TWI228293B - A CMOS utilizing a special layout direction - Google Patents

A CMOS utilizing a special layout direction Download PDF

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TWI228293B
TWI228293B TW092133791A TW92133791A TWI228293B TW I228293 B TWI228293 B TW I228293B TW 092133791 A TW092133791 A TW 092133791A TW 92133791 A TW92133791 A TW 92133791A TW I228293 B TWI228293 B TW I228293B
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Taiwan
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effect transistor
type
field effect
oxide
type metal
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TW092133791A
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TW200520142A (en
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Feng Yuan
Ching-Fang Huang
Chee-Wee Liu
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Univ Nat Taiwan
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76—Unipolar devices, e.g. field effect transistors
    • H01L29/772—Field effect transistors
    • H01L29/78—Field effect transistors with field effect produced by an insulated gate
    • H01L29/7842—Field effect transistors with field effect produced by an insulated gate means for exerting mechanical stress on the crystal lattice of the channel region, e.g. using a flexible substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H01L21/82—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
    • H01L21/822—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being a semiconductor, using silicon technology
    • H01L21/8232—Field-effect technology
    • H01L21/8234—MIS technology, i.e. integration processes of field effect transistors of the conductor-insulator-semiconductor type
    • H01L21/8238—Complementary field-effect transistors, e.g. CMOS
    • H01L21/823807—Complementary field-effect transistors, e.g. CMOS with a particular manufacturing method of the channel structures, e.g. channel implants, halo or pocket implants, or channel materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
    • H01L27/0203—Particular design considerations for integrated circuits
    • H01L27/0207—Geometrical layout of the components, e.g. computer aided design; custom LSI, semi-custom LSI, standard cell technique
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
    • H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body
    • H01L27/08—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including only semiconductor components of a single kind
    • H01L27/085—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including only semiconductor components of a single kind including field-effect components only
    • H01L27/088—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including only semiconductor components of a single kind including field-effect components only the components being field-effect transistors with insulated gate
    • H01L27/092—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including only semiconductor components of a single kind including field-effect components only the components being field-effect transistors with insulated gate complementary MIS field-effect transistors

Description

【舍明所屬之技術領域】 1228293 侔；？ +二年，、互補式金氧半場效電晶體（CM0S)都是以元 ^ itTTPQ “達到增加元件速度及驅動電流的目的，但是 声 r〇admaP，利用元件尺寸縮小以提升元件操作速 ί ξ彳^已經快要達到極限。因此，藉由元件尺寸縮小來 達到性此的改善，顯的越來越不容易。 在同樣元件尺寸下，經研究發現使用應變矽層 (seamed Si)作為載子通道，因其載子遷移率（以厂丨打 111 ty)增加，可達到有效增加元件驅動電流及速 度的目標。 本發明係一種受應變力之互補型金氧半場效電晶體的 佈局擺放方法。該方法中之N型金氧半場效電晶體（NM〇s) 與p型金氧半場效電晶體（PM0S)之通道（channel)中電流流 動方向互王垂直。另外，應變力施加於兩者之通道。該方 法以現有應變矽技術為基礎，在金氧半場效電晶體之通道 中，提供應變力，利用N型金氧半場效電晶體與p型金氧半 %效電aa體的佈局擺放關係’進而使兩種電晶體可以在受 同一方向之應變力的情況下’同時使兩種電晶體都能提供 較大的元件驅動電流與操作速度。 【先前技術】
習知現今應變矽技術，對於金氧半場效電晶體 (MOSFET)施加應變力，可分為與電流方向水平之應變力及 與電流方向垂直之應變力，如圖1及圖2所示。一金氧半p
1228293 案號 92133791 五、發明說明（2)
術提供一應變力於閘極下方之通道進而提升金氧半場效電 晶體之驅動電流與操作速度。圖1為金氧半場效電晶體受 水平應變力之示意圖，該應變力之方向平行元件電流流動 方向。圖2為金氧半場效電晶體受垂直應變力之示意圖， 該應變力之方向垂直元件電流流動方向。兩圖中之u應變力 皆可為張力（tensUe stress)或壓縮力（corapressiv: stress) ° 應變力與通道中之載子遷移率（m 〇 b i 1 i t y )的關係如圖 所不。若施加一張力應變力，則電子遷移率會增加，但 遷移率只有在垂直張力或水平壓縮力的應變力 才會有所增加。 Γ ，知先前技術中華民國專利公告編號523 ==明…定向之互補型金氧半場以 金氣l / A專利‘出在{1叫晶圓上，無論N型或P型 复電ί 電晶體’若金氧半場效電晶體以<1〇〇>方向為 <m>方向為其電流方向，^H 場效電晶體以 法均可增加電晶體之速度。^以垂直應變力。這兩種方 本發明為使互補型金梟 金氧半場效電晶體與P型金晶，祕）中之N型 動方向互呈垂直關係、，則：/场效電晶體之通道電流流 對於N型金氧半場效電晶^ \加~相同方向之應變力時， 場效電晶體則為垂直岸變力為水平應變力、對於？型金氧半 方向之應變力的情況下，同b±如此一纟，便可在施加相同 1228293 _案號92133791_年月曰 五、發明說明（3) 的目的。 【發明内容】 本發明係一種受應變力之互補型金氧半場效電晶體 (CMOS)的佈局擺放方法。 如圖3所示，必須CMOS中的N型金氧半場效電晶體受水 平張力應變力，而P型金氧半場效電晶體受垂直張力應變 力，才能同時讓兩者之載子遷移率增加達到最高。 本發明著眼於元件製作過程中，外加相同$向應變力 較為方便，因此利用這個原理，在CMOS的佈局中，型 金氧半場效電晶體之電流流動方向與P型金氧半場效電晶 體互呈垂直關係。如此一來便可在CMOS中的N型及p型金氧 半場效電晶體受到相同方向應變力的情況下，同時讓1^'型 及p型電晶體之載子遷移率增加，並得以增加CM〇s的元件 操作速度。 【實施方式】 i 係一種受應變力之互補型金氧半場效電晶體 (CMOS)的佈局擺放方法，其包含下列步驟： (a) 提供一矽基板； (b) 2矽基板上形成N型金氧半場效電晶體及p型金氧 ::效電晶體以形成CM0S ’其中，該N型金氧半場 =晶體之電流流動方向與p型金氧半㉟效電晶體 互為垂直關係； ^成i引起金氧半場t晶體通道上之庵、鐵六夕
