TWI232491B - Film coating device and method - Google Patents

Abstract

A film coating device is used to coat substrates with a thin film. The film coating device includes at least two stages and a nozzle. The stages are used to support and fix the substrates. The nozzle is moved in relative to the two substrates for coating the two substrates with the thin film.

Description

1232491 V. Description of the invention (1)-[Technical field to which the invention belongs] t 杳 ming is related to a thin film coating device, and more particularly to a thin film coating device, which can reduce the standby time of the substrate during the thin film coating process. time. [Prior art] In the liquid crystal display manufacturing process, the lithography etching process is widely used. In the micro-fen etching gas, a photoresist is first coated on a glass substrate, and then the photoresist is exposed to light, and a predetermined pattern is formed on the photoresist. In the above process, a photoresist film having the predetermined pattern is formed on the surface of the glass substrate. The photoresist pattern can be further applied to a thin film formation process and last name engraving. On the substrate, a semiconductor layer, an insulating layer, and an electrode layer having a specific pattern are formed. Referring to FIG. 1, there is shown a photoresist coating device / equipment 50 for a liquid crystal display in the prior art. In the photoresist coating device 50, a plurality of substrates (not shown in the figure, I is arranged in the substrate cassette 52, and one of the plurality of substrates is transported to a conveyor belt by a first robot arm 54a. 72. The conveyor belt is used to move the substrate and sequentially pass through a plasma device 60, a cleaning device 62 and a heating device 63, and then to an adhesive layer spraying device 64. The plasma or ultraviolet light (UV ) The device 60 has an ionized environment and is used to clean the substrate in advance. The cleaning device 62 may further include various cleaning processes, such as brush, high pressure jet water, and ultrasonic cleaning. Processes such as cleaning and air knife drying. The heating device 63 is used to remove residual water from the cleaning device. The adhesive layer spraying device 63 is used to spray an adhesive layer on the substrate. After that, The substrate is made by a

Page 5 00847.ptd 1232491 V. Description of the invention (2) The second robot arm 54b is transported from the adhesive layer spraying device 64 to a cooling device 6 / 'for cooling the substrate. After that, the substrate is transported from the cooling device ββ to a photoresist coating device 2 by a third robot '54c for applying a photoresist on the substrate. A third robot arm 54c transports the substrate from the photoresist coating device 2 to the buffer area 70. The solvent in the buffer area 70 ^ ′ is extracted or evaporated. The substrate is transported from the buffer area 70 to the heating device 58 by a fourth robot arm 54d to dry the photoresist. After that, the substrate is transported from the heating device 58 to the substrate cassette 52 by the first robot arm 54a. Referring to FIG. 2, the photoresist coating device 2 described above is shown. The photoresist coating device 2 includes a stage 10, which carries and fixes a substrate 12, such as a glass substrate, and is disposed on a base 4. The photoresist coating device 2 includes a nozzle 6 'having an outlet 8 having a linear slit. A channel 7 is connected to a photoresist supply source (not shown) and a liquid storage portion 9 of the nozzle 6. The nozzle 6 is moved from one side of the substrate 12 to the other side of the substrate 12 and the photoresist is discharged or sprayed onto the substrate 12 through the outlet 8 of the linear slit, so that The photoresist is uniformly coated on the substrate J 2. After the coating of the photoresist is completed, the nozzles 2 and 2 stay in the waiting area 1 40. More specifically, as shown in Figs. 3a and 3b, it shows a conventional photoresist coating process. First, the nozzle 6 discharges the photoresist on the substrate 12 and "moves from above the waiting area 14a to above the waiting area i4b, and its movement path is shown by arrow 22". Then, the nozzle 6 stops discharging the photoresist, and moves from above the waiting area 14b to above the waiting area 14a.

