CN1525809A - Case body for electronic component embarkation and formation method thereof - Google Patents
Case body for electronic component embarkation and formation method thereof Download PDFInfo
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- CN1525809A CN1525809A CNA2004100048242A CN200410004824A CN1525809A CN 1525809 A CN1525809 A CN 1525809A CN A2004100048242 A CNA2004100048242 A CN A2004100048242A CN 200410004824 A CN200410004824 A CN 200410004824A CN 1525809 A CN1525809 A CN 1525809A
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- 230000015572 biosynthetic process Effects 0.000 title claims description 30
- 238000000034 method Methods 0.000 title claims description 22
- 239000000463 material Substances 0.000 claims abstract description 37
- 239000011347 resin Substances 0.000 claims abstract description 19
- 229920005989 resin Polymers 0.000 claims abstract description 19
- 239000000758 substrate Substances 0.000 claims abstract description 14
- 239000002184 metal Substances 0.000 claims description 20
- 238000005452 bending Methods 0.000 claims description 17
- 238000001746 injection moulding Methods 0.000 claims description 10
- 238000007493 shaping process Methods 0.000 claims description 5
- 238000004080 punching Methods 0.000 claims description 3
- 238000000926 separation method Methods 0.000 claims description 3
- 239000000178 monomer Substances 0.000 claims description 2
- 210000004907 gland Anatomy 0.000 description 18
- 238000005476 soldering Methods 0.000 description 8
- 238000009434 installation Methods 0.000 description 3
- 238000000280 densification Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000007429 general method Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
- H05K5/0204—Mounting supporting structures on the outside of casings
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/06—Containers; Seals characterised by the material of the container or its electrical properties
- H01L23/08—Containers; Seals characterised by the material of the container or its electrical properties the material being an electrical insulator, e.g. glass
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/18—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for manufacturing bases or cases for contact members
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/02—Arrangements of circuit components or wiring on supporting structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Casings For Electric Apparatus (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
In the invention, at least one grounding terminal 5 and/or at least one independent terminal 10 are formed on the side face of the case body 16 with a roughly square contour formed by the forming resin material 15. The grounding terminal 5 is connected on the terminal substrate portion 6, in which the terminal part 5a of one side is exposed outside on the upper face of the case body 16 such that it is roughly on the same face with the upper face, and the terminal part 5b of the other side is exposed outside on the bottom face of the case body 16 such that it is roughly on the same face with the bottom face. For the independent terminal 10, the terminal part 10a of one side is exposed outside on the upper face of the case body 16 such that it is roughly on the same face with the upper face, and the terminal part 10b of the other side is exposed outside on the bottom face of the case body 16 such that it is roughly on the same face with the bottom face.
Description
Technical field
The present invention relates to a kind of electronic component at circuit substrate upper surface assembling electronic component carries with housing and forming method thereof.
Background technology
Be used for the electronic component in the electronic installations such as computer or portable phone, the densification along with the electronic installation of body requires further miniaturization, simultaneously, also be strict with precision, the cost of electronic component cheapization, improve operation etc.
With regard to computer, in be assembled in by soldering, form the terminal that is electrically connected with wiring graph on the above-mentioned mainboard in the outside of housing (the outer dress of electronic component) body to the electronic components such as (LargeScale Integrated Circuit) of the LSI on the mainboard of printed base plate with exposing.For example, have such housing in LSI, its resemblance is called as SOP (Small Out-line Package), promptly forms the terminal of crank arm type on rectangular-shaped enclosure body outwardly.Terminal from the enclosure body of this SOP forms outwardly owing to become the main cause of assembling area more than the area of enclosure body that makes on the mainboard, if consider the densification of the electronic installation of body, leaves some room for improvement.Therefore, also developing, seeking the LSI that is referred to as SOJ (Small Out-line J-lead) of miniaturization with the J type terminal of terminal as the inboard that screws in housing.
