TWI232301B - Contactor probe with movable guide plate - Google Patents

Contactor probe with movable guide plate Download PDF

Info

Publication number
TWI232301B
TWI232301B TW90123860A TW90123860A TWI232301B TW I232301 B TWI232301 B TW I232301B TW 90123860 A TW90123860 A TW 90123860A TW 90123860 A TW90123860 A TW 90123860A TW I232301 B TWI232301 B TW I232301B
Authority
TW
Taiwan
Prior art keywords
hole
guide plate
support
movable guide
needle
Prior art date
Application number
TW90123860A
Other languages
Chinese (zh)
Inventor
Toshio Kazama
Original Assignee
Nhk Spring Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nhk Spring Co Ltd filed Critical Nhk Spring Co Ltd
Application granted granted Critical
Publication of TWI232301B publication Critical patent/TWI232301B/en

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02Contact members
    • H01R13/22Contacts for co-operating by abutting
    • H01R13/24Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2407Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
    • H01R13/2421Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means using coil springs
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/06Measuring leads; Measuring probes
    • G01R1/067Measuring probes
    • G01R1/06711Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716Elastic
    • G01R1/06722Spring-loaded

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Abstract

A contactor probe (1) with a movable guide plate (2) has a plurality of conductive needle-shaped members (8) each having an upper shaft (12a) inserted into a through hole (2a) of the movable guide plate (2), and a middle shaft (12b) having a diameter larger than that of the upper shaft (12a) and reciprocally held in a support hole (7) of a holder (3). A step (A) is formed as a boundary part between the upper shaft (12a) and the middle shaft (12b). The step (A) engages with a lower rim of the through hole (2a) of the movable guide plate (2), to press the movable guide plate (2) on a fixed plate (4).

