TWI236326B - Fabricating process of circuit board with embedded passive component - Google Patents

Abstract

A fabricating process of circuit board with embedded passive component is described. The process comprises few steps. First, a circuit substrate is provided, and the circuit substrate has a conductive layer, and at least one material layer of passive component. Additionally, the conductive layer is on a surface of the circuit substrate, and the conductive layer covers the material layer of passive component. The conductive layer has at least one component region, and the material layer of passive component is set on the component region. Next, a patterned photoresist layer is formed on the conductive layer. The conductive layer is carried out a first etching process and a second etching process to form a circuit layer. A basic etchant, is used in the first etching process, and an acid etchant is used in the second etching process.

Description

1236326 V. Description of the invention (1) is related to [the technical field to which the invention belongs] The present invention relates to a circuit board manufacturing process, and particularly a kind of electricity with embedded passive components [prior art] > The integration degree (integration) is higher. Hi f is used for the circuit boards of electronic products with a south integration degree, and its line width is also dependent on layers and 2 layers, which is fi 靥, _____ .. so that if pieces can be more dense Mounted on a printed circuit board. However, the increase in the number of layers and the denseness of the lines, and the transmission of the signal in the circuit board, the effects caused by the resistance-capacitance delay effect (Rc deUy) or cross talk effect (cross talk) are becoming more and more obvious. For the electrical properties of the board, passive components must be added to the limited layout area of the board. With the improvement of the electrical performance of the circuit board, as described above, in addition to the passive components on the limited layout area of the circuit boards, various electronic components must be provided. In addition, standardized passive components with specific electrical values may not fully meet the special circuit design, so it is a feasible solution to make passive components directly inside the circuit board. Furthermore, the passive components inside the circuit board can also be adjusted with the circuit board's wiring design and material selection. It is worth noting that the material of the circuit board circuit layer is usually copper, and acid and etching solution are usually used in the #etching process of the circuit layer, because acidic etching solution will not cause circuit wheel temples (pr 〇fi 1 e ) Has an undercut. In addition, for the conventional manufacturing process of a circuit board with embedded passive components, two opposite surfaces of such a circuit board are provided with circuits.

13454twf.ptd Page 7 1236326 V. Description of the invention (2) layer, but outside the two-layer line, the etching process of this two-layer line using the passive element material element can not reach the pre- [content of the invention] In view of this, the circuit of the passive element The etching liquid is damaged, and then a circuit substrate layer is provided based on the electricity of the above-mentioned passive component, wherein the conductive layer covers the passive component material and one of the passive component materials is usually covered at the same time, and the dynamic component material layer is usually used at the same time. This acidic etching solution is formed, and the layer is formed by the second etching process. The layer will be subjected to the acidic etching solution. • During the etching process, some electrical specifications are regulated. Injury, which in turn causes the board manufacturing process of the present invention to be buried or its circuit board system, its system is located in the layer. This layer is matched to form a patterned photoresist layer in a first money engraving process and a first middle time engraving test money engraving solution with a single eye, in a different way, with a line outside, placed on The passive etching of the conductor avoids the passive. For example, the conductor substrate is engraved on the conductive layer of the conductive substrate. The passive component, such as a cladding and a layer with a layer, is connected. The liquid is provided. Several at least-surfaces, with at least element regions, pair to form while the second has material yield. One step. Passive element and conductor-element domain. Embedding is embedded in the conductor-line rhyme. First, the material layer covers the area, and then the layer is layered. The process uses the acidic etching solution such as chlorine, as described in the preferred embodiment of the present invention. Copper solution or vaporized iron solution. According to the description of the preferred embodiment of the present invention, the test solution includes, for example, an Armonia solution or a gasification solution. According to a preferred embodiment of the present invention, the material of the 'conductor layer is, for example,

1236326 V. Description of the invention (3) Copper. According to a preferred embodiment of the present invention, the circuit layer further includes, for example, a first electrode and a second electrode electrically isolated from each other, which are respectively connected to the passive element material layer, and the material of the passive element material layer includes a resistor. material. In addition, the resistance material includes nickel-filled acid. According to a preferred embodiment of the present invention, the circuit substrate further includes, for example, at least one electrode layer, which is located on the passive element material layer and the element region. The circuit layer further includes a first electrode and a second electrode. The electrode system is connected to the electrode layer, and at least part of the electrode layer and at least part of the second electrode system overlap each other, and the material of the passive element material layer includes a capacitor material. In addition, the capacitor material includes, for example, barium titanate. According to a preferred embodiment of the present invention, a method for forming a patterned photoresist layer on a conductive layer includes, for example, forming a photoresist layer on the conductive layer, and then performing an exposure process and a development process on the photoresist layer. In addition, a method of forming a photoresist layer on the conductor layer includes, for example, applying a liquid photoresist or attaching a photoresist dry film. According to a preferred embodiment of the present invention, after the first etching process and the second etching process are performed on the conductor layer, for example, the patterned photoresist layer is further removed. Based on the foregoing or other objectives, the present invention proposes a circuit board manufacturing process with embedded passive components, which includes, for example, several steps. First, a circuit substrate is provided, which has a first conductor layer, a second conductor layer and at least one passive element material layer, wherein the first conductor layer and the second conductor layer are respectively located on two opposite surfaces of the circuit substrate. In addition, the second conductor layer system

13454twf.ptd Page 9 1236326 V. Description of the invention (4) ------ Covers the passive element material layer, and the second conductor layer has at least one element area 'and the passive element material layer is arranged in the second conductor layer On the component area. Then, a first photoresist layer and a second photoresist layer are formed to cover the first conductor layer and the second conductor layer, respectively. The first photoresist layer is patterned, and a first etching process is performed on the first conductor layer to form a first circuit layer. In other words, the patterned first photoresist layer and the second photoresist layer are removed, and a third photoresist layer and a fourth photoresist layer are respectively covered on the first circuit layer and the second conductor layer. . Next, a fourth photoresist layer is patterned. Furthermore, a first remaining etching process and a third etching process are performed on the second conductor layer to form a second circuit layer. The second etching process uses an acidic etching solution, and the third remaining etching process uses an Experiential remaining liquid. According to a preferred embodiment of the present invention, the acidic etching solution includes, for example, a vaporized copper solution or a ferric chloride solution. According to a preferred embodiment of the present invention, the alkaline etching solution includes, for example, an Armonia solution or a vaporized ammonium solution. According to a preferred embodiment of the present invention, the material of the first conductor layer and the second conductor layer is, for example, copper. According to a preferred embodiment of the present invention, for example, the second circuit layer further has a first electrode and a second electrode electrically isolated from each other, which are respectively connected to the passive element material layer, and the material of the passive element material layer is Includes a resistive material. In addition, the resistance material includes nickel phosphate. ·,

1236326 V. Description of the invention (5) The second circuit layer further has a first electrode and a second electrode, wherein the first electrode system is connected to the electrode layer, and at least part of the electrode layer and at least part of the second electrode system overlap each other. The material of the passive element material layer includes a capacitor material. In addition, the capacitor material includes, for example, barium titanate. According to a preferred embodiment of the present invention, the method for patterning the first photoresist layer and the patterning the fourth photoresist layer includes, for example, an exposure process and a development process. According to a preferred embodiment of the present invention, a method for forming a first photoresist layer, a second photoresist layer, a third photoresist layer, and a fourth photoresist layer includes, for example, applying a liquid photoresist or attaching a photoresist to dry membrane. According to a preferred embodiment of the present invention, after the second etching process and the third etching process are performed on the second conductor layer, for example, the patterned fourth photoresist layer and the third photoresist layer are further removed. Based on the above, the circuit board process with embedded passive components of the present invention uses a two-stage etching process to form a circuit layer contacting the passive component material layer, and the two-stage etching process is a first etching process using an acidic etchant first Then, a second etching process using an alkaline etchant is performed, so the two-stage etching process can prevent the acidic etchant from damaging the passive element material layer, thereby improving the process yield of the embedded passive element. In order to make the above and other objects, features, and advantages of the present invention more comprehensible, a preferred embodiment is given below and described in detail with reference to the accompanying drawings. '[Embodiment] [First Embodiment] Figs. 1A to 1C show a structure according to a first preferred embodiment of the present invention.