1228293
__ii^92l33791 五、發明說明（4) J :: ’且該應變力相對該CM0S中的Ν型 乳+场效電晶體而言，為同一方向。 根據上述構想，該步驟（a ) {1〇〇}。 ^ 4矽暴板結晶方向可為 N型根據1迷構想’該步驟（a)之該石夕基板渗雜可為p型或 根據上曰述構想，該步驟(a)之該矽基板可為晶圓 (wafer)、日日方（die)或其它任意大小及形狀。 根據上述構想，該步驟（b)之N型金氧半場效電晶體電 流流動方向可為等效之<11〇>方向，而p型金氧半場效電晶 體電流流動方向為另一個等效之〇 1〇>方向，但與N型金= 半場效電晶體呈九十度垂直關係。 根據上述構想，該步驟（b)iNS金氧半 流流動方向可為等效之<100>方向，而p型金氧半場效電2 體電流流動方向為另一個等效之<1〇〇>方向，但與N型金 半場效電晶體呈九十度垂直關係。 根據上述構想，該步驟（b)之~型金氧半場效電晶體電 流流動方向可為任意方向，而P型金氧半場效電晶體電流 流動方向為與N型金氧半場效電晶體呈九十度垂直關係。 根據上述構想，其中N型金氧半場效電晶體與1)型金氧 半場效電晶體電流流動方向之夾角亦可為三十度至九十
第8頁 根據上述構想，該步驟（b)之矽基板上可形成多組 CMOS電路’各個CMOS中之n型金氧半場效電晶體電流流動 方向不Μ I $ -方@，祇要其相對應的p型金氧半場效電 - _ 丁“ 1 7 1228293 曰 ----鎌 92]3綱 五、發明說明（5) 晶體電流流動方向與N型金氧半 關係即可。 琢欢寬日日體呈九十度垂直 根據上述構想，該步驟（） 力。 之應變力可為張力或壓縮 根據上述構想，該步驟（c)之壓力源古 化物介電質、高壓縮力氮化物介電質、淺意準n ’ 物、外加機械力、應變石夕層或氫離子佈ς溝渠離填充 本發明之另一製造方法可包括下列步驟： (a) 提供一；ε夕基板； (b) =成一引起應變力之壓力源，且在即將形成“⑽ 處，該應變力相對於該CMOS中的N型及p型金 %效電晶體而言’為同一方向； (c) 於上形成n型金氧半場效電晶體及p型金氧 電晶體以形成CMOS，其中，該N型金氧 體之電流方向與p型金氧半場效電晶= : = 根據上述構想，該步驟（a)之該矽基板 { 1 0 0丨。 曰曰I向可為 根據上述構想，該步驟（a)之該矽基板滲 N型。 ^哪彳馬^型或 根據上述構想，該步驟（a)之該矽基板可為曰口 (wafer)、晶方（die)或其它任意大小及形狀/、、日日圓 根據上述構想，該步驟（b)之應變力可兔租 力。 又刀T為張力或壓縮 根據上述構想，該步驟（b)之壓力源可為—處A --------— π —應變石夕
ItVU!JpiHkVA VUkli f LKIiL jaVLP.UL ! mil _ I ____ ^ 1228293
J 述構想，該步驟(c)之Ν型金氧半場嗖電曰舻電 流流動方向可為等效之·！ 虱牛琢效電日日體電 _____^^92133791 五、發明說明（6) 層、氫離子佈植或外加機械力。 體電流流動方向ΐίί:等°= 半場效電晶體呈九：度：備方向，靖型金氧 、“ Γίΐϊίί ’該步驟(⑽型金氧半場效電晶體電 抓抓動向可為專效之<100〉方向，而ρ型金氧丰場雷曰 體電流流動方向為另一個等 i至乳+场效電日日 1口哥双之<ιυυ>方向，但鱼合負 半場效适晶體呈九十度垂直關係。 、 述構想，該步驟(c)u型金氧半場 流流動方向可為任意方肖，而P型金氧半場效電晶體電流 流動方向為與N型金氧半場效電晶體呈九十度垂直關係。 根據上述構想，其中N型金氧半場效電晶體與{5型金氧 半場效電晶體電流流動方向之夾角亦可為三十度至九十 度。 根據上述構想，该步驟（c )之石夕基板上可形成多組 CMOS電路，各個CMOS中之N型金氧半場效電晶體電流流動 方向不須為同一方向，祇要其相對應的p型金氧半場效電 晶體電流流動方向與N型金氧半場效電晶體呈九+声番亩 關係即可。 Λ 【實施例說明】 本案之一較佳實施例為在一 {1 〇 〇}石夕晶圓基板上，形 成一環型振盪器（ring oscillator)電路。該環型振盈器 為多級CMOS串接，其每一級CMOS之佈局方式如圖5所示。
第10頁 I22S293 ---案號Q9.1奶7Q1 五、發明說明（7) 该CMOS佈局中之N型金氧半 曰 金氧半場效電晶®互呈垂直關係電;°雜“流動方向财型 個⑽ 加機械力的方式，可以對各 ϋΐ :流方向互相垂直，此-同向應變力即可 4 Φ 場效電晶體施以水平張力，而對Ρ型金氧半場 U旦則為垂直張力。如此-來可以同時提升Ν型及ρ型 了曰曰豆的載子遷移率。請參閱圖6，為以模擬當Ν型 型電晶體之載子遷移率增加時，該環型振盪器之延遲 時間與載子遷移率增加比率之關係圖。由圖中可看出載子 遷移率增加時，延遲時間減少，亦即該環型振盪器之速度 、交快。疋故’本發明之佈局擺放方式確實有讓N型及p型電 晶體之載子遷移率增加，並進而達到提升該環型振盪器速 度的目的。 本案之實作晶方（die)圖如圖7所示，另外，請參閱圖 5 ’以0 · 2 5微米製程所製作出n型與p型金氧半電晶體電流 方向互相垂直之環型振盪器，其實驗結果也證明在提供一 外加平行N型電晶體電流方向之張力機械應變力時，該環 型振盪器之速度確實有所提昇。但是在提供一壓縮力機械 應變力時，該環型振盪器之速度則變小。 綜上所述’本案提供一種受應變力之互補变金氧半場 效電晶體（C Μ 0 S)的佈局擺放方法。縱使本發明已由上述之 實施例詳細敘述而可由熟悉本技藝之人士任施匠思而為諸 般修飾，然皆不脫如附申請專利範圍所欲保護者。