Description

1232301 A7 ___B7 五、發明說明(i ) [發明背景] 1 ·發明領域 本發明係關於一種且右 你车、 ,、有可移動導板之接觸探針,該可 移動導板在封裝物的電性 电性測忒期間,負責定位及支撐半導 體封裝物的基板與電極。 2 ·相關技藝之說明 第1圖與第2圖所示之接觸探針1〇〇為所熟知之具有 可移動導板的接觸探針。接觸探針100具有絕緣可移動導 板2,該絕緣可移動導板2置於形成於絕緣支座3與固定 板4之間的導板容納空間5中,該固定板4疊置於支座3 訂 上並具有用於接收插入其中以作為檢測物體的半導體 物P之開口 4a。 線 佈線板6相對於固定板4而疊置於支座3上。支撐孔 7穿過支座3而形成’以便連通導板容納 6。支座3具有彼此疊置之上支座3a與下支座3b。:;板孔 7具有形成於上支座3a中的上台階7a與形成於下支座讣 中的下台階7b,並延伸穿過上、下支座33與讣。 具有軸向彈性的導電針狀組件8置於支撐孔7中而安 裝。該針狀組件8的上端插入可移動導板2内所提供的通 孔2a中,而下端則緊接於佈線板6的導電部分6a。圖式 中所顯示的導電針狀組件8與其它數個至數千個相同結構 的針狀組件構成該接觸探針100。 在使用接觸探針100於半導體封裝物P之檢測的挪試 中’半導體封裝物P的電極P1在前階段插入至通孔23中 丨本紙張尺度適用中國國家標準(CNS)A4規格⑵0 X 297公爱);^ 1232301 經濟部智慧財產局員工消費合作社印製 A7 五、發明說明(2 ) 而與針狀組件8的上端接觸(見第丨圖),而半導體封裝物p 的基板P2在後階段則緊接於可移動導板2(見第2圖)。 接觸探針100的可移動導板2藉由複數個導栓9來導 弓I ’當該導板2移動時,導栓9固定在支座3上,並且該 導板2藉由裝配在各導栓9周圍之線圈彈簧1〇偏向固定板 4 〇 導電針狀組件8具有管體8a,以及藉由包含於管體8a 中的線圈彈簧(未顯示)而偏向相對方向之上、下柱塞8b與 8c。管體8a置於支撐孔7中,並緊接於位在上及下端的上 及下。階7a與7b上以避免滑出。在此安裝狀態中,針狀 ▲件8之下柱塞8c的尖端與佈線板6的導電性部分6a接 觸,而上柱塞8b的上端則插入至可移動導板2的通孔2狂 中。 接觸探針100需要可移動導板2經配置而由導栓9所 導引。該要求使得導板2在設計上變得複雜且在尺寸變得 較大,而導致較高的成本。 探針100的導電性針狀組件8包含有管體8a,並且導 板2藉由複數個導栓9與線圈彈簧1〇進行偏向該事實造 成大量必要的零件、複雜的組裝與更換作業,導致較高的 成本。 、 [發明概要] 本發明之目標在於提供一種具有可移動導板之接觸探 針,該發明允許導板在配置上簡化且在尺寸縮小,使得元 件減少、促使組裝與更換作業變得容易並提供成本降低。 表紙張尺度適用中國國家標準(CNS)A4規格(210x 297公爱) ' ------- 2 313058 (請先閱讀背面之注意事項再填寫本頁) ϋ n an 1^— ϋ y」· ·ϋ 1 n ϋ - . i 兮口 1232301 A7 五、發明說明(3 ) 為達成上述的目標,根據本發明之具有可移動導板的 接觸探針包括:具有至少一個支撐孔之絕緣支座、疊置於 支座的鈿並與支座共同形成以界定與支撑孔連通的空間 之固定板、疊置於支座的另一端之佈線板、置於空間中並 具有至少一個與絕緣支座的支撐孔連通的通孔之絕緣可移 動導板以及具有軸向彈性並置於支撐孔中之至少一個導電 針狀組件,該導電針狀組件包括插入至可移動導板的通孔 中而與檢測物體的電極接觸之一端,而該檢測物體透過固 疋板之上方部分所具備之開口而插入,該導電針狀組件之 另一端與具備佈線板的導電部分接觸以及用於與可移動導 板的通孔下緣嚙合之台階。 該針狀組件最好具有較小的直徑部分以使該組件之一 端插入可移動導板之通孔中,以及具有放置於支撐孔中的 較大直徑冑|。用於肖可移料板之通孔下緣喷合的該台 階在該較小與較大直徑部分之間形成分界部分。 因此,可移動導板藉由插入通孔中之柱塞的較小直徑 部分來定位,並且藉由與通孔下緣嚙合的台階及柱塞的彈 簧力來支撐。此方法將消除以導栓進行導引之複雜的導板 設計的習知需求,且亦消除任何用於導引之組件的需要, 而允許導板在構造上較簡化且在尺寸上縮小,導致零件數 目減少並促使組裝與更換作業變得容易,而使成本降低。 根據本發明之第一個實施例,該針狀組件具有線圈彈 簧與連接至較靠近可移動導板之線圈彈簧的至少一端之柱 塞,且連接至較靠近可移動導板之線圈彈簧之該端點的該 私紙張尺度適用中國國豕標準(CNS)A4規格(210 X 297公釐) (請先閱讀背面之注意事項再填寫本頁) -1 ^----;1 訂--------線. 經濟部智慧財產局員工消費合作社印製 3130581232301 A7 ___B7 V. Description of the invention (i) [Background of the invention] 1. Field of the invention The present invention relates to a contact probe with a movable guide plate, a movable probe plate, and a movable guide plate. During the electrical measurement, it is responsible for positioning and supporting the substrate and electrodes of the semiconductor package. 2 · Explanation of the related art The contact probe 100 shown in Figs. 1 and 2 is a well-known contact probe with a movable guide plate. The contact probe 100 has an insulating movable guide plate 2 placed in a guide plate accommodating space 5 formed between an insulating support 3 and a fixed plate 4 which is stacked on the support 3 is ordered and has an opening 4a for receiving a semiconductor object P inserted therein as a detection object. The wire wiring board 6 is stacked on the support 3 with respect to the fixed board 4. The support hole 7 is formed through the support 3 so as to communicate with the guide plate accommodation 6. The support 3 has an upper support 3a and a lower support 3b stacked on top of each other. : The plate hole 7 has an upper step 7a formed in the upper support 3a and a lower step 7b formed in the lower support 讣, and extends through the upper and lower supports 33 and 讣. A conductive needle-like member 8 having axial elasticity is installed in the support hole 7. The upper end of the needle-like component 8 is inserted into the through hole 2a provided in the movable guide plate 2, and the lower end is directly adjacent to the conductive portion 6a of the wiring board 6. The conductive needle-like member 8 shown in the drawing and the other several to thousands of needle-like members having the same structure constitute the contact probe 100. In the test using the contact probe 100 for the detection of the semiconductor package P, the electrode P1 of the semiconductor package P was inserted into the through hole 23 at a previous stage 丨 This paper size applies the Chinese National Standard (CNS) A4 specification ⑵0 X 297 Public love); ^ 1232301 Printed A7 by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 5. Description of the invention (2) and contact with the upper end of the needle-like component 8 (see figure 丨), and the substrate P2 of the semiconductor package p is behind The stage is next to the movable guide plate 2 (see Fig. 2). The movable guide plate 2 contacting the probe 100 is guided by a plurality of guide pins 9 when the guide plate 2 moves, the guide pin 9 is fixed on the support 3, and the guide plate 2 is assembled on each The coil spring 10 around the guide pin 9 is biased toward the fixing plate 4 and the conductive needle assembly 8 has a tube body 8a, and the coil springs (not shown) included in the tube body 8a are biased toward the upper and lower plungers in opposite directions. 