1232473 玖、發明說明： 發明所屬之技術領域 本發明係關於一種積層式LC濾波模組之結構及其製 作方法。 先前技術 在電子産品走向輕、薄、短、小與多功能之趨勢下， 使得電子被動元件朝向陣列化或模組化發展，因此在一積 層晶片渡波元件中，常常需要組合數個電感器和電容器， 經電路設計及積層晶片組件製程整合爲一體，成爲一積層 式電感電容模組。一般的傳統的製法將元件分爲兩部分， -爲電感材料部 >，包括模組中所有的電感，—爲電容材 料。卩刀，包括所有電容；亦即，把所有電感線路設計在磁 性材料層，所有電容線路設計在介電材料層，二者分別燒 成再加以黏合，或是將二者疊在一起共燒。由於磁性材料 與介電材料之收縮率差異，因此傳統的製法很容易因爲收 鈿匹配問冑’在電感材料與電容材料之界面上，發生應力 集中’而使7G件容易有魑曲、破裂之問題。此外，由於元 件的小型化與多功能化，元件中線路高度整合的結果，使 各疋件間容易相互干擾而産生串音（咖峨）問題。 製備積層式電感電容模組的 尤别技術還有日本專利 JP06-325977，其中將電感部分盥 加以黏合。 -電…为別燒結之後再 美國專利US6094111掘+ λ ^ 揭不由一電感部分與一電容部分 1232473 一者共燒而成的積岸 償廣式電感電容模組。日本專利 JP2003-051729 揭示由 田寬感層之堆疊與電容層之堆疊構成 的積層式電感電容掇^ ^ 、、、且。美國專利US5583470揭示一電感 陣列，其以一低導磁 羊之絕層，將元件隔開爲兩部分， 以減少電感間磁力線刼人 、、輕ϋ。美國專利US5023578揭示三端 子電容型之濾 '波_列’其線路佈局主要在兩個平面上， 一平面爲各信號線之線路，另-平面爲-共同電極。 發明内容 本發明的'^目的右接山 仏 、 &出一種積層式LC濾波模組，利用 電感層”電4層在厚度方向分散之結構，將電感層與電容 層分開來，使電感之間之串音（⑽⑻叫降低。 本U的另-目的在提出_種積層式lc濾波模組，使 用兼 >、導磁率與"電节數之材料同時作為積層式π滤波 模組的電感層與電容層，解決傳統製法中元件之叙曲、破 裂問題。 本發明的再一目的在提出—種積層式IX遽波模組，其 中的電感線路與電容電極之佈局設計均可利用到元件整體 面積，使面積利用率提高，製程之精度亦較好控制。 本發明的還-目的在提出積層式Lc滤波模組之結構 的製備方法。 為達成λ述本發日㈣目的依本發明所構築完成—種積 層式LC濾波模組包含一具有一導磁率介於5與13〇〇盥一 介電常數介於4.7至2750的結構材料；及被形成於該結構 1232473 材料内的不同水平面上的電感線路與電容電極，其中該電 感線路與電容電極於垂直方向互相交替。 較佳的，該電感線路與電容電極涵蓋該水平面之實質 上全面積。 較佳的，中該結構材料具有下列組成 (T1〇2)x(M0.Fe2〇3)y ’ 其中 x+y=1，〇以 i，μ 爲 _、犯、 Cu、Mg、Li、Zn金屬或它們的任意組合。 較佳的’該電感線路與電容電極獨立的爲金、銀、鈀、 鎢或它們的任意組合。 本發明亦提出一種製備積層式…慮波模組的方法，包 含將電感線路分別印刷於n生㈣w μ面上； 將電容電極分別印刷於一第二組生胚材料片的表面上；將 印刷有電感線路的第一組生胚材料片和印刷有電容電極的 第二組生胚材料片以互相上下交替方式疊置成爲一積層式 結構體，然後將該結槿體择纟士而士、 構體麂尨而成積層式LC濾波模組，其 中該第一組生胚材料片及該第二組生胚材料片具有下列的 組成（Ti〇2)x ⑽·Fe2〇3)y，其中 x+y——爲跑、 Νι、Cu、Mg、Li、Ζη金屬或它們的任意組合。 杈佳的，該電感線路與電容電極涵蓋該生胚材料片的 表實質上王面積。較佳的，該電感線路與電容電極獨 立的爲金、銀、鈀、鎢或它們的任意組合。 實施方式 本I月提出種積層式LC濾波模組，利用電感層與電 1232473 容層在厚度方向分散之結構，如圖i所示，將電感層1〇與 電谷層20間隔開，相較於傳統製法將所有電感整合在磁性 材料層本發明的電感之間之串音（crosstalk)會因而大幅度 降低、極接近於零。 本發明的電感層與電容層之材料均使用兼具導磁率與 ;丨電韦數之同一系列材料（但不一定完全相同），導磁率在5 至1300之間，介電常數在4·7至275〇之間，而使各個電 感層及電容層間無燒結收縮匹配問題而使其内應力降低。 本發月的各個電感層及電容層的線路佈局可使用其層 結構之全面積而提高了面積利用率及線路佈局的彈性Γ曰 /本發明提出一種積層式LC濾波模組，此模組由數個電 感與數個電容構成，利用電感層與電容層在厚度方向分散 ^結構’將電感層與電容層分開來。例如將電感線路與電 ^極分別依設計印刷於㈣層生胚材料與電容層生胚材 收縮率2。若積層之方式如傳統方式，則由於二材料之 有翹曲破容易在介面上發生應力集中，而造成元件 且雷片a 積層之方式如本發明之分散結構， 之材:層與電容層生胚材料均使用兼具導磁率與介電常數 via:_，則無收縮匹配之應力問題。再加上端電極或内部 題，接^ _ 解决兀件之翹曲、破裂問 灰咼7G件之可靠度。 利用本發明之結構，電定 件整^接 谷層之電極設計可充分利用元 I體面積，使電感與電容 寸爲例，如^ # 佈局更有彈性。3216尺 如圖2a所示，若分割爲4個簡尺寸在同一介 1232473 電日U佈局叹叶’則每個電容之電極面積可設計爲12mm 。若利用整體面積佈局’如圖几所示，電極面積 =爲2.8mmxl.2mm，面積爲前者之7倍。因此，若 要付到相同於以整體面積佈局一張生胚可得之電容量，則 4分割之佈局必湘7張生胚，利用本創作之結構只需4 張生胚。電感層之線路佈局亦有相同情形，同樣以3216尺 寸爲例’線路可設計爲直、線、折線（meander Me)、或是螺 旋（spi叫單層或多層設計，若割爲4個16〇8尺寸則必須 增加電感之圈數才能獲得相同之電感，增加製程之複雜度。 實施例及對照例 元件尺寸爲3216。電感線路採用單層之折線由銀膠網 印而成’線寬〇· 1 mm。生胚使用 (TiC^o.KNio.uCumZnuO.FeWdu 材料，導磁率 u=5〇， ;丨電书數k 1700。將電感線路1丨與電容電極21分別依設 。十印刷於生胚的表面上。如圖3a所示，將電感層生胚與電 容層生胚以上下交替方式疊置成爲一結構體，然後將結構 體以900 C，2小時燒結而成本發明的積層式濾波模 組，其中電感層10與電容層2〇爲交替間隔的結構。圖3b 爲對照例的積層式LC濾波模組，其製備方法除了疊置方式 不同外，其它步驟類同於實施例。 以咼頻電磁場模擬來評估實施例與對照例的兩積層式 LC據波模組的電感間之串音（cr〇sstaik)。模擬結果如下： 1232473 串音（dB) 實施例 <-100 對照例 -1 0 〜_ 2 0 圖式簡單説明 圖1顯示本發明的積層式LC濾波模組之示意圖。 圖2a顯不習知技藝的積層式lc濾波模組之電容電極 佈局的有效面積示意圖。 圖2b顯示本發明的積層式LC濾波模組之電容電極佈 局的有效面積示意圖。 ^圖3a顯示本發明的積層式LC濾波模組之電感層與電 么層的疊置情形的示意圖。 圖3b顯示習知技藝的積層式LC濾波模組之電感層與 電容層的疊置情形的示意圖。 主要元件之圖號說明 1〇··電感層 20·.電容層 U··電感線路 21··電容電極 101232473 发明 Description of the invention: Technical field to which the invention belongs The present invention relates to the structure of a laminated LC filter module and its manufacturing method. With the trend of electronic products to be lighter, thinner, shorter, smaller, and more versatile, the prior technology has led to the development of arrayed or modular electronic passive components. Therefore, in a multi-layer wafer wave component, it is often necessary to combine several inductors and The capacitor is integrated into a whole through circuit design and multi-layer chip assembly manufacturing process, and becomes a multi-layer inductor-capacitor module. Generally, the traditional manufacturing method divides the component into two parts,-is the inductor material section >, including all the inductors in the module,-is the capacitor material. The trowel includes all capacitors; that is, all inductor circuits are designed on the magnetic material layer and all capacitor circuits are designed on the dielectric material layer. The two are fired separately and then bonded, or the two are stacked and co-fired. Due to the difference in shrinkage between magnetic materials and dielectric materials, it is easy for traditional manufacturing methods to “catch stress at the interface between the inductive material and the capacitive material” due to the close matching problem, which makes 7G parts prone to warping and cracking. problem. In addition, due to the miniaturization and multifunction of the components, the high integration of the lines in the components makes it easy for the components to interfere with each other and cause crosstalk (cay) problems. There is also a Japanese patent JP06-325977 for a special technique for manufacturing a multilayer inductor and capacitor module, in which the inductor part is bonded. -Electricity ... Don't sinter it again. US patent US6094111 + + λ ^ Expose the compensation type capacitor module which is not made by co-firing an inductor part and a capacitor part 1232473. Japanese patent JP2003-051729 discloses a multilayer inductor capacitor 掇 ^^,, and, which is composed of a stack of Tian Kuan sense layers and a stack of capacitor layers. US patent US5583470 discloses an inductor array, which uses a low-permeability insulating layer to separate components into two parts to reduce magnetic lines of force between inductors. The US patent US5023578 discloses that a three-terminal capacitive filter 'wave_column' has a circuit layout mainly on two planes, one plane is a line for each signal line, and the other plane is a common electrode. SUMMARY OF THE INVENTION The objective of the present invention is to connect right to the mountain ridge and & produce a multilayer LC filter module, which uses the structure of "inductor layer" and 4 electric layers dispersed in the thickness direction, separating the inductor layer from the capacitor layer, so that the inductance Crosstalk (howling is reduced. Another purpose of this U is to propose _ a multi-layered lc filter module, which uses materials that have both >, magnetic permeability, and " the number of electrical nodes at the same time as the multi-layered π filter module. The inductor layer and the capacitor layer solve the problem of narration and crack of the components in the traditional manufacturing method. Another object of the present invention is to propose a multilayer IX wave module, in which the layout design of the inductor circuit and the capacitor electrode can be used. The overall area of the component improves the area utilization rate and the accuracy of the process is better controlled. The present invention also aims to propose a method for preparing a structure of a multilayer Lc filter module. In order to achieve the above-mentioned purpose of the present invention, according to the present invention, Completed construction-A laminated LC filter module includes a structural material having a magnetic permeability between 5 and 1300 and a dielectric constant between 4.7 and 2750; and the difference formed in the structure 1232473 material The inductive circuit and the capacitor electrode on a plane, wherein the inductive circuit and the capacitor electrode alternate with each other in a vertical direction. Preferably, the inductive circuit and the capacitor electrode cover a substantially full area of the horizontal plane. Preferably, the structural material has The following composition (T1〇2) x (M0.Fe2〇3) y ', where x + y = 1, 0 and i, μ are _, Cu, Mg, Li, Zn metal or any combination thereof. 