示脫模後之清模板4上視圖，此時該預 定填膠區域400的第一鏤空部4〇1與第二鎮空部4〇2均將 :清模膠料43所填滿’而形成圖示之突出膠塊;該突出膠 塊之四角緣的溢膠穴403位置亦將填滿由溢膠料所成妒之 !卞狀a膠體。因此，藉由圖示之膠塊形狀，即可清楚得知 之清模板4不僅可藉該清模膠料43吸附原本殘留於 f裝膠體’復可有效吸附該模穴上之排氣口之殘 此外，本發明之清模板係為—馬口鐵 並非產品使用之導線架，故可明顯地降低清=成 =同時’該預定鄉區域上僅有部分區域鏤空 強度提升，而不致如習知，板因 壞’亦不會導致清模膠料無法完全填滿 杈具之拉穴，而影響清模之效果。 因此’藉由本發明所提出之半導體封 板’確可有效清潔封裝模具之模穴，並避免該封 18003 11 1246752 之排氣口，塞，同時，復降低清模操作之成本。 上述實施例僅例示性說明本發明之原理及i功嗖， 非用於限制本發明。任何熟習此項技藝之人士均可在 I本發明之㈣*範訂，對上述實_特 延 ;。因此，本發明之_保護範圍，應如後述請 乾圍所列。 Τ明寻利 【圖式簡單説明】 第1圖係為習知清模用導線架之上視圖； ，2圖係為習知σ型清模導線架之上視圖； 弟3Α圖係為習知改良式口型清模導線架之 第3Β圖係為第3Ag|中之清模導 ’ 中之剖面圖； 封農模具 第3C®係為第3Α^中之清模導線架置於 中且進行清模注膠後之剖面圖； 封衣模具 第4A圖係本發明之清模板上視圖； 第4B圖係為第4A圖中之清模板置於— 進行清模注膠後之剖面圖；以及 、杈具中且 第4C圖係為第4a 之示意圖。 圖中之清模板完成料並羥脫模後 【主要元件符號說明】1246752 IX. DESCRIPTION OF THE INVENTION: TECHNICAL FIELD The present invention relates to a stencil for a semiconductor package process, and more particularly to a stencil for a semiconductor package process for removing residual colloids in a mold cavity. [Prior Art]: In the packaging technology using the lead frame as the wafer carrier, the process of dressing is to first adhere the wafer to the wafer holder of the lead frame, and then electrically connect the wafer to the lead frame with the = wire. The foot is embossed to the mold to encapsulate the colloid, and the wafer and the bonding wire are coated on the encapsulant sheet to protect it from dust and other impurities. m. Generally speaking, the encapsulating colloid used for encapsulation is mostly a polymer material such as thermosetting ring-shaped polymer. The material is heated and melted, and then the towel is filled, and then the mold is pressed according to the shape of the cavity. Therefore, after the mold is operated, the mold cavity (10) will remain residual - some residuals will not be properly removed, and the residue will be attached to the inner wall of the ^'s inner wall. Mold: The encapsulation of the package causes the seal wheel to not be viewed;::: Seal 13⁄4 xtt but the green/meter lip (LeadFra ase) solves the problem 'The template is placed in the package Mold and middle two with - clear mold compound (Na used to seal the different materials of the agricultural colloid, the same leakage (four), the clear mold compound filled in / 18003 5 1246752 over the clear template, after the molding is completed, the original remains in The body in the cavity will be adsorbed by the mold compound, and the mold can be removed after demolding: the mold compound is removed together. > The conventional template is as shown in the upper view of Fig. 1, - the same ready-made lead frame as the lead frame used in the product], which has the advantage of no need to prepare or design new Clearing the template, and the disadvantage is that the lead frame! After the die, the wafer holder 10 and the surrounding guide pins n will engage with the clear molding compound: the separation cannot be separated, and the lead frame must be cleaned together after the cleaning is performed. The rubber block formed by the molding compound is discarded and cannot be reused. The cost of forming the material also makes the cost of the cleaning operation too high and is not economical. "Therefore, the above disadvantages are complicated, and there is another A one-piece clear template, as disclosed in the Patent Publication No. 270612, has a mouth in the center, and the clear molding compound after the demoulding is concentrated on the opening σ, and the fine is cleaned by the manpower after the completion of the cleaning die. The mold compound is easily pressed and removed; the second figure shows the π-type clear mold lead frame 2'. The mouth-shaped clear mold lead frame 2 is provided with an opening 20' and the size and position of the opening 2〇 In conjunction with the cover model: 5, at the same time, the inner edge of the opening 20 has a protrusion 21, (after the soap is injected into the mold, the glue block formed by the mold is the opening) The large output of 21 buildings, but the mold compound should be taken out of the mold = the glue is peeled from the mouth (4) of Gukou 2 () The rubber block and the wire wood 2' thus play a reusable effect. However, such a die-shaped clear wire lead frame 2 is also lacking during use, because the exhaust port (Vent) on the package mold The position will be covered by the clearing mold, so the clear molding compound will not be able to fill the exhaust ports 1803 1246752. The residual colloid at the position of the 4 position is not easy to package the mold in the mold (four) process, resulting in poor exhaust gas. Bubbles are generated in the encapsulant, which affects the quality of the package. 1 The handle pressure (4) = Needle: Γ: Disadvantages 'Republic of China Patent Announcement 57 唬 逐 逐 出 改良 改良 改良 改良 改良 改良 改良 改良 改良 改良 改良 改良 改良 改良 改良 改良 改良The four corner positions =: square ^ there is a warm rubber hole 31 'the mouth type opening 3 〇 position is the month: 夕 伸 mold hole ' and the position of the overflow 谬 31 corresponds to the second cause of this The clear template 3 is placed on the upper and lower molds as shown in Fig. 3B, and corresponds to the upper and lower mold holes 3 2 〇, 3 3 〇 each elbow knife. Therefore, when the package mold starts to be injected, the flow direction is: 3 ports 21 331 . =: the amount of the mold compound will be filled in the overflow hole 31, and the clear mold block in the opening 3〇 is combined into a body, and can be used in (4) the handle = demoulding: the mold block Also remove, 俾 prevent: = ^ row the orifice, solve the problem of the conventional lip template. However, the lip-type stencil has a structural disadvantage; the biggest disadvantage is that the surface of the vent-shaped opening area is U ❹ and V is insufficient for the original design, as shown in the % view , =吏1 some of the filling _34 can not fill the mold hole of the material mold, the upper mold hole: =: the area is not filled with rubber, and make the = eight inside the wall is not with the mold compound 34 contact, but lost life: the function of the residual colloid; in addition, the opening 30 of the mouth clear template can be excavated, but there is a problem of insufficient strength, and it is easy to cause problems such as deformation of the template 3, 18003 7 1246752 or damage. Therefore, how to propose a low-cost and can effectively play the role of clearing the mold == does not block the exhaust port of the package mold, which has become an urgent problem to be solved. SUMMARY OF THE INVENTION In view of the above disadvantages of the prior art, it is an object of the present invention to provide a template for a semiconductor package process in which the material can be filled with a cavity. Further, another object of the present invention is to provide a stencil for semiconductor package mounting which can effectively clean the vent opening. And, again, the purpose is to provide a low-cost semiconductor package 1 package. . For the purpose of achieving the above, the present invention provides a clear template for a semiconductor package process for removing and removing residual colloids in a packaged puller, the body of which is provided with a plurality of predetermined filling areas. : 躁 躁 =, _ package mold of the majority of the mold position second brother, the work 邛 'system is formed in each of the predetermined filling area of the approximate central position of the three most of the second hollow, respectively, formed in each material The mating-corner position of the filling area; and the majority of the overflowing holes are formed at the corners of each of the second hollow portions, and the overflowing holes are in the same position as the exhaust gas η. The majority of the predetermined predetermined filling areas of Jingying's packaged molds are in a rectangular shape, and the rubber areas are arranged in an array; 7 has a pre-twisted shape. The eight-line extends outward along the corner of the second hollow portion, and A connecting area with the second hollow portion. 18003 8 1246752 The L-core plate is placed in the package mold and the injection-clearing mold is used to fill the cavity of the sealing mold, and the mold is completely replaced. The first hollow portion and the second hollow portion in the filling area are predetermined; at the same time, the overflowing glue overflowing into the exhaust port in the cavity will also be filled in the overflowing glue hole, when the mold is released, and is removed The overflowing of the glue does not cause the exhausting. [Embodiment] Hereinafter, the embodiment of the present invention will be described by way of specific specific examples, and the person skilled in the art will be able to easily disclose the contents disclosed by the present specification. Other advantages and advantages of the present invention can be understood. The present invention can also be applied to ramie by using other different < With the application, it is not necessary to modify and change. Various of the first read main 4Α FIG ,, 'process which is based semiconductor package of the present invention is made of a lead frame, comprising a tin-based sheet to have the sense Xi check "gate. Or a body 40, the body 40 is bounded by a rectangular predetermined packing area 400, and a plurality of predetermined filling areas 400 on the body 40 are respectively At the same time, the approximate central position of each predetermined filling area 400 forms each corner of the right J, J armor area 400, and an empty portion 4〇1', and each predetermined filling operation, By the first setting, a triangular second hollow portion ^, a hollow portion 401 and a second hollow portion 402 are formed, so that each pre-finished rubber area 4 is lifted up, and the clear template is arranged to be arranged. Into the "well" shape; in addition, the corner of the hollow portion 402, the hole 4〇3, is formed in each second, that is, the corner position of the predetermined filling area 400, 18003 9 1246752 The overflow glue holes 403 correspond to the sealing position. a plurality of exhausts of the x-pull each of the predetermined filling regions 400 are sized to match the shape and position of the cavity of the sealing die, and the position of the cavity is a cavity; == domain:: respectively corresponding to each of the packaging molds The size is the same as the filling area of the mold on the package mold, so that the cleaning template 4 is placed in the package