8b and 8c. The pipe body 8a is placed in the support hole 7 and is located immediately above and below the upper and lower ends. Steps 7a and 7b avoid slipping out. In this mounting state, the tip of the plunger 8c below the needle-shaped ▲ member 8 is in contact with the conductive portion 6a of the wiring board 6, and the upper end of the upper plunger 8b is inserted into the through hole 2 of the movable guide plate 2. . The touch probe 100 requires the movable guide plate 2 to be configured to be guided by a guide pin 9. This requirement makes the guide plate 2 complicated in design and larger in size, resulting in higher costs. The conductive needle-like component 8 of the probe 100 includes a tube body 8a, and the fact that the guide plate 2 is biased by the plurality of guide pins 9 and the coil spring 10 results in a large number of necessary parts, complicated assembly and replacement operations, resulting in Higher costs. [Summary of the invention] The object of the present invention is to provide a contact probe with a movable guide plate. The invention allows the guide plate to be simplified in configuration and reduced in size, reduces components, facilitates assembly and replacement operations, and provides Reduce costs. The paper size of the table applies the Chinese National Standard (CNS) A4 specification (210x 297 public love) '------- 2 313058 (Please read the precautions on the back before filling this page) ϋ n an 1 ^ — ϋ y ” · · Ϋ 1 n ϋ-. I 口 口 1232301 A7 V. Description of the invention (3) In order to achieve the above object, the contact probe with a movable guide plate according to the present invention includes: an insulating support having at least one supporting hole , A fixed plate stacked on the support and formed together with the support to define a space communicating with the support hole, a wiring board stacked on the other end of the support, placed in the space and having at least one and an insulating support An insulating movable guide plate of a through-hole communicating with the support hole of the support and at least one conductive needle-shaped component having axial elasticity and placed in the support hole, the conductive needle-shaped component includes a through-hole inserted into the movable guide plate and detected An electrode of an object contacts one end, and the detection object is inserted through an opening provided on an upper portion of the fixing plate. The other end of the conductive needle-like component is in contact with a conductive portion provided with a wiring board and is used for contacting a movable guide plate. Lower edge of through hole He step. The needle assembly preferably has a smaller diameter portion so that one end of the assembly is inserted into the through hole of the movable guide plate, and has a larger diameter 胄 | placed in the support hole. The step for spraying the lower edge of the through hole of the Xiao movable plate forms a boundary portion between the smaller and larger diameter portions. Therefore, the movable guide plate is positioned by the smaller diameter portion of the plunger inserted into the through hole, and is supported by the step engaging the lower edge of the through hole and the spring force of the plunger. This method will eliminate the conventional need for complicated guide plate design for guiding with guide pins, and also eliminate the need for any components for guiding, and allow the guide plate to be simplified in structure and reduced in size, resulting in The reduced number of parts simplifies assembly and replacement and reduces costs. According to a first embodiment of the present invention, the needle assembly has a coil spring and a plunger connected to at least one end of a coil spring closer to the movable guide plate, and the coil spring is connected to the coil spring closer to the movable guide plate. The private paper size of the endpoint is applicable to China National Standard (CNS) A4 (210 X 297 mm) (Please read the precautions on the back before filling this page) -1 ^ ----; 1 Order --- ----- line. Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 313058

1232301 五、發明說明(4 ) 柱塞具有:彺復地置於通孔令之上軸與具有較上軸大的直 徑之中間轴,並往復地置於支撐孔中,並且該用於與可移 動導板之通孔下緣嚙合的台階形成在該上軸與中間軸之間 的分界部分。 因此,根據上述的實施例,因為針狀組件的柱塞將該 組件之中間轴置於支撐孔中而安裝,所以該軸的徑向偏移 限制至最低的程度,而該可移動導板藉由上轴插入通孔中 之柱塞的台階而穩定地支撐著。 根據本發明的另一個實施例,該針狀組件僅由線圈彈 簧製成。該線圈彈簧具有插入至通孔中的較小直徑線圈與 放置於支撐孔中的較大直徑線圈。用於與可移動導板的通 孔下緣唾合的台階在較小及較大直徑線圈之間形成分界部 分。 根據本實施例,針狀組件由線圈彈簧製成形成單一零 件,該元件更進而減少零件的數目。 該支撐孔最好在該支撐孔之開口附近以台階形成於佈 線板之側邊上以避免該針狀組件滑落。該支撐孔最好穿過 支座而形成,以便導引針狀組件可滑動地穿過該支撐孔。 在此結構中,針狀組件可由可移動導板、固定板與其 它元件所安裝的側端而進行安裝,以便由支座移除固定板 使得針狀組件易於更換,導致組裝與更換作業變得更容 易。因為支撐孔經由單一零件的支座而形成,所以該孔洞 以良好的精度而形成,導致針狀組件之穩定操作。此外, 習知上以二個零件組成之該支座可以以單一零件製成,因 (請先閱讀背面之注意事項再填寫本頁) -I ^----^—訂-------1 » 一 經濟部智慧財產局員工消費合作社印製 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) 4 313058 1232301 新穎的特徵及效果將參 A7 五、發明說明(5 而更進一步地減少零件的數目。 [圖式之簡要說明] 本發明之上述與其他的目標 考隨附的圖式而說明如下,其中 第1圖為具有可移動導板之習知的接觸探針於測試期 間的前階段之剖面圖; 第2圖為第1圖中之探針於測試期間的後階段的剖面 圃, 第3圖為根據本發明之第一實施例之具有可移動導板 之接觸探針於測試期間的前階段的剖面圖; 第4圖為第3圖中之探針於測試期間的後階段的剖面 W· .第5圖為根據第-個實施例之修改的接觸探針的剖面 圖,以及 第6圖為根據本發明之第二個實施例之具有可移 板之接觸探針的剖面圖。 [元件符號說明] (請先閱讀背面之注意事項再填寫本頁) 擎--Ί---^—訂----- •線· 經濟部智慧財產局員工消費合作社印製 1、la 接觸探針 2a 通孔 3 支座 3b 下支座 4a 開口 2 2d 3a 4 5 可移動導板 通孔下緣 上支座 固定板 6 佈線板 7 支撐孔 6a 導引調整空間 導電部分 7a、7b上台階1232301 V. Description of the invention (4) The plunger has: an upper shaft and an intermediate shaft having a larger diameter than the upper shaft, and is reciprocally placed in the support hole, and the A step engaging the lower edge of the through hole of the moving guide plate is formed at a boundary portion between the upper shaft and the intermediate shaft. Therefore, according to the above-mentioned embodiment, since the plunger of the needle-like component is installed by placing the intermediate shaft of the component in the support hole, the radial offset of the shaft is limited to the minimum degree, and the movable guide plate is borrowed It is stably supported by the step of the plunger inserted into the through hole by the upper shaft. According to another embodiment of the present invention, the needle-like assembly is made of only a coil spring. The coil spring has a smaller-diameter coil inserted into a through hole and a larger-diameter coil placed in a support hole. A step for spitting to the lower edge of the through hole of the movable guide plate forms a demarcation portion between the smaller and larger diameter coils. According to this embodiment, the needle-like component is made of a coil spring to form a single part, which further reduces the number of parts. The support hole is preferably formed on the side of the wiring board in steps near the opening of the support hole to prevent the needle-like component from slipping. The support hole is preferably formed through the support so that the guide pin assembly can be slidably passed through the support hole. In this structure, the needle-shaped component can be installed by the movable guide plate, the fixed plate and other components to which the component is mounted, so that the fixed plate can be removed by the holder to make the needle-shaped component easy to replace, resulting in assembly and replacement operations. Easier. Since the support hole is formed through the support of a single part, the hole is formed with good accuracy, resulting in stable operation of the needle-like component. In addition, it is customary that the support composed of two parts can be made of a single part, because (please read the precautions on the back before filling this page) -I ^ ---- ^ — Order ----- --1 »Printed by a consumer cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs. The paper size is applicable to the Chinese National Standard (CNS) A4 (210 X 297 mm) 4 313058 1232301 The novel features and effects will be referred to A7 V. Invention Description ( 5 and further reduce the number of parts. [Brief description of the drawings] The above and other objects of the present invention are illustrated as follows, where the first figure is a conventional contact with a movable guide plate. A cross-sectional view of the probe during the first stage of the test period; FIG. 2 is a cross-sectional view of the probe during the later stage of the test period in FIG. 1; and FIG. 3 is a diagram of the movable guide according to the first embodiment of the invention. Sectional view of the contact probe of the board during the first stage of the test period; Figure 4 is a cross-section of the probe of the third stage of the probe during the test period in Figure 3. Figure 5 is a modification according to the first embodiment A cross-sectional view of a contact probe, and FIG. 6 is a second view of the present invention. Sectional view of a contact probe with a movable plate in the embodiment. [Explanation of component symbols] (Please read the precautions on the back before filling this page) Engine --Ί --- ^ — Order ----- • Line · Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 1, la contact probe 2a through hole 3 support 3b lower support 4a opening 2 2d 3a 4 5 movable guide plate lower hole upper support fixing plate 6 wiring board 7 Support holes 6a Guide and adjust the space conductive steps 7a, 7b up the steps