About portable phone, must reduce its assembling area, for example, the VCO of the wireless frequency when making is received and sent messages (Voltage Controled Oscillator) possesses 1 in the terminals such as gland terminal (gland terminal), supply voltage input terminal, control voltage input terminal, frequency output terminal at least, surface in the side of the housing that forms the general square shape shape etc. roughly forms above-mentioned terminal with simultaneously exposing with the enclosure body surface.
So, passed through multiple effort, when utilizing soldering on printed base plate, to assemble electronic component in the past, the surface of the housing that forms in compactness, form with this body surface roughly with the electronic component of the terminal that simultaneously exposes, reducing to assemble aspect the area, be superior.
And, for example, in above-mentioned VCO, when forming gland terminal or other input terminal (independent terminals) on the surface of housing, general method in the past is, on the surface of the housing that is made of resin etc., utilize plating scolding tin method or print process to form terminal, forming circuit carries chip part in subsequent handling, finish VCO as module.
But,,, have low, the defect of high cost of efficient because form the operation of terminal on the surface (particularly side) of housing very difficult for this method in the past.
Summary of the invention
For this reason, the purpose of this invention is to provide a kind of can form that adapt to electronic component miniaturization requirement and the good electronic component of connective stability during surface-assembled carry use housing and can be simply and the electronic component that forms gland terminal and other terminals at an easy rate on the surface of housing carry the formation method of using housing.
For achieving the above object, electronic component of the present invention carries uses housing, it is the electronic component lift-launch housing that is used at circuit substrate upper surface assembling electronic component, it is characterized in that: in the side of the enclosure body that forms by shaping resin material, has at least 1 common terminal, and/or at least 1 independent terminals, above-mentioned common terminal, on above-mentioned enclosure body, with the end of roughly simultaneously exposing a side above this together, bottom surface in above-mentioned enclosure body, with this bottom surface roughly with simultaneously exposing the opposing party's end and being connected with the terminal baseplate part, above-mentioned independent terminals is on above-mentioned enclosure body, with the end of roughly simultaneously exposing a side above this together, in the bottom surface of above-mentioned enclosure body, with roughly same end of simultaneously exposing the opposing party, this bottom surface.
In addition, it is characterized in that: at the upper central portion of above-mentioned enclosure body, spatial portion with part of the electronic component that can take in lift-launch.
For this electronic component lift-launch housing, in being formed on this spatial portion above electronic component lift-launch usefulness housing, take in the part of the electronic component of lift-launch, splicing ear with above-mentioned electronic component is connected simultaneously, on carrying with housing, exposes by this electronic component on the common terminal such as common terminal and/or independent terminals of correspondence of formation, after forming 1 module, this module is configured in the assigned position of circuit substrate, is used to be electrically connected the terminal that is formed on the foregoing circuit substrate and above-mentioned electronic component and carries terminal with housing.
In addition, electronic component of the present invention carries uses housing, owing to form the terminal that roughly simultaneously exposes together with the surface of this enclosure body, by soldering assembling electronic component the time, can assemble area with this and minimize.And, carry the side of using housing at electronic component, with the terminal of the area wire configuration of regulation, with the soldering of terminal on the circuit substrate that is formed on the above-mentioned electronic component of assembling can be more firm, the terminal that the connective stability in the time of can forming surface-assembled is good.In addition; by in being formed on this spatial portion above electronic component lift-launch usefulness housing; take in the part of the electronic component of lift-launch; can utilize this enclosure body to protect the part of above-mentioned electronic component; simultaneously, can reduce to adopt this electronic component to carry the height dimension of the module body of using housing.
In addition, electronic component of the present invention carries the formation method with housing, it is characterized in that, be made of following operation: the contact terminal that forms the contact terminal from the conductivity sheet material punching press that forms band shape forms operation, this contact terminal has, by the both sides longitudinally of above-mentioned conductivity sheet material with link the seat part that the connecting portion between these both sides constitutes, be attached at terminal baseplate part on the above-mentioned seat part by linking part, at least 1 the 1st terminal plate from above-mentioned terminal baseplate part extension, and at least 1 the 2nd terminal plate that is attached on the above-mentioned seat part and extends to the rightabout that sets direction of above-mentioned terminal baseplate part; Case frame forms operation, as being attached at common terminal on the above-mentioned terminal baseplate part, being bent to form above-mentioned the 1st terminal plate, with above-mentioned the 2nd terminal plate and above-mentioned seat part setting the direction bending, be bent to form above-mentioned the 2nd terminal plate as the independent terminals that is independent of above-mentioned terminal baseplate part simultaneously, the formation case frame to above-mentioned terminal baseplate part across; Enclosure body forms operation, is shaped and above-mentioned common terminal and independent terminals are formed enclosure body with becoming one by inlaying of resin material, reaches; Cut off separation circuit, cut off the each several part that carries the above-mentioned contact terminal of giving prominence to enclosure body from above-mentioned electronic component, the electronic component that forms monomer carries uses housing.
In addition, as described in above-mentioned case frame formation operation, it is characterized in that: form in the operation at above-mentioned case frame, above-mentioned the 1st terminal plate, its leading section of face side approximate vertical bending at above-mentioned conductivity sheet material, be formed on this electronic component and carry the portion of terminal of showing out with the electronic component lift-launch of housing, near the bond sites of the above-mentioned face side approximate vertical bending of this conductivity sheet material and above-mentioned terminal baseplate part, be formed on this electronic component and carry the portion of terminal of exposing with the side of housing, thereby form above-mentioned common terminal; Above-mentioned the 2nd terminal plate, its leading section of face side approximate vertical bending at above-mentioned conductivity sheet material, be formed on this electronic component and carry the portion of terminal of showing out with the electronic component lift-launch of housing, above-mentioned another face side at this conductivity sheet material, this middle part of approximate vertical bending, be formed on this electronic component and carry the portion of terminal of exposing with the side of housing, and, folding its base end part, will above-mentioned electronic component carry electronic component with housing carry the portion of terminal of showing out and the portion of terminal of exposing in the side be configured in above-mentioned terminal baseplate part near, thereby the formation independent terminals.
In addition, carry with as described in the body formation operation of housing as above-mentioned electronic component, it is characterized in that: the body that carries with housing at above-mentioned electronic component forms in the operation, expose the above-mentioned common terminal of above-mentioned case frame and the outer surface ground of independent terminals in this electronic component lift-launch with the surface of housing, to form the case frame that form in the operation at above-mentioned case frame, but be configured in the pair of metal mould that following metal pattern and last metal pattern by the cavity that is formed with the injection moulding resin material constitute; Perhaps carry and expose the above-mentioned common terminal of above-mentioned case frame and the outer surface of independent terminals with the surface of housing at this electronic component, and the upper central of carrying with housing at electronic component forms the spatial portion ground that can accommodate a part that is equipped on this electronic component above electronic component lift-launch usefulness housing, but will form the case frame that form in the operation at above-mentioned case frame is configured on the pair of metal mould that following metal pattern and last metal pattern by the cavity that is formed with the injection moulding resin material constitute, again by injection moulding resin material in above-mentioned cavity, above-mentioned each terminal is fixed on this electronic component carries the assigned position of using housing, thereby obtain enclosure body.
If adopt electronic component of the present invention to carry the formation method of using housing with above-mentioned feature, as previously mentioned, can form simply the following is the electronic component lift-launch housing of feature, promptly, side in enclosure body, has at least 1 common terminal and at least 1 independent terminals that is connected the terminal baseplate part, this common terminal, roughly same end of simultaneously exposing the electronic component side on above-mentioned enclosure body and above this, and bottom surface in above-mentioned enclosure body, with roughly same end of simultaneously exposing substrate-side, this bottom surface, in addition, this independent terminals, on above-mentioned enclosure body, with roughly same end of simultaneously exposing the electronic component side above this, in the bottom surface of above-mentioned enclosure body, with roughly same end of simultaneously exposing substrate-side, this bottom surface.
In addition, if only the part of exposing with the surface of housing in this electronic component lift-launch of above-mentioned metallic plate is implemented to electroplate processing, can reduce cost effectively.
Description of drawings
Fig. 1 is the vertical view of the contact terminal of present embodiment.
Fig. 2 is the key diagram that is bent to form order of the gland terminal of expression present embodiment.
Fig. 3 is the key diagram that is bent to form order of the independent terminals of expression present embodiment.
Fig. 4 is the vertical view of the completion status of expression case frame.
Fig. 5 is the stereogram of the configuration of expression case frame.
Fig. 6 is the main position cutaway view of enclosure body.
Fig. 7 is that electronic component carries the stereogram with housing.
Fig. 8 is that the expression electronic component carries the main position cutaway view with the assembled state of housing.
Symbol description
1: electronic component carries uses housing, 2: conductivity sheet material, 3: contact terminal (terminal), 4: seat part, 5: the gland terminal, 5a: carry the portion of terminal of carrying the gland terminal of showing out with the electronic component of housing at electronic component, 5b: the portion of terminal of carrying the gland terminal that exposes with the side of housing at electronic component, 6: terminal baseplate part, 7: connecting portion, 9: the 1 terminal plates, 10: independent terminals, 10a: carry the portion of terminal of carrying the independent terminals of showing out with the electronic component of housing at electronic component, 10b: the portion of terminal of the independent terminals of exposing with the side of housing in the electronic component lift-launch, 11: case frame, 13: the 2 terminal plates, 14: spatial portion, 15: shaping resin material, 16: enclosure body.
Embodiment
Below, illustrate that according to Fig. 1～Fig. 8 electronic component of the present invention carries the formation method with housing, the electronic component that adopts this formation method to form carries the execution mode of using housing.
When housing is used in the lift-launch of formation electronic component, at first, utilize punch process, from the conductivity sheet material 2 punching presses formation contact terminal 3 of band shape, to form the electronic component lift-launch case frame 11 of housing 1.
Fig. 1 is the vertical view of the shape of the contact terminal 3 used in the present embodiment of expression.
As shown in the figure, the above-mentioned contact terminal 3 of present embodiment has by linking part 4c, 4d between vertical both sides 4a, the 4b of above-mentioned conductivity sheet material 2 and these both sides of binding 4a, 4b and constitutes seat part 4, in the roughly OBL space that is centered on by above-mentioned both sides 4a, 4b and 2 linking part 4c, 4d, electronic component carry expose with the bottom surface of housing 1, formation is as the OBL board material of the terminal baseplate part 6 of the gland terminal 5 of common terminal, by 2 linking parts 7, be attached at above-mentioned seat part 4.
In addition, at above-mentioned terminal baseplate part 6, be exposed to the sheet metal (below, be called the 1st terminal plate) 9 that electronic component carries outer bottom with housing 1, links the portion of terminal that is extended with the above-mentioned gland terminal 5 of formation.
Specifically be, the 1st terminal plate 9, right edge 6a in Fig. 1 of above-mentioned terminal baseplate part 6, each links in an end of its central portion and above-mentioned right edge has 1 to add up to 2, in addition, the limit, upper end of above-mentioned terminal baseplate part 6 6b, limit, left side 6c and limit, lower end 6d, central portion separately each link and have 1.
In addition, in the present embodiment, at above-mentioned linking part 4c, 4d, be exposed to electronic component carry sheet metal outer surface, that constitute the portion of terminal of above-mentioned independent terminals 10 with housing (below, be called the 2nd terminal plate) 13, be attached at with extending with the side of setting of above-mentioned terminal baseplate part 6 in the opposite direction.
Specifically be, in the present embodiment, above-mentioned linking part 4c at the above-mentioned right edge 6a that is provided in above-mentioned terminal baseplate part 6, when forming case frame 11, be positioned near 1 the 2nd terminal plate 13 the other end of above-mentioned right edge 6a, extend to form with the rightabout that sets direction of above-mentioned terminal baseplate part 6.In addition, at the above-mentioned linking part 4d that is provided in limit, above-mentioned left side 6c side, when forming case frame 11, near 2 the 2nd terminal plates 13 the both ends of above-mentioned left side, seat limit 6c respectively, extend to form with the side of setting of above-mentioned terminal baseplate part 6 in the opposite direction.
In addition, in the present embodiment, above-mentioned conductivity sheet material 2 carry the part that the outer surface with housing exposes at this electronic component, implement to electroplate and process.So, by limiting the part of implementing to electroplate processing, can effectively reduce cost.
Then, by the contact terminal 3 that forms shape like this, form case frame 11.
In the present embodiment, utilize the metal pattern punch process, as shown in Figure 2, leading section at each the 1st terminal plate 9 of the above-mentioned contact terminal 3 of inner face side bending generally perpendicularly on a surface of above-mentioned contact terminal 3, be formed on above-mentioned electronic component and carry the portion of terminal 5a that shows out with the electronic component lift-launch of housing 1, near the junction of the above-mentioned inner face side bending generally perpendicularly of above-mentioned contact terminal 3 and above-mentioned terminal baseplate part 6, be formed on above-mentioned electronic component and carry the portion of terminal 5b that exposes with the side of housing 1, thereby form gland terminal 5 as common terminal.In addition, as shown in Figure 3, leading section at above-mentioned the 2nd terminal plate 13 of above-mentioned inner face side bending generally perpendicularly of above-mentioned contact terminal 3, be formed on above-mentioned electronic component and carry the portion of terminal 10a that shows out with the electronic component lift-launch of housing 1, in another surperficial exterior side of above-mentioned contact terminal 3 bending intermediate portion generally perpendicularly, be formed on above-mentioned electronic component and carry the portion of terminal 10b that exposes with the side of housing 1.In addition, to folding its base end part of the above-mentioned inner face side of above-mentioned contact terminal 3, above-mentioned electronic component carries that electronic component with housing 1 carries the portion of terminal 10a that shows out and the portion of terminal 10b that exposes in the side with being formed on, the limit 6a, the 6c that are configured in above-mentioned terminal baseplate part 6 near, thereby formation independent terminals 10.At this moment, carry the bottom surface of using housing 1 at this electronic component, dogleg section when exposing above-mentioned electronic component that bending is formed on the 2nd terminal plate 13 and carrying the portion of terminal 10b that exposes with the side of housing 1 is carried out bending (bending part of the pars intermedia of above-mentioned the 2nd terminal plate 13).
So, formation is carried the case frame 11 of using housing 1 as Fig. 4 and electronic component shown in Figure 5, that have 5 gland terminals 5 and 3 independent terminals 10 on above-mentioned contact terminal 3.
Then, with above-mentioned contact terminal 3 alignment configurations not shown by in the pair of metal mould that constitutes of metal pattern and following metal pattern, by the embedding moulding of resin material, above-mentioned gland terminal 5 and independent terminals 10 are formed one, formation enclosure body 16.
In above-mentioned metal pattern, under the state of matched moulds, carry each terminal 5,10 that exposes above-mentioned case frame 11 with the outer surface of housing 1 at above-mentioned electronic component, and, carry the above-mentioned central authorities that use housing 1 at above-mentioned electronic component, formation can be accommodated lift-launch on spatial portion 14 ground of this electronic component lift-launch with the part of the electronic component 20 above the housing 1, but forms the cavity (not shown) of injection moulding resin material.
Then, above-mentioned pair of metal mould is carried out matched moulds, injection moulding resinous wood 15 in above-mentioned cavity, as shown in Figure 6, above-mentioned each terminal 5,10 is fixed on above-mentioned electronic component carries, obtain electronic component and carry the enclosure body 16 of using housing 1 with on the assigned position of housing 1.
Afterwards, cut off the part of giving prominence to, simultaneously, cut off and separate the connecting portion 7 that above-mentioned enclosure body 16 is connected above-mentioned contact terminal 3, form above-mentioned electronic component lift-launch housing 1 as shown in Figure 7 from the above-mentioned enclosure body 16 of above-mentioned respectively the 2nd terminal plate 13.
As shown in Figure 8, so the electronic component that forms carries with housing 1, the upper central portion of the enclosure body 16 of shape general square shape outside forming by shaping resin material 15, spatial portion 14 with part of the electronic component 20 that can take in lift-launch, side in above-mentioned enclosure body 16, on above-mentioned enclosure body 16 with above being somebody's turn to do, roughly simultaneously expose a square end portion together, form the portion of terminal 5a that is electrically connected with the terminal 21 of electronic component 20; Bottom surface and this bottom surface in above-mentioned enclosure body 16 are roughly simultaneously exposed the opposing party end together, simultaneously, this the opposing party end is attached at the terminal baseplate part 6 of gland terminal 5, forms the portion of terminal 5b of 5 gland terminals 5 that are electrically connected with the terminal 23 of the circuit substrate 22 of assembling electronic component 20; On above-mentioned enclosure body 16,, form the portion of terminal 10a that is electrically connected with the terminal 21 of electronic component 20 with the roughly same square end portion of simultaneously exposing above this; The opposing party end is roughly simultaneously exposed together in bottom surface and this bottom surface in above-mentioned enclosure body 16, exposes the portion of terminal 10b of 3 independent terminals 10 that are electrically connected with the terminal 23 of the circuit substrate 22 of assembling above-mentioned electronic component 20.
In adopting the concrete example of above-mentioned electronic component lift-launch with the assembling of the electronic component of housing 1 shown in Figure 8, on chip substrate 24, adopt terminal conjunction method (26 expression wires among the figure) electrical connecting element 24, in addition, the said elements 25 etc. of the electronic component 20 of encapsulating material such as silicones 27 encapsulation said elements 25 grades will be utilized, being accommodated in electronic component carries with in the spatial portion 14 of housing 1, simultaneously, carry at above-mentioned electronic component on the portion of terminal 10a of the portion of terminal 5a of gland terminal 5 of the correspondence of exposing formation with housing 1 above-mentioned and independent terminals 10, utilize terminal conjunction method or soldering etc., be connected to form the terminal 21 of the circuitous pattern 24a on said chip substrate 24, form 1 module 30.In addition, the module 30 of Fig. 8 is provided with the protection housing (loam cake) 31 of covering, the above-mentioned electronic component 20 of protection above above-mentioned electronic component carries with housing 1.
In addition, above-mentioned module 30 is configured in assigned position as the circuit substrate 22 of mainboard, utilize soldering (among the figure, 32 expression slicken solders), be connected electrically in the terminal 23 of the circuitous pattern 22a that is formed on foregoing circuit substrate 22 and carry the gland terminal 5 and the independent terminals 10 of the correspondence of exposing with the bottom surface and the side of housing 1 at above-mentioned electronic component.
At this moment, the electronic component of present embodiment carries with housing 1 since with roughly same each terminal 5,10 that forms in the side of this enclosure body 16 with showing out, so, when utilizing soldering assembling electronic component 20, can make it assemble area and minimize.And, carry the side of using housing 1 at electronic component, each terminal 5 (5b) of area wire configuration in accordance with regulations, 10 (10b), since can guarantee on a large scale with the circuit substrate 22 that is formed on the above-mentioned electronic component 20 of assembling on the composition surface of soldering of splicing ear 23 of circuitous pattern 22a, so, can form its firm electrical connection, in addition, between each independent terminals 10 and between independent terminals 10 and the gland terminal 5, by constituting the shaping resin material 15 that above-mentioned electronic component carries the enclosure body 16 of using housing 1, because can interdict by electricity really, so, the good joint of connective stability when can also not have electric leakage problem ground formation surface-assembled.In addition, at the spatial portion 14 of the above-mentioned central portion that is formed on above-mentioned enclosure body 16,, can utilize the ledge of these enclosure body 16 protection electronic components 20 by taking in the ledge of electronic component 20.In addition, can also reduce the height dimension of module 30 bodies.
Yet the present invention is not limited to above-mentioned execution mode, can carry out all changes as required.For example, above-mentioned cavity, in the above-described embodiment, be formed on above-mentioned electronic component and carry the upper central of using housing, but can on carrying with housing, this electronic component not form the spatial portion that to take in a part of carrying electronic component yet, that is, also can be to carry at this electronic component to expose the above-mentioned common terminal of above-mentioned case frame and the outer surface ground of independent terminals with the surface of housing, but the mode of injection moulding resin material.In addition, be provided in the electronic component lift-launch is not limited to above-mentioned execution mode with the number of the terminal of housing the number that sets.In addition, in the above-described embodiment, to the base end part of above-mentioned the 2nd terminal plate inner face side as the face side of above-mentioned contact terminal, folding above-mentioned the 2nd terminal plate, on the contrary, also side is folding to the outside.In addition, cut off separation from the contact terminal and constitute the time of above-mentioned electronic component lift-launch, also can be after lift-launch electronic component above enclosure body with the enclosure body of housing.
In sum, use housing if adopt electronic component of the present invention to carry, can provide adapt to electronic component miniaturization requirement and also the good electronic component lift-launch housing of connective stability during surface-assembled.In addition, if adopt electronic component of the present invention to carry formation method with housing, can be simply and form electronic component at an easy rate and carry and use housing with above-mentioned effect.
Claims (7)
1. an electronic component carries and uses housing, is to be used for using housing in the electronic component lift-launch of circuit substrate upper surface assembling electronic component, it is characterized in that:
In the side of the enclosure body that forms by shaping resin material, have at least 1 common terminal and/or at least 1 independent terminals,
Above-mentioned common terminal, on above-mentioned enclosure body, with above this roughly with the end of simultaneously exposing a side, in the bottom surface of above-mentioned enclosure body, with this bottom surface roughly with simultaneously exposing the opposing party's end and be connected with the terminal baseplate part,
Above-mentioned independent terminals is on above-mentioned enclosure body, with roughly same end of simultaneously exposing a side above this, in the bottom surface of above-mentioned enclosure body, with roughly same end of simultaneously exposing the opposing party, this bottom surface.
2. electronic component as claimed in claim 1 carries uses housing, it is characterized in that: at the upper central portion of above-mentioned enclosure body, the spatial portion with part of the electronic component that can take in lift-launch.
3. an electronic component carries the formation method of using housing, it is characterized in that, comprising:
From forming the contact terminal formation operation that banded conductivity sheet material punching press forms the contact terminal, this contact terminal has, by the both sides longitudinally of above-mentioned conductivity sheet material and link seat part that the connecting portion between these both sides constitutes, by linking part be attached at terminal baseplate part on the above-mentioned seat part, at least 1 the 1st terminal plate extending from above-mentioned terminal baseplate part and at least 1 the 2nd terminal plate being attached on the above-mentioned seat part and extending to the rightabout that sets direction of above-mentioned terminal baseplate part;
Case frame forms operation, as being attached at common terminal on the above-mentioned terminal baseplate part, being bent to form above-mentioned the 1st terminal plate, with above-mentioned the 2nd terminal plate and above-mentioned seat part setting the direction bending, be bent to form above-mentioned the 2nd terminal plate as the independent terminals that is independent of above-mentioned terminal baseplate part simultaneously, the formation case frame to above-mentioned terminal baseplate part across;
Enclosure body forms operation, is shaped and above-mentioned common terminal and independent terminals are formed enclosure body with becoming one by inlaying of resin material, reaches;
Cut off separation circuit, cut off the each several part that carries the above-mentioned contact terminal of giving prominence to enclosure body from above-mentioned electronic component, the electronic component that forms monomer carries uses housing.
4. electronic component as claimed in claim 3 carries the formation method with housing, it is characterized in that: form in the operation at above-mentioned case frame, above-mentioned the 1st terminal plate, its leading section of face side approximate vertical bending at above-mentioned conductivity sheet material, be formed on this electronic component and carry the portion of terminal of showing out with the electronic component lift-launch of housing, near the bond sites of the above-mentioned face side approximate vertical bending of this conductivity sheet material and above-mentioned terminal baseplate part, be formed on this electronic component and carry the portion of terminal of exposing with the side of housing, thereby form above-mentioned common terminal; Above-mentioned the 2nd terminal plate, its leading section of face side approximate vertical bending at above-mentioned conductivity sheet material, be formed on this electronic component and carry the portion of terminal of showing out with the electronic component lift-launch of housing, above-mentioned another face side at this conductivity sheet material, this middle part of approximate vertical bending, be formed on this electronic component and carry the portion of terminal of exposing with the side of housing, and, folding its base end part, will above-mentioned electronic component carry electronic component with housing carry the portion of terminal of showing out and the portion of terminal of exposing in the side be configured in above-mentioned terminal baseplate part near, thereby the formation independent terminals.
5. electronic component as claimed in claim 3 carries the formation method with housing, it is characterized in that: the body that carries with housing at above-mentioned electronic component forms in the operation, expose the above-mentioned common terminal of above-mentioned case frame and the outer surface ground of independent terminals in this electronic component lift-launch with the surface of housing, to form the case frame that forms in the operation at above-mentioned case frame, but be configured in the pair of metal mould that following metal pattern and last metal pattern by the cavity that is formed with the injection moulding resin material constitute, and by injection moulding resin material in above-mentioned cavity, above-mentioned each terminal is fixed on this electronic component carries the assigned position of using housing, thereby obtain enclosure body.
6. electronic component as claimed in claim 3 carries the formation method with housing, it is characterized in that: the body that carries with housing at above-mentioned electronic component forms in the operation, expose the above-mentioned common terminal of above-mentioned case frame and the outer surface of independent terminals in this electronic component lift-launch with the surface of housing, and the upper central of carrying with housing at electronic component forms the spatial portion ground that can accommodate a part that is equipped on this electronic component above electronic component lift-launch usefulness housing, but will form the case frame that form in the operation at above-mentioned case frame is configured on the pair of metal mould that following metal pattern and last metal pattern by the cavity that is formed with the injection moulding resin material constitute, by injection moulding resin material in above-mentioned cavity, above-mentioned each terminal is fixed on this electronic component carries the assigned position of using housing, thereby obtain enclosure body.
7. electronic component as claimed in claim 3 carries the formation method with housing, it is characterized in that: this electronic component at above-mentioned conductivity sheet material carries on the part of exposing with the surface of housing, implements to electroplate processing.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003053287A JP2004266013A (en) | 2003-02-28 | 2003-02-28 | Case for carrying electronic parts and its forming method |
| JP2003053287 | 2003-02-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1525809A true CN1525809A (en) | 2004-09-01 |
Family
ID=33117939
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2004100048242A Pending CN1525809A (en) | 2003-02-28 | 2004-02-09 | Case body for electronic component embarkation and formation method thereof |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP2004266013A (en) |
| KR (1) | KR20040077465A (en) |
| CN (1) | CN1525809A (en) |
| TW (1) | TWI235634B (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007201376A (en) * | 2006-01-30 | 2007-08-09 | Yamaha Corp | Semiconductor device |
| KR102316364B1 (en) | 2019-10-08 | 2021-10-22 | 한국단자공업 주식회사 | Holder for surface mounted device |
| FR3112897B1 (en) * | 2020-07-27 | 2022-12-23 | St Microelectronics Grenoble 2 | VOLTAGE REGULATION DEVICE |
-
2003
- 2003-02-28 JP JP2003053287A patent/JP2004266013A/en not_active Withdrawn
-
2004
- 2004-02-06 TW TW093102798A patent/TWI235634B/en not_active IP Right Cessation
- 2004-02-09 CN CNA2004100048242A patent/CN1525809A/en active Pending
- 2004-02-11 KR KR1020040008975A patent/KR20040077465A/en active IP Right Grant
Also Published As
| Publication number | Publication date |
|---|---|
| KR20040077465A (en) | 2004-09-04 |
| TWI235634B (en) | 2005-07-01 |
| JP2004266013A (en) | 2004-09-24 |
| TW200425819A (en) | 2004-11-16 |
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