TW200525597A - Film coating device and method - Google Patents

Abstract

A film coating device is used to coat substrates with a thin film. The film coating device includes at least two stages and a nozzle. The stages are used to support and fix the substrates. The nozzle is moved in relative to the two substrates for coating the two substrates with the thin film.

Description

200525597 V. Description of the invention (1) [Technical field to which the invention belongs] The present invention relates to a thin film coating device, and more particularly to a thin film coating device, which can reduce the standby time of a substrate during a thin film coating process. [Prior art] In the liquid crystal display manufacturing process, the lithography etching process is widely used. In the photolithography process, a photoresist is first coated on a broken glass substrate, and then the photoresist is exposed to light, and a predetermined pattern is formed on the photoresist. In the above process, a photoresist film having the predetermined pattern is formed on the surface of the glass substrate. The photoresist pattern can be further applied to a thin film formation process and a last name engraving process' to form a semiconductor layer, an insulation layer, and an electrode layer with a specific pattern on the substrate. Referring to Fig. 1, there is shown a photoresist coating apparatus 50 for a liquid crystal display in the prior art. In the photoresist coating device 50, a plurality of substrates (not shown) are arranged in the substrate cassette 52, and one of the plurality of substrates is transported to a conveyor belt 72 by a first robot arm 54a. . The conveyor belt 72 is used to move the substrate, and sequentially passes through a plasma device 60, a cleaning device 62, and a heating device 63, and then to an adhesive layer spraying device 64. The plasma or ultraviolet (UV) device 60 has an ionizing environment and is used to clean the substrate in advance. The cleaning device 62 may further include various cleaning processes, such as brush, high pressure jet water spray washing, ultrasonic cleaning, and air knife drying. The heating device 63 is used to remove residual water from the cleaning device. The adhesive layer spraying device 6 4 is used to spray an adhesive layer on the substrate. After that, the substrate is

00847.ptd Page 5 200525597 V. Description of the invention (2) The second robot arm 54b is transported from the adhesive layer spraying device 64 to a cooling device 66 for cooling the substrate. After that, the substrate is transported from the cooling device 66 to a photoresist coating device 2 by a third robot arm 54c for applying a photoresist on the substrate. A third robot arm 54c transports the substrate from the photoresist t coating device 2 to the buffer area 70. The solvent in the photoresist in the buffer zone 70 will be extracted or evaporated. The substrate is transported from the buffer area 70 to the heating device 58 by a fourth robot arm 54d for drying the photoresist. After that, the substrate is transported from the heating device 58 to the substrate cassette 52 by the first robot arm 54a. Referring to FIG. 2, the photoresist coating device 2 described above is shown. The photoresist cold cloth device 2 includes a stage 10, which carries and fixes a substrate 12 'such as a glass substrate, and is disposed on a base 4. The photoresist coating device 2 includes a nozzle 6 having an outlet 8 having a linear slit. A channel 7 is connected to a photoresist supply source (not shown) and a liquid storage portion 9 of the nozzle 6. The nozzle 6 moves from one side of the substrate 12 to the other side of the substrate 12, and the photoresist is discharged or sprayed onto the substrate 12 through the outlet 8 of the linear slit, so that the light The resist is evenly coated on the substrate i 2. When the coating of the photoresist is completed, the nozzles 2 and 2 remain in the equal zone 1 4. 'In more detail, as shown in Figures 3a and 3b, it shows a conventional photoresist coating process. First, the nozzle 6 discharges the photoresist on the substrate 12 and moves from above the waiting area 14a to above the waiting area 141), and its moving path is shown by arrow 22. Then, the nozzle 6 stops discharging the & photoresist, and moves from above the waiting area 14b to above the waiting area 14a.

200525597 V. Description of the invention (3) _, its moving path is shown as arrow 26, so the process cycle is-,,,, etc. In this process, after each substrate is coated, the coating of the photoresist needs to wait for the nozzle β to return to the waiting area 1 4a, $ =, ^ After coating, 54c makes the substrate taken out and loaded into another Its / the second robot arm is used in the photoresist coating equipment 5 " and the photoresist coating is further processed by the process, so the standby time further makes the process more tidy and prolongs the bottleneck processing time of your horse. 4- US Patent No. 5,976,256 of this photoresist coating apparatus 50, entitled " ㈣Coating Apparatus) ", which is incorporated herein by reference to the film coating device 'for coating a photoresist layer Yu-Liquid: Do not plant on the Tao. The photoresist coating process is only for single, non-functional substrate boards.卞 σ is used to carry a single system 2: ΪΪ ΪΪ ΐ A thin coating coating device, which waits for the loading and unloading of the photoresist coating m. Coating: It is to provide a thin film coating device which can be continuously processed on the photoresist substrate without causing processing cloth. The present invention provides a thin film coating device for coating △ and 1 nozzle ζ substrates. The thin film coating device includes at least two flat "rain: the child's platform platform bears and fixes the substrate. The nozzle is used to coat the film on the two substrates. The film coating device of χ 5 Resistance coating process does not need to wait 00847.ptd 200525597

This will further reduce the overall coating process time required for the substrate to be loaded and unloaded. In order to make the above and other aspects of the present invention obvious, the following describes the embodiments of the present invention as follows: The purpose, features, and advantages can be made clearer and accompanied by the accompanying drawings for detailed description. The process of making dpo 2L and one or two processes is taken as an example to illustrate the present invention. Those skilled in Taiji will understand that according to the present invention, the thin and thin film coating device is not limited to liquid coating. The unfavorable process can also be applied to organic light emitting diodes (0rganlc for coating a thin film layer on a substrate of a liquid crystal display, such as a photoresist film layer, a color filter film layer, and a black matrix (Mack matrix) film layer, ink jet film layer (ink jet) or light interstitial film (ph〇t〇,

Llght-Emitting Dl0de; 0LED) display panel manufacturing process. Reference is made to FIG. 々, which shows a thin film coating apparatus (⑽), a spacer) film layer, and the like according to an embodiment of the present invention. Those skilled in the art will understand that the photoresist film layer, color; light filter film layer, black matrix film layer, ink jet film layer, or photointerferon (ph〇t〇spacer) The thin film layer is formed into a specific pattern by a lithographic etching process. In the following, a photoresist will be taken as an example to explain the embodiment of the present invention. The film coating device includes two working areas, such as two platforms 110, 150 ', which carry and fix two substrates 112, 152, and are disposed on a base 104. The photoresist coating device 100 further includes a nozzle 106 having an exit of a linear slit 108. A channel 107 is connected to a photoresist supply source (not shown) and the liquid storage portion 10 of the nozzle 106. The photoresist liquid

00847.ptd Page 8 200525597 V. Description of the invention (5) It can be ejected or discharged from the outlet 108 of the linear slit, and the nozzle 10 is moved relative to the substrate 1 12 or 15 2 to thereby The photoresist is coated on the two substrates 112 and 152. The photoresist coating apparatus 100 further includes a plurality of waiting areas 114a, 114b, and 114c 'for stopping the nozzle, and collecting the photoresist dripped from the nozzle 106. The nozzle 6 can stay above any one of the plurality of waiting areas 114a, 114b, and 114c. At least one of the plurality of waiting areas 114a, 114b, and 114c may further include a cleaning device to remove the photoresist remaining on the nozzle. // In a specific first embodiment, as shown in Figs. 5a and 5b, it shows a coating process for photoresist. First, 'the nozzle 106 starts to apply the photoresist on the substrate 112' and moves from above the waiting area ii4a to above the waiting area 114b, and its moving path is shown by arrow 22. The nozzle 106 applies the photoresist on the substrate 152, and moves from above the waiting area 丨 丨 "to above the waiting area 114c. The moving path is shown by arrow 130 Then, the nozzle 106 stops discharging the photoresist, and moves from above the waiting area 11 4c to above the waiting area u 4a, and its moving path is shown by arrow 134. " In a specific first embodiment, when the photoresist has been coated on the substrate 112 and the nozzle 106 has been moved above the substrate 152, the I 'robotic arm (not shown) may first The substrate 1 1 2 is carried out from the thin film coating device to the device of the next process, and then the next uncoated substrate is loaded on the platform 110 of the thin film coating device. In the second embodiment, as shown in Figures 6a and 6b, it shows the coating process of photoresist. First, the nozzle 106 starts to apply the photoresist to 00847.ptd. Page 9 200525597 V. Description of the invention (6 ) On the substrate 112 and moved from above the waiting area 114 & to above the waiting area 114b, which As above the moving path. The nozzle 106 shown by arrow 222 to stop discharging of the photoresist, and the waiting area from Shu Shu "is moved to a waiting area 114c at the upper, the path of movement thereof as shown by arrow 226. The nozzle 1 06 then applies the photoresist on the substrate 5 2 and moves from above the waiting area 114c to above the waiting area 11413, and its moving path is the same as that of the front 2 3 0 . Then, the nozzle stops discharging the photoresist, and moves from above the waiting area 11 4b to above the waiting area 11 4a. Its moving path is shown by arrow 2 34. In the specific second embodiment, when the photoresist has been coated on the substrate 112 and the nozzle 106 has been moved above the substrate 152, a robot # (not shown) may first The substrate 112 is carried out from the thin film coating device to a device of the next process, and then the next uncoated substrate is loaded on the platform of the thin film coating device. In a specific third embodiment, as shown in Figs. 7a and 7b, it shows the coating process of photoresist. First, the nozzle stops discharging the photoresist, and moves from above the waiting area 114a to above the waiting area 114b, and its moving path is shown by arrow 3 1 8. The nozzle 106 starts to coat the photoresist on the substrate 152, and moves from above the waiting area ii4b to above the waiting area 114c, and its moving path is shown by arrow 322. The nosepiece 106 stops discharging the photoresist, and moves from above the waiting area 114o to above the waiting area 11 4b, and its moving path is shown by arrow 326. The nozzle 106 then coats the photoresist on the substrate 112, and moves from above the waiting area 114b to above the waiting area 丨 丨 其, its moving path 200525597

The diameter is shown by arrow 3 3 0. In this particular third embodiment, when the photoresist is coated on the substrate 152 and the nozzle 106 has been moved above the substrate 112, a & robot arm (not shown) may The substrate 152 is first carried out from the thin film coating device to a device in the next process, and then the next uncoated substrate is placed on the platform 150 of the thin film coating device. Those skilled in this art will know that in the photoresist coating process, the process sequence of discharging the photoresist and stopping the photoresist, the movement path of the nozzle, and any predetermined position can be coordinated with the handling of the robot arm And produce different combinations. Moreover, in the photoresist coating process, any waiting area can be used as the starting position and final position of the nozzle. Reference is made to Figs. 8a and 8b, which show a film coating apparatus 400 according to another embodiment of the present invention. The thin film coating apparatus 400 is substantially similar to the thin film coating apparatus 100, and similar elements will be given similar reference numerals. The film coating and cloth device 400 includes two platforms 410, 450, and 460, which support and fix the three substrates 412, 452, and 462 'and are arranged on a base 404. In a specific embodiment, as shown in the figure and the figure, it shows the coating process of photoresist. First, the nozzle 4 06 starts to apply the photoresist on the US plate 412, and moves from above a waiting area 414a to above a waiting area 41 4b. The moving path is as indicated by arrow 422 Show. The nozzle applies the photoresist on the substrate 452, and from above the waiting area 41 centimeters U㈣ above 14c ', its movement path is as shown by arrow 430. The nozzle 406 then applies the photoresist on the substrate 462 and moves from above the waiting area 4 14c to above a waiting area 414d.

00847.ptd Page 11 200525597 V. Description of the invention (8) Its movement path is shown by arrow 4 3 8. Then, the nozzle 4 06 stops discharging the photoresist, and moves from above the waiting area 4 1 4d to the waiting area 4 1 4 a-^^ ', and its moving path is shown by arrow 442. In this particular embodiment, when the photoresist has been coated on the substrate 4 i 2 and the nozzle 406 has been moved above the substrate 452, a robotic arm (not shown) may first apply The substrate 412 is carried out from the thin film coating device to a device in the next process, and then the next uncoated substrate is loaded on the platform 4 10 of the thin film coating device. Furthermore, when the photoresist system has been coated on the substrate 452 and the nozzle 406 has been moved above the substrate 462, the robot arm (not shown) may first remove the substrate 452 from the film. The coating device is carried out to the device of the next process, and then the next uncoated substrate is loaded on the platform 450 of the film coating device. Compared with the prior art, the thin film coating device according to the present invention does not need to wait for the substrate to be loaded and unloaded during the photoresist coating process, thereby reducing the entire coating process time, that is, the substrate can Continuous processing without causing idle processing equipment. Referring to Fig. 9, there is shown a photoresist coating apparatus 5500 according to an embodiment of the present invention. In the photoresist coating device 5500, a plurality of substrates (not shown) are arranged in the substrate cassette 552, and one of the plurality of substrates is transported to a conveyance by a first robot arm 554a. With 572. The conveyor belt 572 is used to move the substrate, and sequentially passes through a plasma or ultraviolet (UV) device 560, a cleaning device 562, and a heating device 563 to an adhesive layer spraying device 5 64. The plasma or ultraviolet (UV) device 560 has an ionized environment and is used to clean the substrate in advance. The cleaning device 5 6 2 may additionally include

00847.ptd Page 12 200525597 V. Description of the invention (9) Various cleaning processes, such as brush, high pressure jet water spray cleaning, ultrasonic cleaning, and air knife drying . The heating device 5 6 3 is used to remove residual water from the cleaning device. The adhesive layer nozzle device 5 6 4 is used to spray an adhesive layer on the substrate. Thereafter, the substrate is transported from the adhesive layer spraying device 5 6 4 to a cooling device 5 6 6 by a second robot arm 554b for cooling the substrate. After that, the substrate is transported from the cooling device 566 to the photoresist coating device 100 and 400 of the present invention by a third robot arm 554c to apply a photoresist to the substrate. Those skilled in the art can know that the photoresist coating equipment 550 series can be provided with at least two photoresist coating devices 丨 0, 400. For example, Lu 'the photoresist coating device 5 50 is provided with two photoresist coating devices 1 QQ, and in the photoresist coating process, the photoresist coating device 5 50 has two nozzles and four Each platform can be combined with the handling of the robotic arm to generate different combinations. A second robotic arm 554c transports the substrate from the photoresist coating device 100 to the buffer area 5 70. In the buffer area 570, the solvent in the photoresist will be drawn out or burst. The substrate is transported from the buffer zone 570 to the heating device 558 by a fourth robot arm 5 5 4d for drying the photoresist. Thereafter, the substrate is transported from the stacking device 558 to the substrate cassette 552 by the first robot arm. … Although the present invention has been disclosed in the foregoing embodiment *, it is not intended to limit anyone skilled in the art of the present invention without departing from the spirit and scope of the present invention: 2 May: Various changes and modifications. Therefore, the scope of protection of the present invention shall be determined by the scope of the appended patent application.

200525597 Brief description of the drawings [Simplified description of the drawings] Figure 1 is a schematic diagram of the structure of the photoresist coating equipment of the prior art. FIG. 2 is a schematic perspective view of a photoresist coating device of the prior art. Figures 3a and 3b are schematic sectional views of the photoresist coating process of the prior art. Fig. 4 is a three-dimensional view of a photoresist coating device according to an embodiment of the present invention. Figures 5a and 5b are schematic cross-sectional views of the TpC of the photoresist coating process according to the first embodiment of the present invention. Figures 6a and 6b are schematic cross-sectional views of a photoresist coating process according to a second embodiment of the present invention. Figures 7a and 7b are schematic cross-sectional views of a photoresist coating process according to a third embodiment of the present invention. 8a and 8b are schematic cross-sectional views of a photoresist coating process according to another embodiment of the present invention. Fig. 9 is a schematic diagram of the structure of a photoresist coating apparatus according to an embodiment of the present invention. Description of drawing number: 2 Photoresist coating device 4 Base 6 Nozzle 7 Channel 8 Outlet 9 Liquid storage section 10 Platform 12 Substrate 14a Waiting area 14b Waiting area 00847.ptd Page 14 200525597

Brief description of drawings 22 arrow 26 arrow 50 Photoresist coating system 52 Substrate box 54a First robot arm 54b Second robot arm 54c Second robot arm 54d Fourth robot arm 58 Heating device 60 Plasma or ultraviolet light device 62 Cleaning device 63 Teaching device 64 Adhesive layer spraying 66 Cooling device 68 Photoresist coating device 70 Buffer zone 72 Conveyor belt 100 Photoresist coating device 104 Base 106 Nozzle 107 Channel 108 Exit 109 Liquid storage section 110 Platform 112 Substrate 114a Waiting Zone 114b Waiting zone 114c Waiting zone 122 arrow 130 arrow 134 arrow 150 platform 152 substrate 222 arrow 226 arrow 230 arrow 234 arrow 318 arrow 322 arrow 326 arrow 330 arrow 422 arrow 426 arrow 430 arrow 438 arrow 442 arrow 00847.ptd page 15 200525597

Schematic description of 550 Photoresist coating system 552 Substrate box 5 54a Robot arm 554b Robot arm 554c Robot arm 5 54d Robot arm 558 Heating device 560 Plasma device 562 Cleaning device 563 Heating device 564 Adhesive layer spraying Installation · Set 566 Cooling device 570 Buffer zone 572 m Send belt 00847.ptd Page 16

Claims (1)