'The inductive circuit and the capacitor electrode are independently gold, silver, palladium, tungsten or any combination thereof. The present invention also proposes a method for preparing a multi-layer ... wave-containing module, which includes printing the inductive circuits on the n and ㈣w respectively. μ surface; the capacitor electrodes are printed on the surface of a second group of green embryo material pieces; the first group of green embryo material pieces printed with the inductance circuit and the second group of green embryo material pieces printed with the capacitor electrode are The laminated structure is stacked alternately to form a laminated structure, and then the hibiscus body is selected from the group consisting of a solder and a structure, to form a laminated LC filter module, in which the first group of raw embryo material pieces and the second The set of raw embryo material has the following Composition (Ti〇2) x ⑽ · Fe2〇3) y, where x + y——is running, Ni, Cu, Mg, Li, Zη metal or any combination thereof. Preferably, the inductance line and the capacitor electrode The surface covering the raw material sheet is substantially king area. Preferably, the inductor circuit and the capacitor electrode are independently gold, silver, palladium, tungsten or any combination thereof. Embodiments This month, a layered LC filter is proposed. The module uses the structure in which the inductor layer and the electric 1232473 capacitor layer are dispersed in the thickness direction. As shown in FIG. I, the inductor layer 10 is separated from the electric valley layer 20, and all inductors are integrated in the magnetic material layer compared to the traditional manufacturing method. The crosstalk between the inductors of the present invention is thus greatly reduced and is very close to zero. The materials of the inductive layer and the capacitive layer of the present invention use the same series of materials (but not necessarily completely the same) with a permeability of 丨; the permeability is between 5 and 1300, and the dielectric constant is 4 · 7 To 275 °, so that there is no sintering shrinkage matching problem between each inductance layer and capacitor layer, which reduces its internal stress. The circuit layout of each inductance layer and capacitor layer of this month can use the full area of its layer structure to improve the area utilization rate and the flexibility of the circuit layout. Γ / The present invention proposes a multilayer LC filter module. This module consists of Several inductors and several capacitors are used, and the inductor layer and the capacitor layer are dispersed in the thickness direction to separate the inductor layer from the capacitor layer. For example, the inductive circuit and the electric pole are printed on the base layer raw embryo material and the capacitor layer raw embryo material according to the design, respectively. If the lamination method is the traditional method, the stress concentration on the interface is likely to occur due to the warpage and breakage of the two materials, which results in the component and the lamination method of the lamination a is as the dispersed structure