00847.ptd Page 6 1232491 V. In the description of the invention (3), its movement path is shown by arrow 26, so as to complete-the process cycle. In this process, the substrates of the photoresist are finished, and the nozzle 6 needs to wait for the nozzle 6 to return to the waiting area 1 4 a. After that, 54c is used to take out the substrate and load it into another substrate. 5 Because during the third robotic arm, the standby time of the photoresist coating process is "longer:" This one is made in the photoresist coating equipment 50, and the photoresist coating device is, As a result of the manufacturing process, the standby time further lengthens the entire processing time of the bottlenecks. Wang Geqiang first blocked the coating equipment 5. 〇〇ΒΐΓπΛ " ^ 5,! 76ν56 ^ 'C = atlng APparatus) The reference film coating device is incorporated herein for coating a photoresist layer on a liquid crystal display panel. The coating process of the photoresist is only for a single platform to support "a gene," and it is necessary to provide A thin film coating device capable of reducing the waiting time of substrate loading and unloading in one pass of photoresist coating. --- [Summary of the Invention] An objective of r 门 一 ίί is to provide a thin-film coating device that can be continuously processed on a photoresist ::::: substrate without causing processing cloth 2 ;: 提, The coating A soil / pan film coating device includes at least two flat platforms to support and fix the substrate. The nozzle is moved relative to the two substrates, thereby coating the film on the two substrates. One by one According to the film coating device of the present invention, the photoresist coating process does not have to wait. 00847.ptd Page 7 1232491

The processing time for the substrate to be loaded and unloaded. In order to make the above and other purposes of the present invention obvious, the following coatings and advantages can be more clearly explained as follows: ^ No attached drawings, detailed evaluation [Embodiment] Technology ： The manufacturing process of liquid crystal display is taken as an example to illustrate the present invention. The film coating device that is good at this invention is not limited to liquid 221. It can also be applied to organic light emitting diodes (0 叩 心 1-ting Diode, 0LED). ) Display panel manufacturing process. Refer to FIG. 4, which shows a thin film coating device 100 according to an embodiment of the present invention, which is used to coat a thin film layer, such as a photoresist thin film layer and a color filter, on a substrate of a liquid crystal display. Thin film layer, black matrix (Mack matrix) thin film layer, ink jet + ink jet layer (ink jet) or photo spaced film layer (photo spaced film layer, etc.) Those skilled in the art will understand that this photoresistive thin film layer, color light A thin film layer, a black matrix (black film layer, an ink jet film layer, or a photospacer film layer) are then formed into a specific pattern by a lithographic etching process. Hereinafter, light will be used. The film is described as an example to illustrate an embodiment of the present invention. The film coating device includes two working areas, such as two platforms 11 and 150, which support and fix two substrates 12, 12, 152, and are arranged on a base 104. The photoresist coating device 100 further includes a nozzle 106 having a linear slit outlet 108. A channel 107 connects a photoresist supply source (not shown) and the nozzle 106. Liquid storage section 109. The photoresist liquid

00847.ptd Page 8 1232491

It can be sprayed or discharged from the outlet i 08 of the linear slit, and the nozzle 11 is moved relative to the substrate 11 2 or 15 2, thereby coating the photoresist on the two substrates 112 and 152. on. The photoresist coating device 100 further includes a plurality of waiting areas 114a, 114b, and 114c for stopping the nozzle 106 and collecting the photoresist dripped from the nozzle 106. The nozzle 6 can stay above any one of the plurality of waiting areas 114a, 114b, and 114c. At least one of the plurality of waiting areas 114a, 114b, and 11 4c may further include a cleaning device 'to remove the photoresist remaining on the nozzle. In a specific first embodiment, as shown in Figs. 5a and 5b, it shows the coating process of photoresist. First, the nozzle 6 began to apply the photoresist to. On the substrate 112, it moves from above the waiting area H4a to above the waiting area 114b, and its moving path is shown by arrow 122. The nozzle 106 applies the photoresist on the substrate 152, and moves from above the waiting area 14b to the waiting area 114 (: above the moving path, as shown by arrow U 0 Then, the nozzle stops stopping discharging the photoresist, and moves from above the waiting area 114c to above the waiting area 14 &, and its moving path is shown by arrow 134. In one embodiment, when the photoresist has been coated on the substrate 112 and the nozzle 106 has been moved above the substrate 52, a robotic arm (not shown) may first place the substrate 112 It is carried out from the thin coating device to the device of the next process, and then the next uncoated substrate is loaded on the platform 1 i of the thin film coating device. In a specific second embodiment, As shown in Figures 6a and 6b, it shows the photoresist coating process. First, the nozzle i 0 6 starts to coat the photoresist on