I22S293 號 921337Q1 圖式簡單說明 【圖式簡單說明】 圖1為一受水平應 圖2為一受垂直應 圖3為載子遷移率 圖4為本發明方法 向。 圖5為本發明方法 佈局圖。 圖6為本發明方法 增加載子遷移 圖7為本發明方法 圖8為本發明方法 外加機械力強
，力之金氣半場效電晶體佈局圖。 =力之金氧半場效電晶體佈局圖。 '、水^與垂直應變力的關係圖。 之不思圖’其中I為各元件電流方 之貝方也例環型振盪器中每級CMOS之 之貝施例環型振盪器中延遲時間與 率之HspiCe模擬圖。 之$施例環型振盪器之照片。 之貫施例環型振盪器中延遲時間與 度之實驗量測圖。 【主要部分代表符號說明】 10 源極 2 0 汲極 30 閘極 4 0 矽基板 110 N Μ 0 S的源極 120 NM0S的汲極 13 0 Ν Μ 0 S的閘極 210 Ρ Μ 0 S的源極 220 PM0S的汲極 1228293 案號 92133791 年 月_0_修正 圖式簡單說明 230 PMOS的閘極 第13頁

Claims (1)

  1. 9·根 板上 電晶 型金 體呈 ’其中該步驟（c)之應 ，其中該步驟（C)之壓 鬲壓縮力氮化物介電 力、應變矽層或氫離子
    1228293 ----- 銮號 92133791__—年 』_§_____ 六、申請專利範圍 而P型金氧半場效電晶體電流流動方向為另一個等效之 <1〇〇>方向，但與N型金氧半場效電晶體呈九十度垂直關 係。 7 ·根據申請專利範圍第1項之方法，其中該步驟（b)之N型 金氧半場效電晶體電流流動方向可為任意方向，而P型金 氧半場效電晶體電流流動方向為與N型金氧半場效電晶體 王九十度垂直關係。 8·根據申請專利範圍第7項之方法，其中N型金氧半場效電 晶體與P型金氧半場效電晶體電流流動方向之夾角亦可為 二τ度至九十度。 據申請專利範圍第1項之方法，再f該步驟（b)之矽d 可形成多組CMOS電路，各個CMOS中之N型金氧半場1 體電流流動方向不須為同一方向，祇要其相對應的; 氧半場效電晶體電流流動方向與N型金氧半場效電 九十度垂直關係即可。 I 0 ·根據申請專利範圍第1項之方法 變力可為張力或壓縮力。 II ·根據申請專利範圍第1項之方法 力源可為一高張力氮化物介電質、 質、淺溝渠隔離填充物、外加機械 1 2 · —種受應變力之互補型金氧伞 局擺放方法，其包含下列步驟:丁每效電晶體（CM〇S)的佈 (a )提供一矽基板；
    $ 15頁
    1228293 ---- 、曱請專利範圍 (b )幵乂士 處成—引起應變力之壓力源，且在即將形成⑽⑽ 二该應變力相對於該CM0S中的N型及p型金氧半 (c) Z攻電晶體而言，為同一方向； C ^形成N型金氧半場效電晶體及？型金場效 ίj以形成_’纟中’型金氧半場效電晶 係《電流方向與P型金氧半場效電晶體互為垂直關 其中該步驟（a )之該 其中該步驟（a)之該φ 矽基柄^士申请專利範圍第1 2項之方法 h.W二方向可為{1°°丨° 矽美拓、明專利範圍第1 2項之方法 :基板滲雜可為P型或N型。 ’其中該步驟（a)之該 或其它任意大小及形 其中該步驟（b )之應 其中該步驟（b)之壓 .很據申請專利範圍第i 2項之方法 狀。 為日日圓（wafer)、晶方（die: 根據申請專利範圍第1 2項之方法 、交刀可為張力或壓縮力。 \7·、根據申請專利範圍第12項之方法，复 力源可為一應變矽層、氫離子佈植或外、〜I 18·根據申請專利範圍第12項之方法，口機械力。 型金氧半場效電晶體電流流動方向可其中該步驟（c)之N 向，而p型金氧半場效電晶體電流流動為方4△之㈣ ί 方向’但與Ν型金氧半場效電晶體呈九十度垂直關 19·根據申請專利範圍第12項之方法，其中該步驟(c)之Ν
    1228293 --—-j號 92133791 —__年月日__修正 __ 六、申請專利範圍 型金氧半場效電晶體電流流動方向可為等效之<100〉方 向’而P型金氧半場效電晶體電流流動方向為另一個等效 之<10 0〉方向’但與N型金氧半場效電晶體呈九十度垂直關 係。 2 0 ·根據申請專利範圍第丨2項之方法，其中該步驟（c ) 型金氧半場效電晶體電流流動方向可為任意方向，而P型 金氧半場效電晶體電流流動方向為與N型金氧半場效電晶 體呈九十度垂直關係。 2 1 ·根據申請專利範圍第2 0項之方法，其中N型金氧半場效 览晶體與P型金氧半場效電晶體電流流動方向之夾角亦可 j 為三十度至九十度。 2 2 ·根據申請專利範圍第1 2項之方法，其中該步驟（c)之石夕 基板上可形成多組CMOS電路，各個CMOS中之N型金氧半場 效電晶體電流流動方向不須為同一方向，祇要其相對應的 P型金氧半場效電晶體電流流動方向與N型金氧半場效電晶 體呈九十度垂直關係即可。
    第17頁
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