of the present invention. The embryo material uses both the permeability and the dielectric constant via: _, so there is no stress problem of shrinkage matching. Coupled with terminal electrodes or internal problems, ^ _ solves the problem of warping and cracking of the components. Reliability of gray 7G components. Utilizing the structure of the present invention, the electrode design of the integrated fixed valley layer can make full use of the element body area, so that the inductance and capacitance are taken as an example. For example, the layout is more flexible. 3216 feet As shown in Figure 2a, if it is divided into 4 simple dimensions in the same medium 1232473 electric day U layout sigh leaf ', the electrode area of each capacitor can be designed to 12mm. If the overall area layout is used, as shown in the table, the electrode area = 2.8 mm x 1.2 mm, which is 7 times the area of the former. Therefore, if you want to pay for the same amount of electricity as one whole embryo is laid out in a whole area, a four-segment layout will have seven raw embryos. Using the structure of this creation requires only four raw embryos. The wiring layout of the inductor layer has the same situation, and the size of 3216 is also taken as an example. The line can be designed as a straight, wire, meander (Meander Me), or spiral (spi is called a single-layer or multi-layer design, if it is cut into four 16). For the size of 8, the number of turns of the inductor must be increased to obtain the same inductance, which increases the complexity of the process. The component size of the embodiment and the comparative example is 3216. The inductor line uses a single layer of polyline printed by silver plastic screen. 'Line width 0 · 1 mm. Raw embryo uses (TiC ^ o.KNio.uCumZnuO.FeWdu material, magnetic permeability u = 50,; number of books k 1700. Inductive circuit 1 丨 and capacitor electrode 21 are set separately. On the surface of the embryo. As shown in Fig. 3a, the inductor layer and the capacitor layer are alternately stacked up and down to form a structure, and then the structure is sintered at 900 C for 2 hours to form the laminated filter of the invention. The module, in which the inductor layer 10 and the capacitor layer 20 are alternately spaced. Figure 3b is a multilayer LC filter module of a comparative example. The manufacturing method is the same as the embodiment except that the stacking method is different. High-frequency electromagnetic field simulation to evaluate implementation Crosstalk (cr0sstaik) between the inductors of the two-layer LC data wave module of the comparative example. The simulation results are as follows: 1232473 Crosstalk (dB) Example < -100 Comparative Example-1 0 ~ _ 2 0 Figure Brief description of the formula Figure 1 shows the schematic diagram of the multilayer LC filter module of the present invention. Figure 2a shows the effective area of the capacitor electrode layout of the multilayer lc filter module of unknown technology. Figure 2b shows the multilayer LC of the present invention Schematic diagram of the effective area of the capacitor electrode layout of the filter module. ^ Figure 3a shows a schematic diagram of the superposition of the inductor layer and the electric layer of the multilayer LC filter module of the present invention. Figure 3b shows the multilayer LC filter of the conventional art. Schematic diagram of the superposition of the inductor layer and the capacitor layer of the module. The drawing number of the main components 10 ·· inductor layer 20 ·· capacitor layer U ·· inductive line 21 ·· capacitive electrode 10