mold "two equal, exactly corresponding to a cavity space. The glue hole 403 is formed along the first outward extension, and the corner edges of the second hollow portion 4〇2 are connected to each other as shown in the figure-Funnel shape M〇2 and the overflow glue hole and the brother 4B The figure is a schematic diagram of the clear template 4 placed on a package mold and the lower mold is used for the mold clearing operation. At this time, the second glued hole 403 of the second German-Yu 402 edge will be opposite to the shore. At the time of the second clearing, the clear molding compound will gradually flow into and fill the cavity: < m The predetermined filling area will retain most of the untwisted γ ο area (except the first vacant part 4〇1) Compared with the second-hand emptying part, the "2" is used in comparison with the conventional oral clearing template, the clear molding glue injected in the present invention. 4 3 will be able to fill the mold space six without the occurrence of the inner wall of the upper and lower mold 7 holes 410, 420 not contacting the clear mold compound 43. Therefore, the original mold is adhered to the upper and lower mold holes. The residual gel on the inner walls of the 41 〇, 42 将 will be adhered to the clear molding compound 43 during the cleaning step and completely removed by the 18003 10 1246752. In addition, during the cleaning process, a small amount of overflow 44 will overflow to the position of the exhaust ports 41〇a, 420a. At this time, since the second hollow portion 402 on the cleaning template 4 of the present invention has a corner design Corresponding to the venting holes 403 of the exhaust ports 41〇a, 420a; therefore, the overflow glues 44 will be filled in the overflowing glue holes 4〇3, and filled in the predetermined filling area 4〇〇 body 4〇 The clear molding compound C is integrated into the body, and is removed with the hardened molding compound 43 when the cleaning template 4 is demolded. 4C is a top view of the cleaning template 4 after the demolding, in which the first hollow portion 4〇1 and the second hollow portion 4〇2 of the predetermined filling region 400 will be: the clear molding compound 43 Filling up to form the protruding block of the figure; the position of the overflow hole 403 of the four corners of the protruding block will also be filled with the gel-like material; Therefore, it can be clearly seen from the shape of the rubber block shown in the figure that the template 4 can be adsorbed not only by the mold compound 43 but also by the exhaust port which is effectively retained on the mold cavity. In addition, the clear template of the present invention is that the tinplate is not a lead frame used for the product, so that the clearing of the blank can be significantly reduced, and at the same time, only the partial area of the predetermined township area is increased in hollow strength, as is not known, Bad 'will not cause the mold compound to not completely fill the hole of the cookware, which will affect the effect of the mold. Therefore, the semiconductor sealing plate proposed by the present invention can effectively clean the cavity of the packaging mold and avoid the venting opening and plug of the sealing 18003 11 1246752, and at the same time, reduce the cost of the cleaning operation. The above embodiments are merely illustrative of the principles and advantages of the present invention and are not intended to limit the invention. Anyone who is familiar with the art can make a copy of the invention (4)*. Therefore, the scope of protection of the present invention should be as listed below. Τ明寻利 [Simplified illustration of the drawing] The first picture is the upper view of the lead frame for the conventional clear mold; 2, the view is the upper view of the conventional σ-type clear mold lead frame; the third picture is the conventional improved The third diagram of the die-cutting lead frame is the section in the clearing guide of the 3Ag|; the 3C® of the sealing mold is placed in the middle of the clearing wire lead in the third layer and is cleaned. Sectional view after injection molding; Figure 4A of the sealing mold is a top view of the cleaning template of the present invention; Figure 4B is a sectional view of the cleaning template placed in Figure 4A after the injection molding; and The middle figure and the 4C figure are the schematic diagram of the 4a. After the template is completed and the hydroxy mold is removed, the main component symbol description
1、2 清模導線架 10 晶片座 11 導腳 20 開U !8〇〇3 12 1246752 21 突出物 3、4 清模板 30 開口 31 溢膠穴 32 上模具 320 上模穴 321 、 331 排氣口 33 下模具 330 下模穴 34、43 清模膠料 40 本體 400 預定填膠區域 401 第一鏤空部 402 第二鏤空部 403 溢膠穴 41 上模具 410 上模穴 410a、420a 排氣口 42 下模具 420 下模穴 44 溢膠1, 2 clear mold lead frame 10 wafer holder 11 lead 20 open U ! 8 〇〇 3 12 1246752 21 protrusion 3, 4 clear template 30 opening 31 overflow glue hole 32 upper mold 320 upper mold hole 321, 331 exhaust 33 lower mold 330 lower mold hole 34, 43 clear mold compound 40 body 400 predetermined filling area 401 first hollow portion 402 second hollow portion 403 overflow glue hole 41 upper mold 410 upper mold hole 410a, 420a exhaust port 42 under Mold 420 lower mold cavity 44 overflow glue