200525597 6. Scope of patent application Two substrates 1. A thin film coating device for coating a thin film on the top, which includes: At least two working areas, which are respectively used for disposing and evenly coating the thin film on the surface The substrate has at least: nozzles, which are respectively related to the working area; and the film coating device according to item 1 of the scope of patent application, and further includes: at least one waiting area for stopping the nozzles. s 3. The thin film coating device according to item 1 of the scope of patent application, wherein the nozzle has a linear slit exit. 4. The thin film coating device according to item 1 of the scope of patent application, wherein the thin film is composed of a photoresist film, a color filter film, a black matrix (b 1 ackmatri X) film, an inkjet film (inkjet), and a light gap Selected from the group consisting of films. 5. A thin film coating method comprising the following steps: providing a first and a second substrate and a first and a second platform for cutting and fixing the first and the second substrate respectively; providing a nozzle for positioning At a first positioning point; moving the nozzle and coating a film on the first substrate; moving the nozzle and coating a film on the second substrate to a second positioning point; and 00847. ptd page 17 200525597 VI. Patent application scope Move the nozzle from the second positioning point to the first positioning point. 6. A thin film coating method, comprising the following steps: providing a first and a second substrate and a first and a second platform for carrying and fixing the first and the second substrate respectively; providing a nozzle positioned at a A first positioning point; moving the nozzle, and coating a film on the substrate on the first platform to a second positioning point; moving the nozzle to the first positioning point; moving the nozzle, and A film is coated on the substrate on the two platforms to a third positioning point; and the nozzle is moved to the first positioning point. 7. The thin film coating method according to item 5 or 6 of the scope of patent application, further comprising the following steps: providing a robot arm for loading and unloading the substrate, wherein the nozzle is on the first and second platforms When one of them is on, the robot arm is used to load or unload the substrate on the other of the first and second platforms. The thin film coating method according to item 6 of the patent application scope, further includes the following steps: Provide a pre-cleaning device for pre-cleaning the substrate. The thin film coating method according to item 8 of the patent application scope, wherein the pre-cleaning 00847.ptd Page 18 200525597 6. Scope of patent application The washing device is one of plasma or ultraviolet light device. 10. The thin film coating method according to item 6 of the patent application scope, further comprising the following steps: Provide a cleaning device for cleaning the substrate. 11. The thin film coating method according to item 10 of the scope of patent application, wherein the cleaning device is selected from the group consisting of brushing, high-pressure water jet spraying, ultrasonic cleaning, and air knife drying. 1 2. The thin film coating method according to item 6 of the patent application scope, further comprising the following steps: A heating device is provided to heat the substrate. 1 3. The thin film coating method according to item 6 of the scope of patent application, further comprising the following steps: The substrate is transported to a buffer area to extract the solvent contained in the thin film. 14. The film coating method according to item 6 of the patent application scope, further comprising the following steps: A heating device is provided for drying the film. 15. The thin film coating method according to item 6 of the patent application scope, which additionally includes the following 00847.ptd Page 19 200525597 6. Scope of patent application Step: Provide an adhesive layer spraying device for spraying an adhesive layer on the substrate. 16. A thin film coating method comprising the following steps: providing a substrate cassette; arranging a plurality of substrates in the substrate cassette; providing a pre-cleaning device for pre-cleaning the substrate; providing a cleaning device, For cleaning the substrate; providing a first and a second platform 'for carrying and fixing the substrate separately; providing a nozzle positioned at a first positioning point; moving the nozzle and the substrate on the first platform Apply a film to a second positioning point; move the nozzle to the first positioning point; move the nozzle and apply a film on the substrate on the second platform to a third positioning point; Moving the nozzle to the first positioning point; providing a robot arm for loading and unloading the substrate, wherein when the nozzle is on one of the first and second platforms, the robot arm is used for Loading or unloading the substrate on the other of the first and second platforms; transporting the substrate to a buffer area for extracting a solvent contained in the film; drying the film; and The substrate Transported to the substrate cassette. 00847.ptd Page 20 200525597 VI. Scope of patent application 1 -11 " 1 7. Film coating method according to item 16 of patent application scope, wherein the pre-cleaning device is a thunder + + aL μ # π 1 one of plasma or ultraviolet light device. The thin film coating method according to Item 16 of the declared patent scope, wherein the cleaning device is selected from the group consisting of brushing, high-pressure water jet spraying, ultrasonic cleaning, and air knife drying. 119. The thin film coating method according to item 16 of the patent application scope, further comprising the following steps: providing an adhesive layer spraying device for spraying an adhesive layer on the substrate. 20. A thin film coating device for coating a thin film, comprising: n working areas, each of which can carry at least one substrate, where η is an integer; and m nozzles move relative to the ^ working area Thus, the film is coated on the substrate on a remote working area, where is an integer and. 2. A thin film coating method comprising the following steps: providing a plurality of substrates; providing a plurality of platforms for carrying the plurality of substrates; providing at least one nozzle positioned on a first positioning point; moving the nozzle, And sequentially coating a thin film on the plurality of substrates until 200525597 VI. Scope of patent application-a second positioning point; and moving the nozzle from the second positioning point to the first positioning point. Installation · '夂 Display board and board display base type one, two, one, two, two, two, including package and paired phase plate, one and one, and-one, and one, should be placed on the cloth. Budi coating the film in a thin place and set up, borrow the layer of the film film is thin from the middle to its carrier phase to support the area to use the industry, the area and the industry can be divided between the two, less mouth to嗔 Have one. Wrap a film and install it on the cloth and coat it with a coating film, use the base with a thin plate, and move it to display the item on the opposite device. 2 2 The device display specially asks Jingshenye to display the installation instructions for the 3 Series 2/1. Face of the display board Item 22 Display body Circumference Fan Second Liguang Special offer Please apply Shen Youyi for 4 series 2 ΤΊ 00847.ptd Page 22