13454twf.ptd Page 11 1236326 V. Description of the invention (6) The schematic diagram of the cross-sectional structure of the circuit board manufacturing process of formula i 3, pcs. See ^. The circuit board manufacturing process of the sound-in-type passive component includes, for example, several steps. No. 1 provides a circuit substrate 110 having a conductor layer 120 and a passive 7C material layer i 3 〇, where the conductor layer i 2 〇 is located on one surface of the circuit substrate 10 and the conductor layer 12 0 covers the passive Element material layer 13〇. In addition, the conductor layer 120 has at least one element region 120a, and the passive element material layer 130 is disposed on the element region 120a of the conductor layer 120. In addition, the material of the body layer 120 includes, for example, copper or other materials with good conductive properties. Referring to FIG. 1A, a photoresist layer 21o is formed on the conductor layer 120, and a method of forming the photoresist layer 120 is, for example, attaching a photoresist. Dry film (dry film), state photoresist. Referring to FIG. 1B, an exposure process is performed on the photoresist layer 20 to form a patterned photoresist layer 212. Connect to :: road layer m (as shown in Figure κ). In addition, the U-based etching solution is used, and the acidic etching solution includes, for example, a gasified steel solution :: or other appropriate acidic etching solution. Special iron lice: The engraving process does not completely etch the conductive layer 120: road; for example:-the factory does not remove and only the part of the conductive layer 1LY. As shown in Fig. 1C-Fig. 1C, an etching process is formed for the above process to form a circuit layer 122, wherein π is structured into a first alkaline etching solution, and the alkaline etching solution includes, for example, a one-step process. Use: Or other appropriate qualitative analysis = layer (as shown in Figure 1B), in order to fully expose the heart layer case 12 = 2 = page 13454twf.ptd I236326 5. The invention is outside the point, = type Circuit board 100 for passive components (as shown in Figure lc).

For example, the second circuit layer 122 has a first electrode 122a and a second electrode 122b of φ 13 °, which are respectively connected to the passive component material H. Materials such as nickel phosphate or other materials are material. It ’s important to note that when the conductive layer is made of steel, the conductor layer 120 (as shown in Figure 1B) is used for the time being. Ϊ = 130 (for example, nickel phosphate resistance material). Defective ϊ = Second money engraving process last name engraved the circuit layer 丨 22, in addition to the undercut phenomenon produced by the engraving liquid 20, acid can be avoided; the use of two metal circuits can be produced in both ways) Process, posterior etching solution diversion. The two-in-combination type can be included in the early-stage circuit board without the two pieces, and the circuit board 1 1 0 is determined by the resistance material. In addition, the passive component material layer 130 is not limited to the detailed description such as Rear. The passive 70 material layer 130 may be a capacitor material. [Second Embodiment] The Yuli quilt: 2 η is a schematic cross-sectional structure diagram of a circuit board manufacturing process that does not follow the second preferred embodiment of the present invention. Please refer first

Page 13 1236326

According to FIG. 2A, the second embodiment is different from the first embodiment in that the circuit substrate 310 is a multilayer circuit board and the material of the passive component material layer 34 is a capacitor material. Electric valley material damaged by acidic etching solution. The circuit substrate 310 has a first conductive layer mo, a second conductive layer 3 3 0, at least one passive element material layer 34 0, and a disk θ at least 1 3 5 0, wherein the first conductive layer 32 0 and the second conductive layer 33μ is located on two opposite surfaces of the line substrate 31 °. In addition, the second conductor layer covers the passive element material layer 340 and the electrode layer 350, and the second conductor layer has at least one element region 3 3 0 a, wherein the passive element material layer 34 0 is disposed on the second body layer 3 3 0 On the device region 3 3 0 a, and the electrode layer 26 0 covers the passive material layer 340 and the device region 3 3 0 a. Please continue to refer to FIG. 2A to form a first resistive layer on the first conductor layer “ο. 410, and a second photoresist layer 42o is formed on the second conductor layer 33o, where the method of the first photoresist layer 4 10 and the second photoresist layer 42 is, for example, attaching a photoresist dry film (dryfi 1 m) or coating a liquid photoresist. Referring to FIG. 2B, an exposure process and a development process are performed on the first photoresist layer 410 to form a patterned first photoresist layer 412. Then, for the first conductor layer 412 A first etching process is performed to form a first circuit layer 3 2 2. Referring to FIG. 2C, the patterned first photoresist layer 412 and the second photoresist layer 42 are removed, and a third light is formed. The resist layer 43 0 covers the first circuit layer 3 2 2 and forms a fourth photoresist layer 4 ^ ° and covers the second conductor layer 330 The third photoresist layer 430 can be avoided. Second, the road layer 3 2 2 is damaged in the subsequent etching process. Among them, the method of forming the second photoresist layer 430 and the fourth photoresist layer 440, such as attaching light. Dry-resistance, 0film) or coating liquid photoresist. Then, for the fourth photoresist layer

13454twf.ptd Page 14 1236326 V. Description of the invention (9) Perform a patterning process (for example, the fourth photoresist layer 442 (as shown in Figure 2D; \ shirt process) to form a pattern. Please refer to Figure 2D. The two do not). Process, and the second last engraving process \ 官 | 二 f 体 层 3 3 0 to perform a second last engraving of copper solution, ferric chloride solution or 1 = etching solution (such as the second conductor layer 3 including most of chlorination) '30,%? For acid use: etching solution.), The second guide using the etching solution of the second etching method is not shown in Figure 2E, and then the metal is etched to the above JJ3. line. Please refer to the engraving process to facilitate the third etching of the structure formed by the second conductor. The second etching process uses one: 30: two liquid, gasified ammonium solution or other etching solution (such as Armonia Dissolve the third photoresist layer 4 3 0 and the patterned first field, the etch solution). Then, remove to form a layer 442 with embedded passive element Y (as shown in FIG. 2D), ^ ^^ 3 3 2 ^ ^: the electrode 3 3 2b, of which the electrode 3 3 2a and the electrode 3 3 2a and A second small portion of the electrode layer 3 50 and at least a series connection are connected to the electrode layer 35 (), and then stacked to form a buried capacitor V. The second electrode 3321) is mutually heavy. If the passive component material layer 340 (such as barium titanate dielectric material) is easily damaged by acidic etching solution, a two-stage etching process is performed on the second conductor layer. (The acidic etching solution process is used first, and then the alkaline etching solution process is used) to form the second circuit layer '3 3 2'. As a result, in addition to avoiding damage to the passive element material layer 340, the electricity of the circuit board 3_0 0 can be increased. Sexual quality. The conventional technology is a patterning process for the first conductive layer 3 2 0 and the first conductive layer 330 at the same time.

13454twf.ptd Section 15 胄 1236326 V. Description of the invention (10) Material layer 340 caused phase damage. Therefore, Li__ layer 3 2 0 is patterned (Ice: the first conductor in the embodiment), and then the second conductor is thick and contacts the passive component material layer 340 'layer 3 3 0. Axe submits the material layer 34 0) to improve the dragging process of tea (the contact with passive elements is noteworthy in this document; the quality of the leather moving elements. 1 Α and Figure 2 Α Structure, the circuit board manufacturing process is not limited to the circuit layer used in the diagram or 340. The contact passive component material layer 1 30 etching solution process can be used first to improve the embedding process, and then use alkaline. The present invention is not limited to the manufacturing yield of 70 pieces. In addition, the pieces can also be used to make embedded i-type resistor elements or embedded capacitor elements. As described above, the tit element of the present invention. The process has the following advantages: 1. Circuit board manufacturing with embedded passive components. 1. Compared with the conventional circuit board manufacturing process, the use of the first acidic bismuth = invented embedded etching with embedded passive components' to form the connection. = t ^ The two-stage moving element material layer of the etching solution and the post-alkali etching solution will not be lined by the acid material layer Layer, which is damaged by the yield rate etching solution of the passive component, thereby improving the embedding method. The circuit of the present invention, which is used in the present invention, is even more acidic. As a result, not only does any moving element material layer contact the passive element material layer suffer damage. The required circuit layer can also avoid the first conductor layer of the material layer (no contact with the passive element material element material layer? Ί = 1 = the second conductor layer (% passive with contact) ^ and the remaining process, the result can improve the passive

13454twf.ptd Page 16 1236326 V. Description of the Invention (11) The component material layer is damaged by the acidic etching solution. Although the present invention has been disclosed as above with a preferred embodiment, it is not intended to limit the present invention to 'any enthusiast who is skilled in this art'. Without departing from the spirit and scope of the present invention, some modifications and retouching can be made. The scope of protection of the invention shall be determined by the scope of the attached patent application.

13454twf.ptd Page 17 1236326 Brief Description of Drawings Figures 1A to 1C are schematic cross-sectional structures of a circuit board with embedded passive components according to the first preferred embodiment of the present invention. 2A to 2E are schematic cross-sectional structures of a circuit board manufacturing process with embedded passive components according to a second preferred embodiment of the present invention. [Schematic description] 100, 300 ·· Circuit board with embedded passive components 1 1 0, 3 1 0: Circuit board 1 2 0: Conductor layer 120a, 330a: Element area 1 2 2: Circuit layer 122a, 332a ·· First electrodes 122b, 332b: Second electrodes 1 3 0, 3 4 0: Passive element material layer 210 Photoresistive layer 212 Patterned photoresistive layer 320 First conductive layer 322 First wiring layer 330 Second Conductor layer 332 second circuit layer 350 electrode layer 410 first photoresist layer 412 patterned first photoresist layer 420 second photoresist layer 430 third photoresist layer

13454twf.ptd Page 18 1236326 Simple illustration of the diagram 4 4 0 · 4th photoresist layer 4 4 2 · · Patterned fourth photoresist layer IIIH1 Page 19 13454twf.ptd

Claims (1)

