MY130306A - Contactor probe with movable guide plate - Google Patents

Contactor probe with movable guide plate

Info

Publication number
MY130306A
MY130306A MYPI20014467A MY130306A MY 130306 A MY130306 A MY 130306A MY PI20014467 A MYPI20014467 A MY PI20014467A MY 130306 A MY130306 A MY 130306A
Authority
MY
Malaysia
Prior art keywords
guide plate
movable guide
contactor probe
hole
upper shaft
Prior art date
Application number
Inventor
Toshio Kazama
Original Assignee
Nhk Spring Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nhk Spring Co Ltd filed Critical Nhk Spring Co Ltd
Publication of MY130306A publication Critical patent/MY130306A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
    • H01R13/2421—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means using coil springs
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716—Elastic
    • G01R1/06722—Spring-loaded

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Abstract

A CONTACTOR PROBE (1) WITH A MOVABLE GUIDE PLATE (2) HAS A PLURALITY OF CONDUCTIVE NEEDLE-SHAPED MEMBERS (8) EACH HAVING AN UPPER SHAFT (12A) INSERTED INTO A THROUGH HOLE (2A) OF THE MOVABLE GUIDE PLATE (2), AND A MIDDLE SHAFT (12B) HAVING A DIAMETER LARGER THAN THAT OF THE UPPER SHAFT (12A) AND RECIPROCALLY HELD IN A SUPPORT HOLE (7) OF A HOLDER (3). A STEP (A) IS FORMED AS A BOUNDARY PART BETWEEN THE UPPER SHAFT (12A) AND THE MIDDLE SHAFT (12B). THE STEP (A) ENGAGES WITH A LOWER RIM OF THE THROUGH HOLE (2A) OF THE MOVABLE GUIDE PLATE (2), TO PRESS THE MOVABLE GUIDE PLATE (2) ON A FIXED PLATE (4).(FIG 3)
MYPI20014467 2000-09-28 2001-09-25 Contactor probe with movable guide plate MY130306A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000297539A JP4521106B2 (en) 2000-09-28 2000-09-28 Conductive contact with movable guide plate

Publications (1)

Publication Number Publication Date
MY130306A true MY130306A (en) 2007-06-29

Family

ID=18779640

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI20014467 MY130306A (en) 2000-09-28 2001-09-25 Contactor probe with movable guide plate

Country Status (4)

Country Link
JP (1) JP4521106B2 (en)
MY (1) MY130306A (en)
TW (1) TWI232301B (en)
WO (1) WO2002027869A1 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5490529B2 (en) 2007-04-04 2014-05-14 日本発條株式会社 Conductive contact unit
US20100123476A1 (en) * 2007-04-27 2010-05-20 Nhk Spring Co., Ltd. Conductive contact
KR101174007B1 (en) 2008-02-01 2012-08-16 니혼 하츠쵸 가부시키가이샤 probe unit
WO2012067125A1 (en) * 2010-11-17 2012-05-24 日本発條株式会社 Probe unit
WO2012067126A1 (en) * 2010-11-17 2012-05-24 日本発條株式会社 Contact probe and probe unit

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08213128A (en) * 1995-02-08 1996-08-20 Texas Instr Japan Ltd Socket
JP2648120B2 (en) * 1995-02-08 1997-08-27 山一電機株式会社 Surface contact type connector
US6046597A (en) * 1995-10-04 2000-04-04 Oz Technologies, Inc. Test socket for an IC device
JP3256174B2 (en) * 1997-12-12 2002-02-12 株式会社ヨコオ Ball grid array socket
JPH11176548A (en) * 1997-12-15 1999-07-02 Yamamoto Isamu Method of connecting semiconductor integrated circuit connecting socket to inspection function wiring board, and semiconductor integrated circuit inspection device
JP3979478B2 (en) * 1998-05-01 2007-09-19 株式会社エンプラス Contact pin and socket for electrical parts using the contact pin
US6900651B1 (en) * 1998-07-10 2005-05-31 Nhk Spring Co., Ltd. Electroconductive contact unit assembly
US6396293B1 (en) * 1999-02-18 2002-05-28 Delaware Capital Formation, Inc. Self-closing spring probe

Also Published As

Publication number Publication date
TWI232301B (en) 2005-05-11
WO2002027869A1 (en) 2002-04-04
JP4521106B2 (en) 2010-08-11
JP2002107377A (en) 2002-04-10

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