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The substrate 112 moves from above the waiting area η 4a to above the waiting areas 114b, and its moving path is shown by arrow 222. The nozzle 106 stops discharging the photoresist, and moves from above the waiting area to the area above the waiting area 114c, and its moving path is shown by arrow 226. The nozzle 1 06 then coats the photoresist on the substrate 丨 5 2 and moves from above the waiting area 114c to above the waiting area 14b, and its movement path is as shown by arrow 2 3 0 Show. Then, the nozzle 106 stops discharging the photoresist, and moves from above the waiting area 11 4b to above the waiting area 114a ', and its moving path is shown by arrow 234. In this specific second embodiment, when the photoresist system has been coated on the substrate 112 and the nozzle 106 has been moved above the substrate 152, a robotic arm (not shown) may First carry the substrate 丨 2 from the thin film coating device to a device of the next process, and then load the next uncoated substrate on the platform 11 of the thin film coating device. In a specific third embodiment, as shown in Figs. 7a and 7b, it shows the coating process of photoresist. First, the nozzle 106 stops discharging the photoresist, and moves from above the waiting area 114a to above the waiting area 114b, and its moving path is shown by arrow 3 1 8. The nozzle 106 starts to apply the photoresist on the far substrate 152, and moves from above the waiting area 114b to above the waiting area 114c, and its moving path is shown by arrow 322. The nozzle 106 stops discharging the photoresist, and moves from above the waiting area 4c to above the waiting area 114b, and its moving path is shown by arrow 326. The nozzle 106 then coats the photoresist on the substrate 112 and moves from above the waiting area 11 4b to above the waiting area 丨 丨 ", its moving path

00847.ptd Page 10 1232491 V. Description of the invention (7) The diameter is shown by arrow 3 3 0. In the specific third embodiment, when the photoresist is coated on the substrate 152 and the nozzle 106 has been moved to the substrate 丨? Above, a robotic arm (not shown) can first carry the substrate 152 from the film coating device to the device of the next process, and then load the next uncoated substrate on the film coating Cloth device on the platform 150. Those skilled in this art will know that in the photoresist coating process, the process sequence of discharging the photoresist and stopping the photoresist, the movement path of the nozzle and any predetermined position can be coordinated with the handling of the robot arm And a combination is not generated. Furthermore, in the photoresist coating process, any waiting area can be used as the starting position and final position of the nozzle. Reference is made to Figs. 8a and 8b, which show a thin film coating apparatus 400 according to another embodiment of the present invention. The thin film coating apparatus 400 is substantially similar to the thin film coating device 100 and similar elements will be given similar reference numerals. The film coating device 400 includes three platforms 410, 450, and 4 60, which support and fix the three substrates 412, 452, and 462, and are arranged on a base 400. In a specific embodiment, as shown in Figures 8a and 8b, it shows the coating process of photoresist. First, 'the nozzle 4 06 starts to apply the photoresist on the substrate 412' and moves from above a waiting area 414a to above a waiting area 414b, and its moving path is shown by arrow 422. The nozzle 4 06 then coats the photoresist on the substrate 452, and moves from above the waiting area 41m to above a waiting area 41 4c. The moving path is as shown by arrow 430. . The nozzle 406 then coats the photoresist on the substrate 462, and moves from above the waiting area 41 4c to 1232491 above a waiting area 414d, and its moving path is shown by arrow 438. Then: after that, the nozzle 40 6 stops emitting the light Ph h 丨 and moves from above the waiting area 414d to above the waiting area 414a, and its moving path is shown by arrow 442. In this particular embodiment, when the photoresist has been coated on the substrate 4 1 2 and the nozzle 40 6 has been moved above the substrate 452, a robotic arm (not shown in the figure) may first The substrate 412 was carried out from the thin film coating device to a reeling device, and then the next uncoated substrate was loaded on the platform 41 of the thin film coating device. Furthermore, when the photoresist system has been coated on the substrate 452 and the nozzle 40β has been moved above the substrate 462 ', the robot arm (not shown) may first move the substrate 452 from The film coating device is carried out to a device of the next process, and then the next uncoated substrate is loaded on the platform 45 of the film coating device. Compared with the prior art, according to the film coating device of the present invention, the photoresist coating process does not need to wait for the substrate to be loaded and unloaded, which will reduce the entire coating process time, that is, the substrate Can be processed continuously without causing idle processing equipment. Reference is made to Fig. 9 which shows a photoresist coating apparatus 550 according to an embodiment of the present invention. In the photoresist coating device 5 50, a plurality of substrates (not shown) are arranged in the substrate cassette 5 52. One of the plurality of substrates is transported to a Conveyor belt 572. The conveyor belt 572 is used to move the substrate, and sequentially passes a plasma or ultraviolet (UV) device 560, a cleaning device 562, and a heating device 563 to an adhesive layer spraying device 564. The plasma or ultraviolet (UV) device 560 has an ionization environment and is used to clean the substrate in advance. The cleaning device 5 6 2 may additionally include

1232491 V. Description of the invention (9) A variety of cleaning processes, such as brush, high pressure jet water spraying, ultrasonic cleaning, and air knife drying. The heating device 5 6 3 is used to remove residual water from the cleaning device. The adhesive layer spraying device 5 6 4 is used to spray an adhesive layer on the substrate. Thereafter, the substrate is transported from the adhesive layer spraying device 5 6 4 to a cooling device 5 6 6 by a second robot arm 554b for cooling the substrate. After that, the substrate is transported from the cooling device 5 6 6 to the photoresist coating device 100 and 400 of the present invention by a third robot arm 5 5 4 c for coating a photoresist on On the substrate. Those skilled in the art will know that the photoresist coating a and the 550 series may not have at least two photoresist coating devices 100 and 400. For example, the photoresist coating device 5 50 is provided with two photoresist coating devices 100. In the photoresist coating process, the photoresist coating device 5 50 has two nozzles and The four platforms can be combined with the robot arm to produce different combinations. A third robot arm 554c is used to transport the substrate from the photoresist coating device 100 to the buffer area 570. In the buffer area 57, the solvent in the photoresist is extracted or evaporated. The substrate is transported from the punching area 570 to the heating device 558 by a fourth robot arm 55 忉 for drying the photoresist. Thereafter, the substrate is transported from the 埶 558 to the substrate cassette 552 by the first robot arm 554a. … Although the present invention has been disclosed in the foregoing embodiment, it is also invented. Anyone who is familiar with this art can make various changes in the book without changing the discussion of 5: : The spirit and scope are subject to the definition of the enclosed patent application. Motian

