TW200607057A - Lead frame base for semiconductor packaging process - Google Patents
Lead frame base for semiconductor packaging processInfo
- Publication number
- TW200607057A TW200607057A TW093124007A TW93124007A TW200607057A TW 200607057 A TW200607057 A TW 200607057A TW 093124007 A TW093124007 A TW 093124007A TW 93124007 A TW93124007 A TW 93124007A TW 200607057 A TW200607057 A TW 200607057A
- Authority
- TW
- Taiwan
- Prior art keywords
- lead frame
- frame base
- predetermined areas
- packaging process
- semiconductor packaging
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/93—Batch processes
- H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
Abstract
A lead frame base for a semiconductor packaging process is used to remove resin residues in an encapsulation mold. The lead frame base includes a body having a plurality of predetermined areas for being filled with a resin, wherein the predetermined areas correspond to a plurality of mold cavities of the encapsulation mold respectively; a plurality of first openings each formed substantially at a central position of each of the predetermined areas; a plurality of second openings each formed at a corner position of each of the predetermined areas; and a plurality of flash cavities connected to the second openings and corresponding to a plurality of air vents of the encapsulation mold respectively. This lead frame base has improved performance on resin removal as compared to a conventional lead frame base.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW093124007A TWI246752B (en) | 2004-08-11 | 2004-08-11 | Lead frame base for semiconductor packaging process |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW093124007A TWI246752B (en) | 2004-08-11 | 2004-08-11 | Lead frame base for semiconductor packaging process |
Publications (2)
Publication Number | Publication Date |
---|---|
TWI246752B TWI246752B (en) | 2006-01-01 |
TW200607057A true TW200607057A (en) | 2006-02-16 |
Family
ID=37193819
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW093124007A TWI246752B (en) | 2004-08-11 | 2004-08-11 | Lead frame base for semiconductor packaging process |
Country Status (1)
Country | Link |
---|---|
TW (1) | TWI246752B (en) |
-
2004
- 2004-08-11 TW TW093124007A patent/TWI246752B/en not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
TWI246752B (en) | 2006-01-01 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |