1229408 疚、發明說明 (發明_應敘明：發明所屬之技術領域、先前技術、內容、實施方式及圖式簡單說明) 【發明所屬之技術領域】 本發明係與影像掏取半導體裝置有關，特別關於一種 影像擷取裝置模組。 5 【先前技術】 ’用的影像掏取裝置7G如第—圖所示，包含有一基板 72 ’其上裝汉有-影像感應器㈣喂此腦〇74、一承載架 76，裝設於該基板72上，且收容該影像隸器74於其中， 該承載架76上裝設有至少—個透鏡78，以及複數個電子 10元件8〇,裝設於該基板72上，位於該承載架76之外或之 内0 現今的電子產品均朝向輕薄短小的理念設計’以且有 照相功能的手機為例，習用之影像擷取裝置將很難順利安 裝於一小財的手射。如料有限㈣ 15 的電子元件，為業者-直努力的裝又取多 【發明内容】 本發明之主要目的在於提供—種影像 其體積較習用之影像擷取裝置模組小者。、 ·Α， 並 為達成前狀㈣目的，本發0綺提 置模組’包含有：一基板，具有—第—側:、；像擷取裝 -電路佈n像祕器，固_ 側以及 電性連接； 與該基板之第-側上之電路体局電性::板:Γ側， 固定於該基板之第二側上，並與該電路_ 晶片 0續次頁（翻_頁不陳卿，iS_麵職頁） 1229408 發明說明 第二晶片，堆疊於該第一晶片之上’並與該電路佈局電性 連接’以及—承載架’固定於該基板之第_側覆蓋該影 像感應器；該承載架具有_窗口，對準該影像感應器。 5 【實施方式】 為了詳細說明本發明之構造及特點所在，茲舉以下之 較佳實施例並配合圖式說明如后，其中： 第二圖係本發明第一較佳實施例之剖視圖； 第二圖係本發明第一較佳實施例之剖視圖，顯示透鏡 _ 10 安裝於承載架上，以及 第四圖本發明第二較佳實施例之剖視圖。 請參閱第二圖所示，本發明一較佳實施例所提供之影 像擷取裝置模組1，包含有： 一基板10 ,具有一第一側12以及一第二側14，而該 15第一與第二側12, 14上設有一預定之電路佈局（conduct〇r pattern)(圖中未顯示）。該基板上設有一孔槽16，貫穿該第 一與第二側12, 14。 一影像感應器18，本實施例為一 CMOS影像感應器 ® (CMOS image sensor, CIS),其尺寸大於該孔槽16 〇該影像 20 感應器18藉由一黏著層20，固定於該基板10之第一側 12，且其底側具有一部分對應該孔槽16。該影像感應器18 藉由複數條金線22與該基板10之第一側14上之電路佈局 電性連接。 一第一晶片24,其尺寸小於該孔槽16,以容設於該孔 -5- 1229408 發明說明_胃 均16中，並固接於該影像感應器2〇底側之黏著展加上 並藉由複數條金線26與該基板1〇之第二側16上曰兩 ， 局電性連接。 〈电路佈 一弟一晶片28’堆登於該第一晶片24之上，允叫 ^ 亚籍由複 數仏金線30與該基板1 〇之第二側16上之電路体巧#^生、 接。 ϋ电性連 一隔離層32，其可為環氧樹脂或其他隔離材料，咬於 該基板10之第二側16，覆蓋該第一晶片24、該第二晶片 28、該等金線26, 30與該孔槽16。 一散熱器34’其為一金屬片’設置於該隔離層32上。 一承載架36，固定於該基板10之第一側12,覆芸談 影像感應器18。該承載架18具有一窗口（window)38，對準 該影像感應器18。該承載架36設有一鏡片40，封閉該窗 口 38，藉以避免水氣或灰塵由該窗口 38進入該承載架36 15 中，而影響該影像感應器18之工作。 本發明之主要特徵在於將該影像擷取裝置模組中必要 之電子元件以堆疊（stack)之方式安排在一起，藉以減小整 個模組之寬度，並將該等堆疊之晶片安排在該基板之孔槽 中，藉以減小整個模組之高度。如此，本發明所提供之影 20 像擷取裝置模組具有較小之體積’可被輕易的裝設於任何 電子產品中。 對於某些製造者，其沒有製造或組裝透鏡之工作，可 製造如第二圖所示之影像掘取裝置模組1，然後交由其他 製造者裝配透鏡42於該承載架36之窗口 38中，而形成如 -6- 12294081229408 Guilt and invention description (Invention_shall be described: brief description of the technical field to which the invention belongs, prior art, content, embodiments, and drawings) [Technical field to which the invention belongs] The present invention relates to image extraction semiconductor devices, particularly An image capture device module. 5 [Prior art] As shown in the first figure, the used image extraction device 7G includes a substrate 72. It is equipped with a Han-image sensor, which feeds the brain 074, a carrier 76, and is installed in the At least one lens 78 and a plurality of electronic 10 elements 80 are mounted on the base plate 72 and the image processing device 74 is housed therein. The base plate 72 is located on the base frame 76. Outside or within 0 Today's electronic products are designed to be light, thin and short. 'Taking a mobile phone with a camera as an example, the conventional image capture device will be difficult to smoothly install in a small fortune. As expected, 15 electronic components are available for the industry to install more and more. [Summary of the invention] The main purpose of the present invention is to provide a kind of image whose volume is smaller than that of a conventional image capture device module. , · Α, and in order to achieve the purpose of the former state, the present 0 Qi lifting module 'contains: a substrate, with-the first side:,; image capture device-circuit cloth n camera, solid_ side And electrical connection; local electrical connection with the circuit body on the-side of the substrate :: board: Γ side, fixed on the second side of the substrate, and with the circuit _ chip 0 continued page (turn _ page (Chen Chen, iS_face page) 1229408 Description of the invention The second chip is stacked on the first chip 'and electrically connected to the circuit layout' and-the carrier 'is fixed on the _ side of the substrate to cover the Image sensor; the carrier has a window and is aligned with the image sensor. 5 [Embodiment] In order to explain the structure and characteristics of the present invention in detail, the following preferred embodiments are described below with reference to the drawings, wherein: The second diagram is a cross-sectional view of the first preferred embodiment of the present invention; The second figure is a cross-sectional view of the first preferred embodiment of the present invention, showing the lens _ 10 is mounted on a carrier, and the fourth figure is a cross-sectional view of the second preferred embodiment of the present invention. Please refer to the second figure. The image capture device module 1 provided by a preferred embodiment of the present invention includes: a substrate 10 having a first side 12 and a second side 14; and the 15th A predetermined circuit pattern (not shown) is provided on the first and second sides 12, 14. The substrate is provided with a hole slot 16 penetrating the first and second sides 12, 14. An image sensor 18, in this embodiment, a CMOS image sensor (CIS), the size of which is larger than the slot 16 〇 The image 20 The sensor 18 is fixed to the substrate 10 by an adhesive layer 20 The first side 12 has a part corresponding to the slot 16 on the bottom side. The image sensor 18 is electrically connected to the circuit layout on the first side 14 of the substrate 10 through a plurality of gold wires 22. A first wafer 24 having a size smaller than the hole slot 16 to be accommodated in the hole -5- 1229408 Description of the Invention_Stomach are 16 and fixed to the adhesive extension of the bottom side of the image sensor 20 The plurality of gold wires 26 are electrically connected to the second side 16 of the substrate 10 by two wires. <The circuit cloth has a wafer 28 'stacked on the first wafer 24, and it is allowed to be called a circuit body on the second side 16 of the substrate 10 and the plurality of gold wires 30 and the substrate 10. Pick up. ϋ Electrically connected to an isolation layer 32, which may be epoxy or other isolation material, bite on the second side 16 of the substrate 10, covering the first wafer 24, the second wafer 28, the gold wires 26, 30 与 该 孔 槽 16。 30 and the hole slot 16. A heat sink 34 'is a metal sheet' disposed on the isolation layer 32. A carrier 36 is fixed on the first side 12 of the substrate 10 and covers the image sensor 18. The carrier 18 has a window 38 aligned with the image sensor 18. The carrier frame 36 is provided with a lens 40 to close the window 38 so as to prevent moisture or dust from entering the carrier frame 36 15 through the window 38 and affecting the operation of the image sensor 18. The main feature of the present invention is to arrange the necessary electronic components in the image capturing device module in a stack manner, thereby reducing the width of the entire module, and arranging the stacked wafers on the substrate. In the hole slot, the height of the entire module is reduced. In this way, the image capturing device module provided by the present invention has a relatively small volume 'and can be easily installed in any electronic product. For some manufacturers, they do not have the task of manufacturing or assembling lenses. They can manufacture the image mining device module 1 as shown in the second figure, and then let other manufacturers assemble the lenses 42 in the window 38 of the carrier 36. And formed as -6- 1229408
第三圖所示者。但是，對於某些可直接組裝透鏡之製造者， 可在製造之過程中直接將透鏡42安裝於該承載架％上， 而該承載架36上可不需要設置該鏡片4〇。 第四圖係顯示本發明第二較佳實施例所提供之影像擷 5取裝置模組2，其主要結構與第一實施例相似，惟，基板 50之孔槽52在第一側54呈封閉狀，而在第二側％呈開 放狀，使第一晶片58是固接於該孔槽52之底側6〇。 最後有兩點要特別提出說明： 1·由於該影像感應器18受溫度的影響較大，因此在第 10 一較佳實施例中，該影像感應器18與該第一晶片24之間 的黏著層20最好同時具有黏性與隔熱之功能。因此，該黏 著層20可為環氧樹脂、黑膠或其他適當之材料。而如欲加 強該影像感應器與第一晶片間之隔熱或散熱之作用，可再 於二者間加入一具有隔熱或散熱功能的層（圖中未顯示）。 15 2·該第一晶片24可為一記憶晶片（隨機記憶體(RAM) 或快閃記憶體(flash))，而第二晶片28可為一數位訊號處理 器（digital signal processor, DSP);或是該第一晶片 24 為一 數位訊號處理器’而第二晶片28為一記憶晶片。而第'一與 弟一晶片24，28之種類亦不偈限於說明書中所列。 20 -7- 1229408 發明說明®胃 【圖式簡單說明】 第一圖係習用影像擷取裝置之剖視圖； 第二圖係本發明一較佳實施例之剖視圖； 第三圖係本發明一較佳實施例之剖視圖，顯示透鏡安 5 裝於承載架上，以及 第四圖係本發明另一較佳實施例之剖視圖。 【圖式符號說明】 1影像擷取裝置模組 10 10基板 12第一側 14第二側 16孔槽 18影像感應器 20黏著層 22金線 24第一晶片 26金線 28第二晶片 30金線 32隔離層 34散熱器 36承載架 38窗口 15 40鏡片 42透鏡 2影像擷取裝置模組 50基板 52孔槽 54第一側 56第二側 58第一晶片 60底側 70習用影像擷取裝置 20 72基板 74影像感應器 76承載架 78透鏡 80電子元件The third picture. However, for some manufacturers who can directly assemble the lens, the lens 42 can be directly mounted on the carrier frame% during the manufacturing process, and the lens holder 40 need not be provided on the carrier frame 36. The fourth figure shows the image capture 5 capturing device module 2 provided by the second preferred embodiment of the present invention. The main structure is similar to that of the first embodiment. The first wafer 58 is fixed to the bottom side 60 of the hole 52. Finally, there are two points to be particularly explained: 1. Since the image sensor 18 is greatly affected by temperature, in the tenth preferred embodiment, the adhesion between the image sensor 18 and the first chip 24 The layer 20 preferably has both adhesive and thermal insulation functions. Therefore, the adhesive layer 20 may be epoxy resin, vinyl, or other suitable materials. To enhance the heat insulation or heat dissipation function between the image sensor and the first chip, a layer with heat insulation or heat dissipation function (not shown) can be added between the two. 15 2 · The first chip 24 may be a memory chip (random memory (RAM) or flash memory (flash)), and the second chip 28 may be a digital signal processor (DSP); Or the first chip 24 is a digital signal processor and the second chip 28 is a memory chip. The types of the first and second wafers 24 and 28 are not limited to those listed in the description. 20 -7- 1229408 Description of the Invention® Stomach [Simplified Illustration] The first picture is a cross-sectional view of a conventional image capture device; the second picture is a cross-sectional view of a preferred embodiment of the present invention; the third picture is a preferred view of the present invention The sectional view of the embodiment shows that the lens 5 is mounted on a carrier, and the fourth view is a sectional view of another preferred embodiment of the present invention. [Symbol description] 1 image capture device module 10 10 substrate 12 first side 14 second side 16 hole slot 18 image sensor 20 adhesive layer 22 gold wire 24 first chip 26 gold wire 28 second chip 30 gold Line 32 isolation layer 34 heat sink 36 carrier 38 window 15 40 lens 42 lens 2 image capturing device module 50 substrate 52 hole slot 54 first side 56 second side 58 first wafer 60 bottom side 70 conventional image capturing device 20 72 substrate 74 image sensor 76 carrier 78 lens 80 electronic component