1235634 九、發明說明： 【發明所屬之技術領域】 本發明關於一種在電路基板上表面組裝電子零件的電子 零件裝載用盒體及其形成方法。 【先前技術】 用於電知或行動電活等電子裝置内的電子零件，隨著本 體的電子裝置的簡潔化，而要求進一步的小型化，同時， 還嚴格要求電子零件的精度、成本的低廉化、提高作業性 等。 就電腦而言’在藉由錫焊組裝在爲印刷基板的主板上的 LSI (Large Scale Integrated Circuit)等電子零件中，在盒體（電子零 件的外裝）本體的外部露出地形成與上述主板上的配線圖 案電性連接的端子。例如，在LSI中具有外形特徵被稱爲s〇p (Small Out-line Package)的盒體，亦即在矩形狀的盒體本體上朝 外形成有曲臂形的端子。從該SOP的盒體本體朝外形成的 端子，由於成爲使主板上的組裝面積大過盒體本體的面積 的主要原因，因此若考慮本體的電子裝置的簡潔化，其尚 有改進的空間。因此，也進行開發以端子作爲旋入盒體内 側的J型端子，而謀求小型化的稱之爲SOJ (Small Out-line J-lead) 的LS卜 關於行動電話，必須減小其組裝面積，例如，製作收發 資訊時的無線頻率的VCO (Voltage Controled Oscillator)至少具備 接地端子、電源電壓輸入端子、控制電壓輸入端子、頻率 輸出端子等端子中的1個，在形成大致方形狀的盒體的側面 90735-940218.doc 1235634 寺的表面，盘各微士 μ 士 〃 體表面大致同一面地露出形成上述端 子。 恭如以往經過多種努力’利用錫焊在印刷基板上组裝 电子令件時’簡潔地形成的盒體的表面，形成與該本體表 面大致同一面地露出的端子的電子零件，在減小組農面積 方面，此係最優越者。 、 山而且’例如，在上述vco甲，當在盒體的表面形成接地 端子或其他的輸出人端子（獨立端子）時，以往的—般的方 法，係在由樹脂等構成的盒體的表面，利用鍍焊錫法或印 刷法形成端子，構成電路，在後續工序中裝載片零件’作 爲模組完成VCO。 但是，如此先前的方法，由於在盒體的表面（特別是側面） 形成端子的作業非常困難，因此存在效率低、成本高的缺 陷。 、 【發明内容】 爲此’本發明的目的係提供-種滿足電子零件小型化的 需求且進行表面安裝時的連接穩定性佳的電子零件裝載用 盒體，及可以簡單且便宜地於盒體表面形成接地端子及其 他端子的電子零件裝載用盒體形成方法。 爲實現上述目的’本發明的電子零件裝載用盒體，係用 於在電路基板上表面組裝電子零件的電子零件裝載用盒 體，其特徵在於：在由成型樹脂材料形成的盒體本體的側 面具有至J1根共用端子、及/或至少i根獨立端子，上述 共用端子’在上述盒體本體的上面，與該上面大致同一面 90735-940218.doc 1235634 地露出一方的端部，在上述盒體本體的底面，與該底面大 致同一面地露出另一方的端部並且與端子基板部相連接， 上述獨立ί而子，在上述盒體本體的上面，與該上面大致同· 一面地露出一方的端部，在上述盒體本體的底面，與該底· 面大致同一面地露出另一方的端部。 此外，其特徵在於：在上述盒體本體的上面中央部，具 有可收納裝載的電子零件的一部分的空間部。 八 對於该電子零件裝載用盒體，在形成在該電子零件裝載 用盒體的上面的空間部π，收納裝載的電子零件的一部 刀，同時將上述電子零件的連接端子連接在，在該電子零 件裝載用盒體的上面露出形成的對應的共用端子等共用端 子及/或獨立端子上，在形成丨個模組後，將該模組配置在 電路基板的規定位置，用於電性連接形成在上述電路基板 上的端子和上述電子零件裝載用盒體的端子。 一另外，本發明的電子零件裝載用盒體，由於形成與該盒 ^本體的表面大致同一面地露出的端子，在通過錫焊組裝 电子零件時，能夠與該組裝面積最小化。而且，在電子零 /裝載用i體的側面，用規定的面積線狀配置的端子，與 $ =組裝上述電子零件的電路基板上的端子的锡焊能夠 更牢固’能夠形成表面組裝時的連接穩定性優良的端子。 立卜通過在形成在該電子零件裝載用盒體的上面的空間 p内，收納農載的電子零件的一部分，能夠利用該盒體本 兩保&上述電子零件的局部’同時’能夠減小採用該電子 令件衣載用盒體的模組本體的高度尺寸。 90735-940218.doc 1*235634 此外，本發明的電子零件裝载用盒體的形成方法，其特 徵在於& 3以下工序.從形成帶狀的導電性板材衝壓形 成接觸終端的接觸終端形成H接觸終 述導電性板材的縱向的兩側部及連結該兩側部間的連接部 的支座部、藉由連結部連結在上述支座部上的端子美 部、從上述端子基板部延伸的至少丨個的第i端子片、;及 連結在上述支座部上並向上述端子基板部 的配設方向的相 反方向延伸的至少Η固第2端子片；盒體框架形成工序，彎 曲形成上述第1端子片而作爲連結在上述端子基板部上的 共用端子，彎曲形成上述第2端子片而使其與上述支座部交 叉地向上述端子基板部的配設方向折彎而作爲獨立於上述 端子基板部的獨立端子，而形成盒體框架；盒體本體形成 :序，藉由樹脂材料的嵌入成形而將上述共用端子與獨立 端子成爲一體地形成盒體本體；及切斷分離工序，切斷從 上述电子+件裝載用盒體本體突出的上述接觸終端的各部 分’开> 成單體的電子零件裝載用盒體。 另外，如上述盒體框架形成工序所述， 上述盒體框架形成工序中，上述第丨端子片，其二述導: 性板材的-表面側大致垂直地折彎其前端部，而作為在該 電子零件冑載用t體的電子零件裝載面露出的端子部，在 忒導電性板材的上述一表面側大致垂直地折彎與上述端子 基板部的連結部位的附&，而作為在該電子零件裝載用盒 體的側面露出的端子部，從而形成上述共用端子；上述第2 知子片在上述導電性板材的一表面側大致垂直地折彎其 90735-940218.doc 1235634 =部’而作為在該電子零件裝載用盒體的電子 面路出的端子部，在該導電性板材的上述另—表㈣衣= 二垂直地折彎射間部位，而作為在該電子 '載用= ::::裝載用盒體的電子零件裝載面露出的端:::: 路出的端子部配置在上述端子基 獨立端子。 v 了迎而形成 此外’如上述電子零人 、十、甘处 衣载用益體的本體形成工序所 2序中在於：在上述電子零件裝_盒體的本體形成 工序中，以在該電子零件裝 框㈣… γ件裝載用益體的表面露出上述盒體 “的I、用端子及獨立端子的外表面的方式， 述盒體框架形成工序中形成的盒體框架，配置在包含形成 有可注入成型樹脂材料的空腔的下金屬模與上金屬模的一 ==才莫中；或者以在該電子零件裝載用盒體的表面露出 體框架的上述接地端子及獨立端子的外表面，且電 子夺件裝载用盒體的上面中央形成可收容裝載於該電子零 件裝_⑼上面的電子零件的—部分的空間部的方式y 將在上述盒體框架形成工序中形成的盒體框架配置在包含 形成有可注入成型樹脂材料的空腔的下金屬模和上金屬模 的對金屬模上，再藉由在上述空腔内注入成型樹脂材料 而將上述各端子固定在該電子零件裝載以體的規定位 置，從而得到盒體本體。 如果採用具有上述特徵的本發明的電子零件裝載用盒體 的形成方法’如前所述，能夠簡單地形成以如下爲特徵的 90735-940218.doc -10- 1235634 私子令件I載用盒體，即，在盒體本體的側面，具有至少^ 根連接在端子基板部的共用端子及至少丨根獨立端子，該共 用端子，在上述盒體本體的上面與該上面大致同一面地露 出電子零件側的端部，且在上述盒體本體的底面，與該底 面大致同一面地露出基板側的端部，此外，該獨立端子， 在上述盒體本體的上面，與該上面大致同一面地露出電子 零件側的端部，在上述盒體本體的底面，與該底面大致同 一面地露出基板側的端部。 此外，如果只在上述金屬板的該電子零件裝載用盒體的 表面露出的部分實施電鑛加工，能夠有效地降低成本。 【實施方式】 以下，根據圖1〜圖8說明本發明的電子零件裝載用盒體 的形成方法、以及藉由該形成方法形成的電子零件裝=用 盒體的實施方式。 在形成電子零件裝載用盒體時，首先，利用衝壓加工， 從帶狀的導電性板材2衝壓形成接觸終端3，以形成電子零 件裝載用盒體1的盒體框架11。 圖係表不本實知方式令使用的接觸終端3的形狀的俯視 圖。 汝圖所不，本貫施方式的上述接觸終端3具有由上述導電 f生板材2的縱向兩側部4&、扣和連結該兩側部仏、仆間的連 P 4c 4d構成支座部4，在被上述兩側部钝、仆和2根連 結部4c、4d圍繞的大致長方形狀的空間内，在電子零件裝 載用盒體1的底面露出而作爲共用端子的接地端子料 90735-940218.doc 1235634 基板部6的長方形狀的板部材，藉由2根連結部7,連結在上 述支座部4。 ° 此外，在上述端子基板部6,露出於電子零件裝載用盒體. !的外底面、連結延伸有構成上述接地端子5的端子部的金 屬片（以下，稱爲第1端子片）9。 具體而言，第1端子片9,在上述端子基板部6的圖1中的 右側邊6a，於其中央部與上述右側邊的一端部各連結有地 合計2根，此外，在上述端子基板部6的上端邊化、左側邊 6c及下端邊6d各自的中央部各連結有1根。 此外，在本實施方式中，在上述連結部心、4d，露出於 電子零件裝載用盒體！的外表面而構成上述獨立端子1〇的 端子部的金屬片（以下，稱爲第2端子片）13，延伸地連結在 與上述端子基板部6的配設方向相反的方向。 具體而言，在本實施方式中，在配設在上述端子基板部6 的上述右側邊6a的上述連結部4e，在形成盒體框架u時， 位於上述右側邊仏的另一端部附近的1根第2端子片η，延 伸形成在與上述端子基板部6的配設方向的相反方向。此 外，在配設在上述左側邊^側的上述連結部牝，在形成盒 體忙木11 aT，分別位於上述左側邊&的兩端部附近的2根第 2端子片13，延伸形成在與上述端子基板部6的配設方向相 反的方向。 另外，在本實施方式中，在上述導電性板材2的在該電子 零件裝載用盒體1的外表面露出的部分，實施電鐘加工。如 此’藉由限定實施電鐘加卫的部分，能夠有效降低成本。 90735-940218.doc -12- 1235634 …々後’由形成如此形狀的接觸終端3，形成盒體框架〗j。 