1232491 Brief description of the drawings [Simplified description of the drawings] Figure 1 is a schematic diagram of the structure of the prior art photoresist coating equipment. FIG. 2 is a perspective view g of a prior art photoresist coating device. Figures 3a and 3b are a photoresist coating process of the prior art. Figure f4 is a U-body of a photoresist coating device according to an embodiment of the present invention. 5a and 5b are schematic cross-sectional views of a photoresist according to a first embodiment of the present invention. Figures 6 3 and 6 b are cross-sections of the photoresist coating process according to the present invention. Figures 7a and 7b are schematic sectional views of a photoresist according to a third embodiment of the present invention.丨 Clothing Madam Figures 8a and 8b are schematic cross-sectional views of a photoresist cooler according to another embodiment of the present invention. π a π-f 9 is a schematic structural diagram of a photoresist coating apparatus according to an embodiment of the present invention. Description of the drawing number: Photoresist coating device Nozzle outlet Platform Waiting area 4 Base 7 Channel 9 Liquid storage 2 Substrate 4b Waiting area 00847.ptd Page 14 1232491

Brief description of drawings 22 arrow 26 arrow 50 Photoresist coating system 52 Substrate box 54a First robot arm 54b Second robot arm 54c Second robot arm 54d Fourth robot arm 58 Heating device 60 Plasma or ultraviolet light device 62 Cleaning device 63 Adding device 64 Adhesive layer spraying device 66 Cooling device 68 Photoresist coating device 70 Buffer 72 Conveyor 100 Photoresist coating device 104 Base 106 Nozzle 107 Channel 108 Out α 109 Liquid storage section 110 Platform 112 Substrate 114a Waiting Zone 114b Waiting zone 114c Waiting zone 122 arrow 130 arrow 134 arrow 150 platform 152 substrate 222 arrow 226 arrow 230 arrow 234 arrow 318 arrow 322 arrow 326 arrow 330 arrow 422 arrow 426 arrow 430 arrow 438 arrow 442 arrow 00847.ptd page 151232491

Schematic description 550 Photoresist coating system 552 Substrate box 5 54a First robot arm 554b Second robot arm 5 54c Second robot arm 554d Fourth robot arm 558 Heating device 560 Plasma device 562 Cleaning device 563 Heating device 564 Adhesion Layer spraying equipment-set 566 cooling device 570 buffer zone 572 conveyor 00847.ptd page 16

Claims (1)

1232491 6. The scope of the patent application: a thin film is applied to at least two substrates, a thin m coating device for coating one, which includes: at least two working areas for configuring the substrate; and at least one nozzle, The film is coated on the substrate relative to the working area respectively. Move both wrongly and correctly 2. The film coating device according to item 1 of the patent application scope further includes: at least one waiting area for staying the pout. 3. According to the thin film coating device according to item 丨 of the patent application scope, there should be a linear slit exit in 1. Eight ^ ^ 4. The thin film coating device according to item 丨 of the patent application scope, wherein the color filter film, black matrix (Mack matr; x) 2 groups of water film (lnk ... and light gap sub-film) 2. A thin film coating method of the factory, including the following steps: for the first and second substrates and a first and second flat △ bearing, respectively, and fixing the first and second substrates; a nozzle is provided at the mouth for positioning At a first positioning point, moving the nozzle, and coating a thin film on the first substrate; moving the nozzle, and coating a film on the second substrate, and finding a film to Ptd 00847, page 17 1232491 6. The scope of the patent application moves the nozzle from the second positioning point to the first positioning point 6. A thin film coating method comprising the following steps: providing a first and a second substrate and a First and second platforms for carrying and fixing the first and second substrates respectively; providing a nozzle positioned at a first positioning point; moving the nozzle and coating on the substrate on the first platform A film to a second anchor point Moving the nozzle to the first positioning point; moving the nozzle and coating a film on the substrate on the second platform to a third positioning point; and moving the nozzle to the first positioning point. 7 The film coating method according to item 5 or 6 of the patent application scope, further comprising the following steps: providing a robot arm for loading and unloading the substrate, wherein the nozzle is on both the first and second platforms When one of them is on, the robot arm is used to load or unload the substrate on the other of the first and second platforms. 8. According to the thin film coating method of the 6th scope of the patent application, the other It includes the following steps: Provide a pre-cleaning device to pre-clean the substrate. 9. The thin-film coating method according to item 8 of the patent application scope, wherein the pre-cleaning 00847.ptd Page 18 1232491 6. Scope of patent application The washing device is one of plasma or ultraviolet light device. 10. The thin film coating method according to item 6 of the patent application scope, further comprising the following steps: A cleaning device is provided to clean the substrate. 11. The thin film coating method according to item 10 of the scope of the patent application, wherein the cleaning device is selected from the group t consisting of brushing, high-pressure water jet spraying, ultrasonic cleaning, and air knife drying. 1 2. The thin film coating method according to item 6 of the patent application scope, further comprising the following steps: A heating device is provided to heat the substrate. 1 3. The thin film coating method according to item 6 of the scope of patent application, further comprising the following steps: The substrate is transported to a buffer area to extract the solvent contained in the thin film. 14. The film coating method according to item 6 of the patent application scope, further comprising the following steps: A heating device is provided for drying the film. 15. The thin film coating method according to item 6 of the patent application scope, which additionally includes the following 00847.ptd Page 19, 1232491 Patent application steps: Provide a 0-adhesive layer spraying device for spraying an adhesive layer on the substrate 16, a configuration providing a providing platform, providing a mobile film, to a mobile film, to The supply nozzle is inserted into the base or the base; the method for drying and coating the film includes the following steps: a substrate box; a plurality of substrates in the cleaning device for cleaning the substrate; providing a first A first and a second for respectively carrying and fixing the substrate; positioned at and at a second positioning point of the nozzle of a pre-cleaning nozzle; a substrate box;-for pre-cleaning the substrate; a first positioning point; A thin film of the nozzle is coated on the substrate on the first platform to the first positioning point; a thin film of the nozzle is coated on the substrate on the second platform and positioned on the positioning point; the nozzle is moved to the first positioning Point; arm, use the second platform, the first machine, the first, and the board to carry the first and the first to the first buffer to load and carry the substrate, where the spray When one of the person who, for the robot arm on the other of the two substrates bis platform; region for extracting the film contained within the film of solution; and conveying the substrate to the substrate cassette 1232491 VI. Scope of patent application 1 7. The thin film coating method according to item 16 of the scope of patent application, wherein the pre-cleaning device is one of a plasma or ultraviolet light device. 18. The thin film coating method according to item 16 of the scope of patent application, wherein the cleaning device is selected from the group consisting of brushing, high-pressure water jet spraying, ultrasonic cleaning, and air knife drying. -19. The thin film coating method according to item 16 of the patent application scope, further comprising the following steps: providing an adhesive layer spraying device for spraying an adhesive layer on the substrate 20, a thin film coating device, The utility model is used for coating a thin film, which comprises: n working areas, each of which can carry at least one substrate, where η is an integer; and m nozzles move relative to the n working areas, thereby coating the film on the On the substrate on the work area, where m is an integer and l $ m < n. 2. A thin film coating method comprising the following steps: providing a plurality of substrates; providing a plurality of platforms for carrying the plurality of substrates; providing at least one nozzle positioned on a first positioning point; moving the nozzle, And sequentially coating a thin film on the plurality of substrates until 00847.ptd page 21 1232491 6. Scope of patent application-a second positioning point; and moving the nozzle from the second positioning point to the first positioning point. 2 2. A display device comprising: a first substrate; a second substrate disposed opposite to the first substrate; and at least one thin film layer disposed on the first substrate;-wherein the thin film is provided by a A thin film coating device is coated on the first substrate, and the thin film coating device includes at least two working areas for carrying the first substrate, and at least one nozzle can be moved relative to the working area, respectively, for The film is applied. 2. The display device according to item 22 of the scope of patent application, wherein the display device is a liquid crystal display. 24. The display device according to item 22 of the scope of patent application, wherein the display device is an organic light emitting diode display panel. 00847.ptd Page 22