I2J2301 A7 B7 五、發明說明(6 8 導電針狀組件 扑' 12上杈塞 9 導拴 1 la 緊密圍繞部分 UC 圓錐形尖端線圈 7 c、11 d台階 8a 管體 8c、13下柱塞 I 〇、Π線圈彈簧 II b 間隔圍繞部分 1 e 上位較小直徑線圈 llf 下位較大直徑線圈 12a 上軸 m 12c、13c 軸襯 l2d 13a 下圓錐形尖端 i3b 凸緣I2J2301 A7 B7 V. Description of the invention (6 8 Conductive needle-shaped component flutter '12 Upper fork plug 9 Guide bolt 1 la Closely surround part of UC Conical tip coil 7 c, 11 d Step 8a Tube body 8c, 13 Lower plunger I 〇 Π coil spring II b spaced around the part 1 e upper smaller diameter coil 11f lower larger diameter coil 12a upper shaft m 12c, 13c bushing l2d 13a lower conical tip i3b flange

20、100 接觸探針 A 台階 P半導體封裝物 Pl _ 電極 P2 基板 [較佳實施例之詳細說明] 本發明之較佳實施例將參考隨附圖式而說明如下。相 同的組件或元件以相同的圖式標號標示。 第3圖與第4圖顯示根據本發明之第一個實施例之具 有可移動導板之接觸探針i。 該接觸探針1具有絕綾可#說道 π 5緣』移動導板2,該絕緣可移動 導板2置於由絕緣支座3與一固定板4之間所形成的空間 5中,該固定板4疊置於支座3上並具有用於接收插入作 為檢測物件的半導體封裝物ρ之開口 4a。佈線板6相斜著 固定板4而疊置於支座3上。復數個支撐孔7(只有一個顯 示於圖式中)穿過鑄模中的支座3而形成並連通固定容納~ 本紙張尺度適用中國國豕標準(CNS)A4規格(210 X 297公爱) ^ 313058 1232301 A7 B7 五、發明說明(7 ) 導板2的空間5與佈線板6。具有轴向彈性的導電針狀組 件8放置於各支撐孔7中。該組件8的上端插入至具有可 移動導板2的通孔2a中並且該組件8的下端則與佈線板6 的導電部分6a接觸。在使用接觸探針半導體封裝物p 檢測的測試中,半導體封裝物P的電極P!在前階段插入 通孔2a中’以與針狀組件8的上端接觸(見第3圖),在後 階段,半導體封裝物P的基板!>2在後階段緊接於可移動|| 導板2(見第4圖)。該電極?1以錫球或類似物製成。 針狀組件8在上端部分具有台階A,該台階a在插入 通孔2a中之較小直徑部分與固定於支撐孔7中之較大直徑 口P刀之間形成分界部分。組件8與通孔h之下緣Μ在台 階A處哺合,以將可移動導板2摩緊於固定板4上。 線 特別地疋,該針狀組件8具有線圈彈簧11,並且上柱 塞12與下柱塞13分別連接該線圈彈簧11的上及下端。上 柱塞12具有作為往復地維持於通孔〜中的較小直徑部分 之上軸12a、作為往復地維持於支撐孔7中的較大直徑部 刀之中間轴Ub ’以及具有直徑較中間軸12b為小的直徑 之抽概12c。與半導體封裝物P之電極P1接觸而用於電氣 電極端子12d是以凸出方式形成於上軸12a之上端 線圈彈簧11具有緊密圍繞部分lla㈣ 上的軸襯^圍繞部分Ub的下端裝配於下柱塞13之面向 • 、__^以用於互連。間隔圍繞部分1 lb的彈簧力 本紙張尺-度適用中國國爾規格⑵。x 29fi:il------ 1232301 經濟部智慧財產局員工消費合作社印製 A7 五、發明說明(8 ) 將上柱塞12與下柱塞〗3偏向相對方向。因此’可移動導 板2由台階a所支撐,並且下柱塞13的下圓錐形尖端 與佈線板6的導電性部分6a接觸。下柱塞13往復地維 於支撐孔7中。 ' 此類結構的接觸探針1可具有平板狀的可移動導板 2’造成製作導板2與周圍組件(特別是相對於可移動導板2 的支座3之表面)所需的精度降低。 接觸探針1的可移動導板2藉由插入通孔2&中之針狀 組件8的上軸12a來定位,並且由與通孔2a下緣2d嚙合 的台階A所支撐,以及由針狀組件8的彈簧力所偏向。因 此,不像習知的可移動導板,該可移動導板2毋需經由配 置而以導栓來導引(見第1圖與第2圖中的導栓9),而造成 導板的形狀之簡化及尺寸縮小,導致成本降低。 該接觸探針1毋需習知所要求之任何的導引組件,直 接固疋導電針狀組件8於支撐孔7中,且不需要習知所要 求的管體’藉以大幅地減少零件數目,並使組裝與更換作 業變得容易,而進一步降低成本。 接觸探針1的針狀組件8具有直接固定於支撐孔7中 之上柱塞12的中間轴!2b,以便該軸的徑向偏移受到限 制。藉由將上柱塞12的上軸i2a插入通孔2a中,台階a 將穩定地支撐可移動導板2。 支樓孔7穿過單一元件的支座3而形成,並可滑動地 導引針狀組件8。 支樓孔7在該支撐孔的低位部分形成台階7c,用於避 、又k用1f國國豕標準(cns)A4規格(210 X 297公爱) ί請先閱讀背面之注意事項再填寫本頁)20, 100 contact probe A step P semiconductor package Pl _ electrode P2 substrate [detailed description of preferred embodiment] The preferred embodiment of the present invention will be described below with reference to the accompanying drawings. Identical components or elements are identified by the same drawing reference numerals. 3 and 4 show a contact probe i having a movable guide plate according to a first embodiment of the present invention. The contact probe 1 has an absolutely movable guide plate 2 which can be said π 5 edges. The insulated movable guide plate 2 is placed in a space 5 formed between an insulating support 3 and a fixed plate 4. The board 4 is stacked on the support 3 and has an opening 4a for receiving a semiconductor package ρ inserted as a detection object. The wiring boards 6 are stacked on the support 3 with the fixing board 4 inclined. A plurality of support holes 7 (only one is shown in the drawing) is formed through the support 3 in the mold and connected and fixedly accommodated ~ This paper size applies to China National Standard (CNS) A4 (210 X 297 public love) ^ 313058 1232301 A7 B7 V. Description of the invention (7) The space 5 of the guide plate 2 and the wiring board 6. A conductive needle-like member 8 having axial elasticity is placed in each support hole 7. The upper end of the module 8 is inserted into the through hole 2a having the movable guide plate 2 and the lower end of the module 8 is in contact with the conductive portion 6a of the wiring board 6. In the test using the contact probe semiconductor package p detection, the electrode P! Of the semiconductor package P was inserted into the through-hole 2a 'to contact the upper end of the needle-like component 8 in the previous stage (see Fig. 3), and in the later stage , The substrate of the semiconductor package P! > 2 is next to the movable || guide plate 2 in the later stage (see Fig. 4). The electrode? 1 Made of solder balls or the like. The needle assembly 8 has a step A at an upper end portion, and the step a forms a boundary portion between a smaller diameter portion inserted in the through hole 2a and a larger diameter port P knife fixed in the support hole 7. The module 8 and the lower edge M of the through hole h are fed at the stage A to tighten the movable guide plate 2 on the fixed plate 4. In particular, the needle assembly 8 has a coil spring 11, and the upper plug 12 and the lower plunger 13 connect the upper and lower ends of the coil spring 11, respectively. The upper plunger 12 has an upper shaft 12a as a smaller-diameter portion reciprocally held in the through-hole, a middle shaft Ub 'as a larger-diameter portion knife reciprocally held in the support hole 7, and a middle shaft Ub' 12b is an abstraction 12c of a small diameter. The contact with the electrode P1 of the semiconductor package P for electrical electrode terminals 12d is formed in a protruding manner on the upper end of the upper shaft 12a. The coil spring 11 has a bushing on the tightly surrounding portion 11a㈣ and the lower end of the surrounding portion Ub is assembled to the lower post The face of plug 13 •, __ ^ for interconnection. The spring force is 1 lb spaced around the part. The paper ruler-degree applies to China National Standard 尔. x 29fi: il ------ 1232301 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs A7 V. Description of the invention (8) The upper plunger 12 and the lower plunger 3 are biased in opposite directions. Therefore, the 'movable guide plate 2 is supported by the step a, and the lower conical tip of the lower plunger 13 is in contact with the conductive portion 6a of the wiring board 6. The lower plunger 13 is reciprocally held in the support hole 7. 'The contact probe 1 of such a structure may have a flat-shaped movable guide plate 2' resulting in a reduction in accuracy required for making the guide plate 2 and surrounding components (especially the surface of the holder 3 relative to the movable guide plate 2) . The movable guide plate 2 of the contact probe 1 is positioned by the upper shaft 12a of the needle-like component 8 inserted in the through-hole 2 & and is supported by a step A that meshes with the lower edge 2d of the through-hole 2a, and is needle-shaped The spring force of the module 8 is biased. Therefore, unlike the conventional movable guide plate, the movable guide plate 2 does not need to be configured to be guided by a guide pin (see the guide pin 9 in Fig. 1 and Fig. 2), which results in the The simplification of the shape and the reduction in size lead to a reduction in costs. The contact probe 1 does not need to be acquainted with any required guide assembly, and directly fixes the conductive needle-like assembly 8 in the support hole 7, and does not need to be acquainted with the required pipe body to greatly reduce the number of parts. And make assembly and replacement work easy, and further reduce costs. The needle assembly 8 of the contact probe 1 has an intermediate shaft which is directly fixed in the support hole 7 above the plunger 12! 2b so that the radial offset of the shaft is limited. By inserting the upper shaft i2a of the upper plunger 12 into the through hole 2a, the step a will stably support the movable guide plate 2. An abutment hole 7 is formed through the single-element abutment 3 and slidably guides the needle assembly 8. The branch hole 7 forms a step 7c at the lower part of the support hole, which is used to avoid and use the 1f national standard (cns) A4 specification (210 X 297 public love). Please read the precautions on the back before filling in this page)