Ϊ236326 A circuit board manufacturing process with embedded passive components includes: providing a circuit substrate having a conductor layer and at least one passive element layer, wherein the conductor layer is located on a surface of the circuit substrate, and Cover the passive element material layer, and the conductor layer has at least = piece area 'and the passive component material layer is arranged on the piece area of the conductor layer; The electrical isolation of the ammonium electricity and the electricity forming a patterned photoresist layer on the conductor layer; and performing a first etching process and a second etching process on the conductor layer to form a circuit layer, wherein the The first etching process uses an acidic etching and the second etching process uses an alkaline etching solution. • As described in item 1 of the patent scope, a process for slabs with embedded passive components, where the acidic etching solution includes a vaporized copper solution and chlorinated 3 System 5 · If the road board system is one of the passive elements 6 · If the road board system is required, please make a special trip, if you are in the middle, please make a special trip, please make a special trip, if the second piece of material, please make a special trip. The benefits of the electrode and the material layer, wherein the alkaline etching solution with the embedded passive element described in the first item includes the Armonia solution and the material with the conductive layer of the embedded passive element described in the first item. For copper. The circuit layer with an embedded passive component described in item 1 further has a first electrode and is electrically connected to the passive component material layer, and the material includes a resistive material. (1) The item Λ has embedded passive elements. The resistor material includes nickel phosphate. 1236326 6. Scope of patent application 7. The process of the circuit board with embedded passive components described in item 1 of the scope of patent application, wherein the circuit substrate further includes at least one electrode layer located on the passive component material layer and the component Area, and the circuit layer further has a first electrode and a second electrode, wherein the first electrode system is connected to the electrode layer, and at least part of the electrode layer and at least part of the second electrode system overlap each other, The material of the passive element material layer includes a capacitor material. 8. The process of manufacturing a circuit board with an embedded passive component as described in item 7 of the scope of patent application, wherein the capacitor material includes barium titanate. 9. The process of manufacturing a circuit board with an embedded passive component as described in item 1 of the scope of patent application, wherein the method of forming the patterned photoresist layer on the conductor layer includes first forming a photoresist layer on the conductor layer Then, an exposure process and a development process are performed on the photoresist layer. 10. The process for manufacturing a circuit board with an embedded passive component as described in item 9 of the scope of the patent application, wherein the method of forming the photoresist layer on the conductor layer includes applying a liquid photoresist and attaching a photoresist dry film one of them. 1 1. The process for manufacturing a circuit board with an embedded passive component as described in item 1 of the scope of patent application, wherein the first etching process and the second etching process are performed on the conductor layer and the patterned light is further removed. Barrier layer. 12. A process for manufacturing a circuit board with embedded passive components, including: providing a circuit substrate having a first conductor 'layer, a second conductor layer, and at least one passive component material layer, wherein the first conductor layer And the second conductor layer are respectively located on two opposite surfaces of the circuit substrate, and the second conductor layer covers the passive element material layer, and the second conductor layer has 13454twf.ptd Page 21 1236326 6. The scope of the patent application is one element area less, and the passive element material layer is arranged on the element area of the second conductor layer; forming a first photoresist layer and a second photoresist Layers respectively covering the first conductor layer and the second conductor layer; patterning the first photoresist layer; performing a first etching process on the first conductor layer to form a first circuit layer; removing the pattern Forming the first photoresist layer and the second photoresist layer; forming a third photoresist layer and a fourth photoresist layer to cover the first circuit layer and the second conductor layer respectively; patterning the A fourth photoresist layer; performing a second etching process and a third etching process on the second conductor layer to form a second circuit layer, wherein the second etching process uses an acidic etchant and the third etching The process uses an alkaline etchant. 1 3. The process for manufacturing a circuit board with embedded passive components as described in item 12 of the scope of patent application, wherein the acidic etching solution includes one of a vaporized copper solution and a vaporized iron solution. '1 4. The process for manufacturing a circuit board with embedded passive components as described in item 12 of the scope of patent application, wherein the alkaline etching solution includes one of an Armonia solution and a gasification solution. 1 5. The process for manufacturing a circuit board with embedded passive components as described in item 12 of the scope of patent application, wherein the material of the first conductor layer and the second conductor layer is copper. 16. With embedded passive element as described in item 12 of the scope of patent application 13454twf.ptd Page 22 1236326 6. The process of applying for a circuit board for a patent application, wherein the second circuit layer further has a first electrode and a second electrode electrically isolated from each other, which are respectively connected to the passive component material layer The material of the passive element material layer includes a resistive material. 1 7 · If applied, please refer to the process of manufacturing a circuit board with embedded passive components as described in item 丨 6 of the patent, wherein the resistive material includes nickel phosphate. The embedded passive element described in item 12 of the patent application scope is located on the passive element. The circuit substrate further includes at least one electrode layer, and the circuit layer further has a first material layer and the element area. And the second line is connected to the electrode layer, and δ and a second electrode, wherein the first electrode system and the second electrode system mutually overlap a small portion of the electrode layer and at least a portion of the capacitor material. & 'And the material of the passive component material layer includes a 1 9 · As a patented circuit board process, it has embedded passive elements as described in item 18 of the park. The capacitor material includes barium titanate. Circuit board manufacturing process, the method of patterning the first photoresistive layer and patterning the first piece in a method package with an embedded passive element and a layer described in Item 12 of I Fan Yuan > 2 1 · If applying for a patent t exposure process and development process. The process of the electrical circuit board of the drawer is based on the embedded passive element pi described in Item 12. You can read the third photoresist layer ii to form the first photoresist layer, the second photoresist, and the photoresist. The method of the fourth photoresist layer includes coating a liquid light member + 2 2. As described in the patent application ^, the circuit board process, the embedded passive element and the third etching described in item 12 of the park ^ After performing the second etching on the second conductor layer, the method further includes removing the patterned fourth Page 23 1236326 6. Scope of patent application Photoresist layer and the third photoresist layer. 13454twf.ptd