在本貝苑方式中，利用金屬模衝壓加工，如圖2所示，在 上述接觸終端3的一表面的内面側大致垂直地折彎上述接· 觸終端3的各第1端子片9的前端部，形成在上述電子零件裝 載用盒體1的電子零件裝載面露出的端子部5a，在上述接觸 n端3的上述内面側大致垂直地折彎與上述端子基板部6的 連、-處的附近，形成在上述電子零件裝載用盒體1的側面露 出的端子部5b，從而形成作爲共用端子的接地端子5。此 外’如圖3所示，在上述接觸終端3的上述内面側大致垂直 地折彎上述第2端子片13的前端部，形成在上述電子零件裝 載用盒體1的電子零件裝載面露出的端子部i〇a，在上述接 觸終端3的另-表面的外面側大致垂直地折彎其中間部，形 成在上述笔子零件裝載用盒體丨的側面露出的端子部1 。 此外，向上述接觸終端3的上述内面側折疊其基端部，將形 成在上述電子零件裝載❹體丨的電子零件裝载面露出的 端子部1〇a及在側面露出的端子部⑽、配置在上述端子基 板部6的邊6a、6c的附近，從而形成獨立端子ι〇。此時，二 洛電子零件裝載用盒體！的底面，露出折彎形成在第2端子 片13的上述電子零件裝載用盒體⑽側面露出的端子部⑽ 時的折彎部分（上述第2端子片13的中間部的折彎處）地，進 圖4及圖5所示，具有5 子零件裝載用盒體1的 如此’在上述接觸終端3上形成如 個接地端子5和3個獨立端子丨〇的電 盒體框架11。 90735-940218.doc 13- 1235634 然後，將上述接觸終端 釦入Μ > 、％ 3對準配置在未圖示的由上金屬模 i屬模構成的一對| ^ 刑收L 复屬拉内，藉由樹脂材料的嵌入成 型，將上述接地端子5及想★山 體16。 蜀立鸲子10形成一體，形成盒體本 在上述金屬模内，扃人 〇枳的狀態下，在上述電子零件装 栽用Α體1的外表面露出 、， 路出上逑盒體框架11的各端子5、10, 亚且，在上述電子零件袭 戰用五體1的上述中央，以形成可 收谷裝載在該電子零件梦 凌载用益體1上面的電子零件20的 一部分的空間部14之 式’形成可注入成型樹脂材料1 5的 空腔（未圖示）。 、…、後’對上述-對金屬模進行合模，在上述空腔内注入 成型樹脂材料15 ’如圖6所示，將上述各端子5、Π)固定在 上述電子零件裝載用盒體1的規定位置上，得到電子零件裝 載用盒體1的盒體本體16。 之後，切斷從上述各第2端子片13的上述盒體本體16突出 的口p刀$時，切斷分離將上述盒體本體16連接在上述接 觸終端3的連接部7,形成如圖7所示的上述電子零件裝載用 盒體1。 如圖8所示，如此形成的電子零件裝載用盒體丨，在藉由 成型樹脂材料15形成外形狀大致方形的盒體本體16的:面 中央部，具有可收納裝載的電子零件2〇的一部分的空間部 14，在上述盒體本體16的側面，在上述盒體本體16的上面 與該上面大致同一面地露出一方端部，形成與電子零件Μ 的端子21電性連接的端子部5a ;在上述盒體本體“的底面 90735-940218.doc •14- 1235634 與該底面大致同一面地露出另一方端部，同時，將該另一 方端部連結在接地端子5的端子基板部6，形成與組裝電子 零件20的電路基板22的端子23電性連接的5個接地端子$的 端子部5b;在上述盒體本體16的上面，與該上面大致同一 面地露出一方端部，形成與電子零件2〇的端子21電性連接 的端子部l〇a;在上述盒體本體16的底面與該底面大致同一 面地露出另一方端部，露出與組裝上述電子零件2〇的電路 基板22的端子23電性連接的3個獨立端子1〇的端子部101)。 在採用圖8所示的上述電子零件裝載用盒體丨的電子零件 的、、且衣的具體例中，在晶片基板24上，採用引線接合法（圖 中2 6表示至屬絲）電性連接零件2 5，此外，將利用石夕樹脂等 封裝材料27封裝上述零件25等的電子零件2〇、的上述零件25 等，收納在電子零件裝載用盒體1的空間部14内，同時，在 述电子零件裝載用盒體1的上述露出形成的對應的接地 端子5的端子部化及獨立端子1〇的端子部1以上，利用引線 接^法或錫知等’連接形成在上述晶片基板24上的電路圖 案24a的端子21，形成1個模組30。另外，圖8的模組30在上 述電子零件裝載用盒體1的上方，設置覆蓋，保護上述電子 零件20的保護盒體（上蓋）31。 另外’將上述模組30配置在作爲主板的電路基板22的規 疋位置’利用錫焊（圖中，32表示軟焊料），電性連接在形成 在上述電路基板22的電路圖案22a的端子23和在上述電子 零件裝載用盒體1的底面及側面露出的對應的接地端子5及 獨立端子1 〇。 90735-940218.doc -15- 1235634 體本的電子零件裝載用盒體1 ’由於與該盒 以乂 大致同一面露出地形成各端子5、10,所 化在利用錫谭組裝電子零件2。時，能夠使其組裝面積最 产、1。而且，在電子零件裝㈣盒體1的侧面，按規定的面 =狀配置的各端B(5b)、10(10b)，由於能夠大範圍地確 安^形成在組裝上述電子零件2㈣電路基板22上的電路圖 固::二接端子23的錫焊的接合面，所以，能夠形成其牢 、电性連接，此外，在各個獨立端子1〇之間及獨立端子 和接地端子5之間，藉由構成上述電子零件裝載用盒體！ 的盒體她6的成型樹脂材料15，由於確實能夠電遮斷， :以’能夠也無漏電問題地形成表面組裝時連接穩定性優 义的接合。此外’在形成在上述盒體本體16的上述中央部 的空間部14’藉由收納電子零件2〇的突出部分，能夠利用 该盒體本體16保護電子零件2〇的突出部分。另外，還能夠 減小模組30本體的高度尺寸。 然而’本發明並不局限於上述的實施方式，可根據需要 進行種種變更。例如，上述空腔，在上述實施方式中，形 成在上述電子零件裝載用盒體的上面中力，但也可以不在 該電子零件裝載用盒體上面形成可收納裝載電子零件的一 部分的空間部’即，也可以是在該電子零件裝載用盒體的 表面露出上述盒體框架的上述共用端子及獨立端子的外表 面地’可注入成型樹脂材料的方式。此外，配設在電子零 件裝載用盒體的端子的個數不局限於上述實施方式的配言： 個數。另外，在上述實施方式中，向以上述第2端子片的基 90735-940218.doc -16 - 1235634 知部作爲上述接觸終端的矣 端早…表面侧的内面側’折疊上述第2 子片，相反，也可以向外面側折 k I \ w 且力外，從接觸終端 刀斷为離構成上述電子零件梦 門^ 3士 7件農載用盒體的盒體本體的時 間，也可以在向錢本體的上㈣載電切件之後。 2上所述，如果㈣本發明的電子零件裝制盒體，能 约提供適應電子零件小型化要求 的而且表面組裝時連接 穩疋性優良的電子零件裝載用盒體。 此外，如果採用本發明的雷早焚生 千令件裝載用盒體的形成方 法’能夠簡單且廉價地形成且有 _ /、有上述效果的電子零件裝載 用盒體。 【圖式簡單說明】 圖1係本實施方式的接觸終端的俯視圖。 圖2係表示本實施方式的接地端子的形成順序的說 圖3係表示本實施方式的獨立端子的彎曲形成順序的說 明圖。 圖4係表示盒體框架的完成狀態的俯視圖。 圖5係表示盒體框架的配置的立體圖。 圖6係盒體本體的主要部位剖視圖。 圖7係電子零件裝載用盒體的立體圖。 圖8係表示電子零件裝載用盒體的組裝狀態的主要部位 剖視圖。 【主要元件符號說明】 1 電子零件裝載用盒體 90735-940218.doc -17- 1235634 2 導電性板材 3 接觸終端 4 支座部 5 接地端子 5a 在電子零件裝載用 接地端子的端子部 5b 在電子零件裝載用 端子部 6 端子基板部 7 連接部 9 第1端子片 10 獨立端子 10a 在電子零件裝載用 獨立端子的端子部 10b 在電子零件裝載用 端子部 11 盒體框架 13 第2端子片 14 空間部 15 成型樹脂材料 16 盒體本體 20 電子零件 21 端子 22 電路基板 22a 電路圖案 23 端子 盒體的電子零件裝載面露出的 盒體的側面露出的接地端子的 盒體的電子零件裝載面露出的 盒體的側面露出的獨立端子的 90735-940218.doc -18- 1235634 24 晶片基板 24a 電路圖案 25 零件 26 金屬絲 27 封裝材料 30 模組 31 保護盒體 32 軟焊料 90735-940218.doc1235634 IX. Description of the invention: [Technical field to which the invention belongs] The present invention relates to an electronic part loading box body for assembling electronic parts on a circuit board surface and a method for forming the same. [Prior art] Electronic components used in electronic devices such as electronic knowledge or mobile electrical activities require further miniaturization as the electronic device of the main body is simplified, and at the same time, precision and low cost of electronic components are strictly required. And improve workability. In the case of a computer, an electronic component such as an LSI (Large Scale Integrated Circuit), which is assembled on a motherboard that is a printed circuit board by soldering, is formed on the main body of the case (outer part of the electronic component) to expose the main board. The terminals on the wiring pattern are electrically connected. For example, in the LSI, a box body having an external feature called a sop (Small Out-line Package), that is, a rectangular arm body is formed with curved arm-shaped terminals facing outward. The terminals formed outward from the box body of this SOP are the main reason for making the assembly area on the main board larger than the area of the box body. Therefore, if the simplicity of the electronic device of the body is considered, there is still room for improvement. Therefore, we have also developed J-type terminals that are screwed into the inside of the box, and miniaturized LS called SOJ (Small Out-line J-lead). For mobile phones, the assembly area must be reduced. For example, a VCO (Voltage Controled Oscillator) at the time of making and transmitting information is provided with at least one terminal such as a ground terminal, a power supply voltage input terminal, a control voltage input terminal, and a frequency output terminal. Side surface 90735-940218.doc 1235634 Temple surface, the surface of each disc of the micro-μ μs body is exposed on approximately the same side to form the terminal. Respectively, in the past, the surface of the box body that was formed simply when "assembly of electronic orders on a printed circuit board by soldering" was formed through various efforts, and the electronic components of the terminals exposed substantially on the same surface as the surface of the body were reduced. In terms of area, this is the most superior. "And, for example, in the above vco armor, when a ground terminal or other output terminal (independent terminal) is formed on the surface of the box, the conventional method is attached to the surface of the box made of resin or the like. The terminal is formed by a soldering method or a printing method to form a circuit, and a sheet part is loaded as a module in a subsequent process to complete the VCO. However, in the previous method, since the operation of forming terminals on the surface (especially the side surface) of the case is very difficult, it has the disadvantages of low efficiency and high cost. [Summary of the Invention] To this end, an object of the present invention is to provide a box for loading electronic parts that satisfies the demand for miniaturization of electronic parts and has excellent connection stability during surface mounting, and can be simply and inexpensively used in the box. A method for forming a box for mounting electronic parts on which a ground terminal and other terminals are formed on the surface. In order to achieve the above-mentioned object, the electronic component loading case of the present invention is an electronic component loading case for assembling electronic components on the upper surface of a circuit board, and is characterized in that a side of the case body formed of a molded resin material is provided. There are up to J1 common terminals and / or at least i independent terminals, and the common terminals are on the upper surface of the box body and substantially the same surface as the upper surface 90735-940218.doc 1235634, and one end is exposed in the box. The bottom surface of the main body is exposed at the same end as the other end and is connected to the terminal substrate portion. The independent body is exposed on the upper surface of the box body substantially on the same side as the upper surface. The other end portion is exposed on the bottom surface of the box body substantially on the same surface as the bottom surface. Further, it is characterized in that a central portion of the upper surface of the box body is provided with a space portion capable of accommodating a part of the mounted electronic components. In the electronic component loading case, a knife accommodating the loaded electronic component is accommodated in a space portion π formed on the upper surface of the electronic component loading case, and the connection terminal of the electronic component is connected at the same time. The corresponding common terminals and / or independent terminals formed on the top of the box for mounting electronic parts are exposed on the corresponding common terminals and / or independent terminals. After forming a module, the module is arranged at a predetermined position on the circuit board for electrical connection. The terminals formed on the circuit board and the terminals of the electronic component loading case. In addition, since the box for mounting electronic parts of the present invention is formed with terminals exposed substantially on the same surface as the surface of the box body, it is possible to minimize the assembly area when assembling electronic parts by soldering. Furthermore, on the side of the electronic zero / loading i-body, the terminals arranged linearly with a predetermined area can be more firmly soldered with the terminals on the circuit board on which the above-mentioned electronic components are assembled. Terminals with excellent stability. The Rib can accommodate a part of agricultural electronic components in a space p formed on the upper surface of the electronic component loading box, and the use of the box can be reduced. The height dimension of the module body using the electronic order clothing box. 90735-940218.doc 1 * 235634 In addition, the method for forming a case for loading electronic parts according to the present invention is characterized by the following steps: & 3 The contact terminal formation H is formed by punching a contact terminal from a strip-shaped conductive plate. Contacting the longitudinal side portions of the conductive sheet and the support portion connecting the connection portion between the two side portions, the terminal beauty portion connected to the support portion by the connection portion, and the terminal portion extending from the terminal substrate portion At least one i-th terminal piece; and at least a second terminal piece connected to the supporting portion and extending in a direction opposite to the direction in which the terminal substrate portion is arranged; a box frame forming step, which is formed by bending The first terminal piece is used as a common terminal connected to the terminal substrate portion, and the second terminal piece is bent to form a cross with the seat portion and bent in the direction in which the terminal substrate portion is disposed as independent from the above. The individual terminals of the terminal substrate portion form a box body frame; the box body is formed: in order to form the box integrally with the common terminal and the independent terminal by insert molding of a resin material A body; and a separating step of cutting, the cutting member of the electronic + loaded cartridge with the contact terminal projecting various portions of the body 'apart from > into individual electronic component for mounting a cartridge. In addition, as described in the above-mentioned case frame forming step, in the above-mentioned case frame forming step, the second terminal piece is described as follows: The front surface side of the sheet is bent substantially perpendicularly as The terminal portion exposed on the electronic component mounting surface of the electronic component loading t body is bent substantially perpendicularly to the connection portion with the terminal substrate portion on the one surface side of the conductive plate, and is used as the electronic component. The terminal portion exposed on the side surface of the component loading case forms the common terminal; the second sub-piece is bent substantially vertically on one surface side of the conductive plate 90735-940218.doc 1235634 = section 'as The terminal portion of the electronic surface of the box for mounting electronic parts is in the above-mentioned other surface of the conductive sheet = two vertical shots, and is used as an electronic load: ::: : The exposed end of the mounting surface of the electronic part of the loading box body :::: The terminal part that is routed out is arranged on the terminal base independent terminal. v In order to form the body, the second step of the body forming process of the electronic zero person, ten, and Gan Chu clothing is as follows: In the body forming step of the electronic component packaging box, the electronic component is Frame ㈣ ... γ The way in which the surface of the beneficial body for loading pieces exposes the outer surface of the above-mentioned box body I, the terminals and the individual terminals, the box body frame formed in the box body frame forming step is arranged to include an injectable body One of the lower metal mold and the upper metal mold of the cavity of the molding resin material is equal to one; or the outer surface of the ground terminal and the independent terminal of the body frame is exposed on the surface of the electronic component loading box body, and the electronics Method for forming a space portion in the center of the upper surface of the box for loading the electronic component to be mounted on the electronic component package _ 将 The box frame formed in the above-mentioned box frame forming step is arranged in The lower metal mold and the upper metal mold including a cavity in which a moldable resin material is formed are formed on the counter metal mold, and the above-mentioned ends are injected by injecting the moldable resin material into the cavity. It is fixed at a predetermined position of the electronic component loading body to obtain a box body. If the method for forming the electronic component loading box of the present invention having the above-mentioned characteristics is used, as described above, it can be simply formed with the following characteristics 90735-940218.doc -10- 1235634 Private Order I contains a box, that is, at the side of the box body, there are at least ^ common terminals connected to the terminal substrate portion and at least 丨 independent terminals, the common The terminal exposes an end on the electronic component side on the upper surface of the box body substantially on the same surface as the upper surface, and exposes an end portion on the substrate side of the bottom surface of the box body on the same surface as the bottom surface. The independent terminal exposes an end portion on the electronic component side on the upper surface of the box body substantially on the same surface, and exposes an end portion on the substrate side of the bottom surface of the box body on the same surface as the bottom surface. It is possible to effectively reduce the cost by performing electric mining only on the exposed portion of the surface of the electronic component loading box of the metal plate. Next, a method for forming a box for loading electronic parts according to the present invention and an embodiment of a box for mounting electronic parts using the method will be described with reference to FIGS. 1 to 8. When forming a box for loading electronic parts First, the contact terminal 3 is formed by punching from a strip-shaped conductive plate 2 by press processing to form a box frame 11 of the electronic component loading box 1. The figure shows the contact terminal 3 used in a known manner. As shown in the figure, the above-mentioned contact terminal 3 of the present embodiment has the longitudinal side portions 4 & formed by the conductive f green sheet 2 described above, a buckle and a connection P 4c connecting the side portions 仏, and the servants. 4d constitutes a support portion 4, and in a substantially rectangular space surrounded by the above-mentioned two side portions, two connecting portions 4c, 4d, the bottom surface of the electronic component loading case 1 is exposed as a common terminal ground. Terminal material 90735-940218.doc 1235634 The rectangular plate member of the substrate portion 6 is connected to the support portion 4 via two connection portions 7. ° In addition, the terminal substrate portion 6 is exposed on the outer bottom surface of the electronic component mounting case.! A metal piece (hereinafter referred to as a first terminal piece) 9 constituting the terminal portion constituting the ground terminal 5 is connected to the outer bottom surface of the terminal base portion 6. Specifically, a total of two first terminal pieces 9 are connected to the right side 6a of the terminal substrate portion 6 in FIG. 1 at the central portion and one end portion of the right side, and the terminal substrate 6 The upper end of the portion 6 is edged, and the central portions of the left side 6c and the lower end 6d are connected to one each. In addition, in this embodiment, the above-mentioned connection part center, 4d, is exposed to the box for mounting electronic components! A metal piece (hereinafter, referred to as a second terminal piece) 13 constituting a terminal portion of the independent terminal 10 is formed on the outer surface of the outer surface and is extendedly connected in a direction opposite to the direction in which the terminal substrate portion 6 is arranged. Specifically, in the present embodiment, the connecting portion 4e disposed on the right side 6a of the terminal substrate portion 6 is formed near the other end portion of the right side edge 1 when the box frame u is formed. The second terminal piece η is formed to extend in a direction opposite to the direction in which the terminal substrate portion 6 is arranged. In addition, in the connecting portion 牝 arranged on the left side ^, two second terminal pieces 13 located near the both ends of the left side & are formed in the box body 11 aT, and are extended to form The direction opposite to the arrangement direction of the terminal substrate portion 6 described above. In the present embodiment, a part of the conductive plate 2 exposed on the outer surface of the electronic component loading case 1 is subjected to electric clock processing. In this way, it is possible to effectively reduce costs by limiting the portion of the electric clock guarding. 90735-940218.doc -12- 1235634… 々 后 ’From the contact terminal 3 formed in this shape, a box frame is formed. In the present shell method, as shown in FIG. 2, the front end of each first terminal piece 9 of the contact terminal 3 is bent substantially perpendicularly on the inner surface side of the one surface of the contact terminal 3 by using a die stamping process. The terminal portion 5 a formed on the electronic component mounting surface of the electronic component mounting case 1 is formed to be bent substantially perpendicularly to the connection with the terminal substrate portion 6 at the inner surface side of the contact n-end 3. In the vicinity, a terminal portion 5b exposed on the side surface of the above-mentioned electronic component loading case 1 is formed to form a ground terminal 5 as a common terminal. In addition, as shown in FIG. 3, the front end portion of the second terminal piece 13 is bent substantially perpendicularly on the inner surface side of the contact terminal 3 to form a terminal exposed on the electronic component mounting surface of the electronic component mounting case 1. The portion i0a is formed by bending an intermediate portion substantially perpendicularly on the outer surface side of the other surface of the contact terminal 3 to form a terminal portion 1 exposed on a side surface of the pen component loading case 丨. In addition, the base end portion is folded toward the inner surface side of the contact terminal 3, and the terminal portion 10a exposed on the electronic component mounting surface of the electronic component mounting body 丨 and the terminal portion ⑽ exposed on the side are arranged. Independent terminals ι0 are formed in the vicinity of the sides 6a, 6c of the terminal substrate portion 6 described above. At this time, Eruo electronic parts loading box! The bottom surface of the second terminal piece 13 exposes a bent portion (a bent portion of the middle portion of the second terminal piece 13) when the terminal portion ⑽ formed on the side of the electronic component loading case 零件 exposed on the second terminal piece 13 is bent, As shown in FIGS. 4 and 5, the electrical box frame 11 having five sub-component loading boxes 1 is formed on the above-mentioned contact terminal 3 such as one ground terminal 5 and three independent terminals. 90735-940218.doc 13- 1235634 Then, snap the above contact terminal into M >,% 3 aligned and arranged in a pair (not shown) made of the upper metal mold i mold | ^ Sentence L Duan Lai By insert molding of a resin material, the ground terminal 5 and the mountain body 16 are formed. The Shu Li shuttlecock 10 is integrated into a box body formed in the above-mentioned metal mold, and the outer surface of the above-mentioned electronic component mounting A body 1 is exposed in a state of 扃 枳, and the upper box body frame 11 is led out. Each of the terminals 5, 10, and the electronic part strikes the center of the five body 1 to form a space portion that can receive a part of the electronic part 20 mounted on the electronic part Mengling loadable body 1. Formula 14 'forms a cavity (not shown) into which the molding resin material 15 can be injected. "..." After the above-mentioned-clamping the metal mold, injecting a molding resin material 15 into the cavity, as shown in Fig. 6, the terminals 5, 2) are fixed to the electronic component loading box 1 At a predetermined position, the case body 16 of the case 1 for loading electronic parts is obtained. After that, when the opening blades protruding from the box body 16 of each of the second terminal pieces 13 are cut off, the box body 16 is connected to the connection portion 7 of the contact terminal 3 by cutting and separating, as shown in FIG. 7. The above-mentioned electronic component loading case 1 is shown. As shown in FIG. 8, the thus-formed electronic component loading case 丨 has a substantially square outer shape of the box body 16 formed by the molding resin material 15. The central part of the surface has a housing capable of accommodating the loaded electronic parts 20. A part of the space portion 14 exposes one end portion on the side surface of the box body 16 on the upper surface of the box body 16 substantially on the same surface as the upper surface, and forms a terminal portion 5a electrically connected to the terminal 21 of the electronic component M. On the bottom surface of the above-mentioned box body "90735-940218.doc • 14-1235634, the other end portion is exposed substantially on the same surface as the bottom surface, and the other end portion is connected to the terminal substrate portion 6 of the ground terminal 5, A terminal portion 5b of five ground terminals $ which are electrically connected to the terminal 23 of the circuit board 22 of the assembled electronic component 20 is formed; one end portion is exposed on the upper surface of the box body 16 on substantially the same surface as the upper surface, and is formed with The terminal portion 10a for electrically connecting the terminal 21 of the electronic component 20; the other end portion is exposed on the bottom surface of the box body 16 substantially on the same surface as the bottom surface, and the circuit for assembling the electronic component 20 is exposed. The terminal portion 101 of the three independent terminals 10 that are electrically connected to the terminal 23 of the board 22). In the specific example of the electronic component using the electronic component of the above-mentioned electronic component loading case 丨 shown in FIG. 8, The chip substrate 24 is electrically connected to the components 25 by a wire bonding method (indicated by a metal wire in the figure 26). In addition, the electronic components 20 such as the components 25 and the components 25 are encapsulated with a packaging material 27 such as a stone resin. Parts 25 and the like are accommodated in the space portion 14 of the electronic component loading case 1, and at the same time, the terminal portions of the corresponding ground terminals 5 formed by the above-mentioned exposure of the electronic component loading case 1 and the individual terminals 10 are formed. At the terminal part 1 or more, the terminals 21 of the circuit pattern 24a formed on the wafer substrate 24 are connected to each other by a wire bonding method or a soldering process to form one module 30. In addition, the module 30 in FIG. A cover (upper cover) 31 is provided above the loading case 1 to protect the electronic components 20. In addition, 'the module 30 is arranged at a regular position of the circuit board 22 as the main board' by soldering (Fig. Medium, 32 means soft solder ), Electrically connected to the terminal 23 formed on the circuit pattern 22a of the circuit board 22 and the corresponding ground terminal 5 and the independent terminal 1 exposed on the bottom and side surfaces of the electronic component loading case 1 90. 90735-940218. doc -15- 1235634 The box 1 for mounting electronic parts 1 ′ is formed with the terminals 5 and 10 exposed on substantially the same side as the box. Therefore, it is possible to assemble the electronic part 2 using Xi Tan. The assembly area is the most productive, 1. Moreover, the sides B (5b) and 10 (10b) of the side of the electronic component mounting box 1 are arranged in a predetermined surface shape, because it can be reliably formed in a wide range. Assembly of the above-mentioned electronic component 2㈣circuit board 22 on the circuit board 22: solder joints of the two terminals 23, so that it can form a strong and electrical connection. In addition, between the individual terminals 10 and between the individual terminals and Between the ground terminals 5, the above-mentioned case for loading electronic parts is constituted! Since the molded resin material 15 of the box body 6 can be electrically cut off, a joint having excellent connection stability during surface assembly can be formed with no leakage problem. In addition, in the space portion 14 formed in the central portion of the case body 16, the protruding portion of the electronic component 20 is housed, and the protruding portion of the electronic component 20 can be protected by the case body 16. In addition, the height of the main body of the module 30 can be reduced. However, the present invention is not limited to the above-mentioned embodiments, and various changes can be made as necessary. For example, in the above-mentioned embodiment, the cavity is formed on the upper surface of the electronic component loading case, but a space portion that can house a part of the electronic component may not be formed on the electronic component loading case. That is, it is also possible to inject a molding resin material so that the outer surfaces of the common terminals and the independent terminals of the box frame are exposed on the surface of the box for mounting electronic components. In addition, the number of terminals arranged in the electronic component loading case is not limited to the wording of the above embodiment: the number. In addition, in the above-mentioned embodiment, the second sub-sheet is 'folded' to the inner side of the surface side of the base end of the second terminal sheet 90735-940218.doc -16-1235634 as the contact terminal as early as ... Conversely, it is also possible to fold k I \ w to the outside and cut off from the contact terminal knife to separate the time from the main body of the 7-piece agricultural box that constitutes the electronic part mentioned above ^ 3 persons, or After the upper body of the money body is loaded with a cutting part. As described above, if the electronic component packaging box according to the present invention is provided, it is possible to provide an electronic component loading box that is suitable for miniaturization of electronic components and has excellent connection stability during surface assembly. In addition, if the method for forming a box for loading a thousand pieces of thunder-relief incineration according to the present invention is used, it can be easily and inexpensively formed and has the above-mentioned effect for the box for mounting electronic parts. [Brief Description of the Drawings] FIG. 1 is a plan view of a contact terminal according to this embodiment. Fig. 2 is an explanatory diagram showing the formation sequence of the ground terminal of the present embodiment. Fig. 3 is an explanatory diagram showing the bend formation sequence of the individual terminal of the present embodiment. FIG. 4 is a plan view showing a completed state of the box frame. Fig. 5 is a perspective view showing the arrangement of a box frame. Fig. 6 is a sectional view of a main part of the box body. Fig. 7 is a perspective view of a case for mounting electronic components. Fig. 8 is a cross-sectional view of a main part showing an assembled state of a case for loading electronic parts. [Description of main component symbols] 1 Box for loading electronic parts 90735-940218.doc -17- 1235634 2 Conductive plate 3 Contact terminal 4 Stand 5 Ground terminal 5a The terminal part 5b of the ground terminal for electronic parts Terminal part for component mounting 6 Terminal board part 7 Connection part 9 First terminal piece 10 Independent terminal 10a Terminal part 10b for independent terminal for electronic component mounting Terminal part for electronic component mounting 11 Box frame 13 Second terminal piece 14 Space Part 15 Molded resin material 16 Box body 20 Electronic parts 21 Terminals 22 Circuit board 22a Circuit pattern 23 Terminal box body with electronic part loading surface exposed Box side with ground terminal exposed Box with electronic component loading surface exposed 90735-940218.doc of independent terminals exposed from the side of the body 907- 1235634 24 Wafer substrate 24a Circuit pattern 25 Parts 26 Wire 27 Packaging material 30 Module 31 Protective case 32 Soft solder 90735-940218.doc