313058 1232301 經濟部智慧財產局員工消費合作社印制衣 A7 - B7 五、發明說明(9 ) 免針狀組件8滑落。當佈線板6尚未安裝時,形成於下柱 塞13上之凸緣13b與該防滑落台階&嚙合,以避免針狀 組件8滑出支撐孔7。 在此結構中,針狀組件8可由安裝該可移動導板2、 固定板4與其他兀件的上端而進行安裝(該側端相對於佈 線板),且固定板4由支座3之移除將使組件8的更換變得 容易。因為支撐孔7穿過單一元件的支座3而形成,所以 該支#孔形成雨精度,導致針狀組件8的穩定操作。 第5圖顯示第一實施例的修改,該實施例不同於依據 如第3圖所顯示的第一實施例,其中導電性針狀組件8的 低位部分係由線圈彈簧U的延伸部分製成。接觸探針u 的針狀組件8根據修正具有螺旋形彈簧u,該螺旋形彈簧 11具有連續形成之緊密圍繞部分lla、間隔圍繞部分llb 及縮減線圈直徑之圓錐形尖端線圈Uc。該圓錐形尖端線 圈1lc緊接於佈線板6的導電部分上。接觸探針具 有在間隔圍繞部分lib與圓錐形尖端線圈11(:之間形成分 界部分之台階lid,該台階與防滑落台階7c嚙合,以避免 針狀組件8滑出支撐孔7。 接觸探針la之導電針狀組件8具有類似於接觸探針j 之導電針狀組件8的功能。接觸探針ia具有類似於接觸探 針1的效果。 第6圖顯示根據本發明之第二個實施例之具有可移動 導板的接觸探針20。該接觸探針2〇與第一實施例之探針 的差異在於導電性針狀組件8的結構。 t氏張尺度適用中g家標準格(21G X 297公釐)---9 --- (請先閱讀背面之注音?事項再填寫本頁) —ili 訂-------線· 1232301 A7313058 1232301 Printed clothing by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs A7-B7 V. Description of the invention (9) Needle-free component 8 does not slip. When the wiring board 6 has not been installed, the flange 13b formed on the lower pillar plug 13 engages the non-slip fall step & to prevent the needle-like component 8 from sliding out of the support hole 7. In this structure, the needle-like component 8 can be installed by mounting the movable guide plate 2, the fixed plate 4 and other upper ends of the element (the side end is relative to the wiring board), and the fixed plate 4 is moved by the support 3. Removal will facilitate replacement of the assembly 8. Since the support hole 7 is formed through the support 3 of the single element, the support #hole forms rain precision, resulting in stable operation of the needle-like assembly 8. Fig. 5 shows a modification of the first embodiment, which is different from the first embodiment according to Fig. 3, in which the lower portion of the conductive needle-like member 8 is made of an extension of the coil spring U. The needle-like component 8 of the contact probe u has a helical spring u according to a modification, and the helical spring 11 has a continuously formed closely surrounding portion 11a, an interval surrounding portion 11b, and a conical tip coil Uc having a reduced coil diameter. The conical tip coil 11c is immediately abutted on the conductive portion of the wiring board 6. The contact probe has a step lid forming a boundary portion between the spaced-apart surrounding portion lib and the conical tip coil 11 (:, the step meshing with the non-slip fall step 7c to prevent the needle-like component 8 from sliding out of the support hole 7. The conductive needle assembly 8 of la has a function similar to the conductive needle assembly 8 of the contact probe j. The contact probe ia has an effect similar to that of the contact probe 1. Fig. 6 shows a second embodiment according to the present invention. It has a contact probe 20 with a movable guide plate. The difference between the contact probe 20 and the probe of the first embodiment is the structure of the conductive needle-like component 8. The t-scale standard is applicable to the standard grid of the home (21G X 297 mm) --- 9 --- (Please read the phonetic on the back? Matters and then fill out this page) —ili order ------- line · 1232301 A7

五、發明說明(10) 本實施例中的針狀組件8是由線圈彈簧丨i所構成,炎 具有在插入通孔2a中之上位較小直徑線圈iie與固定於支 撐孔7中之下位較大直徑線圈1 i f之間形成分界部分之合 階A。線圈彈簧11具有較小直徑線圈丨丨e與作為緊密蘭鍊 部分之連績的較大直徑線圈uf;緊密圍繞部分Ua以相 同的直徑由較大直徑線圈llf連績地延伸;間隔圍繞部分 lib與圓錐形尖端線圈lie以如上述之接觸探針ia中的相 同方式开>成。線圈彈簧11藉由具有該較大直徑線圈lla 的緊密圍繞而獲得所需的剛性。與通孔2a下緣2d嚙合的 台階A藉由間隔圍繞部分llb的彈簧力而穩定地支撐可移 動導板2。 接觸探針2 0的針狀組件8以線圈彈簧丨丨形成單一元 件,更進而造成零件數目之減少。 -----^--訂-------3 — 線 广請先閲讀背面二法意典填寫本頁) 經濟部智慧財產局員工消費合作社印製 313058 本紙張尺度過用中國國家標準(c^^.10 x 297 _ -——-—V. Description of the invention (10) The needle component 8 in this embodiment is composed of a coil spring 丨 i, which has a small diameter coil iie inserted into the through hole 2a and fixed to the support hole 7 in a lower position. The joint A of the boundary portion is formed between the large diameter coils 1 if. The coil spring 11 has a smaller-diameter coil 丨 e and a larger-diameter coil uf that is a continuous succession of the tight blue chain part; the closely-closed part Ua is continuously extended by the larger-diameter coil 11f with the same diameter; the interval surrounds the part lib It is formed with the conical tip coil lie in the same manner as in the above-mentioned contact probe ia. The coil spring 11 obtains the required rigidity by tightly surrounding the coil 11a having the larger diameter. The step A which is engaged with the lower edge 2d of the through hole 2a stably supports the movable guide plate 2 by the spring force spaced around the portion 11b. The needle-like component 8 of the contact probe 20 is formed as a single element by a coil spring, which further reduces the number of parts. ----- ^-Order ------- 3 — Xian Guang, please read the two French Codes on the back to complete this page) Printed by the Intellectual Property Bureau of the Ministry of Economic Affairs, Consumer Cooperatives 313058 This paper has been used in China Standard (c ^^. 10 x 297 _ -——---

Claims (1)

1232301 經濟部智慧財產局員工消費合作社印製 B8 C8 D8 力、申請專利範圍 1· 一種具有可移動導板的接觸探針,該探針包括: 具有至少一個支撐孔之絕緣支座; 疊置於支座的一側端上並與該支座一起以界定出 與支撐孔連通的空間之固定板; 疊置於支座的另一側端之佈線板; 置於該空間中並具有至少一個與該絕緣支座的支 樓孔連通的通孔之絕緣可移動導板,·以及 具有軸向彈性並置於支撐孔中之至少一個導電針 狀組件,該導電針狀組件包括·· 插入該可移動導板的通孔中之一末端,使該末端與 經由該固定板之上位部分所具有之開口插入之檢測物 體之電極接觸; 與具有該佈線板的導電部分接觸之另一末端;以及 用於與該可移動導板之通孔之下緣嚙合之台階。 2·如申請專利範圍第1項之接觸探針,其中·· 該針狀組件具有較小直徑的部分以作為插入至該 可移動導板之通孔中的該一末端,以及置於支撐孔中的 較大直徑部分;以及 用於與該可移動該導板之通孔之下緣嚙合的台階 形成在該較小直徑部分與該較大直徑部分之間的分界 部分。 — — — — — 11 — ----^丨訂-丨丨丨丨丨丨卜線丨 (請先閱讀背面之注意事項再填寫本頁) 3·如申請專利範圍第1項之接觸探針,其中: 該針狀組件具有線圈彈簧與連揍至較靠近該可移1232301 Printed by B8, C8, D8, Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs, patent application scope 1. A contact probe with a movable guide plate, the probe includes: an insulating support with at least one supporting hole; stacked on A fixed plate on one end of the support and together with the support to define a space communicating with the support hole; a wiring board stacked on the other end of the support; placed in the space and having at least one and An insulating movable guide plate of a through-hole communicating with the support hole of the insulating support, and at least one conductive needle-like component having axial elasticity and placed in the support hole, the conductive needle-like component including ... inserted into the movable An end of one of the through holes of the guide plate so that the end is in contact with an electrode of a detection object inserted through an opening provided in an upper portion of the fixed plate; the other end in contact with a conductive portion having the wiring board; and A step engaging with the lower edge of the through hole of the movable guide plate. 2. The contact probe according to item 1 of the patent application scope, wherein the needle-shaped component has a smaller diameter portion as the one end inserted into the through hole of the movable guide plate, and is placed in the support hole A larger diameter portion; and a step for engaging with a lower edge of the through hole of the movable guide plate is formed at a boundary portion between the smaller diameter portion and the larger diameter portion. — — — — — 11 — ---- ^ 丨 Order- 丨 丨 丨 丨 丨 丨 Bulb 丨 (Please read the precautions on the back before filling this page) 3 · If you apply for a contact probe in the scope of item 1 , Where: the needle-like component has a coil spring and flail closer to the movable 1232301 Α8 Β8 C8 D8 六、申請專利範圍 連接至較靠近該可移動導板之線圈彈簧之末端的 該柱塞具有往復地置於通孔中之上轴與往復地置於該 支撐孔中之具有較該上轴大的直徑之中間軸;以及 用於與該可移動導板之通孔下緣嚙合的該台階在 該上轴與該中間軸之間形成分界部分^ 4.如申請專利範圍第1項之接觸探針,其中: 該針狀組件僅由線圈彈簧構成; 該線圈彈簧具有插入該通孔中的較小直徑線圈以 及置於該支撐孔中的較大直徑線圈;以及 用於與該可移動導板之通孔下緣嚙合的該台階在 該較小直徑線圈與該較大直徑線圈之間形成分界部 分。 5·如申請專利範圍第丨項之接觸探針,其中該支撐孔在佈 線線板之側面上之支撐孔之開口的周圍内形成用於避 免該針狀組件滑落的台階。 6·如申咕專利犯圍第1項之接觸探針,其中該支撑孔藉由 經 濟 部 智 慧 財 產 局 員 工 消 費 合 作 社 印 製 (請先閲讀背面之注意事項再填寫本頁) 單一元件所構成之該支座而形成,以便導引該針狀組件 可滑動地穿過該支撐孔。 7·—種具有可移動導板的接觸探針,包括: 絕緣支座; 疊置於該支座上並具有用於插入半導體封裝物穿 過該開口之固定板; 形成於該支座與該固定板之間之導板容納空間; 容納於該導板容納空間中之絕緣可移動導板; i紙張尺度適用中_家標準(CNS)A4規格⑽χ 297公髮) ΑΖ 313058 A8B8C8D8 1232301 六、申請專利範圍 疊置於相對該固定板的支座上之佈線板; 穿過支座而形成以連通該導板容納空間與該佈線 板之支撐孔;以及 置於該支撐孔中並具有軸向彈性之導電針狀組 件;其中, 該針狀組件的一端插入具有該可移動導板内的通 孔中’並且該組件的另一端則與該佈線板的導電部分接 觸; 該半導體封裝物的電極在測試斯間的前階段插入 該通孔中而與針狀組件之一端接觸,並且該半導體封裝 物的基板在測試期間的後階段緊接於該移動導板上;以 及 該針狀組件具有以作為插入該通孔中的該其中一 端之較小直徑的部分、置於該支撐孔中的較大直徑部分 以及在該較小直徑部分與該較大直徑部分之間形成分 界部分之台階,該台階與該通孔下緣嚙合以在測試之前 夾合該可移動導板與該固定板。 (請先閲讀背面之注意事項再填寫本頁) 用 適 度 尺 張 紙 __I本 經濟部智慧財產局員工消費合作社印製1232301 Α8 Β8 C8 D8 6. The scope of the patent application The plunger connected to the end of the coil spring closer to the movable guide plate has a shaft reciprocatingly placed in the through hole and a shaft reciprocally placed in the supporting hole. An intermediate shaft having a larger diameter than the upper shaft; and the step for engaging with the lower edge of the through hole of the movable guide plate forms a boundary portion between the upper shaft and the intermediate shaft ^ 4. The contact probe of 1 item, wherein: the needle-like component is only composed of a coil spring; the coil spring has a smaller diameter coil inserted into the through hole and a larger diameter coil placed in the support hole; and The step engaged with the lower edge of the through hole of the movable guide plate forms a boundary portion between the smaller diameter coil and the larger diameter coil. 5. The contact probe according to item 丨 of the patent application scope, wherein the support hole forms a step for preventing the needle-like component from falling down around the opening of the support hole on the side of the wiring board. 6. The contact probe of No. 1 in Ruogu Patent, where the support hole is printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs (please read the precautions on the back before filling this page). The support is formed to guide the needle-like assembly to slidably pass through the support hole. 7 · A contact probe with a movable guide plate, comprising: an insulating support; a fixed plate stacked on the support and having a semiconductor package inserted through the opening; formed on the support and the Guide plate accommodation space between fixed plates; Insulated movable guide plates accommodated in the guide plate accommodation space; i Paper size is applicable _ Home Standard (CNS) A4 Specification ⑽χ 297 public issued) AZ 313058 A8B8C8D8 1232301 VI. Application The scope of the patent is a wiring board stacked on a support opposite to the fixed plate; a support hole formed through the support to communicate the guide plate accommodation space and the wiring board; and placed in the support hole and having axial elasticity A conductive needle-shaped component; wherein one end of the needle-shaped component is inserted into a through hole having the movable guide plate; and the other end of the component is in contact with the conductive portion of the wiring board; the electrodes of the semiconductor package are at The front stage of the test cell is inserted into the through hole to contact one end of the needle-like component, and the substrate of the semiconductor package is immediately adjacent to the moving guide plate at the later stage of the test period; And the needle-shaped component has a smaller diameter portion as one of the ends inserted into the through hole, a larger diameter portion placed in the support hole, and between the smaller diameter portion and the larger diameter portion A step forming a boundary portion is engaged with the lower edge of the through hole to clamp the movable guide plate and the fixed plate before testing. (Please read the precautions on the back before filling out this page) Printed with a moderate size of paper __I This is printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 準 標 家Quasi-standard home
TW90123860A 2000-09-28 2001-09-27 Contactor probe with movable guide plate TWI232301B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000297539A JP4521106B2 (en) 2000-09-28 2000-09-28 Conductive contact with movable guide plate

Publications (1)

Publication Number Publication Date
TWI232301B true TWI232301B (en) 2005-05-11

Family

ID=18779640

Family Applications (1)

Application Number Title Priority Date Filing Date
TW90123860A TWI232301B (en) 2000-09-28 2001-09-27 Contactor probe with movable guide plate

Country Status (4)

Country Link
JP (1) JP4521106B2 (en)
MY (1) MY130306A (en)
TW (1) TWI232301B (en)
WO (1) WO2002027869A1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI385399B (en) * 2007-04-27 2013-02-11 Nhk Spring Co Ltd Conductive contact
TWI463141B (en) * 2010-11-17 2014-12-01 Nhk Spring Co Ltd Contact probe and probe unit

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008123608A1 (en) 2007-04-04 2008-10-16 Nhk Spring Co., Ltd. Conductive contact holder and conductive contact unit
KR101174007B1 (en) 2008-02-01 2012-08-16 니혼 하츠쵸 가부시키가이샤 probe unit
WO2012067125A1 (en) * 2010-11-17 2012-05-24 日本発條株式会社 Probe unit

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08213128A (en) * 1995-02-08 1996-08-20 Texas Instr Japan Ltd Socket
JP2648120B2 (en) * 1995-02-08 1997-08-27 山一電機株式会社 Surface contact type connector
US6046597A (en) * 1995-10-04 2000-04-04 Oz Technologies, Inc. Test socket for an IC device
JP3256174B2 (en) * 1997-12-12 2002-02-12 株式会社ヨコオ Ball grid array socket
JPH11176548A (en) * 1997-12-15 1999-07-02 Yamamoto Isamu Method of connecting semiconductor integrated circuit connecting socket to inspection function wiring board, and semiconductor integrated circuit inspection device
JP3979478B2 (en) * 1998-05-01 2007-09-19 株式会社エンプラス Contact pin and socket for electrical parts using the contact pin
KR20010071815A (en) * 1998-07-10 2001-07-31 마에다 츠구요시 Conductive contact
US6396293B1 (en) * 1999-02-18 2002-05-28 Delaware Capital Formation, Inc. Self-closing spring probe

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI385399B (en) * 2007-04-27 2013-02-11 Nhk Spring Co Ltd Conductive contact
TWI463141B (en) * 2010-11-17 2014-12-01 Nhk Spring Co Ltd Contact probe and probe unit

Also Published As

Publication number Publication date
MY130306A (en) 2007-06-29
JP2002107377A (en) 2002-04-10
WO2002027869A1 (en) 2002-04-04
JP4521106B2 (en) 2010-08-11

Similar Documents

Publication Publication Date Title
JP3215946B2 (en) Test head for microstructure with interface
JP6515003B2 (en) Interface device, interface unit, probe device and connection method
EP2833158A1 (en) Probe apparatus
JP3616236B2 (en) Probe card and wafer test method using the same
CN104880658B (en) Test device for acceleration transducer
WO2008013273A1 (en) Socket for inspection
TWI232301B (en) Contactor probe with movable guide plate
JP3094007B2 (en) Probe and probe card using this probe
JP5199460B2 (en) System and method for parametric testing of dies
US4847553A (en) Needle card contacting mechanism for testing micro-electronic components
CN115932550A (en) Semiconductor testing device
CN214409203U (en) BGA package chip function test fixture
JP2002015821A (en) Electrical connector
US9915682B2 (en) Non-permanent termination structure for microprobe measurements
US6164982A (en) IC socket for holding IC having multiple parallel pins
JPH1194875A (en) Probe and probe card using the same
JP2004138576A (en) Electrical connection device
JPH09113555A (en) Characteristic measuring device for small electronic component
JPS63169038A (en) Probe card
KR950014949B1 (en) Chip currier socket
KR20030008641A (en) Socket of semiconductor package
JPH0566243A (en) Jig for lsi evaluation
JP2009250917A (en) Tool for substrate inspection and contact for inspection
US20030143889A1 (en) Electrical signal taking-out method and device therefor
JPS6041729Y2 (en) wafer probe card

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees